CN106384633A - High-power current detector - Google Patents
High-power current detector Download PDFInfo
- Publication number
- CN106384633A CN106384633A CN201611012329.5A CN201611012329A CN106384633A CN 106384633 A CN106384633 A CN 106384633A CN 201611012329 A CN201611012329 A CN 201611012329A CN 106384633 A CN106384633 A CN 106384633A
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- Prior art keywords
- resistive element
- current detector
- power current
- radiator structure
- electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a high-power current detector, which comprises a resistor body, two electrode ends, a protection layer and a heat radiation structure, wherein the two electrode ends are respectively arranged at the two ends of the resistor body and form electric connection with the resistor body; the protection layer covers the resistor body; the integral thickness of the two electrode ends is greater than the thickness of the resistor body; the heat radiation structure is arranged between the two electrode ends positioned under the resistor body; the heat radiation structure comprises a heat conduction sheet and heat conduction glue layers arranged at the two sides of the heat conduction sheet; one side of the heat radiation structure is in tight contact with the resistor body; the other side of the heat radiation surface is in tight contact with the metal welding disc. The high-power current detector has the tiny sheet-shaped appearance and a shorter heat transfer path, and has the good heat radiation effect under the condition of not increasing the dimension of the current detector, so that the lower product temperature rise is realized; the application at higher power can be realized; the current intensity is more accurately fed back in real time.
Description
Technical field
The invention belongs to electronic component technology field, be related to a kind of current detector, particularly a kind of band radiator structure and
Can be used for surface-pasted current detector.
Background technology
Surface mount current detector is mainly used in the detecting of electric current in circuit, can be accurately and in time in feedback circuit
The size of electric current, Circuits System adopts corresponding measure to the excessive or too small electric current being detected again.But general surface
Attachment current detector electric current under high-power energising is larger, and the heat energy that resistive element itself produces also accordingly increases, if internal
Heat energy cannot pass in time the deviation of detector resistance can be brought even to damage.At present the more popular way of industry be by
The width of resistive element is broadening, and electrode size increases, and which increases the passage that resistive element radiates to electrode and electrode to weldering
The area of dissipation of disk and then the efficiency of increase radiating, but thus may require that extra circuit board space, it is unfavorable for element body
Long-pending reduces.
Chinese patent 201380067037.X discloses a kind of surface mount current detector, including a resistive element and its
Two end electrodes, electrode by welding by way of be connected on pcb board, one electric insulation radiator and two termination, termination
Can be insulation or conduction, radiator is fitted tightly over above resistive element by heat-conducting glue, heat conduction is passed through in radiator termination
The mode of glue or welding is connected to the top of electrode.This mode manufacture craft is simple, but heat dissipation path oversize it is necessary to pass through
Resistive element is delivered to the radiator of top, and radiator is transferred to its termination again, then is transferred to electrode tip by termination, finally by
Electrode tip is transferred on pcb board, additionally, the termination of electrode and radiator needs larger size design, otherwise can become whole
Neck region in heat dissipation path.
And Chinese patent 02130724.5 discloses a kind of miniature low voltage and low resistance current sensor, cooling mechanism is set
Put the lower section in resistive element, below cooling mechanism, protective layer is all set with the top of resistive element, two ends arrange electrode tip, resistance
The heat that body produces is delivered to termination by cooling mechanism and is delivered on pcb board again.Pass through galvanoplastics by electricity described in patent
Pole thickeies, thus raising cooling mechanism, increases radiating effect, actually used in because being provided with protective layer, be empty outside protective layer
Gas, heat-conducting effect is excessively poor, and heat directly can not be passed by cooling mechanism, and having thickeied electrode on the contrary makes the road of heat transfer
Footpath is longer.
In sum, in prior art surface mount current detector in the case of not increasing resistive element width, because of it
Structure limits, and radiating effect is all not ideal enough, thus constraining it to apply power.
Content of the invention
For solving the above problems, the invention discloses a kind of high power current detector, there is small chip profile, more
Short heat transfer path, has good radiating effect under conditions of not increasing current detector size, thus possessing lower
Product temperature rise, may be implemented under higher power application, more accurately Real-time Feedback carried out to size of current.
