CN106384633B - High power current detector - Google Patents
High power current detector Download PDFInfo
- Publication number
- CN106384633B CN106384633B CN201611012329.5A CN201611012329A CN106384633B CN 106384633 B CN106384633 B CN 106384633B CN 201611012329 A CN201611012329 A CN 201611012329A CN 106384633 B CN106384633 B CN 106384633B
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- resistor body
- current detector
- radiator structure
- electrode
- high power
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a kind of high power current detectors; including resistor body; two electrode tips, protective layer and radiator structure; two electrode tips are separately positioned on resistor body both ends and are electrically connected with resistor body formation; protective layer is covered on resistor body; two electrode tip integral thickness are greater than resistance body thickness; radiator structure is set to below resistor body between two electrode tips; radiator structure includes thermally conductive sheet and the heat-conducting glue layer for being separately positioned on thermally conductive sheet two sides; wherein one side and the resistor body of radiator structure are in close contact, and another side and metal pad are in close contact.The present invention has small chip shape, shorter heat transfer path, there is good heat dissipation effect under conditions of not increasing current detector size, to have lower product temperature rise, it can be achieved that applying under higher power, more accurately carrying out Real-time Feedback to size of current.
Description
Technical field
The invention belongs to electronic component technology fields, are related to a kind of current detector, especially a kind of band radiator structure and
It can be used for surface-pasted current detector.
Background technique
Surface mount current detector is mainly used for the detecting of electric current in circuit, can be accurately and in time in feed circuit
The size of electric current, circuit system use corresponding measure to the excessive or too small electric current detected again.But general surface
Attachment current detector electric current under high-power energization is larger, and the thermal energy that resistor body itself generates also increases accordingly, if internal
Thermal energy can not pass in time can bring detector resistance value deviation even damage.At present the more popular way of industry be by
The width of resistor body is broadening, and electrode size increases, and channel from resistor body to electrode that radiate which increases and electrode are to weldering
The heat dissipation area of disk and then the efficiency for increasing heat dissipation, but thus may require that additional circuit board space, it is unfavorable for element body
Long-pending diminution.
Chinese patent 201380067037.X discloses a kind of surface mount current detector, including a resistor body and its
Two end electrodes, electrode are connected on pcb board by welding, a radiator being electrically insulated and two end, end
Can be insulation or conductive, radiator is fitted tightly over above resistor body by heat-conducting glue, and radiator end passes through thermally conductive
Glue or the mode of welding are connected to the top of electrode.This mode manufacture craft is simple, but heat dissipation path is too long, it is necessary to pass through
Resistor body is transmitted to the radiator of top, and radiator is transferred to its end again, then is transferred to electrode tip by end, finally by
Electrode tip is transferred on pcb board, in addition, the end of electrode and radiator needs biggish size design, otherwise can become entire
Neck region in heat dissipation path.
And Chinese patent 02130724.5 discloses a kind of miniature low voltage and low resistance current sensor, and cooling mechanism is set
It sets below the lower section of resistor body, cooling mechanism and protective layer is all arranged in the top of resistor body, electrode tip, resistance is arranged in both ends
The heat that body generates is transmitted to end by cooling mechanism and is transmitted on pcb board again.Description will be electric by galvanoplastics in patent
Pole thickeies, to raise cooling mechanism, increases heat dissipation effect, is empty because being provided with protective layer, outside protective layer in actual use
Gas, heat-conducting effect is excessively poor, and heat cannot directly be passed by cooling mechanism, and having thickeied electrode instead makes the road of heat transfer
Diameter is longer.
In conclusion surface mount current detector is not in the case where increasing resistor body width in the prior art, because of it
Structure limitation, heat dissipation effect is not ideal enough, to restrict its application power.
Summary of the invention
To solve the above problems, there is small chip shape, more the invention discloses a kind of high power current detector
Short heat transfer path has good heat dissipation effect, to have lower under conditions of not increasing current detector size
Product temperature rise, it can be achieved that applied under higher power, more accurately to size of current carry out Real-time Feedback.
