CN201180159Y - Mixed flow nozzle - Google Patents
Mixed flow nozzle Download PDFInfo
- Publication number
- CN201180159Y CN201180159Y CNU2008200430029U CN200820043002U CN201180159Y CN 201180159 Y CN201180159 Y CN 201180159Y CN U2008200430029 U CNU2008200430029 U CN U2008200430029U CN 200820043002 U CN200820043002 U CN 200820043002U CN 201180159 Y CN201180159 Y CN 201180159Y
- Authority
- CN
- China
- Prior art keywords
- fluid
- mixed flow
- jet
- flow pipe
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to the technical field of fluid nozzle devices, in particular to a mixed flow nozzle, which comprises a body, wherein a fluid passage which runs through both ends of the body is arranged in the body, one end of the body is externally provided with screw threads, a jet-flow pipe is extended from the other end of the body, the outside of the jet-flow pipe is provided with a mixed flow hole which is communicated with an inner cavity of the jet-flow pipe; fluid is sprayed out of the fluid passage to make the jet-flow pipe produce suction at the mixed flow hole, plating bath fluid is sucked into the jet-flow pipe from the mixed flow hole and forms mixed flow with the sprayed fluid, the mixed flow is sprayed out of the jet-flow pipe and is sprayed on the surface of a printed circuit board, thereby improving the supply amount of the liquid during the spraying, improving the ion exchange rate of liquid medicine, and accelerating the plating thickness efficiency of the printed circuit board; and the larger flow resistance exists after the fluid flows into the inner cavity of the jet-flow pipe, which equalizes the state of the fluid and ensures that the plating thickness is evener.
Description
Technical field:
The utility model relates to arrangement of fluid-spraying nozzle technical field, particularly mixed flow nozzle.
Background technology:
In the electroplating process of printed circuit board (PCB), need electroplate liquid be ejected into the surface of printed circuit board (PCB) with tuyere arrangement, to realize handling as far as possible fast and uniformly to the printed circuit board (PCB) of process.Be provided with many jet pipes in the general plating tank, establish a plurality of tuyere arrangements on the every jet pipe, electroplate liquid is extracted out by pump and is sprayed from tuyere arrangement through jet pipe, perpendicular to printed circuit board (PCB) plate face jet flow, forces to carry out the inside and outside liquid medicine exchange in hole.
In generally comprising, establishes existing tuyere arrangement the body of fluid channel, one end of body is provided with screw thread, body is by being threaded on the jet pipe, but directly enter into bath solution from the fluid that this tuyere arrangement gushes out, the fluid that gushes out is a direct current, the liquid medicine ion-exchange speed is slow, and the electroplating thickness efficient of printed circuit board (PCB) is lower.
The utility model content:
The purpose of this utility model is that a kind of mixed flow nozzle that improves the liquid medicine ion-exchange speed, accelerates the electroplating thickness efficient of printed circuit board (PCB) is provided at the deficiencies in the prior art.
For achieving the above object, the utility model adopts following technical scheme:
Mixed flow nozzle, it includes body, offers the fluid channel of running through its two ends in the body, and the end outside of body is provided with screw thread, and the other end of body extends jet pipe, and the outside of jet pipe offers the mixed flow hole that is communicated with its inner chamber.
Described fluid channel is provided with the V-type slot at body inner outlet place.
Jet pipe is vertically run through in described mixed flow hole.
The utility model beneficial effect is: the utility model includes body, offer the fluid channel of running through its two ends in the body, the one end outside of body is provided with screw thread, the other end of body extends jet pipe, the outside of jet pipe offers the mixed flow hole that is communicated with its inner chamber, fluid makes jet pipe produce suction at place, mixed flow hole behind the ejecting fluid passage, bath solution is inhaled into from the mixed flow hole in the jet pipe and with the fluid that sprays and forms mixed flow, spraying jet pipe together is injected on the printed circuit board surface, fluid feed rate when improving ejection, improve the liquid medicine ion-exchange speed, accelerated the electroplating thickness efficient of printed circuit board (PCB); Fluid exists bigger flow resistance after entering the inner chamber of jet pipe, balanced fluid state, and electroplating thickness is more even.
