CN106374869A - Patch-type quartz crystal resonator base - Google Patents
Patch-type quartz crystal resonator base Download PDFInfo
- Publication number
- CN106374869A CN106374869A CN201610791842.2A CN201610791842A CN106374869A CN 106374869 A CN106374869 A CN 106374869A CN 201610791842 A CN201610791842 A CN 201610791842A CN 106374869 A CN106374869 A CN 106374869A
- Authority
- CN
- China
- Prior art keywords
- base plate
- lower floor
- crystal resonator
- quartz crystal
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 239000010453 quartz Substances 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 16
- 235000003392 Curcuma domestica Nutrition 0.000 claims description 7
- 235000003373 curcuma longa Nutrition 0.000 claims description 7
- 235000013976 turmeric Nutrition 0.000 claims description 7
- 244000008991 Curcuma longa Species 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 244000163122 Curcuma domestica Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910021489 α-quartz Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention discloses a patch-type quartz crystal resonator base, comprising an upper layer bottom plate and a lower layer bottom plate. The upper layer bottom plate and the lower layer bottom plate are overlapped and are adhered. Wafer overlapping tables are arranged on the top surface of the lower layer bottom plate. Bonding pads are arranged on the bottom surface of the lower layer bottom plate. The wafer overlapping tables and the bonding pads are electrically connected. The upper layer bottom plate is a hollow frame. The wafer overlapping tables are located in a hollow part of the upper layer base plate. There are two wafer overlapping tables. The two wafer overlapping tables are electrically insulated. Base materials of the upper layer bottom plate and the lower layer bottom plate are an FR4 material. According to the base, a production technology can be simplified, the energy consumption can be reduced in production, a production cycle can be shortened, and the production cost can be reduced.
Description
Technical field
The present invention relates to electronic devices and components field, more particularly, to a kind of fr4 material surface mount type quartz crystal resonator pedestal.
Background technology
Quartz-crystal resonator is the FREQUENCY CONTROL components and parts made using the piezoelectric effect of alpha-quartz (α-sio2).Quartz
Crystal resonator has frequency accuracy height, the stable characteristic of output frequency, and it is a kind of for stablizing frequency and selecting frequency
Important frequencies components and parts.At wire communication, wireless telecommunications, radio and television, satellite communication, navigation, electronic measuring instrument, microcomputer
It is widely applied in reason, the various dual-use product such as digital intelligent instrument, clock and watch, automobile, be now pottery with resonator base
Porcelain pedestal, complex manufacturing, high energy consumption, the cycle is long, and manufacturing cost is high.
Content of the invention
The present invention is intended to provide a kind of surface mount type quartz crystal resonator pedestal, simplify production technology, in production, reduce energy
Consumption, shortens the production cycle, reduces manufacturing cost.
For reaching above-mentioned purpose, the present invention employs the following technical solutions realization:
Surface mount type quartz crystal resonator pedestal disclosed by the invention, including upper strata base plate and lower floor's base plate, described upper strata
Base plate is with lower floor's base plate mounted on top and bonding, and the top surface of described lower floor base plate is provided with chip and sets up the stage, and the bottom surface of lower floor's base plate sets
There is pad, described chip is set up the stage and pad electrical connection, described upper strata base plate is the frame-type of hollow, and described chip is set up the stage positioned at upper
Layer base plate hollow bulb, chip is set up the stage two, two chips set up the stage between electric insulation, the base of upper strata base plate and lower floor's base plate
Material is fr4 material.
Preferably, described lower floor base plate is fr4 copper-clad plate, and described chip is set up the stage and passed sequentially through electrical cable, electrically connects
Meet area and connect pad, described electrical cable, pad are fr4 copper-clad plate corrosion and are formed, described electrical connection area up/down perforation
Lower floor's base plate.
Preferably, described lower floor base plate is rectangle, and the corner of lower floor's base plate is the arc of indent, and described electrical connection area is
Turmeric layer at arc, described electrical cable, the equal turmeric in surface of pad, described pad is located at the corner of lower floor's base plate.
