CN104178795B - Electroplate Liquid Residue remove device and method - Google Patents
Electroplate Liquid Residue remove device and method Download PDFInfo
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- CN104178795B CN104178795B CN201410410156.7A CN201410410156A CN104178795B CN 104178795 B CN104178795 B CN 104178795B CN 201410410156 A CN201410410156 A CN 201410410156A CN 104178795 B CN104178795 B CN 104178795B
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Abstract
The present invention relates to a kind of electroplate Liquid Residue remove device and method, the electroplate Liquid Residue remove device, including at least two tracheaes, multiple shower nozzles, air cleaner, wherein two tracheaes are arranged on the both sides above electroplating bath, the shower nozzle is disposed on tracheae, and connected with tracheae, the tracheae is connected with high-pressure air source, and the air cleaner is arranged between tracheae and high-pressure air source.By setting air cleaner filtration high pressure air, the foreign matter and little particle in pressure-air can effectively be reduced, prevent the damage to electroplating plate face, pressure-air is through on shower nozzle spray electroplate, impulsive force is produced to the Liquid Residue on electroplate, Liquid Residue is set to return to electroplating bath along electroplate surface current, reduce loss of the electroplate liquid caused by plating plate face is remained, save the cost of precious metal, and removing speed is fast, production efficiency can be greatly improved, the apparatus structure is simple, installing/dismounting easy, be easy to maintenance.
Description
Technical field
The present invention relates to printed circuit technique field, more particularly to a kind of electroplate Liquid Residue remove device and method.
Background technology
During ordinary printed circuit board factory and package substrate factory manufacture, wherein the golden cost of plating accounts for raw material and disappears
30% or so of consumption totle drilling cost, lowering golden cost can effectively lower total production cost, improve efficiency and industrialization profit.Subtract
Low golden cost mainly has two methods：One kind is to lower electric plated thickness, but client has to electric plated thickness upper and lower limit
Clearly require；Another is to cause the loss of gold salt by reducing panel plating gold liquid residual to take out of, general factory
Using dropping liquid time of the gold-plated rear sheet material of growth on golden groove, but this method is limited for reducing plate face gold liquid residual
, while to the unfavorable of improve production efficiency.
The content of the invention
Based on this, it is necessary to for the defect of prior art, there is provided a kind of electroplate Liquid Residue remove device, can not only have
Effect removes the Liquid Residue on electroplate, reduces the loss of precious metal, and removing speed is fast, can greatly improve production efficiency.
Its technical scheme is as follows：
A kind of electroplate Liquid Residue remove device, including at least two tracheaes, multiple shower nozzles, air cleaners, wherein two
Root tracheae is arranged on the both sides above electroplating bath, and multiple shower nozzles are disposed on tracheae, and are connected with tracheae, the tracheae with
High-pressure air source is connected, and the air cleaner is arranged between tracheae and high-pressure air source.
Its further technical scheme is as follows：
The shower nozzle is set down, and horizontal by 30 ° of angles of ± 5 ° of scopes.
The shower nozzle of electroplating bath both sides is interlaced to be arranged on tracheae.
Described electroplate Liquid Residue remove device also includes inductive switch, and the inductive switch is arranged on electroplating bath and goes out liquid
The side in face, and the controller of the inductive switch and high-pressure air source is electrically connected with.
Described electroplate Liquid Residue remove device also includes control damper, and the control damper is arranged on the tracheae
On.
The tracheae is provided with junction block corresponding with the shower nozzle, and the shower nozzle includes body and nozzle, the body
Passage is provided with, the first nut is provided near porch in the passage, is provided with the nozzle with mounting hole near exit
Seat, is provided with the second nut in the mounting hole, the junction block is connected with first nut, the nozzle and second spiral shell
Mother's connection.