In order to achieve the above object, the present invention provides following technical scheme：
A kind of high power current detector, including resistive element, two electrode tips, protective layer and radiator structure, described two electricity
Extreme head is separately positioned on resistive element two ends and is electrically connected with resistive element formation, and described protective layer covers on resistive element, described
Two electrode tip integral thickness are more than resistance body thickness, and described radiator structure is arranged at below resistive element between two electrode tips,
Described radiator structure includes conducting strip and is separately positioned on the heat conduction glue-line on conducting strip two sides, wherein one side and the electricity of radiator structure
Resistance body is in close contact, and another side is in close contact with metal pad.
Further, the thickness difference of electrode tip and resistive element is less than or equal to 1mm, and the thickness of described heat conduction glue-line exists
Between 0.01mm to 0.1mm, described conducting strip thickness is between 0.04mm to 0.4mm.
Further, described radiator structure also includes two panels metal fin, and described metal fin is arranged on radiating knot
Structure bottom, does not produce electrical connection between two panels metal fin, and described radiator structure passes through metal fin with metal pad even
Connect.
Further, the gap width between described two panels metal fin is more than or equal to 0.2mm.
Further, described two panels metal fin along resistive element side boundaries extend up to resistive element top surface it
On, do not produce between metal fin and resistive element and electrically connect.
Further, described electrode tip be two be oppositely arranged Z-shaped, between electrode supporting section and resistive element, angle is
30 °～150 °.
Further, described two electrode tips and resistive element are structure as a whole.
Further, described two electrode tips and resistive element weld together.
Further, described two electrode tips are cuboid or L-shaped, and described two electrode tips and resistive element are welded on one
Rise.
Further, described heat conduction glue-line includes heat conduction adhesive tape
Or
Component including following parts by weight：Silicone oil or 10～15 parts of silica gel, 0～40 part of talcum, 0～40 part of aluminium nitride,
0～5 part of mica, 0～3 part of zirconium oxide, 0～3 part of aluminum oxide.
Compared with prior art, the invention has the advantages that and beneficial effect：
1. in the present invention, radiator structure one side and resistive element are in close contact, and another side is tight with the metal pad on pcb board
Contact, the heat that resistive element produces can be transmitted directly on pad by radiator structure, shorten the path of Heat transmission, increased
The efficiency of Heat transmission, is compared to the current detector in the past adopting big two end electrodes, and radiating efficiency is higher, with a size of
As a example the current detector of 6.5mmx3.5mmx1.5mm, prior art power at most can only accomplish 2W, and the structure of the present invention makes electricity
Stream detector power is up to 7W.And the current detector of the present invention has less chip profile, saves on circuit board
Space.
2. pre-production of the present invention has well certain ledge structure electrode and resistive element, and one-shot forming does not need follow-up
Radiator structure is sticked between two step surfaces and under resistive element by machining on this basis, and technological process is simple,
Damage to electrode and radiator structure is less.
3. the heat conduction glue-line on radiator structure is very thin, can be good at infiltrating and be attached between two solid interfaces, real
Contact between the face of existing heat dissipation interface and face, can overcome the disadvantages that the not enough problem of the compactness contacting between solid and solid interface,
Make contact surface not produce hole, gap, reduce the thermal resistance of interface heat transfer, adhesion is strong, and long-time stability are good.Heat-conducting glue is filled
There are talcum, aluminium nitride, mica, zirconium oxide, the excellent inorganic non-metallic particle of the heat conduction such as aluminum oxide, there is outstanding thermal conductivity
Can, or using Bergquist Bond Ply series heat conduction adhesive tape, two ways is respectively provided with excellent heat conductivility and bonding is strong
Degree.
4. the radiator structure in the present invention can also increase extra metal fin, and metal fin can also be from entirely dissipating
The bottom of heat structure extends out on the top surface being folded upward at resistive element, makes radiator structure more firm, heat dispersion is more
Superior.
Brief description
Fig. 1 is high power current detector entirety sectional view in embodiment one.
Fig. 2 is embodiment one radiator structure sectional view.
Fig. 3 is embodiment two radiator structure sectional view.
Fig. 4 is the high power current detector overall structure diagram of embodiment three.
Fig. 5 is high power current detector entirety sectional view in example IV.
Fig. 6 is high power current detector entirety sectional view in embodiment five.
Fig. 7 is high power current detector entirety sectional view in embodiment six.