In order to achieve the above object, the invention provides the following technical scheme:
A kind of high power current detector, including resistor body, two electrode tips, protective layer and radiator structure, two electricity
Extreme head is separately positioned on resistor body both ends and is electrically connected with resistor body formation, and the protective layer is covered on resistor body, described
Two electrode tip integral thickness are greater than resistance body thickness, and the radiator structure is set to below resistor body between two electrode tips,
The radiator structure includes thermally conductive sheet and the heat-conducting glue layer for being separately positioned on thermally conductive sheet two sides, the wherein one side and electricity of radiator structure
Resistance body is in close contact, and another side and metal pad are in close contact.
Further, the thickness difference of electrode tip and resistor body is less than or equal to 1mm, and the thickness of the heat-conducting glue layer exists
Between 0.01mm to 0.1mm, the thermally conductive sheet is with a thickness of between 0.04mm to 0.4mm.
Further, the radiator structure further includes two panels metal fin, and the metal fin setting is tied in heat dissipation
Structure bottom, does not generate electrical connection between two panels metal fin, and the radiator structure is connected by metal fin and metal pad
It connects.
Further, the gap width between the two panels metal fin is greater than or equal to 0.2mm.
Further, the two panels metal fin along the side boundaries of resistor body extend up to resistor body top surface it
On, it does not generate and is electrically connected between metal fin and resistor body.
Further, the electrode tip is oppositely arranged Z-shaped for two, and angle is between electrode supporting section and resistor body
30 °~150 °.
Further, two electrode tip and resistor body are structure as a whole.
Further, two electrode tip and resistor body weld together.
Further, two electrode tip is cuboid or L shape, and two electrode tip and resistor body are welded on one
It rises.
Further, the heat-conducting glue layer includes heat-conducting glue band
Or
Component including following parts by weight: silicone oil or 10~15 parts of silica gel, 0~40 part of talcum, 0~40 part of aluminium nitride,
0~5 part of mica, 0~3 part of zirconium oxide, 0~3 part of aluminium oxide.
Compared with prior art, the invention has the advantages that and the utility model has the advantages that
1. radiator structure one side is in close contact with resistor body in the present invention, another side and the metal pad on pcb board are close
Contact, the heat that resistor body generates can be transmitted directly on pad by radiator structure, shorten the path of Heat transmission, increase
The efficiency of Heat transmission, be compared in the past use big two end electrodes current detector, radiating efficiency is higher, with having a size of
For the current detector of 6.5mmx3.5mmx1.5mm, prior art power can only at most accomplish 2W, and structure of the invention makes electricity
Stream detector power is up to 7W.And current detector of the invention has lesser chip shape, saves on circuit board
Space.
2. there is well certain step structure electrode and resistor body, one-pass molding not to need subsequent for pre-production of the present invention
Radiator structure, is adhered between two step surfaces and under resistor body by machining on this basis, and process flow is simple,
It is smaller to the damage of electrode and radiator structure.
3. the heat-conducting glue layer on radiator structure is very thin, can be good at infiltrating and being attached between two solid interfaces, it is real
Contact between the face and face of existing heat dissipation interface, can overcome the disadvantages that the problem of the compactness deficiency contacted between solid and solid interface,
So that contact surface is not generated hole, gap, reduce the thermal resistance of interface heat transfer, adhesion strength is strong, and long-time stability are good.Heat-conducting glue filling
There are talcum, aluminium nitride, mica, zirconium oxide, the thermally conductive excellent inorganic non-metallic particle such as aluminium oxide, with outstanding thermal conductivity
Can, or Bergquist Bond Ply series heat-conducting glue band is used, it is strong that two ways all has excellent heating conduction and bonding
Degree.
4. the radiator structure in the present invention can also increase additional metal fin, metal fin can also be dissipated from entire
The bottom of heat structure, which extends out, to be folded upward on the top surface of resistor body, enables radiator structure more secured, and heat dissipation performance is more
It is superior.
Detailed description of the invention
Fig. 1 is high power current detector entirety sectional view in embodiment one.
Fig. 2 is one radiator structure cross-sectional view of embodiment.
Fig. 3 is two radiator structure cross-sectional view of embodiment.
Fig. 4 is the high power current detector overall structure diagram of embodiment three.
Fig. 5 is high power current detector entirety sectional view in example IV.
Fig. 6 is high power current detector entirety sectional view in embodiment five.
Fig. 7 is high power current detector entirety sectional view in embodiment six.
Fig. 8 is high power current detector entirety sectional view in embodiment six.
