CN106350841B - A kind of electroplanting device - Google Patents
A kind of electroplanting device Download PDFInfo
- Publication number
- CN106350841B CN106350841B CN201610909232.8A CN201610909232A CN106350841B CN 106350841 B CN106350841 B CN 106350841B CN 201610909232 A CN201610909232 A CN 201610909232A CN 106350841 B CN106350841 B CN 106350841B
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- Prior art keywords
- jet pipe
- spray
- hole
- jet
- circuit board
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of electroplanting devices, including electroplating bath, transport mechanism and multiple groups are set to the jet pack in electroplating bath, the jet pack includes two vertical and arranged side by side jet pipes, there are can the gap that passes through of power circuit board between two jet pipes, the injection hole groups that at least one column are axially distributed along the jet pipe are provided on the inside of each jet pipe, each column injection hole groups of two jet pipes are oppositely arranged, each injection hole groups include multiple spray-holes, and it is located at the opposite each spray-hole for arranging the injection hole groups along the axially staggered setting of the jet pipe.Spray-hole is cavernous structure, and circuit board will not be scratched；When each spray-hole of opposite column interlocks, the spray-hole of two column is avoided to liquidate, improves the bubble removing effect to hole；The electroplate liquid of two opposite column spray-holes sprayed is identical to the impact force of circuit board, can effectively avoid circuit board from waving, collision jet pipe and avoid jet pipe scratch circuit board.
Description
Technical field
The present invention relates to circuit board electroplating fields, are to be related to a kind of electroplanting device more specifically.
Background technique
The process that multiple tracks involved in the electroplating process of circuit board is surface-treated circuit board, such as spray cleaning,
Dry, plating of water etc..In the plating process, circuit board is immersed in electroplating pool, carries out surface electricity to circuit board by electroplanting device
Plating, when dry circuit board is immersed in electroplating pool, the surface of circuit board and hole bubble easy to form, these aerations
The electroplating quality of circuit board.Usually pass through pump by the way that the jet pack of jet electro-plating liquid is arranged in electroplating pool in the prior art
The injection pressure of electroplate liquid is provided, circuit board is impacted via jet pack jet electro-plating liquid, to take away bubble.Jet flow group
Part includes two jet pipes arranged side by side, is provided with nozzle on jet pipe, is transmitted by transport mechanism, circuit board is made to walk and spray
Between flow tube, the nozzle jet electro-plating liquid on jet pipe carries out electroplating processes to circuit board.In order to avoid nozzle injection liquidates, lead to
It often needs to mutually stagger the position of nozzle, but so be easy to cause circuit board uneven by jet power when transmitting, cause
It rocks back and forth, is easy that circuit board is made to collide nozzle, it is also possible to cause circuit board locking spray nozzle that can not transmit, and nozzle is sharper
Sharp thing part easily causes scratch after contacting circuit board, and circuit board is delicate elements, and any fine scratches are likely to influence electricity
The quality of road plate, the final yield rate and service life for influencing circuit board.
In order to solve the above-mentioned technical problem, setting limits object usually in the travelling route of circuit board in the prior art,
Such as idler wheel, guide plate, nozzle is from the gap between limit object to circuit board ejector air.But above-mentioned improvement additionally increases
Part-structure, keeps electroplanting device more complicated, increases production cost, and can not solve that circuit board rocks back and forth at all asks
Topic.
Summary of the invention
The purpose of the present invention is to provide a kind of circuit boards to transmit stable electroplanting device, it is intended to which solution is deposited in the prior art
The problem of rocking back and forth in circuit board transmission.
In order to solve the above technical problems, the technical scheme is that provide a kind of electroplanting device, including electroplating bath, pass
Mechanism and multiple groups is sent to be set to the jet pack in electroplating bath, the jet pack includes two vertical and arranged side by side jet flows
Pipe, between two jet pipes there are can the gap that passes through of power circuit board, be provided at least one on the inside of each jet pipe
The injection hole groups being axially distributed along the jet pipe are arranged, each column injection hole groups of two jet pipes are oppositely arranged, each institute
Stating injection hole groups includes multiple spray-holes, and is located at the opposite each spray-hole for arranging the injection hole groups along the jet pipe axis
To being staggered.
Optionally, the guiding for guiding the circuit board to pass through the gap is additionally provided on the inside of each jet pipe
Structure.