Fig. 8 is high power current detector entirety sectional view in embodiment six.
Reference numerals list：
1- radiator structure, 2- conducting strip, 3- upper end heat conduction glue-line, 4- lower end heat conduction glue-line, 5- first metal fin, 6-
Second metal fin, 7- resistive element, 8- electrode tip, 8-1- resistive element linkage section, 8-2- electrode supporting section, 8-3- metal welding
Disk contact-segment, 10- protective layer, 11- weld seam, 14- metal pad, 15-PCB plate, 17- top folding line.
Specific embodiment
The technical scheme present invention being provided below with reference to specific embodiment is described in detail it should be understood that following concrete
Embodiment is only illustrative of the invention and is not intended to limit the scope of the invention.
Embodiment one：
As shown in figure 1, a kind of high power current detector, comprise resistive element 7, electrode tip 8, radiator structure 1 and protection
Layer 10, two electrode tips 8 are separately positioned on the two ends of resistive element 7 and are electrically connected with resistive element 7 formation, and protective layer 10 covers in electricity
On resistance body 7, radiator structure 1 is arranged at the bottom of resistive element 7, and the integral thickness ratio resistance body 7 of electrode tip 8 is thick, therefore two electricity
Form cavity, radiator structure 1 is placed in this cavity, entirely electricity between extreme head, resistive element, the metal pad 14 of PCB substrate 15
Stream detector is welded on the metal pad 14 of PCB substrate 15.Thickness difference between electrode tip 8 and resistive element 7 namely holds
The height of cavity of radiator structure received should be less than or is equal to 1mm, to ensure the tight of radiator structure and resistive element and metal pad
Contact.Protective layer covers in resistive element upper surface and side, does not cover electrode and radiator structure, by electrode and radiator structure pair
Resistance body portion outside the thermal window of pcb board carries out encapsulating protection, thus avoiding erosion and the destruction in the external world.
Fig. 2 is a kind of structure of radiator structure 1, including conducting strip 2, upper end heat conduction glue-line 3 and lower end heat conduction glue-line 4.Lead
Backing 2 is good and material that have certain support strength is made, such as Kapton, aluminum oxide by heat conduction and electrical insulation capability
Potsherd, alumimium nitride ceramic sheet etc..The thickness of conducting strip 2 is (to include two ends point value) between 0.04mm to 0.4mm, conducting strip 2
Length and width can as the size of resistive element 7 it is also possible to beyond resistive element 7 size.The upper and lower surface of conducting strip 2
Upper end heat conduction glue-line 3 and lower end heat conduction glue-line 4 are coated respectively, upper end heat conduction glue-line 3 is used for connecting resistive element 7 and conducting strip 2,
Lower end heat conduction glue-line 4 is located at conducting strip 2 another side, for being bonded together conducting strip 2 and metal pad.Upper end heat conduction glue-line
3 and lower end heat conduction glue-line 4 thickness between 0.01mm to 0.1mm (include two ends point value).The main one-tenth of heat conduction glue line material
It is divided into silicone oil or 10～15 parts of silica gel, 0～40 part of talcum, 0～40 part of aluminium nitride, 0～5 part of mica, 0～3 part of zirconium oxide, oxidation
0～3 part of aluminium.Heat conduction glue-line 3 and lower end heat conduction glue-line 4 also can bring replacement with heat-conducting glue, and heat conduction adhesive tape can adopt
Bergquist Bond Ply series.Heat conduction glue-line on radiator structure is very thin, can be good at infiltrating and be attached to two admittedly
Between body interface, realize the contact between the face of heat dissipation interface and face, can overcome the disadvantages that contact between solid and solid interface tight
Property not enough problem, make contact surface not produce hole, gap, reduce the thermal resistance of interface heat transfer, adhesion is strong, long-time stability
Good.Heat-conducting glue is filled with talcum, aluminium nitride, mica, zirconium oxide, the excellent inorganic non-metallic particle of the heat conduction such as aluminum oxide, has
Outstanding heat conductivility, or using Bergquist Bond Ply series heat conduction adhesive tape, two ways is respectively provided with excellent heat conduction
Performance and adhesion strength.In the present embodiment, radiator structure one side and resistive element are in close contact, the metal welding on another side and pcb board
Disk is in close contact, and the heat that resistive element produces can be transmitted directly on pad by radiator structure, shortens the path of Heat transmission,
Increased the efficiency of Heat transmission, be compared to the current detector in the past adopting big two end electrodes, radiating efficiency is higher, for example
The a size of current detector of 6.5mmx3.5mmx1.5mm, prior art power at most can only accomplish 2W, and the structure of the present invention makes
The current detector power of this size is up to 3W.