Preferably, the thickness of described surface mount type quartz crystal resonator pedestal is 0.6-1mm.
Preferably, the size length × width × height of described surface mount type quartz crystal resonator pedestal is 3.2 × 2.5 × 0.7mm.
Preferably, described number of pads is 4, is divided into two groups, every group two, two groups of pads are set up the stage with two chips respectively
Electrical connection.
Preferably, described pad is square.
Preferably, described number of pads is two, and two pads are set up the stage with two chips electrical connection respectively.
Preferably, described pad is strip, and two pads are positioned opposite.
The manufacture method of the present invention comprises the steps:
1), lower floor's base plate fr4 copper clad plate carries out wiring process, and pad and chip are set up the stage turmeric;
2), upper strata base plate carries out hollow process with fr4 plate;
3), with bonding agent, upper strata base plate plate is bonded at lower floor's substrate and makes quartz crystal resonator base.
Beneficial effects of the present invention are as follows:
1st, the small volume of the present invention, can meet market miniature requirement;Simultaneously alternative existing base of ceramic;
2nd, the present invention adopts fr4 material, improves toughness of products and bending resistance;
3rd, the present invention adopts fr4 material, simplifies production technology, reducing energy consumption in production, shortens the production cycle, reduces and manufacture
Cost.
Brief description
Fig. 1 is the structural representation of embodiment 1;
Fig. 2 is the profile of embodiment 1;
Fig. 3 is the bottom view of embodiment 1;
Fig. 4 is the top view of lower floor's base plate;
Fig. 5 is the profile of lower floor's base plate;
Fig. 6 is the top view of upper strata base plate;
Fig. 7 is the bottom view of embodiment 2;
In figure: 1- lower floor base plate, 2- upper strata base plate, 3- chip are set up the stage, 4- pad, 5- are electrically connected area, 6- electrical connection
Line.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with accompanying drawing, the present invention is entered
Row further describes.
Embodiment 1
As shown in figures 1 to 6, the thickness of the present embodiment be 0.6-1mm, preferred size length × width × height be 3.2 × 2.5 ×
0.7mm, the present embodiment includes upper strata base plate 2 and lower floor's base plate 1, and upper strata base plate 2 is with lower floor base plate 1 mounted on top and bonding, under
The top surface of layer base plate 1 is provided with chip and sets up the stage 3, and the bottom surface of lower floor's base plate 1 is provided with pad 4, and chip is set up the stage and 3 is electrically connected with pad 4,
Upper strata base plate 2 is the frame-type of hollow, and chip is set up the stage 3 hollow bulbs being located at upper strata base plate 2, and chip is set up the stage and 3 had two, two chips
Set up the stage electric insulation between 3, the base material of upper strata base plate 2 and lower floor's base plate 1 is fr4 material.
Lower floor's base plate 1 be preferably fr4 copper-clad plate, chip set up the stage 3 pass sequentially through electrical cable 6, electrical connection area 7 connect
Pad, electrical cable 6, pad 4 are fr4 copper-clad plate corrosion and are formed, electrical connection area 5 up/down perforation lower floor base plate 1;Lower floor
Base plate 1 is rectangle, and the corner of lower floor's base plate 1 is the arc of indent, and electrical connection area 5 is the turmeric floor at arc, electrical connection
Line 6, the equal turmeric in surface of pad 4, pad 4 is located at the corner of lower floor's base plate.
Pad 4 quantity is 4, is divided into two groups, every group two, and two groups of pads are set up the stage with two chips 3 electrical connections respectively;
Pad 4 is square.
Embodiment 2
As shown in fig. 7, the difference of the present embodiment and preferred embodiment 1 is the quantity of pad 4, the pad of the present embodiment
4 quantity are two, and two pads 4 are set up the stage with two chips 3 electrical connections respectively;Pad 4 is strip, and two pads 4 are relatively
Arrangement.
