CN106356443A - Manufacturing method for illuminating circuit board - Google Patents
Manufacturing method for illuminating circuit board Download PDFInfo
- Publication number
- CN106356443A CN106356443A CN201610993321.5A CN201610993321A CN106356443A CN 106356443 A CN106356443 A CN 106356443A CN 201610993321 A CN201610993321 A CN 201610993321A CN 106356443 A CN106356443 A CN 106356443A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- reflector
- printing
- manufacturing
- illuminating circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000007639 printing Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000004020 luminiscence type Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 238000007373 indentation Methods 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910000004 White lead Inorganic materials 0.000 claims 1
- 235000010215 titanium dioxide Nutrition 0.000 claims 1
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000010068 moulding (rubber) Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention relates to a manufacturing method for an illuminating circuit board. The circuit board comprises a flexible circuit board. The method comprises the following steps: firstly, manufacturing a printed template with a certain angle; and printing an adhesion agent mixed with a white reflecting matter onto the flexible circuit board by the printed template and then curing by heating or curing at room temperature, thereby firmly gluing the reflecting matter onto the flexible circuit board, and forming a reflecting cup, wherein a welding plate for mounting an illuminating chip is mounted on the flexible circuit board in a position of the cup bottom of the reflecting cup in advance. According to the invention, when the illuminating chip is mounted, the reflecting cup is formed on the circuit board by printing through the printed template, so that the manufacturing is convenient and high-efficient, the cost is low and the method is suitable for large-scale production.
Description
Technical field
The present invention relates to the circuit board manufacturing method with luminescence chip.
Background technology
For luminescence chip is installed, traditional mounting means is encapsulated reflecting cup in the circuit board, and this reflector will
Form box dam using mode for dispensing glue to form, or forming reflector in the circuit board using injection molding manner.Due to technique and
Reasons in structure, aforesaid way make efficiency is very low, and is formed for reflector mode for injection molding manner, Mold Making expense
With also higher, whole illuminating module cost of manufacture is made to increase.
Content of the invention
The technical problem to be solved is to provide a kind of luminous circuit board making side easy to make, low cost
Method.
For solving above-mentioned technical problem, the technical solution used in the present invention is as follows:
A kind of illuminating circuit board manufacturing method, this circuit board includes flexible circuit board, and the method includes: produces first and has one
Determine the print glue pattern plate of angle, heated on flexible PCB by the adhesive that the printing of this print glue pattern plate is mixed with white reflection thing
Solidification or cold curing, make reflective thing good bond on flexible PCB, form reflector, this reflector cup bottom position
The pad installing luminescence chip is furnished with advance on flexible PCB.
Wherein, the printing of reflective thing, through printing process twice, forms jagged on reflector after the first impression, the
Secondary printing is directed to the adhesive that the printing of this indentation, there is mixed with white reflection thing, cold curing, and it is reflective that formation completely encloses
Cup.
Wherein, described white reflection thing is titanium dioxide or zinc oxide.
Wherein, adhesive is epoxiess or silicone or acrylic compounds or polyamide-based adhesive.
Wherein, described reflector opening angle is more than or equal to 90 degree, less than 180 degree, depth 0.1mm～2mm it
Between..
Reflector, when luminescence chip is installed, is taken shape in wiring board by printing glue pattern plate using by way of printing by the present invention
On, easy to make efficient, cost is relatively low, is suitable for large-scale production.
Brief description
Fig. 1 takes shape in cross section structure schematic diagram after on wiring board for embodiment of the present invention reflector.
Fig. 2 is the present embodiment light emitting chip module positive structure schematic.
Specific embodiment
For the ease of it will be appreciated by those skilled in the art that entering to present inventive concept below in conjunction with accompanying drawing and specific embodiment
Row describes in further detail.
It is using the present embodiment technology molding reflector and the circuit board section after luminescence chip to be installed as shown in Figure 1
Structural representation.This structure has wiring board 1 and the reflector 2 printing using print glue pattern plate mode, reflector edge
Higher than wiring board 1 surface, edge medial wall is to tilt, and opening angle is more than or equal to 90 degree, and less than 180 degree, edge depth exists
Between 0.1mm～2mm.For luminescence chip 3 in the middle of reflector 2.
Accompanying drawing 2 is the positive structure schematic of the light emitting package module being formed using circuit board in accompanying drawing 1.Wherein in figure a
It is designated as reflector forming region, be packaged with glue in surface of reflection cup.