Embodiment two：
As the improvement of embodiment one, the radiator structure 1 in this example increased two panels gold on the basis of first embodiment
Belong to fin 5,6, as shown in figure 3, the first metal fin 5 and the second metal fin 6 are arranged on the bottommost of radiator structure,
They pass through lower end heat conduction glue-line 4 and conducting strip 2 connects, and metal fin 5 and 6 can be welded to metal pad 14 with some
On.Two metal fins are not formed with two end electrodes or resistive element and electrically connect, and also do not form electrical connection between two metal fins,
For a size of current detector of 6.5mmx3.5mm, preferred metal fin 5,6 thickness be less than or be equal to 0.2mm, two
Spacing between metal fin should be greater than or is equal to 0.2mm, just can make not formed between two metal fins to conduct.Metal
Fin 5 is the same with 6 length and width, and its width (with the line between two electrodes as length direction, as width vertical with length direction
Degree direction) can be it is also possible to exceed the width of resistive element 7 as the width of resistive element 7.The present embodiment is in first embodiment
Increased two metal fins on the basis of radiator structure, and metal fin can be connected with metal pad by welding,
Greatly improve radiating efficiency, and use central current detector more solid and reliable with the connection of pcb board in circuit.
The a size of current detector of 6.5mmx3.5mmx1.5mm in the present embodiment, prior art power at most can only do
To 2W, the structure of the present invention makes current detector power be up to 5W.
Embodiment three：
In order to further enhance radiating effect, as the improvement of embodiment two, as shown in figure 4, the base in second embodiment
Make the first metal fin 5 and the second metal fin 6 can extend along its width respectively on plinth, and all along resistive element 7
Side boundaries be folded upward at extending on resistive element top surface twice afterwards, now the first metal fin 5 and the second metal dissipate
Backing 6 coats completely or part envelopes resistive element 7 top surface, the portion that resistive element 7 top surface is contacted with metal fin 5,6 with side
Position is coated with the protective layer 10 of insulation in advance, and for a size of current detector of 6.5mmx3.5mm, the thickness of protective layer 10 is big
In or be equal to 0.03mm it is ensured that the electric insulation of metal fin 5 and 6 and resistive element 7.Protective layer 10 is except separating resistive element and dissipating
Outside backing, also resistive element is exposed with aerial remainder and carries out encapsulating protection.The metal fin of the present embodiment from
The bottom of whole radiator structure extends out on the top surface being folded upward at resistive element, makes radiator structure more firm, thermal diffusivity
Can be more superior.The such as a size of current detector of 6.5mmx3.5mmx1.5mm, prior art power at most can only be accomplished
2W, the structure of the present invention makes current detector power be up to 7W.
Example IV：
As the preferred version of embodiment one to embodiment three, as shown in figure 5, resistive element 7 and both sides electrode tip 8 are one
Body structure, is made by with a piece of sheet metal, passes through bending machine respectively and rolls over twice along different directions respectively by two end electrodes, with electricity
Resistance body 7 forms a step surface respectively on both sides, and this step surface also once can be stamped to form by stamping machine.Two electrode tip steps
Form cavity between face, the lower surface of resistive element 7 and metal pad.Both sides electrode tip 8 include both sides step surface and
Its adjacent regions, be equivalent to as shown in Figure 1 two relative Z-shaped, including resistive element linkage section 8-1, electrode supporting section 8-2, gold
Belong to contact pads section 8-3, the part that electrode tip 8 is contacted with metal pad 14 is metal pad contact-segment 8-3 and resistive element 7
Parallel, the angle [alpha] being formed between electrode supporting section 8-2 and metal pad contact-segment 8-3 (is formed equal between 8-2 and resistive element 7
Angle) should be 30 °～150 °.For a size of current detector of 6.5mmx3.5mm, preferred scheme is as illustrated in the drawing
Electrode supporting section 8-2 is vertical with resistive element, makes the cavity height of receiving radiator structure, that is, resistive element 7 lower surface and electrode
Vertical range H between the lower surface of termination 8 should be less than or is equal to 1mm, ensure that radiator structure is adjacent to pcb board.By first
The radiator structure 1 of embodiment, second embodiment or 3rd embodiment is placed in cavity, at 110 DEG C～150 DEG C heating 5～
30min, is realized radiator structure 1 and is closely connected with resistive element 7 and pad, play the effect of Heat transmission.
