CN106374869A - Patch-type quartz crystal resonator base - Google Patents

Patch-type quartz crystal resonator base Download PDF

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Publication number
CN106374869A
CN106374869A CN201610791842.2A CN201610791842A CN106374869A CN 106374869 A CN106374869 A CN 106374869A CN 201610791842 A CN201610791842 A CN 201610791842A CN 106374869 A CN106374869 A CN 106374869A
Authority
CN
China
Prior art keywords
base plate
lower floor
crystal resonator
quartz crystal
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610791842.2A
Other languages
Chinese (zh)
Inventor
何仁举
刘青彦
杨清明
黄建友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHENGDU KINGBRI FREQUENCY TECHNOLOGY CO LTD
Original Assignee
CHENGDU KINGBRI FREQUENCY TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHENGDU KINGBRI FREQUENCY TECHNOLOGY CO LTD filed Critical CHENGDU KINGBRI FREQUENCY TECHNOLOGY CO LTD
Priority to CN201610791842.2A priority Critical patent/CN106374869A/en
Publication of CN106374869A publication Critical patent/CN106374869A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

The invention discloses a patch-type quartz crystal resonator base, comprising an upper layer bottom plate and a lower layer bottom plate. The upper layer bottom plate and the lower layer bottom plate are overlapped and are adhered. Wafer overlapping tables are arranged on the top surface of the lower layer bottom plate. Bonding pads are arranged on the bottom surface of the lower layer bottom plate. The wafer overlapping tables and the bonding pads are electrically connected. The upper layer bottom plate is a hollow frame. The wafer overlapping tables are located in a hollow part of the upper layer base plate. There are two wafer overlapping tables. The two wafer overlapping tables are electrically insulated. Base materials of the upper layer bottom plate and the lower layer bottom plate are an FR4 material. According to the base, a production technology can be simplified, the energy consumption can be reduced in production, a production cycle can be shortened, and the production cost can be reduced.