Optionally, arc cylinder is set as on the inside of each jet pipe, the arc cylinder constitutes the guide frame.
Optionally, the jet pipe is round tube or elliptical tube, described in the arc cylinder on the inside of each jet pipe is constituted
Guide frame.
Optionally, the jet pipe includes the upper sealing panel and lower sealing plate for being respectively arranged at both ends, the upper sealing
The side wall of plate is provided with upper sealing panel spray-hole corresponding with the spray-hole of the jet pipe, the upper sealing panel injection
Hole is connected to the jet pipe.
Optionally, the upper surface of the upper sealing panel is provided with a short tube, and the short tube is provided with and the spray-hole phase
Short tube spray-hole that is corresponding and being connected to the jet pipe, the diameter of the short tube are less than the diameter of the jet pipe.
Optionally, each jet pipe is provided with the two column injection hole groups arranged side by side, the two column injection hole groups
Each laterally staggered setting of spray-hole.
Optionally, it is provided with inner tube in each jet pipe, said inner tube, which is provided with, multiple makes said inner tube and the spray
The through-hole of flow tube connection, said inner tube connect the interface entered for electroplate liquid.
Optionally, the upper end of each said inner tube protrudes from the upper end of the corresponding jet pipe, each said inner tube
The upper spray-hole is provided on the inside of upper end.
Optionally, the direction of its other end, multiple through-holes are directed toward along one end that the spray-hole is arranged in said inner tube
Axially distributed and internal diameter is gradually increased.
The invention has the advantages that:
The present invention provides one kind, and circuit can be made to transmit stable electroplanting device, including two vertical and arranged side by side jet flows
It manages, the injection hole groups that at least one column are axially distributed along the jet pipe, two jet flows is provided on the inside of each jet pipe
Each column injection hole groups of pipe are oppositely arranged, and each spray-hole of opposite column is staggered.Spray-hole is poroid on jet pipe
Structure does not protrude from jet pipe, and practical when circuit board passes through jet pipe directly to contact with jet pipe, circuit board will not when transmitting
It is highlighted object scratch, therefore the gap across two jet pipes that circuit board can be safe, moreover it is possible to effectively reduce jet pipe
Between mounting distance, reduce the size of jet pack；Each spray-hole of opposite column is staggered, staggeredly when can make its phase
Pair two column injection hole groups in a column it is whole move up or down a certain distance, avoid the spray-hole of two column from liquidating, improve
To the effect of the bubble removing of hole；Impact force phase of the electroplate liquid of two opposite simultaneously column spray-holes sprayed to circuit board
Together, overall, the difference of tiny impact force action position is only existed, circuit board can smoothly pass through jet flow group
Gap between part can effectively avoid circuit board from waving, collision jet pipe and avoid jet pipe scratch circuit board.
Detailed description of the invention
Fig. 1 is jet pack scheme of installation in embodiment provided by the invention；
Fig. 2 is jet pipe exploded view in embodiment provided by the invention；
Fig. 3 is the enlarged drawing of regional area I in Fig. 2；
Fig. 4 is inner tube partial sectional view in embodiment provided by the invention；
Fig. 5 is the cross-sectional view of upper sealing panel in embodiment provided by the invention；
Fig. 6 is the top view of jet pipe one embodiment in embodiment provided by the invention；
Fig. 7 be in embodiment provided by the invention jet pipe secondly embodiment top view；
Fig. 8 be in embodiment provided by the invention jet pipe thirdly embodiment top view；
Fig. 9 is the structural schematic diagram of electroplanting device in embodiment provided by the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It should also be noted that, the positional terms such as left and right, upper and lower in the present embodiment, be only each other relative concept or
It is reference with the normal operating condition of product, and should not be regarded as restrictive.
Cleaning, water involved in the electroplating technology of circuit board are dry, three big processes are electroplated, and utilize electroplate liquid in the plating process
Electroplating processes are carried out to the surface of circuit board.