Reference signs list:
1- radiator structure, 2- thermally conductive sheet, the upper end 3- heat-conducting glue layer, the lower end 4- heat-conducting glue layer, the first metal fin of 5-, 6-
Second metal fin, 7- resistor body, 8- electrode tip, 8-1- resistor body linkage section, 8-2- electrode supporting section, 8-3- metal welding
Disk contact-segment, 10- protective layer, 11- weld seam, 14- metal pad, 15-PCB plate, the top 17- folding line.
Specific embodiment
Technical solution provided by the invention is described in detail below with reference to specific embodiment, it should be understood that following specific
Embodiment is only illustrative of the invention and is not intended to limit the scope of the invention.
Embodiment one:
As shown in Figure 1, a kind of high power current detector, includes resistor body 7, electrode tip 8, radiator structure 1 and protection
Layer 10, two electrode tips 8 are separately positioned on the both ends of resistor body 7 and are electrically connected with the formation of resistor body 7, and protective layer 10 is covered on electricity
On resistance body 7, radiator structure 1 is set to the bottom of resistor body 7, and the integral thickness specific resistance body 7 of electrode tip 8 is thick, therefore two electricity
Extreme head, resistor body, PCB substrate 15 metal pad 14 between form cavity, radiator structure 1 is placed in the cavity, entire electricity
Stream detector is welded on the metal pad 14 of PCB substrate 15.Thickness difference between electrode tip 8 and resistor body 7 namely holds
The height of cavity of radiator structure received should be less than or be equal to 1mm, to guarantee the close of radiator structure and resistor body and metal pad
Contact.Protective layer is covered on resistor body upper surface and side, does not cover electrode and radiator structure, by electrode and radiator structure pair
Resistance body portion except the thermal window of pcb board carries out encapsulating protection, to avoid extraneous erosion and destruction.
Fig. 2 is a kind of structure of radiator structure 1, including thermally conductive sheet 2, upper end heat-conducting glue layer 3 and lower end heat-conducting glue layer 4.It leads
Good by the thermally conductive and electrical insulation capability and material with certain support strength of backing 2 is made, such as Kapton, aluminium oxide
Potsherd, alumimium nitride ceramic sheet etc..Thermally conductive sheet 2 with a thickness of (including both ends point value), thermally conductive sheet 2 between 0.04mm to 0.4mm
Length and width can as the size of resistor body 7, can also exceed resistor body 7 size.The upper and lower surface of thermally conductive sheet 2
Upper end heat-conducting glue layer 3 and lower end heat-conducting glue layer 4 are coated respectively, upper end heat-conducting glue layer 3 is used to connect resistor body 7 and thermally conductive sheet 2,
Lower end heat-conducting glue layer 4 is located at 2 another side of thermally conductive sheet, for thermally conductive sheet 2 to be bonded together with metal pad.Upper end heat-conducting glue layer
3 and lower end heat-conducting glue layer 4 thickness between 0.01mm to 0.1mm (including both ends point value).Heat-conducting glue layer material it is main at
It is divided into silicone oil or 10~15 parts of silica gel, 0~40 part of talcum, 0~40 part of aluminium nitride, 0~5 part of mica, 0~3 part of zirconium oxide, oxidation
0~3 part of aluminium.Heat-conducting glue layer 3 and lower end heat-conducting glue layer 4 can also bring replacement with heat-conducting glue, and heat-conducting glue band can use
Bergquist Bond Ply series.Heat-conducting glue layer on radiator structure is very thin, can be good at infiltrating and being attached to two admittedly
Between body interface, realize the contact between the face of heat dissipation interface and face, can overcome the disadvantages that contacted between solid and solid interface it is close
Property insufficient problem, so that contact surface is not generated hole, gap, reduce the thermal resistance of interface heat transfer, adhesion strength is strong, long-time stability
It is good.Heat-conducting glue has filled with talcum, aluminium nitride, mica, zirconium oxide, the thermally conductive excellent inorganic non-metallic particle such as aluminium oxide
Outstanding heating conduction, or Bergquist Bond Ply series heat-conducting glue band is used, two ways all has excellent thermally conductive
Performance and adhesion strength.Radiator structure one side is in close contact with resistor body in the present embodiment, the metal welding on another side and pcb board
Disk is in close contact, and the heat that resistor body generates can be transmitted directly on pad by radiator structure, shortens the path of Heat transmission,
The efficiency for increasing Heat transmission is compared to the current detector for using big two end electrodes in the past, and radiating efficiency is higher, such as
Current detector having a size of 6.5mmx3.5mmx1.5mm, prior art power can only at most accomplish 2W, and structure of the invention makes
The current detector power of this size is up to 3W.