Description

A kind of surface mount type quartz crystal resonator pedestal
Technical field
The present invention relates to electronic devices and components field, more particularly, to a kind of fr4 material surface mount type quartz crystal resonator pedestal.
Background technology
Quartz-crystal resonator is the FREQUENCY CONTROL components and parts made using the piezoelectric effect of alpha-quartz (α-sio2).Quartz Crystal resonator has frequency accuracy height, the stable characteristic of output frequency, and it is a kind of for stablizing frequency and selecting frequency Important frequencies components and parts.At wire communication, wireless telecommunications, radio and television, satellite communication, navigation, electronic measuring instrument, microcomputer It is widely applied in reason, the various dual-use product such as digital intelligent instrument, clock and watch, automobile, be now pottery with resonator base Porcelain pedestal, complex manufacturing, high energy consumption, the cycle is long, and manufacturing cost is high.
Content of the invention
The present invention is intended to provide a kind of surface mount type quartz crystal resonator pedestal, simplify production technology, in production, reduce energy Consumption, shortens the production cycle, reduces manufacturing cost.
For reaching above-mentioned purpose, the present invention employs the following technical solutions realization:
Surface mount type quartz crystal resonator pedestal disclosed by the invention, including upper strata base plate and lower floor's base plate, described upper strata Base plate is with lower floor's base plate mounted on top and bonding, and the top surface of described lower floor base plate is provided with chip and sets up the stage, and the bottom surface of lower floor's base plate sets There is pad, described chip is set up the stage and pad electrical connection, described upper strata base plate is the frame-type of hollow, and described chip is set up the stage positioned at upper Layer base plate hollow bulb, chip is set up the stage two, two chips set up the stage between electric insulation, the base of upper strata base plate and lower floor's base plate Material is fr4 material.
Preferably, described lower floor base plate is fr4 copper-clad plate, and described chip is set up the stage and passed sequentially through electrical cable, electrically connects Meet area and connect pad, described electrical cable, pad are fr4 copper-clad plate corrosion and are formed, described electrical connection area up/down perforation Lower floor's base plate.
Preferably, described lower floor base plate is rectangle, and the corner of lower floor's base plate is the arc of indent, and described electrical connection area is Turmeric layer at arc, described electrical cable, the equal turmeric in surface of pad, described pad is located at the corner of lower floor's base plate.
Preferably, the thickness of described surface mount type quartz crystal resonator pedestal is 0.6-1mm.
Preferably, the size length × width × height of described surface mount type quartz crystal resonator pedestal is 3.2 × 2.5 × 0.7mm.
Preferably, described number of pads is 4, is divided into two groups, every group two, two groups of pads are set up the stage with two chips respectively Electrical connection.
Preferably, described pad is square.
Preferably, described number of pads is two, and two pads are set up the stage with two chips electrical connection respectively.
Preferably, described pad is strip, and two pads are positioned opposite.
The manufacture method of the present invention comprises the steps:
1), lower floor's base plate fr4 copper clad plate carries out wiring process, and pad and chip are set up the stage turmeric;
2), upper strata base plate carries out hollow process with fr4 plate;
3), with bonding agent, upper strata base plate plate is bonded at lower floor's substrate and makes quartz crystal resonator base.
Beneficial effects of the present invention are as follows:
1st, the small volume of the present invention, can meet market miniature requirement;Simultaneously alternative existing base of ceramic;
2nd, the present invention adopts fr4 material, improves toughness of products and bending resistance;
3rd, the present invention adopts fr4 material, simplifies production technology, reducing energy consumption in production, shortens the production cycle, reduces and manufacture Cost.
Brief description
Fig. 1 is the structural representation of embodiment 1;
Fig. 2 is the profile of embodiment 1;
Fig. 3 is the bottom view of embodiment 1;
Fig. 4 is the top view of lower floor's base plate;
Fig. 5 is the profile of lower floor's base plate;
Fig. 6 is the top view of upper strata base plate;
Fig. 7 is the bottom view of embodiment 2;
In figure: 1- lower floor base plate, 2- upper strata base plate, 3- chip are set up the stage, 4- pad, 5- are electrically connected area, 6- electrical connection Line.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with accompanying drawing, the present invention is entered Row further describes.
Embodiment 1
As shown in figures 1 to 6, the thickness of the present embodiment be 0.6-1mm, preferred size length × width × height be 3.2 × 2.5 × 0.7mm, the present embodiment includes upper strata base plate 2 and lower floor's base plate 1, and upper strata base plate 2 is with lower floor base plate 1 mounted on top and bonding, under The top surface of layer base plate 1 is provided with chip and sets up the stage 3, and the bottom surface of lower floor's base plate 1 is provided with pad 4, and chip is set up the stage and 3 is electrically connected with pad 4, Upper strata base plate 2 is the frame-type of hollow, and chip is set up the stage 3 hollow bulbs being located at upper strata base plate 2, and chip is set up the stage and 3 had two, two chips Set up the stage electric insulation between 3, the base material of upper strata base plate 2 and lower floor's base plate 1 is fr4 material.
Lower floor's base plate 1 be preferably fr4 copper-clad plate, chip set up the stage 3 pass sequentially through electrical cable 6, electrical connection area 7 connect Pad, electrical cable 6, pad 4 are fr4 copper-clad plate corrosion and are formed, electrical connection area 5 up/down perforation lower floor base plate 1;Lower floor Base plate 1 is rectangle, and the corner of lower floor's base plate 1 is the arc of indent, and electrical connection area 5 is the turmeric floor at arc, electrical connection Line 6, the equal turmeric in surface of pad 4, pad 4 is located at the corner of lower floor's base plate.
Pad 4 quantity is 4, is divided into two groups, every group two, and two groups of pads are set up the stage with two chips 3 electrical connections respectively; Pad 4 is square.
Embodiment 2
As shown in fig. 7, the difference of the present embodiment and preferred embodiment 1 is the quantity of pad 4, the pad of the present embodiment 4 quantity are two, and two pads 4 are set up the stage with two chips 3 electrical connections respectively;Pad 4 is strip, and two pads 4 are relatively Arrangement.
The other parts of the present embodiment are same as Example 1, therefore do not repeat.
Certainly, the present invention also can have other various embodiments, in the case of without departing substantially from present invention spirit and its essence, ripe Know those skilled in the art to make various corresponding changes according to the present invention and deform, but these corresponding changes and deformation The protection domain of appended claims of the invention all should be belonged to.

Claims (9)

