CN106431415B - 制备高性能纯结晶碳化硅纳米平板陶瓷膜的方法 - Google Patents
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Abstract
本发明公开了一种制备高性能纯结晶碳化硅纳米平板陶瓷膜的方法,首先选用高纯6H‑SiC粉料作为基料,对支撑层、过渡层和上膜层材料进行介质气流整形,采用活塞式挤出机挤出支撑层坯体并用履带式真空微波干燥机进行固化;将过渡层的泥料挤到固化的支撑层上并放入履带式真空微波干燥机中固化,然后高温烧结;最后将上膜层泥料通过等离子方法喷涂到过渡层上即可。本发明制备方法可连续生产,节能环保效果明显,工作环境好,能很好的控制陶瓷膜的孔径尺寸、通量渗透量和粒子去除率,烧结后没有添加剂残留;成品陶瓷膜可在高温、高盐、强腐蚀工况条件下充分发挥碳化硅自身的理化性能优势,分离精度高,再生能力强,使用寿命强,能实现重复使用。
Description
技术领域
本发明涉及特种工业陶瓷,尤其是涉及一种制备高性能纯结晶碳化硅纳米平板陶瓷膜的方法。
背景技术
陶瓷膜是固态膜的一种,具有分离效率高、效果稳定、化学稳定性好、耐酸碱、耐有机溶剂、耐高温、分离过程简单等众多优势。目前的固液、液液分离的陶瓷膜基本以氧化铝中空平板陶瓷膜为主,由依次叠加的上膜层、中间过渡层和底部支撑层构成。由于现有平板陶瓷膜的制造工艺复杂多变,制作成本高且产品易开裂变形,造成成品率低;而成品陶瓷膜由于空隙率低,孔径大小不一且分布不均匀,又使得陶瓷膜的过滤精度达不到要求,过滤有效通量低,使用能耗高,再生困难,在温度超过80℃的工况条件下就会失去过滤效果,无法使固气、固液分离,当出现压差后陶瓷膜还会出现变形、裂纹甚至折断等损坏。
发明内容
本发明的目的在于提供一种制备高性能纯结晶碳化硅纳米平板陶瓷膜的方法,该方法可很好的控制陶瓷膜的孔径尺寸、通量渗透量、粒子去除率,成品陶瓷膜的分离精度高,使用寿命长。
为实现上述目的,本发明可采取下述技术方案:
本发明所述的制备高性能纯结晶碳化硅纳米平板陶瓷膜的方法包括下述步骤:
第一步,原料选取
选用原位合成高纯6H-SiC粉体材料作为制备平板陶瓷膜的基料,其中支撑层所用粉体的粒度为25~40微米、过渡层所用粉体的粒度为3~6微米、上膜层所用粉体的粒度为0.25~0.40微米;
第二步,粉体材料整形
采用负压引风、分级自动化控制系统,将上述三种粉体材料进行整形,得到圆形度≥0.955的粉体材料;其中整形后支撑层所用粉体的粒度为24.5~39.5微米、过渡层所用粉体的粒度为2.8~5.7微米、上膜层所用粉体的粒度为0.23~0.39微米;
第三步,制备支撑层、过渡层和上膜层泥料
按照粉体材料: 淀粉造孔剂:酸性粘接剂=65%:32%:3%之体积比准确称量粉体材料、淀粉造孔剂和酸性粘接剂,入混料机干法混合两小时,分别得到支撑层、过渡层和上膜层泥料原料;在所述泥料原料中按质量浓度加入15%的纯净水,在混料机中混合45分钟,分别得到支撑层、过渡层和上膜层泥料备用;
第四步,制备固化支撑层
将支撑层泥料用活塞式挤出成型机直接挤入履带式真空微波干燥机中,在60~65℃的温度下干燥4~5分钟,干燥后按设计尺寸裁剪,得到固化支撑层;
第五步,制备固化过渡层
以第四步固化的支撑层作为内模具,将过渡层的泥料用螺旋挤塑成型机直接挤入放在微带式真空微波干燥机中的支撑层上,在70~73℃的温度下干燥2~2.5分钟,得到固化有过渡层的坯体;
