CN106449685B - 用于感光芯片封装的喷胶工艺 - Google Patents
用于感光芯片封装的喷胶工艺 Download PDFInfo
- Publication number
- CN106449685B CN106449685B CN201610931552.3A CN201610931552A CN106449685B CN 106449685 B CN106449685 B CN 106449685B CN 201610931552 A CN201610931552 A CN 201610931552A CN 106449685 B CN106449685 B CN 106449685B
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- CN
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- Prior art keywords
- sensitive chip
- glue
- glue spraying
- sol solution
- protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 67
- 238000005507 spraying Methods 0.000 claims abstract description 42
- 239000012790 adhesive layer Substances 0.000 claims abstract description 22
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 208000014674 injury Diseases 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012946 outsourcing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610931552.3A CN106449685B (zh) | 2016-10-24 | 2016-10-24 | 用于感光芯片封装的喷胶工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610931552.3A CN106449685B (zh) | 2016-10-24 | 2016-10-24 | 用于感光芯片封装的喷胶工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106449685A CN106449685A (zh) | 2017-02-22 |
CN106449685B true CN106449685B (zh) | 2018-09-21 |
Family
ID=58177420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610931552.3A Active CN106449685B (zh) | 2016-10-24 | 2016-10-24 | 用于感光芯片封装的喷胶工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106449685B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101188202A (zh) * | 2006-11-15 | 2008-05-28 | 矽品精密工业股份有限公司 | 感测式封装件及其制造方法 |
CN101477955A (zh) * | 2008-01-04 | 2009-07-08 | 南茂科技股份有限公司 | 小片重新配置的封装结构及封装方法 |
CN103178194A (zh) * | 2011-12-23 | 2013-06-26 | 山东浪潮华光光电子股份有限公司 | 一种大功率白光led封装结构及其制备方法 |
CN103441208A (zh) * | 2013-09-02 | 2013-12-11 | 厦门华联电子有限公司 | 快速固化的白光led荧光胶涂覆方法 |
CN104485319A (zh) * | 2014-12-26 | 2015-04-01 | 江苏长电科技股份有限公司 | 用于感光芯片的封装结构及工艺方法 |
CN105591008A (zh) * | 2014-10-24 | 2016-05-18 | 比亚迪股份有限公司 | 一种led点胶方法及led灯 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103109361B (zh) * | 2011-04-06 | 2016-04-13 | 北京大学深圳研究生院 | 一种半导体封装中的底胶填充方法及设备 |
-
2016
- 2016-10-24 CN CN201610931552.3A patent/CN106449685B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101188202A (zh) * | 2006-11-15 | 2008-05-28 | 矽品精密工业股份有限公司 | 感测式封装件及其制造方法 |
CN101477955A (zh) * | 2008-01-04 | 2009-07-08 | 南茂科技股份有限公司 | 小片重新配置的封装结构及封装方法 |
CN103178194A (zh) * | 2011-12-23 | 2013-06-26 | 山东浪潮华光光电子股份有限公司 | 一种大功率白光led封装结构及其制备方法 |
CN103441208A (zh) * | 2013-09-02 | 2013-12-11 | 厦门华联电子有限公司 | 快速固化的白光led荧光胶涂覆方法 |
CN105591008A (zh) * | 2014-10-24 | 2016-05-18 | 比亚迪股份有限公司 | 一种led点胶方法及led灯 |
CN104485319A (zh) * | 2014-12-26 | 2015-04-01 | 江苏长电科技股份有限公司 | 用于感光芯片的封装结构及工艺方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106449685A (zh) | 2017-02-22 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200402 Address after: Room 101, tower C, cancer, software park, No. 18, Zhenze Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu gutai Microelectronics Co., Ltd Address before: Block C No. 18 national software park 214028 cancer in Jiangsu province Wuxi City District Road Zhenze layer Patentee before: NST TECHNOLOGY LIMITED Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201119 Address after: Floor 1, block C, cancer, software park, No. 18, Zhenze Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi gutai Microelectronics Technology Co., Ltd Address before: Room 101, tower C, cancer, software park, No. 18, Zhenze Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: Jiangsu gutai Microelectronics Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 214028 1st floor, building C, cancer, software park, No.18 Zhenze Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu gutai Microelectronics Co.,Ltd. Address before: 214028 1st floor, building C, cancer, software park, No.18 Zhenze Road, Xinwu District, Wuxi City, Jiangsu Province Patentee before: Wuxi gutai Microelectronics Technology Co., Ltd |