As shown in Figures 1 to 9, the present embodiment is a kind of electroplanting device, including electroplating bath 600, transport mechanism 300 and multiple groups
The jet pack being set in electroplating bath 600, jet pack include two vertical and arranged side by side jet pipes 100, two jet pipes
Between 100 there are can the gap that passes through of power circuit board 200, the inside of each jet pipe 100 is provided with an at least column injection hole groups, respectively
Injection hole groups include multiple spray-holes 101, and each column injection hole groups of two jet pipes 100 are oppositely arranged, the injection hole groups of opposite column
Each spray-hole 101 along the axially staggered setting of jet pipe 10.Inside refers to two jet pipes 100 arranged side by side in the present embodiment
The side of spray-hole 101 is arranged in opposite side.
Spray-hole 101 is the cavernous structure on jet pipe, does not protrude from jet pipe 101, and circuit board 200 passes through jet pipe
When gap between 100, circuit board 200 will not be highlighted object scratch, thus circuit board 200 can safety pass through two jet pipes
Gap between 100, moreover it is possible to which the mounting distance between effective reduction jet pipe 100 reduces the overall dimensions of jet pack；?
When carrying out electroplating processes to circuit board 200, the hole on circuit board 200 is dead angle difficult to deal with, in the present embodiment, two jet flows
Each column injection hole groups of pipe 100 are oppositely arranged, and each spray-hole 101 of the injection hole groups of opposite column is along the axial friendship up and down of jet pipe 10
Mistake setting.One in two opposite column injection hole groups can be made to arrange entirety when staggeredly and move up or down a certain distance, avoid two
The spray-hole 101 of column liquidates, and improves the bubble elimination effect to hole.Opposite two column spray-holes 101 are sprayed simultaneously
Electroplate liquid is identical to the impact force of circuit board 200, overall, only exists the difference of tiny impact force action position
Not, the gap that circuit board 200 can smoothly across jet pack can effectively avoid circuit board 200 from waving, collide
Jet pipe 100 and avoid 100 scratch circuit board 200 of jet pipe.
Further, each jet pipe 100 is provided with the gap for guiding circuit board 200 across two jet pipes 100
Guide frame 102, guide frame 102 can be arc cylinder or arc block with guide function.By in jet pipe
On 100 be arranged guide frame 102, circuit board 200 pass through each jet pack when, the bootable circuit board 200 of guide frame 102 into
Enter the gap between jet pipe 100, prevent circuit board 200 from directly encountering jet pipe 100, further prevents 200 snap-gauge of circuit board.
Jet pipe 100 has numerous embodiments in the present embodiment, and jet pipe 100 can be square tube 100a, elliptical tube (figure
In be not shown), round tube (not shown) etc., it is rectangular, oval and circle that square tube 100a, elliptical tube and round tube, which respectively refer to section,
The pipe of shape.
Specifically, it when jet pipe 100 is square tube 100a, is provided on the inside of square tube 100a and is connect with square tube 100a ontology
Arc cylinder perhaps arc block arc cylinder or arc block constitute guide frame 102.More specifically, working as arc cylinder structure
When at guide frame 102, as shown in fig. 6, arc cylinder may be disposed at one end angle of square tube 100a, with arc cylinder alternative pipe
One end angle of the inside of 100a, circuit board 200 are conveyed between side cross tube 100a from the end angle when transmitting.In the present embodiment
Two arc cylinders can also be set, and two arc cylinders are respectively arranged at the both ends angle of the inside of rectangular jet pipe 100.The present embodiment
In, as shown in fig. 7, arc cylinder may be disposed at the inside of square tube 100a, to replace the inner sidewall of square tube 100a.The present embodiment
In, as shown in figure 8, arc block is set to the one or both ends Jiao Chu of square tube 100a when arc block constitutes guide frame 102,
The inner sidewall of cambered surface and square tube 100a in arc block is smoothly connected, and arc block guides circuit board to go out to enter from the cambered surface of arc block
Gap between side cross tube 100a.
When jet pipe 100 is elliptical tube or round tube, its own can be used as with arc cylinder, the arc cylinder of itself
Guide frame 102 has guide function.In the present embodiment, preferably jet pipe 100 is preferably round tube, the cylinder on the inside of each round tube
Face constitutes guide frame 102, and round tube itself has arc cylinder, and arc column face can be used as guide frame 102.The present embodiment
In, the structure of round tube is more simple, saves cost, and production assembling speed is fast.Similarly, above-mentioned square tube also can be set in round tube
Arc block described in 100a.