Embodiment two:
As the improvement of embodiment one, the radiator structure 1 in this example increases two panels gold on the basis of first embodiment
Belong to cooling fin 5,6, as shown in figure 3, the bottommost of radiator structure is arranged in the first metal fin 5 and the second metal fin 6,
They are connected by lower end heat-conducting glue layer 4 and thermally conductive sheet 2, and metal fin 5 and 6 can be welded to metal pad 14 with some
On.Two metal fins are not electrically connected with two end electrodes or resistor body formation, also do not form electrical connection between two metal fins,
For the current detector having a size of 6.5mmx3.5mm, preferred metal fin 5,6 thickness be less than or be equal to 0.2mm, two
Spacing between metal fin should be greater than or be equal to 0.2mm, can just make not formed between two metal fins to conduct.Metal
Cooling fin 5 is as 6 length and width, and (using the line between two electrodes as length direction, vertical with length direction be width to width
Spend direction) it can also exceed the width of resistor body 7 as the width of resistor body 7.The present embodiment is in first embodiment
Two metal fins are increased on the basis of radiator structure, and metal fin can be connected by welding with metal pad,
Radiating efficiency is greatly improved, and the connection of current detector and pcb board is stronger reliable in circuit use.
Having a size of the current detector of 6.5mmx3.5mmx1.5mm in the present embodiment, prior art power can only at most be done
To 2W, structure of the invention makes current detector power be up to 5W.
Embodiment three:
In order to further enhance heat dissipation effect, as the improvement of embodiment two, as shown in figure 4, in the base of second embodiment
Enable the first metal fin 5 and the second metal fin 6 that can extend respectively along its width direction on plinth, and along resistor body 7
Side boundaries be folded upward at and extended on resistor body top surface afterwards twice, the first metal fin 5 and the second metal dissipate at this time
The cladding or part completely of backing 6 envelopes 7 top surface of resistor body, the portion that 7 top surface of resistor body and side are contacted with metal fin 5,6
Position is coated with the protective layer 10 of insulation in advance, and for the current detector having a size of 6.5mmx3.5mm, the thickness of protective layer 10 is big
In or be equal to 0.03mm, guarantee being electrically insulated for metal fin 5 and 6 and resistor body 7.Protective layer 10 is in addition to separating resistor body and dissipating
Except backing, encapsulating protection also is carried out to the aerial rest part of resistor body exposure.The metal fin of the present embodiment from
The bottom of entire radiator structure, which extends out, to be folded upward on the top surface of resistor body, enables radiator structure more secured, thermal diffusivity
It can be more superior.Such as the current detector having a size of 6.5mmx3.5mmx1.5mm, prior art power can only at most be accomplished
2W, structure of the invention make current detector power be up to 7W.
Example IV:
As embodiment one to the preferred embodiment of embodiment three, as shown in figure 5, resistor body 7 and both sides electrode tip 8 are one
Body structure is respectively rolled over two end electrodes along different directions twice, with electricity by bending machine by being made with a piece of sheet metal respectively
Resistance body 7 is respectively formed a step surface on both sides, which can also be once stamped to form by press machine.Two electrode tip steps
Face, resistor body 7 lower end surface and metal pad between form cavity.Both sides electrode tip 8 include both sides step surface and
Its adjacent regions is equivalent to two opposite Z-shaped, including resistor body linkage section 8-1, electrode supporting section 8-2, gold as shown in Figure 1
Belong to contact pads section 8-3, the part that electrode tip 8 is in contact with metal pad 14 i.e. metal pad contact-segment 8-3 and resistor body 7
In parallel, the angle [alpha] formed between electrode supporting section 8-2 and metal pad contact-segment 8-3 (is formed equal between 8-2 and resistor body 7
Angle) it should be 30 °~150 °.For the current detector having a size of 6.5mmx3.5mm, Preferable scheme is that as illustrated in the drawing
Electrode supporting section 8-2 is vertical with resistor body, makes the cavity height for accommodating radiator structure, that is, 7 lower end surface of resistor body and electrode
Vertical range H between 8 lower end surface of end should be less than or be equal to 1mm, can guarantee that radiator structure is adjacent to pcb board.By first
The radiator structure 1 of embodiment, second embodiment or 3rd embodiment is placed in cavity, at 110 DEG C~150 DEG C heat 5~
30min realizes that radiator structure 1 is closely connect with resistor body 7 and pad, plays the role of Heat transmission.
