CN106409972A - 硅片多线切割后的脱胶工装 - Google Patents

硅片多线切割后的脱胶工装 Download PDF

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CN106409972A
CN106409972A CN201610851593.1A CN201610851593A CN106409972A CN 106409972 A CN106409972 A CN 106409972A CN 201610851593 A CN201610851593 A CN 201610851593A CN 106409972 A CN106409972 A CN 106409972A
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degumming
silica gel
frock
groove body
cell body
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李枫
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ZHANGJIAGANG GANGWEI ULTRASONIC CO Ltd
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ZHANGJIAGANG GANGWEI ULTRASONIC CO Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

硅片多线切割后的脱胶工装,包括槽体,其特征在于,所述槽体的两侧安装有侧耐腐蚀硅胶防护挡条,侧耐腐蚀硅胶防护挡条的两端设置有工装侧板,支撑横梁安装在槽体的上面,加工夹具均布布设在支撑横梁的中间,所述槽体的底部设置有下耐腐蚀硅胶防护挡皮,所述槽体的内部均布布设有分检隔板。本发明的有益效果:本发明整根硅棒装框脱胶,可完成约2000片硅片生产量,该装置的投入使用,大大提高了用户生产效率,整个脱胶过程无需人工接触硅片,做到了过程管控,将合格率提升到了98%,降低了碎片率,提高了经济效益,适合推广使用。

Description

硅片多线切割后的脱胶工装
技术领域
本发明涉及一种硅片多线切割后的脱胶工装,属于太阳能技术领域。
背景技术
光伏即为太阳能光伏发电系统,是将太阳光辐射能直接转换为电能的一种新型发电系统,被誉为新型清洁能源,将会主导本世纪整个电力行业,与国家乃至整个世界密切相关。而该系统中最为重要的组成是为太阳能电池片,电池片的核心即为硅片。目前中国国内有着众多光伏产品大型生产厂家,如晶科能源、天合光电、昱辉阳光、阿特斯阳光电力、英利绿色能源等,经过长期经验积累,他们有着一整套完善的生产及组装工艺。而多线切割后的脱胶主要用于硅片生产工序,是为前道工艺的主要组成部分,
早期脱胶工艺基本为人工操作,存在效率低、合格率低、碎片率高等问题,无法满足快速发展的光伏行业,同样也成为各清洗设备生产厂家进军光伏行业的门槛。
发明内容
本发明克服了现有技术存在的问题,提出了一种硅片多线切割后的脱胶工装,本发明整根硅棒装框脱胶,可完成约2000片硅片生产量,该装置的投入使用,大大提高了用户生产效率,整个脱胶过程无需人工接触硅片,做到了过程管控,将合格率提升到了98%,降低了碎片率,提高了经济效益。
本发明的具体技术方案如下:
硅片多线切割后的脱胶工装,包括槽体,其特征在于,所述槽体的两侧安装有侧耐腐蚀硅胶防护挡条,侧耐腐蚀硅胶防护挡条的两端设置有工装侧板,支撑横梁安装在槽体的上面,加工夹具均布布设在支撑横梁的中间,所述槽体的底部设置有下耐腐蚀硅胶防护挡皮,所述槽体的内部均布布设有分检隔板。
优先地,所述工装侧板的顶端设置有入槽定位点。所述装侧板的外侧还安装有挂取定位点。所述挂取定位点的数量为4个,一侧2个。
本发明的有益效果:本发明整根硅棒装框脱胶,可完成约2000片硅片生产量,该装置的投入使用,大大提高了用户生产效率,整个脱胶过程无需人工接触硅片,做到了过程管控,将合格率提升到了98%,降低了碎片率,提高了经济效益,适合推广使用。
附图说明
图1为本发明硅片多线切割后的脱胶工装的主视图;
图2为本发明硅片多线切割后的脱胶工装的俯视图;
图3为本发明硅片多线切割后的脱胶工装的侧视图。
具体实施方式
实施例1
如图所示,硅片多线切割后的脱胶工装,包括槽体10,所述槽体10的两侧安装有侧耐腐蚀硅胶防护挡条5,侧耐腐蚀硅胶防护挡条5的两端设置有工装侧板4,支撑横梁1安装在槽体10的上面,加工夹具均布布设在支撑横梁1的中间,所述槽体10的底部设置有下耐腐蚀硅胶防护挡皮6,所述槽体10的内部均布布设有分检隔板7。
工装侧板4的顶端设置有入槽定位点9。所述装侧板4的外侧还安装有挂取定位点8。所述挂取定位点8的数量为4个,一侧2个。
支撑横梁1主要用于完成切割后的硅棒3和加工夹具2的支撑,可承重约100KG,通过专业周转车将多线切割后整套硅棒放置在支撑横梁1上即可,通过多层分检隔板7隔离硅片,防止硅片脱胶掉落后相互挤压,同时也便于人工拿料分检。单根硅棒在多线切割后可生产出约2000片硅片,该工装将整根硅棒装框脱胶,即一次可完成约2000片硅片生产量,同时两侧的侧耐腐蚀硅胶防护挡条5,下耐腐蚀硅胶防护挡皮6承载脱胶后掉落的硅片,确保整个过程无损伤,这样硅棒3,入槽定位点9、挂取定位点8配套机械小车实现自动化搬运,提高生产效率。
除上述实施例外,本发明还可以有其他实施方式。凡采用等同替换或等效变换形成的技术方案,均落在本发明要求的保护范围。