Orifice plate is additionally provided with the passage, the orifice plate is arranged between the first nut and the second nut, on the orifice plate
Multiple through holes are disposed with, the mounting hole is in horn-like, and it is big end near one end of orifice plate, and the one end near the second nut is
Small end.
In the small taper of outer imperial palace, the cone angle of the outlet of the passage is 88 ° of ± 3 ° of scopes for the outlet of the passage.
Present invention also offers a kind of electroplate Liquid Residue sweep-out method, its technical scheme is as follows：
A kind of electroplate Liquid Residue sweep-out method, comprises the following steps：
Both sides above electroplating bath are respectively provided with the tracheae connected with high-pressure air source, and multiple shower nozzles are disposed with tracheae,
Air cleaner is set between tracheae and high-pressure air source；
Electroplate opens high-pressure air source after completing plating；
In electroplate uphill process, gases at high pressure are injected on electroplate after being filtered by air cleaner through shower nozzle, by electricity
The electroplate liquid remained on plating plate blows off into electroplating bath.
Further, described electroplate Liquid Residue sweep-out method, also comprises the following steps：
The side for going out liquid level in electroplating bath sets inductive switch, and inductive switch is electrically connected with the controller of high-pressure air source
Connect；
When electroplate goes out liquid from electroplating bath, inductive switch will go out controller of the liquid signal transmission to high-pressure air source, high pressure
Source of the gas is opened immediately, and shower nozzle starts to spray gases at high pressure.
The advantage or principle to preceding solution are illustrated below：
Above-mentioned electroplate Liquid Residue remove device, by setting air cleaner filtration high pressure air, can effectively reduce height
Foreign matter and little particle in pressure air, prevent the damage to electroplating plate surface, and pressure-air is sprayed onto on electroplate through shower nozzle, right
Liquid Residue on electroplate produces impulsive force, Liquid Residue is flow back into electroplating bath along plating plate surface, reduces electroplate liquid because of plating
The loss that plate surface residual is caused, saves the cost of precious metal, and removing speed is fast, can greatly improve production efficiency, should
Apparatus structure is simple, installing/dismounting is easy, is easy to maintenance, it is adaptable to the plating of gantry plating line, VCP plating lines or level
Line etc..
Above-mentioned electroplate Liquid Residue sweep-out method, it is simple to operate, the Liquid Residue on electroplate can be effectively removed, reduce valuable
The loss of metal, and removing speed is fast, can greatly improve production efficiency.
Brief description of the drawings
Fig. 1 is the schematic diagram one of electroplate Liquid Residue remove device described in the embodiment of the present invention；
Fig. 2 is the schematic diagram two of electroplate Liquid Residue remove device described in the embodiment of the present invention；
Fig. 3 is the schematic diagram three of electroplate Liquid Residue remove device described in the embodiment of the present invention；
Fig. 4 is the structural representation of shower nozzle described in the embodiment of the present invention.
Description of reference numerals：
1st, electroplate, 10, tracheae, 11, junction block, 20, shower nozzle, 21, body, 211, passage, 22, nozzle, 23, first
Nut, 24, nozzle carrier, 241, mounting hole, the 25, second nut, 26, orifice plate, 30, air cleaner, 40, control damper, 50,
Pressure gauge.
Specific embodiment
As shown in Figure 1 to Figure 3, a kind of electroplate Liquid Residue remove device, including at least two tracheaes 10, multiple shower nozzles
20th, air cleaner 30, wherein two tracheaes 10 are arranged on the both sides above electroplating bath, multiple shower nozzles 20 are disposed on tracheae
On 10, and connected with tracheae 10, the tracheae 10 is connected with high-pressure air source, the air cleaner 30 is arranged on tracheae 10 with height
Between pressurized air source.