The present embodiment pre-production has well certain ledge structure electrode and resistive element, and one-shot forming does not need follow-up
Radiator structure is sticked between two step surfaces and under resistive element by machining on this basis, and technological process is simple,
Damage to electrode and radiator structure is less.
Embodiment five：
As another preferred version of embodiment one to embodiment three, as shown in fig. 6, resistive element 7 and electrode in this example
The non-integral structure in termination 8, can be made with different materials respectively.Resistive element 7 and electrode tip 8 pass through electron beam welding one
Rise, between form two weld seams 11 respectively, resistive element 7 and the generous consistent size of electrode tip 8.Subsequently pass through bending machine by two
Termination electrode termination 8 is rolled over twice along different directions respectively, formed two relative Z-shaped.This shape is possible with stamping machine and once rushes
Swaging becomes.It is also possible to first pass through bending machine two end electrodes termination 8 is rolled over two along different directions respectively in addition to above-mentioned technique
Secondary, formed two relative Z-shaped after weld with resistive element 7 again.Electrode tip 8 specifically includes resistive element linkage section 8-1, electrode props up
Support section 8-2, metal pad contact-segment 8-3, wherein resistive element 7 and linkage section 8-1 on a horizontal plane, parallel to metal pad
Contact-segment 8-3, electrode supporting section 8-2 and resistive element 7 and all at an angle with contact-segment 8-3.For a size of
The current detector of 6.5mmx3.5mm, the distance between electrode tip 8 top folding line 17 and weld seam 11 should be greater than or be equal to
0.5mm, it is to avoid damage weld seam 11 in Forging Process.The angle being formed between electrode supporting section 8-2 and metal pad contact-segment 8-3
Degree α (equal to angulation between 8-2 and resistive element 7) should be 30 °～150 °, resistive element 7 lower surface and electrode tip 8 lower surface
Between vertical range H should be less than or be equal to 1mm, radiator structure can be allowed to be adjacent to pcb board.Between resistive element and two electrode tips
Form cavity, the radiator structure 1 of first embodiment, second embodiment or 3rd embodiment is placed in this cavity, 110 DEG C～
Heat 5～30min at 150 DEG C, realize radiator structure 1 and be closely connected with resistive element 7 and pad, play the effect of Heat transmission.
Embodiment six：
As another preferred version of embodiment one to embodiment three, as shown in fig. 7, resistive element 7 and electrode tip 8 are non-
Integrative-structure, can be made with different materials respectively.Two electrode tips 8 are cuboid, pass through electron beam welding with resistive element 7
Together, both sides respectively form weld seam 11.Vertical range H between resistive element 7 lower surface and electrode tip 8 lower surface should be less than or
Equal to 1mm.Electrode tip 8 upper surface at two ends and the either flush of resistive element 7, shape between resistive element 7 bottom surface and electrode tip 8
Become a cavity, radiator structure 1 is placed in this cavity, at 110 DEG C～150 DEG C, heat 5～30min, realize radiator structure 1 with
Resistive element 7 and pad closely connect, and play the effect of Heat transmission.
Embodiment seven：
As another preferred version of embodiment one to embodiment three, as shown in figure 8, resistive element 7 and electrode tip 8 are non-
Integrative-structure, can be made with different materials respectively.First pass through bending machine two end electrodes termination 8 is bent once L-shaped, then
Pass through together with electron beam welding with resistive element 7, both sides respectively form weld seam 11.Two electrode tips 8 include electrode supporting section 8-2,
Metal pad contact-segment 8-3, the part that electrode tip 8 is contacted with metal pad 14 is metal pad contact-segment 8-3 and resistance
Body 7 is parallel, and the angle [alpha] being formed between electrode supporting section 8-2 and metal pad contact-segment 8-3 is (equal between 8-2 and resistive element 7
Angulation) should be 30 °～150 °, preferably 90 ° in this example.Vertical between resistive element 7 lower surface and electrode tip 8 lower surface
Should be less than apart from H or be equal to 1mm.Electrode tip 8 upper surface at two ends and the either flush of resistive element 7, resistive element 7 bottom surface and electricity
Form a cavity, radiator structure 1 is placed in this cavity, heats 5～30min at 110 DEG C～150 DEG C, real between extreme 8
Existing radiator structure 1 is closely connected with resistive element 7 and pad, plays the effect of Heat transmission.