The other parts of the present embodiment are same as Example 1, therefore do not repeat.
Certainly, the present invention also can have other various embodiments, in the case of without departing substantially from present invention spirit and its essence, ripe
Know those skilled in the art to make various corresponding changes according to the present invention and deform, but these corresponding changes and deformation
The protection domain of appended claims of the invention all should be belonged to.
Claims (9)
1. a kind of surface mount type quartz crystal resonator pedestal it is characterised in that: include upper strata base plate and lower floor's base plate, described upper strata
Base plate is with lower floor's base plate mounted on top and bonding, and the top surface of described lower floor base plate is provided with chip and sets up the stage, and the bottom surface of lower floor's base plate sets
There is pad, described chip is set up the stage and pad electrical connection, described upper strata base plate is the frame-type of hollow, and described chip is set up the stage positioned at upper
Layer base plate hollow bulb, chip is set up the stage two, two chips set up the stage between electric insulation, the base of upper strata base plate and lower floor's base plate
Material is fr4 material.
2. surface mount type quartz crystal resonator pedestal according to claim 1 it is characterised in that: described lower floor base plate is
Fr4 copper-clad plate, described chip is set up the stage and is passed sequentially through electrical cable, electrical connection area connects pad, described electrical cable, weldering
Disk is fr4 copper-clad plate corrosion and is formed, up/down perforation lower floor of described electrical connection area base plate.
3. surface mount type quartz crystal resonator pedestal according to claim 2 it is characterised in that: described lower floor base plate be square
Shape, the corner of lower floor's base plate is the arc of indent, and described electrical connection area is the turmeric floor at arc, described electrical cable,
The equal turmeric in surface of pad, described pad is located at the corner of lower floor's base plate.
4. surface mount type quartz crystal resonator pedestal according to claim 3 it is characterised in that: described SMD quartz-crystal
The thickness of body resonator base is 0.6-1mm.
5. surface mount type quartz crystal resonator pedestal according to claim 4 it is characterised in that: described SMD quartz-crystal
The size length × width × height of body resonator base is 3.2 × 2.5 × 0.7mm.
6. the surface mount type quartz crystal resonator pedestal according to any one of claim 1-5 it is characterised in that: described pad
Quantity is 4, is divided into two groups, every group two, and two groups of pads are set up the stage with two chips electrical connection respectively.
7. surface mount type quartz crystal resonator pedestal according to claim 6 it is characterised in that: described pad be square.
8. the surface mount type quartz crystal resonator pedestal according to any one of claim 1-5 it is characterised in that: described pad
Quantity is two, and two pads are set up the stage with two chips electrical connection respectively.
9. surface mount type quartz crystal resonator pedestal according to claim 6 it is characterised in that: described pad be strip
Shape, two pads are positioned opposite.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610791842.2A CN106374869A (en) | 2016-08-31 | 2016-08-31 | Patch-type quartz crystal resonator base |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610791842.2A CN106374869A (en) | 2016-08-31 | 2016-08-31 | Patch-type quartz crystal resonator base |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106374869A true CN106374869A (en) | 2017-02-01 |
Family
ID=57899802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610791842.2A Pending CN106374869A (en) | 2016-08-31 | 2016-08-31 | Patch-type quartz crystal resonator base |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106374869A (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102629851A (en) * | 2011-02-07 | 2012-08-08 | 日本电波工业株式会社 | Oscillator |