Further, as shown in figure 8, the present embodiment further includes pump (not shown), pipeline (not shown), passes
Mechanism 300 and the above-mentioned jet pack of multiple groups are sent, jet pack is fixed below transport mechanism, and pump passes through piping connection jet pipe
100.Transport mechanism 300 includes fixture 301 and transmission track 302, the upper end of 301 clamping circuit board 200 of fixture, fixture 301
It is moved along transmission track 302 and circuit board 200 is driven to move, circuit board 200 is made to pass vertically through the gap between jet pipe 100.
Further, electroplanting device includes two column main jet boxes 601, and the bottom of main jet box 601 setting and electroplating bath 600 is main
Interface 602 corresponding with jet pipe 100 is provided in spray box 601, the lower part of jet pipe 100 passes through interface 602 and main jet box 601
Connection.It is additionally provided with fixed frame 610 on electroplating bath 600, passes through the top of the fixed jet pipe 100 of fixed frame 610.The present embodiment
In, interface 602 is express card interface 602.
Further, fixed frame 610 includes connecting rod 611 and fixed column 612, and 611 one end of connecting rod connects electroplating bath
600, the other end is connect with fixed column 612, and fixed column 612 is fixed in the upper end of jet pipe 100.Specifically, fixed column 612 connects
It is connected to the side opposite with spray-hole 101 of jet pipe 100, the upper end of jet pipe 100 can so reserved enough for folder
The space that tool 301 passes through.
Optionally, in the present embodiment, spray-hole 101 includes at least one along the axial distribution of jet pipe 100, a column injection hole groups
A spray-hole 101, when the column injection hole groups in the present embodiment include a spray-hole 101, spray-hole 101 is a rectangle
Hole or long hole, spray-hole 101 extend to the other end of jet pipe 100 from one end of jet pipe 100.It is each to arrange in the present embodiment
When injection hole groups include more than two spray-holes 101, spray-hole 101 include but is not limited to round hole, slotted eye, square hole,
Slot or long hole, since circuit board 200 is the plate-shaped electronic elements with multiple hole, preferred spray-hole in the present embodiment
101 be round hole.The present embodiment preferably column injection hole groups include the circular spray-hole 101 of multiple fine and closely woven distributions.
Optionally, jet pipe 100 includes upper sealing panel 103 and lower sealing plate 104, and upper sealing panel 103 is for sealing jet flow
The upper end of pipe 100, lower sealing plate 104 seal the lower end of jet pipe 100.As shown in figure 5, the side wall of upper sealing panel 103 is set
It is equipped with upper sealing panel spray-hole 1031 corresponding with the spray-hole 101 of jet pipe 100, upper sealing panel spray-hole 1031 and jet flow
Pipe 100 is connected to.Specifically, it is provided with a cavity on upper sealing panel 103, when upper sealing panel 103 and jet pipe 100 are tightly connected
When, which is connected to upper sealing panel spray-hole 1031 and jet pipe 100 simultaneously.Lower sealing plate 104 is provided with a connecting hole 1041,
It is connected by the connecting hole 1041 with the corresponding interface 602 flowed into for electroplate liquid.When 301 clamping circuit board 200 of fixture, folder
Close to the upper end of jet pipe 100, the spray-hole 101 on upper sealing panel 103 can be to 301 lower part of fixture for the lower part of tool 301
Region is surface-treated, and the surface treatment region of jet pipe 100 is expanded.
Optionally, in order to further expand the surface treatment region of jet pipe 100, the upper surface of upper sealing panel 103 is set
It is equipped with short tube 105, short tube 105 has spray-hole 101 and is connected to jet pipe 100, and the diameter of short tube 105 is less than jet pipe 100
Diameter.Spray-hole 101 on short tube 105 can carry out at surface the circuit board 200 of 301 retained part of fixture 301 and fixture
Reason, the especially surface treatment to the region portion between 200 upper fixture 301 of circuit board.Fixture 301 along perpendicular circuit board
The size in 200 directions is greater than the thickness of circuit board 200, and when the diameter of short tube 105 is less than the diameter of jet pipe 100, two is opposite
Jet pipe 100 it is installable closer, the gap between two opposite jet pipes 100 is smaller, jet pipe 100 more close to
The injector stroke of circuit board 200, electroplate liquid is shorter, and required injection pressure is also smaller.