1. a kind of surface mount type quartz crystal resonator pedestal it is characterised in that: include upper strata base plate and lower floor's base plate, described upper strata Base plate is with lower floor's base plate mounted on top and bonding, and the top surface of described lower floor base plate is provided with chip and sets up the stage, and the bottom surface of lower floor's base plate sets There is pad, described chip is set up the stage and pad electrical connection, described upper strata base plate is the frame-type of hollow, and described chip is set up the stage positioned at upper Layer base plate hollow bulb, chip is set up the stage two, two chips set up the stage between electric insulation, the base of upper strata base plate and lower floor's base plate Material is fr4 material.
2. surface mount type quartz crystal resonator pedestal according to claim 1 it is characterised in that: described lower floor base plate is Fr4 copper-clad plate, described chip is set up the stage and is passed sequentially through electrical cable, electrical connection area connects pad, described electrical cable, weldering Disk is fr4 copper-clad plate corrosion and is formed, up/down perforation lower floor of described electrical connection area base plate.
3. surface mount type quartz crystal resonator pedestal according to claim 2 it is characterised in that: described lower floor base plate be square Shape, the corner of lower floor's base plate is the arc of indent, and described electrical connection area is the turmeric floor at arc, described electrical cable, The equal turmeric in surface of pad, described pad is located at the corner of lower floor's base plate.
4. surface mount type quartz crystal resonator pedestal according to claim 3 it is characterised in that: described SMD quartz-crystal The thickness of body resonator base is 0.6-1mm.
5. surface mount type quartz crystal resonator pedestal according to claim 4 it is characterised in that: described SMD quartz-crystal The size length × width × height of body resonator base is 3.2 × 2.5 × 0.7mm.
6. the surface mount type quartz crystal resonator pedestal according to any one of claim 1-5 it is characterised in that: described pad Quantity is 4, is divided into two groups, every group two, and two groups of pads are set up the stage with two chips electrical connection respectively.
7. surface mount type quartz crystal resonator pedestal according to claim 6 it is characterised in that: described pad be square.
8. the surface mount type quartz crystal resonator pedestal according to any one of claim 1-5 it is characterised in that: described pad Quantity is two, and two pads are set up the stage with two chips electrical connection respectively.
9. surface mount type quartz crystal resonator pedestal according to claim 6 it is characterised in that: described pad be strip Shape, two pads are positioned opposite.
CN201610791842.2A 2016-08-31 2016-08-31 Patch-type quartz crystal resonator base Pending CN106374869A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610791842.2A CN106374869A (en) 2016-08-31 2016-08-31 Patch-type quartz crystal resonator base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610791842.2A CN106374869A (en) 2016-08-31 2016-08-31 Patch-type quartz crystal resonator base

Publications (1)

Publication Number Publication Date
CN106374869A true CN106374869A (en) 2017-02-01

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Family Applications (1)

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CN201610791842.2A Pending CN106374869A (en) 2016-08-31 2016-08-31 Patch-type quartz crystal resonator base

Country Status (1)

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CN (1) CN106374869A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102629851A (en) * 2011-02-07 2012-08-08 日本电波工业株式会社 Oscillator
CN102638243A (en) * 2012-05-07 2012-08-15 烟台森众电子科技有限公司 SMD (Surface Mount Device) quartz crystal resonator base and processing method thereof
US20120256695A1 (en) * 2011-04-07 2012-10-11 Seiko Epson Corporation Base substrate, resonator, oscillator, and electronic device
CN202750054U (en) * 2012-09-22 2013-02-20 烟台森众电子科技有限公司 Surface mount device (SMD) quartz-crystal resonator base
CN103066941A (en) * 2012-09-22 2013-04-24 烟台森众电子科技有限公司 Surface mounted device (SMD) quartz-crystal resonator base and processing method thereof
CN105471405A (en) * 2014-09-30 2016-04-06 日本特殊陶业株式会社 Wiring substrate and multi-piece wiring substrate
CN105793978A (en) * 2013-12-19 2016-07-20 株式会社大真空 Electronic component-use package and piezoelectric device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102629851A (en) * 2011-02-07 2012-08-08 日本电波工业株式会社 Oscillator
US20120256695A1 (en) * 2011-04-07 2012-10-11 Seiko Epson Corporation Base substrate, resonator, oscillator, and electronic device
CN102739185A (en) * 2011-04-07 2012-10-17 精工爱普生株式会社 Base substrate, resonator, oscillator, and electronic device
CN102638243A (en) * 2012-05-07 2012-08-15 烟台森众电子科技有限公司 SMD (Surface Mount Device) quartz crystal resonator base and processing method thereof
CN202750054U (en) * 2012-09-22 2013-02-20 烟台森众电子科技有限公司 Surface mount device (SMD) quartz-crystal resonator base
CN103066941A (en) * 2012-09-22 2013-04-24 烟台森众电子科技有限公司 Surface mounted device (SMD) quartz-crystal resonator base and processing method thereof
CN105793978A (en) * 2013-12-19 2016-07-20 株式会社大真空 Electronic component-use package and piezoelectric device
CN105471405A (en) * 2014-09-30 2016-04-06 日本特殊陶业株式会社 Wiring substrate and multi-piece wiring substrate

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
(陈铭均: "《深入剖析针式打印机》", 31 May 2011 *
彭承琳: "《生物医学传感器原理》", 30 June 2000 *

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Application publication date: 20170201