Electroplate Liquid Residue remove device described in the present embodiment, by setting the filtration high pressure air of air cleaner 30, energy
The foreign matter and little particle in pressure-air are effectively reduced, the damage to the surface of electroplate 1 is prevented, pressure-air sprays through shower nozzle 20
Onto electroplate 1, impulsive force is produced to the Liquid Residue on electroplate 1, Liquid Residue is flow back into electroplating bath along the surface of electroplate 1,
Loss of the electroplate liquid caused by the remained on surface of electroplate 1 is reduced, the cost of precious metal is saved, and removing speed is fast, can be big
Big improve production efficiency, the apparatus structure is simple, installing/dismounting easy, is easy to maintenance, it is adaptable to gantry plating line, VCP
Plating line or horizontal plating line etc..
As shown in figure 1, the shower nozzle 20 of electroplating bath both sides is interlaced being arranged on tracheae 10, electroplate 1 is on the one hand avoided
Inclined because of the impulsive force of pressure-air, on the other hand can effectively reduce the residual of electroplate liquid in welding hole on electroplate 1.
As shown in Fig. 2 electroplate Liquid Residue remove device as described in Figure also includes control damper 40, the gas flow optimized
Valve 40 is arranged on the tracheae 10.By adjusting control damper 40, the pressure of shower nozzle 20 is controlled to adapt to different plates
The air blowing of the electroplate of thickness, aperture ratio and board dimension etc., in actual production process, the flexibility with operation.Gas
Pressure gauge 50 is additionally provided with pipe 10, for detecting the pressure size in tracheae 10.
Reference picture 3, the shower nozzle 20 is set down, and it is 30 ° of ± 5 ° of scopes, preferably 30 ° to press from both sides a with the angle of horizontal plane.Upper,
Under be the relative motion of electroplate 1 direction for, the direction towards the motion of electroplate 1 is upper, on the contrary under being then, by the court of shower nozzle 20
Lower setting, and be 30 ° of ± 5 ° of scopes with the angle a of horizontal plane, such shower nozzle 20 is blown to electroplate 1 down, can preferably by
Liquid Residue on electroplate 1 blows off, and when shower nozzle 20 is 30 ° ± 5 ° with the angle a of horizontal plane, Liquid Residue elimination effect is optimal.
Described electroplate Liquid Residue remove device also includes inductive switch, and the inductive switch is arranged on electroplating bath and goes out liquid
The side in face, and the controller of the inductive switch and high-pressure air source is electrically connected with.By setting inductive switch, electroplate 1 is sensed
Whether proposed from electroplating bath, once the liquid level of electroplating bath is stretched out on the top of electroplate 1, inductive switch will go out liquid signal transmission to
The controller of high-pressure air source, high-pressure air source is opened immediately, and shower nozzle 20 starts to spray gases at high pressure, right with the rising of electroplate 1
The Liquid Residue of the diverse location of electroplate 1 carries out air blowing removing, realizes Automatic Control, and Modulatory character is strong, quick and convenient,
Reference picture 1, Fig. 4, the tracheae 10 is provided with junction block 11 corresponding with the shower nozzle 20, and the shower nozzle 20 includes
Body 21 and nozzle 22, the body 21 are provided with passage 211, and the first spiral shell is provided near porch in the passage 211
Female 23, it is provided near exit in the nozzle carrier 24 with mounting hole 241, the mounting hole 241 and is provided with the second nut 25, it is described to connect
Head tube 11 is connected with first nut 23, and the nozzle 22 is connected with second nut 25.As shown in figure 4, the ventilation
Orifice plate 26 is additionally provided with hole 211, the orifice plate 26 is arranged between the first nut 23 and the second nut 25, is arranged on the orifice plate 26
There are multiple through holes, the mounting hole 241 is in horn-like, and one end of its close orifice plate 26 is big end, near the one of the second nut 25
It is small end to hold.By setting orifice plate 26, for the pressure-air air-flow even into nozzle 22, by the mounting hole in nozzle carrier 24
241 are arranged to horn-like, are easy to the pressure-air through orifice plate 26 after uniform to enter nozzle 22.