As shown in figure 3, preferably each jet pipe 100 of the present embodiment is provided with the injection hole groups of even column, setting even column sprays
When perforation set, the interlaced setting of spray-hole 101 that same jet pipe respectively arranges.It is highly preferred that each two column of the setting of jet pipe 100 are simultaneously
The injection hole groups of setting are arranged, the spray-hole 101 of two column injection hole groups is staggered.In the present embodiment, it is staggered and refers to transverse direction
Staggeredly, on same jet pipe 100, two interlaced column spray-holes 101 are not in the same horizontal position, column spray-hole therein
Group is opposite to be moved up or moves down with another column injection hole groups.Two column injection hole groups, while each column are respectively provided with multiple fine and closely woven sprays
Perforation 101, it is reasonable that the quantity of spray-hole 101 arranges；In addition, two jet pipes 100 are mounted side by side during installation, 101 court of spray-hole
To circuit board 200, i.e., the jet pipe 100 of same jet pack is vertical opposite, and which forms the injections of opposite column injection hole groups
About 101 relative misalignment of hole, in this implementation, identical jet pipe 100 is can be used in same jet pack.
As shown in figure 4, optionally, it is provided with inner tube 400 in each jet pipe 100, inner tube 400 is provided at least one makes
The through-hole that pipe 400 is connected to jet pipe 100, inner tube 400 connect the interface 602 entered for electroplate liquid by lower sealing plate 104.
Inner tube 400 can balance the pressure of the electroplate liquid in jet pipe 100, reduce the injection pressure difference of the jet pipe 100 of same row.Other
In embodiment, inner tube 400 can be in the opening that setting is connect with interface 602 on tube wall.
Optionally, the upper end of each inner tube 400 protrudes from the upper end of corresponding jet pipe 100, the upper end of each inner tube 400
Spray-hole 101 is provided on the inside of portion.Above-mentioned short tube 105 is the structure of additional, and 400 upper end of inner tube is made to protrude from jet flow
Pipe 100 can replace short tube 105, the technical effect with short tube 105.Corresponding, upper sealing panel 103 is equipped with the first mounting hole
1032, the first mounting hole 1032 is passed through for the upper end of inner tube 400 and is tightly connected with the outer wall of the upper end of inner tube 400,
Lower sealing plate 104 is additionally provided with the second mounting hole 1042, and the second mounting hole 1042 is coaxially disposed with connecting hole 1041, the second installation
Hole 1042 is used to be tightly connected with the lower end of inner tube 400.Relative to adding for short tube 105, by extending 400 length of inner tube
The function can be realized, therefore 400 upper end of inner tube can reduce production procedure, improves production efficiency.
Optionally, spray-hole 101 is distributed along the axial direction of inner tube 400, and through-hole 401 is preferably disposed on the separate spray of inner tube 400
The side of perforation 101 can effectively avoid and flow through the electroplate liquid of inner tube 400 and flow directly into spray-hole 101, increases balance jet pipe
The effect of 100 plating solution pressures.
Optionally, the quantity at least two of through-hole 401, axial distribution and internal diameter of the through-hole 401 along inner tube 400 gradually increase
Greatly, specially the internal diameter of through-hole 401 is sequentially increased from top to bottom.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (8)
1. a kind of electroplanting device is set to the jet pack in electroplating bath, the jet flow including electroplating bath, transport mechanism and multiple groups
Component includes two vertical and arranged side by side jet pipes, between two jet pipes there are can the gap that passes through of power circuit board,
It is characterized in that: being provided at least one injection hole groups that are axially distributed along the jet pipe of column on the inside of each jet pipe, two
Each column injection hole groups of the jet pipe are oppositely arranged, and each injection hole groups include multiple spray-holes, and are located at opposite
Each spray-hole of the injection hole groups is arranged along the axially staggered setting of the jet pipe；It is set as on the inside of each jet pipe
For guiding the arc cylinder of the circuit board；It further include pump and pipeline, pump passes through jet pipe described in piping connection.
2. a kind of electroplanting device according to claim 1, it is characterised in that: the jet pipe be round tube or elliptical tube,
Arc cylinder on the inside of each jet pipe constitutes the guide frame.
3. a kind of electroplanting device according to claim 1 or 2, it is characterised in that: the jet pipe includes being respectively arranged at
The upper sealing panel at both ends and lower sealing plate, the side wall of the upper sealing panel are provided with the spray-hole phase with the jet pipe
Corresponding upper sealing panel spray-hole, the upper sealing panel spray-hole are connected to the jet pipe.