第六步,烧结
将第五步的坯体用微波厌氧真空烧结炉内在烧结温度1600℃条件下高温烧结;
第七步,真空镀膜
将温度降至室温的坯体放入入真空镀膜机中,将上膜层泥料通过等离子方法喷涂到过渡层上,得到镀膜厚度符合设计要求的上膜层;制备成的纳米平板陶瓷膜成品的最高操作温度为240℃,纯水通量渗透量60~80立方/m2.d,10纳米以上颗粒的去除率≥96%。
所述高纯6H-SiC粉体材料中,碳化硅含量≥99.6%,6H结构纯度≥95%,显微硬度≥3350kg/mm2,韧性值≥72%。
所述第六步烧结时,其升温时间为6小时,升温至1600℃后保温1小时,然后降温4小时至室温。
本发明的优点在于制备方法可连续生产,节能环保效果明显,智能化程度高,工作环境好,能很好的控制陶瓷膜的孔径尺寸、通量渗透量和粒子去除率,烧结后没有添加剂残留;由于采用微波固化、烧结,充分发挥了碳化硅吸收微波的特点,颗粒表面烧结温度均匀一致,制备的成品陶瓷膜可在高温(>80℃,最高可达240℃)、高盐、强腐蚀工况条件下充分发挥碳化硅自身的理化性能优势,分离精度高,再生能力强,使用寿命强,能实现多次往复使用。
附图说明
图1是本发明陶瓷膜的结构示意图。
具体实施方式
如图1所示,平板陶瓷膜包括支撑层1、过渡层2和上膜层3,一般情况下,支撑层1的厚度为3.5~3.6毫米、过渡层2的厚度为1.0~1.2毫米,上膜层3的厚度为20~30微米。
本发明制备高性能纯结晶碳化硅纳米平板陶瓷膜的方法包括下述步骤:
第一步,原料选取
选用原位合成高纯6H-SiC粉体材料作为制备平板陶瓷膜的基料,选用的高纯6H-SiC粉体材料中,要求碳化硅含量≥99.6%,6H结构纯度≥95%,显微硬度≥3350kg/mm2,韧性值≥72%;其中支撑层所用粉体的粒度为25~40微米、过渡层所用粉体的粒度为3~6微米、上膜层所用粉体的粒度为0.25~0.40微米;
第二步,粉体材料整形
采用630型整形分级系统(负压引风、分级自动化控制),对以上三种粉体材料分别进行整形,整形后的粉体材料圆形度≥0.955;整形后支撑层所用粉体的粒度为24.5~39.5微米,过渡层所用粉体的粒度为2.8~5.7微米,上膜层所用粉体的粒度为0.23~0.39微米;
第三步,制备支撑层、过渡层和上膜层泥料
按照粉体材料:淀粉造孔剂:酸性粘接剂(可采用聚丙烯酸酯)=65%:32%:3%之体积比(振实后)准确称量粉体材料、淀粉造孔剂和酸性粘接剂,入双螺杆混料机干法混合两小时,分别得到支撑层、过渡层和上膜层的泥料原料;在该泥料原料中按质量浓度加入15%的纯净水,用双螺杆混料机混合45分钟,分别得到支撑层、过渡层和上膜层的坯泥料;
第四步,制备固化支撑层
将支撑层的泥料用JD-125A型活塞式挤出成型机直接挤出到履带式真空微波干燥机(BDMS-MM-T-1000型)中的支撑层上,控制微波的发射端功率,确保干燥温度在60~65℃,有效干燥时间4~5分钟,干燥后按设计尺寸进行裁剪,得到固化支撑层;
第五步,制备固化过渡层
以第四步固化的支撑层作为内模具,将过渡层的坯泥料同样用活塞式挤出成型机直接挤放在履带式真空微波干燥机中的支撑层上,控制微波的发射端功率,确保干燥温度在70~73℃,有效干燥时间2~2.5分钟,得到由过渡层和支撑层构成的半成品坯体;
第六步,烧结