The outlet of the passage 211 in the small taper of outer imperial palace, the cone angle of the outlet of the passage 211 for 88 ° ±
3 ° of scopes, preferably 88 °.The pressure-air for so being sprayed by nozzle 22 rationally disperses through the outlet of passage 211, by passage
The cone angle of 211 outlet is arranged to 88 ° of ± 3 ° of scopes, it is to avoid pressure-air is excessively concentrated, and influences elimination effect, it is ensured that high pressure is empty
Gas can blow on electroplate 1 to greatest extent, improve elimination efficiency and effect.
The present embodiment additionally provides a kind of electroplate Liquid Residue sweep-out method, and its technical scheme is as follows：
A kind of electroplate Liquid Residue sweep-out method, comprises the following steps：
Both sides above electroplating bath are respectively provided with the tracheae connected with high-pressure air source, and multiple shower nozzles are disposed with tracheae,
Air cleaner is set between tracheae and high-pressure air source；
Electroplate opens high-pressure air source after completing plating；
In electroplate uphill process, gases at high pressure are injected on electroplate after being filtered by air cleaner through shower nozzle, by electricity
The electroplate liquid remained on plating plate blows off into electroplating bath.
Further, described electroplate Liquid Residue sweep-out method, also comprises the following steps：
The side for going out liquid level in electroplating bath sets inductive switch, and inductive switch is electrically connected with the controller of high-pressure air source
Connect；
When electroplate goes out liquid from electroplating bath, inductive switch will go out controller of the liquid signal transmission to high-pressure air source, high pressure
Source of the gas is opened immediately, and shower nozzle starts to spray gases at high pressure.
Electroplate Liquid Residue sweep-out method described in the present embodiment, it is simple to operate, can effectively remove the residual on electroplate
Liquid, reduces the loss of precious metal, and removing speed is fast, can greatly improve production efficiency.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Shield scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (7)
1. a kind of electroplate Liquid Residue remove device, it is characterised in that including at least two tracheaes, multiple shower nozzles, air filtration
Device, wherein two tracheaes are arranged on the both sides above electroplating bath, multiple shower nozzles are disposed on tracheae, and are connected with tracheae,
The tracheae is connected with high-pressure air source, and the air cleaner is arranged between tracheae and high-pressure air source, the spray of electroplating bath both sides
Interlaced to be arranged on tracheae, the tracheae is provided with junction block corresponding with the shower nozzle, and the shower nozzle includes body
And nozzle, the body is provided with passage, is provided with the first nut near porch in the passage, is provided near exit
Nozzle carrier with mounting hole, is provided with the second nut in the mounting hole, the junction block is connected with first nut, the spray
Mouth is connected with second nut, and orifice plate is additionally provided with the passage, and the orifice plate is arranged on the first nut and the second nut
Between, it is disposed with multiple through holes on the orifice plate, in horn-like, it is big end near one end of orifice plate to the mounting hole, near the
One end of two nuts is small end.
2. electroplate Liquid Residue remove device as claimed in claim 1, it is characterised in that the shower nozzle is set down, and with
Horizontal plane is in 30 ° of angles of ± 5 ° of scopes.
3. electroplate Liquid Residue remove device as claimed in claim 1, it is characterised in that it also includes inductive switch, described
Inductive switch is arranged on the side that electroplating bath goes out liquid level, and the inductive switch is electrically connected with the controller of high-pressure air source.
4. electroplate Liquid Residue remove device as claimed in claim 1, it is characterised in that it also includes control damper, should
Control damper is arranged on the tracheae.
5. electroplate Liquid Residue remove device as claimed in claim 1, it is characterised in that the outlet of the passage is in outer big
Interior small taper, the cone angle of the outlet of the passage is 88 ° of ± 3 ° of scopes.