Claims (4)

1.硅片多线切割后的脱胶工装,包括槽体(10),其特征在于,所述槽体(10)的两侧安装有侧耐腐蚀硅胶防护挡条(5),侧耐腐蚀硅胶防护挡条(5)的两端设置有工装侧板(4),支撑横梁(1)安装在槽体(10)的上面,加工夹具均布布设在支撑横梁(1)的中间,所述槽体(10)的底部设置有下耐腐蚀硅胶防护挡皮(6),所述槽体(10)的内部均布布设有分检隔板(7)。
2.根据权利要求1所述的硅片多线切割后的脱胶工装,其特征在于:所述工装侧板(4)的顶端设置有入槽定位点(9)。
3.根据权利要求1或2所述的硅片多线切割后的脱胶工装,其特征在于:所述装侧板(4)的外侧还安装有挂取定位点(8)。
4.根据权利要求3所述的硅片多线切割后的脱胶工装,其特征在于:所述挂取定位点(8)的数量为4个,一侧2个。
CN201610851593.1A 2016-09-27 2016-09-27 硅片多线切割后的脱胶工装 Pending CN106409972A (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201302990Y (zh) * 2008-11-19 2009-09-02 高佳太阳能(无锡)有限公司 硅片清洗脱胶夹具
CN101879756A (zh) * 2010-04-01 2010-11-10 浙江硅宏电子科技有限公司 一种硅片脱胶机
CN102275234A (zh) * 2011-06-29 2011-12-14 浙江光益硅业科技有限公司 单晶/多晶硅片多线切割自动脱胶方法及其装置
CN203002693U (zh) * 2012-12-07 2013-06-19 西安隆基硅材料股份有限公司 金刚线切割单晶硅片脱胶预清洗装置
CN103464418A (zh) * 2013-09-18 2013-12-25 天津市环欧半导体材料技术有限公司 一种半导体硅片脱胶工艺
CN206116439U (zh) * 2016-09-27 2017-04-19 张家港市港威超声电子有限公司 硅片多线切割后的脱胶工装

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201302990Y (zh) * 2008-11-19 2009-09-02 高佳太阳能(无锡)有限公司 硅片清洗脱胶夹具
CN101879756A (zh) * 2010-04-01 2010-11-10 浙江硅宏电子科技有限公司 一种硅片脱胶机
CN102275234A (zh) * 2011-06-29 2011-12-14 浙江光益硅业科技有限公司 单晶/多晶硅片多线切割自动脱胶方法及其装置
CN203002693U (zh) * 2012-12-07 2013-06-19 西安隆基硅材料股份有限公司 金刚线切割单晶硅片脱胶预清洗装置
CN103464418A (zh) * 2013-09-18 2013-12-25 天津市环欧半导体材料技术有限公司 一种半导体硅片脱胶工艺
CN206116439U (zh) * 2016-09-27 2017-04-19 张家港市港威超声电子有限公司 硅片多线切割后的脱胶工装

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Application publication date: 20170215