There is well certain step structure electrode and resistor body, one-pass molding not to need subsequent for the present embodiment pre-production
Radiator structure, is adhered between two step surfaces and under resistor body by machining on this basis, and process flow is simple,
It is smaller to the damage of electrode and radiator structure.
Embodiment five:
As another preferred embodiment of embodiment one to embodiment three, as shown in fig. 6, resistor body 7 and electrode in this example
The non-integral structure in end 8, can be made of different materials respectively.Resistor body 7 and electrode tip 8 pass through electron beam welding one
Rise, between be respectively formed two weld seams 11, resistor body 7 is consistent with the generous size of electrode tip 8.Then pass through bending machine for two
Termination electrode end 8 respectively along different directions folding twice, formed two it is opposite Z-shaped.The shape can also be used press machine and once rush
Swaging at.In addition to above-mentioned technique, bending machine can also be first passed through by two end electrodes end 8 respectively along different directions folding two
It is secondary, formed two it is opposite it is Z-shaped after welded again with resistor body 7.Electrode tip 8 specifically includes resistor body linkage section 8-1, electrode branch
Section 8-2, metal pad contact-segment 8-3 are supportted, wherein resistor body 7 and linkage section 8-1 are parallel to metal pad on a horizontal plane
Contact-segment 8-3, electrode supporting section 8-2 are at an angle with resistor body 7 and with contact-segment 8-3.For having a size of
The current detector of 6.5mmx3.5mm, the distance between 8 top folding line 17 of electrode tip and weld seam 11 should be greater than or be equal to
0.5mm avoids damageeing weld seam 11 in bending process.The angle formed between electrode supporting section 8-2 and metal pad contact-segment 8-3
Degree α (forming angle equal between 8-2 and resistor body 7) should be 30 °~150 °, 7 lower end surface of resistor body and 8 lower end surface of electrode tip
Between vertical range H should be less than or be equal to 1mm, radiator structure can be allowed to be adjacent to pcb board.Between resistor body and two electrode tips
Form cavity, the radiator structure 1 of first embodiment, second embodiment or 3rd embodiment is placed in the cavity, 110 DEG C~
5~30min is heated at 150 DEG C, is realized that radiator structure 1 is closely connect with resistor body 7 and pad, is played the role of Heat transmission.
Embodiment six:
As another preferred embodiment of embodiment one to embodiment three, as shown in fig. 7, resistor body 7 and electrode tip 8 are non-
Integral structure can be made of different materials respectively.Two electrode tips 8 are cuboid, pass through electron beam welding with resistor body 7
Together, both sides respectively form weld seam 11.Vertical range H between 8 lower end surface of 7 lower end surface of resistor body and electrode tip should be less than or
Equal to 1mm.The either flush of electrode tip 8 upper surface and resistor body 7 at both ends, shape between 7 bottom surface of resistor body and electrode tip 8
At a cavity, radiator structure 1 is placed in the cavity, at 110 DEG C~150 DEG C heat 5~30min, realize radiator structure 1 with
Resistor body 7 and pad closely connect, and play the role of Heat transmission.
Embodiment seven:
As another preferred embodiment of embodiment one to embodiment three, as shown in figure 8, resistor body 7 and electrode tip 8 are non-
Integral structure can be made of different materials respectively.First pass through bending machine two end electrodes end 8 is bent it is primary at L-shaped, then
It is connected together with resistor body 7 by electron beam welding, both sides respectively form weld seam 11.Two electrode tips 8 include electrode supporting section 8-2,
Metal pad contact-segment 8-3, the part that electrode tip 8 is in contact with metal pad 14 i.e. metal pad contact-segment 8-3 and resistance
Body 7 is parallel, and the angle [alpha] formed between electrode supporting section 8-2 and metal pad contact-segment 8-3 (is equal between 8-2 and resistor body 7
Form angle) it should be 30 °~150 °, preferably 90 ° in this example.It is vertical between 7 lower end surface of resistor body and 8 lower end surface of electrode tip
Distance H should be less than or be equal to 1mm.The either flush of electrode tip 8 upper surface and resistor body 7 at both ends, 7 bottom surface of resistor body and electricity
A cavity is formed between extreme head 8, radiator structure 1 is placed in the cavity, and 5~30min is heated at 110 DEG C~150 DEG C, real
Existing radiator structure 1 is closely connect with resistor body 7 and pad, plays the role of Heat transmission.