For the making of circuit board, first can get the print rubber moulding version with certain angle, this print glue with 3d printer
Template angle is more than zero degree, is less than or equal to 90 degree, then the adhesive being mixed with white reflection thing with the printing of this print glue pattern plate is to line
It is heating and curing or cold curing on the plate of road, makes reflective thing good bond in the circuit board, formed and be more than or equal to 90 degree, be less than
The band reflector jaggy of 180 degree, reflector depth be more than 0.1mm be less than 2mm, due to first impression reflector have scarce
Mouthful, if reflector needs completely enclosed, print reflective thing at twice with two print rubber moulding versions, the reflective thing of the second printing arrives
The indentation, there that the first impression stays, cold curing or be heating and curing, form completely enclosed reflector, the depth of reflector
Equally control and be less than 2mm, the complete making molding of the circuit board with reflector more than 0.1mm.
In foregoing circuit plate makes, described white reflection thing is titanium dioxide or zinc oxide, and adhesive can adopt ring
Oxygen class or silicone or acrylic compounds or polyamide adhesives.And wiring board may also be employed flexible PCB, make bent
Circuit board.
On the basis of foregoing circuit plate, light emitting package module is formed by the installation of luminescence chip.In above-mentioned reflector
After being completed for printing, luminescence chip formal dress bonding wire or upside-down mounting bonding wire mode are weldingly fixed on the pad at reflector cup bottom,
Apply again to encapsulate glue and solidify in reflector and make light emitting package module.
In light emitting package module makes, depending on reflector quantity can be according to luminescence chip quantity, can a luminous core
Piece position print one piece of reflector it is also possible to the corresponding one piece of reflector of multiple luminescence chip and, one or more welding on wiring board
The pad locations of fixing luminescence chip print a reflector.
Embodiment described above only have expressed embodiments of the present invention, and its description is more concrete and detailed, but can not
Therefore it is interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the protection model of the present invention
Enclose.
Claims (5)
1. a kind of illuminating circuit board manufacturing method, this circuit board includes flexible circuit board it is characterised in that the method includes: first
First produce the print glue pattern plate with certain angle, the adhesive of white reflection thing is mixed with to soft by the printing of this print glue pattern plate
Property circuit board on be heating and curing or cold curing, make reflective thing good bond on flexible PCB, formed reflector, this is anti-
The pad installing luminescence chip is furnished with advance on the flexible PCB of light cup cup bottom position.
2. illuminating circuit board manufacturing method according to claim 1 is it is characterised in that the printing of reflective thing prints through twice
Swiped through journey, forms jagged on reflector after the first impression, the second printing is directed to the printing of this indentation, there and is mixed with white
The adhesive of reflective thing, cold curing, form completely enclosed reflector.
3. illuminating circuit board manufacturing method according to claim 1 and 2 is it is characterised in that described white reflection thing is titanium
White lead or zinc oxide.
4. illuminating circuit board manufacturing method according to claim 1 and 2 is it is characterised in that adhesive is epoxiess or has
Machine silicon class or acrylic compounds or polyamide-based adhesive.
5. illuminating circuit board manufacturing method according to claim 1 and 2 is it is characterised in that described reflector open-angle
Degree is more than or equal to 90 degree, and less than 180 degree, depth is between 0.1mm～2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610993321.5A CN106356443A (en) | 2016-11-11 | 2016-11-11 | Manufacturing method for illuminating circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610993321.5A CN106356443A (en) | 2016-11-11 | 2016-11-11 | Manufacturing method for illuminating circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106356443A true CN106356443A (en) | 2017-01-25 |
Family
ID=57862062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610993321.5A Pending CN106356443A (en) | 2016-11-11 | 2016-11-11 | Manufacturing method for illuminating circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106356443A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110765A (en) * | 2010-10-29 | 2011-06-29 | 连展科技（深圳）有限公司 | Chip carrier package structure and manufacturing method thereof |
| CN102347418A (en) * | 2010-08-02 | 2012-02-08 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure and manufacturing method thereof |
| CN102709407A (en) * | 2012-05-25 | 2012-10-03 | 瑞声声学科技(深圳)有限公司 | Method for manufacturing an LED (light-emitting diode) packaging retaining wall |
| CN104103741A (en) * | 2014-07-02 | 2014-10-15 | 柳钊 | Integrally packaged LED (Light-Emitting Diode) light source device taking silicon carbide ceramic as radiator, and preparation method of LED light source device |
-
2016
- 2016-11-11 CN CN201610993321.5A patent/CN106356443A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102347418A (en) * | 2010-08-02 | 2012-02-08 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure and manufacturing method thereof |
| CN102110765A (en) * | 2010-10-29 | 2011-06-29 | 连展科技（深圳）有限公司 | Chip carrier package structure and manufacturing method thereof |
| CN102709407A (en) * | 2012-05-25 | 2012-10-03 | 瑞声声学科技(深圳)有限公司 | Method for manufacturing an LED (light-emitting diode) packaging retaining wall |
| CN104103741A (en) * | 2014-07-02 | 2014-10-15 | 柳钊 | Integrally packaged LED (Light-Emitting Diode) light source device taking silicon carbide ceramic as radiator, and preparation method of LED light source device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170125 |