CN102638243A (en) * | 2012-05-07 | 2012-08-15 | 烟台森众电子科技有限公司 | SMD (Surface Mount Device) quartz crystal resonator base and processing method thereof |
US20120256695A1 (en) * | 2011-04-07 | 2012-10-11 | Seiko Epson Corporation | Base substrate, resonator, oscillator, and electronic device |
CN202750054U (en) * | 2012-09-22 | 2013-02-20 | 烟台森众电子科技有限公司 | Surface mount device (SMD) quartz-crystal resonator base |
CN103066941A (en) * | 2012-09-22 | 2013-04-24 | 烟台森众电子科技有限公司 | Surface mounted device (SMD) quartz-crystal resonator base and processing method thereof |
CN105471405A (en) * | 2014-09-30 | 2016-04-06 | 日本特殊陶业株式会社 | Wiring substrate and multi-piece wiring substrate |
CN105793978A (en) * | 2013-12-19 | 2016-07-20 | 株式会社大真空 | Electronic component-use package and piezoelectric device |
-
2016
- 2016-08-31 CN CN201610791842.2A patent/CN106374869A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102629851A (en) * | 2011-02-07 | 2012-08-08 | 日本电波工业株式会社 | Oscillator |
US20120256695A1 (en) * | 2011-04-07 | 2012-10-11 | Seiko Epson Corporation | Base substrate, resonator, oscillator, and electronic device |
CN102739185A (en) * | 2011-04-07 | 2012-10-17 | 精工爱普生株式会社 | Base substrate, resonator, oscillator, and electronic device |
CN102638243A (en) * | 2012-05-07 | 2012-08-15 | 烟台森众电子科技有限公司 | SMD (Surface Mount Device) quartz crystal resonator base and processing method thereof |
CN202750054U (en) * | 2012-09-22 | 2013-02-20 | 烟台森众电子科技有限公司 | Surface mount device (SMD) quartz-crystal resonator base |
CN103066941A (en) * | 2012-09-22 | 2013-04-24 | 烟台森众电子科技有限公司 | Surface mounted device (SMD) quartz-crystal resonator base and processing method thereof |
CN105793978A (en) * | 2013-12-19 | 2016-07-20 | 株式会社大真空 | Electronic component-use package and piezoelectric device |
CN105471405A (en) * | 2014-09-30 | 2016-04-06 | 日本特殊陶业株式会社 | Wiring substrate and multi-piece wiring substrate |
Non-Patent Citations (2)
Title |
---|
(陈铭均: "《深入剖析针式打印机》", 31 May 2011 * |
彭承琳: "《生物医学传感器原理》", 30 June 2000 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100950511B1 (en) | Microelectronic assembly with impedance controlled wirebond and conductive reference element | |
CN106301283A (en) | The encapsulating structure of SAW filter and manufacture method | |
JP2001244688A (en) | High-frequency module component and its manufacturing method | |
CN104364897B (en) | Element storage packaging part and assembling structure | |
TW201637155A (en) | Semiconductor device | |
CN103208536A (en) | Semiconductor packaging structural member for pyroelectric infrared sensor, manufacturing method thereof and sensor | |
CN106374869A (en) | Patch-type quartz crystal resonator base | |
JPH04259104A (en) | Small sized oscillator | |
CN201846474U (en) | Silicon microphone | |
CN203746897U (en) | Led | |
JP4571012B2 (en) | Crystal unit with pedestal | |
CN206441725U (en) | A kind of multiple-level stack formula LED encapsulation structure | |
WO2008138182A1 (en) | Chip type light-emitting diode | |
CN107393878B (en) | Parts installation module | |
JP2013243209A (en) | Semiconductor device | |
CN209000901U (en) | High density surface-mount type semiconductor integrated circuit | |
CN202818246U (en) | Quartz crystal resonator | |
CN2567873Y (en) | Piezoelectric ceramic high-frequency plaster resonator | |
CN107431047A (en) | Circuit board, electronic installation and electronic module | |
CN110544632B (en) | Method for manufacturing BGA (ball grid array) bonding pad on packaging cover plate of LTCC (Low temperature Co-fired ceramic) substrate with double-sided cavity | |
JPH0258257A (en) | Semiconductor package with leads | |
WO2001011771A1 (en) | Reflectionless lc filter and method of manufacture therefor | |
CN106169918A (en) | A kind of crystal oscillator and manufacture method thereof | |
CN107735861A (en) | High-frequency model | |
CN202297106U (en) | Packaging structure of vertical sensor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170201 |