The technical means disclosed in the embodiments of the present invention is not limited only to technological means disclosed in above embodiment, further includes
Technical solution consisting of any combination of the above technical features.It should be pointed out that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (8)
1. a kind of high power current detector, including resistor body, two electrode tips, protective layer and radiator structure, two electrode
End is separately positioned on resistor body both ends and is electrically connected with resistor body formation, and the protective layer is covered on resistor body, feature
Be: the two electrode tips integral thickness is greater than resistance body thickness, and the radiator structure is set to two electrodes below resistor body
Between end, the radiator structure includes that thermally conductive sheet, the heat-conducting glue layer for being separately positioned on thermally conductive sheet two sides and setting are being radiated
The two panels metal fin of structural base, does not generate electrical connection between two panels metal fin, and wherein one side is thermally conductive on thermally conductive sheet
Glue and resistor body are in close contact, and another side heat-conducting glue is contacted with metal fin, and metal fin is connect with metal pad；It is described
Two panels metal fin extends up on resistor body top surface along the side boundaries of resistor body, metal fin and resistor body it
Between do not generate electrical connection.
2. high power current detector according to claim 1, it is characterised in that: the thickness of the electrode tip and resistor body
Degree difference be less than or equal to 1mm, the thickness of the heat-conducting glue layer between 0.01mm to 0.1mm, the thermally conductive sheet with a thickness of
Between 0.04mm to 0.4mm.
3. high power current detector according to claim 1, it is characterised in that: between the two panels metal fin
Gap width is greater than or equal to 0.2mm.
4. high power current detector according to claim 1 to 3, it is characterised in that: the electrode tip is set relatively for two
That sets is Z-shaped, and angle is 30 °~150 ° between electrode supporting section and resistor body.
5. high power current detector according to claim 4, it is characterised in that: two electrode tip and resistor body are
Integral structure.
6. high power current detector according to claim 4, it is characterised in that: two electrode tip and resistor body weldering
It is connected together.
7. high power current detector according to claim 1, it is characterised in that: two electrode tip be cuboid or
L shape, two electrode tip and resistor body weld together.
8. high power current detector according to claim 1, it is characterised in that: the heat-conducting glue layer includes heat-conducting glue band
Or
The component of following parts by weight: silicone oil or 10~15 parts of silica gel, 0~40 part of talcum, 0~40 part of aluminium nitride, mica 0~5
Part, 0~3 part of zirconium oxide, 0~3 part of aluminium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611012329.5A CN106384633B (en) | 2016-11-17 | 2016-11-17 | High power current detector |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611012329.5A CN106384633B (en) | 2016-11-17 | 2016-11-17 | High power current detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106384633A CN106384633A (en) | 2017-02-08 |
| CN106384633B true CN106384633B (en) | 2019-02-05 |
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| CN108538527B (en) * | 2018-06-19 | 2024-01-26 | 常德思高技术有限公司 | Chip resistor and manufacturing method thereof |
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
| CN112198189B (en) * | 2020-08-26 | 2024-05-14 | 北京卫星制造厂有限公司 | Power module thermal resistance testing device based on static measurement method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19638288A1 (en) * | 1996-09-19 | 1998-03-26 | Gerhard Dr Ing Meyer | Multiple conductor systems electric current detecting component |
| JP3803025B2 (en) * | 2000-12-05 | 2006-08-02 | 富士電機ホールディングス株式会社 | Resistor |
| CN204204532U (en) * | 2014-10-20 | 2015-03-11 | 致强科技股份有限公司 | The micro-resistance of metallic plate |
| CN206322540U (en) * | 2016-11-17 | 2017-07-11 | 南京萨特科技发展有限公司 | High power current detector |
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