将第五步的半成品坯体用微波厌氧真空烧结炉(HY-ZK6016型)进行高温烧结,烧结温度为1600℃,其中升温时间为6小时,升温至1600℃后保温1小时,然后降温4小时至室温;
第七步,真空镀膜
将温度降至室温的坯体放入入等离子真空镀膜机中进行镀膜:将上膜层泥料通过等离子方法喷涂到过渡层表面形成上膜层,上膜层厚度可以根据使用要求进行调整,即可得到如图1所示的高性能结晶碳化硅纳米平板陶瓷膜成品。
本发明制备的纳米平板陶瓷膜成品的最高操作温度达到240℃,纯水通量渗透量60~80立方/m2.d,10纳米以上颗粒的去除率≥96%,适用于pH的范围为0~14。
与常规使用的氧化铝中空平板陶瓷膜最高操作温度130℃,纯水通量渗透量30~40立方/m2.d,10纳米以上颗粒的去除率≥95%,适用于pH的范围为0~14的技术指标相比,本发明制备的纳米平板陶瓷膜成品的工作温度显著增高,纯水通量渗透量增大一倍,10纳米以上颗粒的去除率增高。
本发明制备的平板陶瓷膜可用于海水淡化预处理、再生油高温过滤、硅材料的酸洗、碱洗废水等的处理,工作时分离精度高,使用寿命得以大大延长。
Claims (1)
1.一种制备高性能纯结晶碳化硅纳米平板陶瓷膜的方法,其特征在于:包括下述步骤:
第一步,原料选取
选用原位合成高纯6H-SiC粉体材料作为制备平板陶瓷膜的基料,其中支撑层所用粉体的粒度为25~40微米、过渡层所用粉体的粒度为3~6微米、上膜层所用粉体的粒度为0.25~0.40微米;
第二步,粉体材料整形
采用负压引风、分级自动化控制系统,将上述三种粉体材料进行整形,得到圆形度≥0.955的粉体材料;其中整形后支撑层所用粉体的粒度为24.5~39.5微米、过渡层所用粉体的粒度为2.8~5.7微米、上膜层所用粉体的粒度为0.23~0.39微米;
第三步,制备支撑层、过渡层和上膜层泥料
按照粉体材料: 淀粉造孔剂:酸性粘接剂=65%:32%:3%之体积比准确称量粉体材料、淀粉造孔剂和酸性粘接剂,入混料机干法混合两小时,分别得到支撑层、过渡层和上膜层泥料原料;在所述泥料原料中按质量浓度加入15%的纯净水,在混料机中混合45分钟,分别得到支撑层、过渡层和上膜层泥料备用;
第四步,制备固化支撑层
将支撑层泥料用活塞式挤出成型机直接挤入履带式真空微波干燥机中,在60~65℃的温度下干燥4~5分钟,干燥后按设计尺寸裁剪,得到固化支撑层;
第五步,制备固化过渡层
以第四步固化的支撑层作为内模具,将过渡层的泥料用螺旋挤塑成型机直接挤入放在履带 式真空微波干燥机中的支撑层上,在70~73℃的温度下干燥2~2.5分钟,得到固化有过渡层的坯体;
第六步,烧结
将第五步的坯体用微波厌氧真空烧结炉在烧结温度1600℃条件下高温烧结;
第七步,真空镀膜
将温度降至室温的坯体放入真空镀膜机中,将上膜层泥料通过等离子方法喷涂到过渡层上,得到镀膜厚度符合设计要求的上膜层;制备成的纳米平板陶瓷膜成品的最高操作温度为240℃,纯水通量渗透量60~80立方/m2.d,10纳米以上颗粒的去除率≥96%;
所述第六步烧结时,其升温时间为6小时,升温至1600℃后保温1小时,然后降温4小时至室温;
所述高纯6H-SiC粉体材料中,碳化硅含量≥99.6%,6H结构纯度≥95%,显微硬度≥3350kg/mm2,韧性值≥72%。
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