Description of drawings:
Fig. 1 is a structural representation of the present utility model
Fig. 2 is a front view of the present utility model
Fig. 3 is the sectional view of A-A direction among Fig. 2
Embodiment:
Below in conjunction with accompanying drawing the utility model is further described, see Fig. 1,2,3, mixed flow nozzle, it includes tubular body 1, offers the fluid channel 2 of running through its two ends in the body 1, fluid channel 2 is provided with V-type slot 6 at body 1 inner outlet place, the V-type limit of V-type slot 6 becomes an angle of 90 degrees, and the end outside of body 1 is provided with screw thread 3, and the other end of body 1 extends jet pipe 4, the outside of jet pipe 4 offers the mixed flow hole 5 that is communicated with its inner chamber, and jet pipe 4 is vertically run through in mixed flow hole 5.
Fluid makes jet pipe 4 produce suction at 5 places, mixed flow hole behind ejecting fluid passage 2, bath solution is inhaled into from mixed flow hole 5 in the jet pipe 4 and with the fluid that sprays and forms mixed flow, spraying jet pipe 4 together is injected on the printed circuit board surface, fluid feed rate when improving ejection, improve the liquid medicine ion-exchange speed, accelerated the electroplating thickness efficient of printed circuit board (PCB); Fluid exists bigger flow resistance after entering the inner chamber of jet pipe 4, balanced fluid state, and electroplating thickness is more even.
Claims (3)
1, mixed flow nozzle, it includes body (1), offer the fluid channel (2) of running through its two ends in the body (1), the one end outside of body (1) is provided with screw thread (3), it is characterized in that: the other end of body (1) extends has jet pipe (4), and the outside of jet pipe (4) offers the mixed flow hole (5) that is communicated with its inner chamber.
2, mixed flow nozzle according to claim 1 is characterized in that: described fluid channel (2) are provided with V-type slot (6) at body (1) inner outlet place.
3, mixed flow nozzle according to claim 1 is characterized in that: jet pipe (4) is vertically run through in described mixed flow hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200430029U CN201180159Y (en) | 2008-01-18 | 2008-01-18 | Mixed flow nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200430029U CN201180159Y (en) | 2008-01-18 | 2008-01-18 | Mixed flow nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201180159Y true CN201180159Y (en) | 2009-01-14 |
Family
ID=40249658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200430029U Expired - Fee Related CN201180159Y (en) | 2008-01-18 | 2008-01-18 | Mixed flow nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201180159Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668406A (en) * | 2012-09-17 | 2014-03-26 | 郑振华 | Ejection-suction electroplating bath |
| CN104338631A (en) * | 2013-08-09 | 2015-02-11 | 昆山东威电镀设备技术有限公司 | Spray nozzle |
| CN105019006A (en) * | 2015-07-17 | 2015-11-04 | 深圳市华祥电路科技有限公司 | Electroplating bath |
| CN105821455A (en) * | 2015-01-08 | 2016-08-03 | 和旺昌喷雾股份有限公司 | Nozzle |
| CN113355721A (en) * | 2021-06-29 | 2021-09-07 | 上海天承化学有限公司 | Electroplating jet system |
-
2008
- 2008-01-18 CN CNU2008200430029U patent/CN201180159Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668406A (en) * | 2012-09-17 | 2014-03-26 | 郑振华 | Ejection-suction electroplating bath |
| CN103668406B (en) * | 2012-09-17 | 2016-05-11 | 郑振华 | Spray-sucking type electroplating bath |
| CN104338631A (en) * | 2013-08-09 | 2015-02-11 | 昆山东威电镀设备技术有限公司 | Spray nozzle |
| CN105821455A (en) * | 2015-01-08 | 2016-08-03 | 和旺昌喷雾股份有限公司 | Nozzle |
| CN105821455B (en) * | 2015-01-08 | 2018-08-07 | 和旺昌喷雾股份有限公司 | Nozzle |
| CN105019006A (en) * | 2015-07-17 | 2015-11-04 | 深圳市华祥电路科技有限公司 | Electroplating bath |
| CN113355721A (en) * | 2021-06-29 | 2021-09-07 | 上海天承化学有限公司 | Electroplating jet system |
| CN113355721B (en) * | 2021-06-29 | 2022-06-17 | 上海天承化学有限公司 | Electroplating jet system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090114 Termination date: 20150118 |
|
| EXPY | Termination of patent right or utility model |