Technological means disclosed in the present invention program is not limited only to the technological means disclosed in above-mentioned embodiment, also includes
By the formed technical scheme of above technical characteristic any combination.It should be pointed out that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of high power current detector, including resistive element, two electrode tips, protective layer and radiator structure, described two electrodes
Termination is separately positioned on resistive element two ends and is electrically connected with resistive element formation, and described protective layer covers on resistive element, its feature
It is：Described two electrode tip integral thickness are more than resistance body thickness, and described radiator structure is arranged at two electrode below resistive element
Between termination, described radiator structure includes conducting strip and is separately positioned on the heat conduction glue-line on conducting strip two sides, radiator structure its
Middle one side is in close contact with resistive element, and another side is in close contact with metal pad.
2. high power current detector according to claim 1 it is characterised in that：Described electrode tip and the thickness of resistive element
Degree difference is less than or equal to 1mm, and between 0.01mm to 0.1mm, described conducting strip thickness is the thickness of described heat conduction glue-line
Between 0.04mm to 0.4mm.
3. high power current detector according to claim 1 it is characterised in that：Described radiator structure also includes two panels gold
Belong to fin, described metal fin is arranged on radiator structure bottom, does not produce electrical connection between two panels metal fin, described
Radiator structure is connected with metal pad by metal fin.
4. high power current detector according to claim 3 it is characterised in that：Between described two panels metal fin
Gap width is more than or equal to 0.2mm.
5. high power current detector according to claim 4 it is characterised in that：Described two panels metal fin is along resistance
The side boundaries of body extend up on resistive element top surface, do not produce and electrically connect between metal fin and resistive element.
6. the high power current detector according to claim 1-5 it is characterised in that：Described electrode tip sets relatively for two
That puts is Z-shaped, and between electrode supporting section and resistive element, angle is 30 °～150 °.
7. high power current detector according to claim 6 it is characterised in that：Described two electrode tips and resistive element are
Integrative-structure.
8. high power current detector according to claim 6 it is characterised in that：Described two electrode tips and resistive element weldering
It is connected together.
9. the high power current detector according to claim 1-5 it is characterised in that：Described two electrode tips are cuboid
Or L-shaped, described two electrode tips and resistive element weld together.
10. high power current detector according to claim 1 it is characterised in that：Described heat conduction glue-line includes heat-conducting glue
Band or
The component of following parts by weight：Silicone oil or 10～15 parts of silica gel, 0～40 part of talcum, 0～40 part of aluminium nitride, mica 0～5
Part, 0～3 part of zirconium oxide, 0～3 part of aluminum oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611012329.5A CN106384633B (en) | 2016-11-17 | 2016-11-17 | High power current detector |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611012329.5A CN106384633B (en) | 2016-11-17 | 2016-11-17 | High power current detector |
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| CN106384633A true CN106384633A (en) | 2017-02-08 |
| CN106384633B CN106384633B (en) | 2019-02-05 |
Family
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Cited By (3)
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| CN108538527A (en) * | 2018-06-19 | 2018-09-14 | 常德思高技术有限公司 | A kind of chip resistor and its manufacturing method |
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
| CN112198189A (en) * | 2020-08-26 | 2021-01-08 | 北京卫星制造厂有限公司 | Power module thermal resistance testing device based on static measurement method |
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| CN108538527B (en) * | 2018-06-19 | 2024-01-26 | 常德思高技术有限公司 | Chip resistor and manufacturing method thereof |
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
| CN112198189A (en) * | 2020-08-26 | 2021-01-08 | 北京卫星制造厂有限公司 | Power module thermal resistance testing device based on static measurement method |
| CN112198189B (en) * | 2020-08-26 | 2024-05-14 | 北京卫星制造厂有限公司 | Power module thermal resistance testing device based on static measurement method |
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