4. a kind of electroplanting device according to claim 3, it is characterised in that: the upper surface of the upper sealing panel is provided with one
Short tube, the short tube are provided with short tube spray-hole that is corresponding with the spray-hole and being connected to the jet pipe, the short tube
Diameter be less than the jet pipe diameter.
5. a kind of electroplanting device according to claim 1 or 2, it is characterised in that: each jet pipe is provided with two column simultaneously
Arrange the injection hole groups of setting, each laterally staggered setting of spray-hole of the two column injection hole groups.
6. a kind of electroplanting device according to claim 1 or 2, it is characterised in that: it is provided with inner tube in each jet pipe,
Said inner tube is provided with multiple through-holes for being connected to said inner tube with the jet pipe, and said inner tube connection is for electroplate liquid entrance
Interface.
7. a kind of electroplanting device according to claim 6, it is characterised in that: the upper end of each said inner tube protrudes from correspondence
The jet pipe upper end, be provided with the upper spray-hole on the inside of the upper end of each said inner tube.
8. a kind of electroplanting device according to claim 6, it is characterised in that: be arranged the one of the spray-hole along said inner tube
The direction of its other end is directed toward at end, and multiple through-holes are axially distributed and internal diameter is gradually increased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610909232.8A CN106350841B (en) | 2016-10-18 | 2016-10-18 | A kind of electroplanting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610909232.8A CN106350841B (en) | 2016-10-18 | 2016-10-18 | A kind of electroplanting device |
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| CN106350841A CN106350841A (en) | 2017-01-25 |
| CN106350841B true CN106350841B (en) | 2019-03-05 |
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| CN110318086A (en) * | 2018-03-28 | 2019-10-11 | 姜力 | Electroplating tank structure |
| KR102124406B1 (en) * | 2018-03-28 | 2020-06-18 | 주식회사 익스톨 | A horizontal plating apparatus and a method thereof |
| TWI831852B (en) * | 2019-10-24 | 2024-02-11 | 香港商亞洲電鍍器材有限公司 | A fluid delivery system and a method of electroplating a workpiece |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003514125A (en) * | 1999-11-09 | 2003-04-15 | シーメンス アクチエンゲゼルシヤフト | Equipment for electrolytically processing plate-shaped workpieces, especially printed wiring boards |
| CN1944717B (en) * | 2006-07-04 | 2010-08-11 | 深圳市深南电路有限公司 | Negative pressure electroplating method for PCB |
| CN103305882B (en) * | 2012-03-07 | 2016-08-10 | 深南电路有限公司 | Pcb board electro-plating method and device |
| CN202658251U (en) * | 2012-03-26 | 2013-01-09 | 宇宙电路板设备(深圳)有限公司 | Double-track-type vertical and continuous electroplating apparatus |
| CN204022972U (en) * | 2014-08-11 | 2014-12-17 | 湖南维胜科技电路板有限公司 | Pcb board is electroplated jet pipe protection structure |
| CN104178795B (en) * | 2014-08-19 | 2017-06-16 | 广州兴森快捷电路科技有限公司 | Electroplate Liquid Residue remove device and method |
| CN204080169U (en) * | 2014-09-01 | 2015-01-07 | 梅州市志浩电子科技有限公司 | The electroplating liquid medicine jet flow recycle system of printed circuit board (PCB) |
| CN204625810U (en) * | 2015-05-06 | 2015-09-09 | 苏州吉岛电极科技有限公司 | A kind of liquid sprays with tape guide water cutter |
| CN105019006B (en) * | 2015-07-17 | 2017-11-21 | 深圳市华祥电路科技有限公司 | Electroplating bath |
| CN105063709B (en) * | 2015-09-18 | 2018-02-23 | 安捷利电子科技（苏州）有限公司 | Use in printed circuit board electroplanting device |
| CN205152366U (en) * | 2015-10-28 | 2016-04-13 | 东莞市希锐自动化科技股份有限公司 | Take PCB soft board electro -coppering jar of floor conveying device and sport mechanism |
| CN206266725U (en) * | 2016-10-18 | 2017-06-20 | 东莞宇宙电路板设备有限公司 | A kind of electroplanting device |
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