6. a kind of electroplate Liquid Residue for applying the electroplate Liquid Residue remove device as described in claim any one of 1-5 is removed
Method, it is characterised in that comprise the following steps：Both sides above electroplating bath are respectively provided with the tracheae connected with high-pressure air source,
Multiple shower nozzles are disposed with tracheae, air cleaner is set between tracheae and high-pressure air source；Electroplate opens high after completing plating
Pressurized air source；In electroplate uphill process, gases at high pressure are injected on electroplate after being filtered by air cleaner through shower nozzle, will be electroplated
The electroplate liquid remained on plate blows off into electroplating bath.
7. electroplate Liquid Residue sweep-out method as claimed in claim 6, it is characterised in that also comprise the following steps：In plating
The side that groove goes out liquid level sets inductive switch, and the controller of inductive switch and high-pressure air source is electrically connected with；Electroplate is from plating
When going out liquid in groove, inductive switch will go out controller of the liquid signal transmission to high-pressure air source, and high-pressure air source is opened immediately, and shower nozzle starts
Injection gases at high pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410410156.7A CN104178795B (en) | 2014-08-19 | 2014-08-19 | Electroplate Liquid Residue remove device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410410156.7A CN104178795B (en) | 2014-08-19 | 2014-08-19 | Electroplate Liquid Residue remove device and method |
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| CN104178795A CN104178795A (en) | 2014-12-03 |
| CN104178795B true CN104178795B (en) | 2017-06-16 |
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| CN201410410156.7A Active CN104178795B (en) | 2014-08-19 | 2014-08-19 | Electroplate Liquid Residue remove device and method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104562124A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Electroplating liquid-blowing device |
| CN106350841B (en) * | 2016-10-18 | 2019-03-05 | 东莞宇宙电路板设备有限公司 | A kind of electroplanting device |
| CN109811384A (en) * | 2019-04-04 | 2019-05-28 | 苏州联滔环保设备有限公司 | A kind of full-automatic oxidation rack plating production equipment of novel environment friendly |
| CN113249759B (en) * | 2021-03-31 | 2022-06-03 | 深圳市鑫标特自动化科技有限公司 | Electroplating residual liquid removing device and removing method |
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| CN1118062A (en) * | 1993-10-22 | 1996-03-06 | 阿托技术德国有限公司 | Process for removal of liquid from the surface of a wetted product and device for effecting the process |
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| CN201455023U (en) * | 2009-07-22 | 2010-05-12 | 山西太钢不锈钢股份有限公司 | Device for cleaning residual sewage on strip steel surface |
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| JP3232069B2 (en) * | 1999-10-04 | 2001-11-26 | 株式会社オーケープリント | Etching equipment |
| JP3898989B2 (en) * | 2002-07-18 | 2007-03-28 | 矢崎総業株式会社 | Plating equipment |
| CN201104081Y (en) * | 2007-09-30 | 2008-08-20 | 扬博科技股份有限公司 | Circuit board drying mechanism |
| CN101570878A (en) * | 2009-06-12 | 2009-11-04 | 上海集成电路研发中心有限公司 | Electroplating bath for integrated circuit silicon chip and electroplating method thereof |
| CN202359224U (en) * | 2011-11-11 | 2012-08-01 | 竞陆电子(昆山)有限公司 | Water removal device for vertical electroplating line feeding clamp |
| CN103851887B (en) * | 2012-12-07 | 2016-01-27 | 深南电路有限公司 | PCB drying machine |
| CN204080155U (en) * | 2014-08-19 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Electroplate debris clearing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1118062A (en) * | 1993-10-22 | 1996-03-06 | 阿托技术德国有限公司 | Process for removal of liquid from the surface of a wetted product and device for effecting the process |
| CN2613125Y (en) * | 2003-04-10 | 2004-04-21 | 登泰电路机械股份有限公司 | Plate cooling device |
| CN201455023U (en) * | 2009-07-22 | 2010-05-12 | 山西太钢不锈钢股份有限公司 | Device for cleaning residual sewage on strip steel surface |
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