CN106338890B - A kind of passive base connecting mechanism and method - Google Patents
A kind of passive base connecting mechanism and method Download PDFInfo
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- CN106338890B CN106338890B CN201510415980.6A CN201510415980A CN106338890B CN 106338890 B CN106338890 B CN 106338890B CN 201510415980 A CN201510415980 A CN 201510415980A CN 106338890 B CN106338890 B CN 106338890B
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Abstract
The present invention performs relative motion stationary part by subpart, when substrate joins before exposure, subpart moves downward, lower air chamber air pressure declines, air pressure in the first substrate adsorbent chamber is made to cause substrate absorption on connection device less than external atmosphere pressure, until the first pressure release passage and extraneous unicom, make that intracavitary air pressure is equal with the external world, and substrate has been handover on sucker at this time；In exposure, subpart moves downward, and the second substrate adsorbent chamber, the absorption cavity volume increase of the second substrate are generated between connection device and substrate, and air pressure is less than external atmosphere pressure, and substrate is attracted on sucker；When joining substrate after exposure, subpart moves upwards, second substrate adsorbent chamber air pressure rises to equal in external atmosphere pressure, substrate is made to be detached from sucker and is handover to machine transmission hand, therefore the present invention can be realized without using gas path pipe and vacuum pump and be adsorbed in connection device to substrate, it is simple in structure, effective, there is the effect for reducing cost.
Description
Technical field
The present invention relates to a kind of connecting mechanism and method, more particularly to a kind of passive base connecting mechanism and method.
Background technology
Lithographic equipment is a kind of equipment by mask pattern exposure image to substrate.Known lithographic equipment includes stepping
Repetitive and step-by-step scanning type.In above-mentioned lithographic equipment, there need to be corresponding device as mask plate and the carrier of substrate
And mask plate and the connecting mechanism of substrate, the carrier for being mounted with mask plate or substrate generate accurate mutually movement to meet
Photoetching needs.The carrier of aforementioned mask plate is referred to as board platform, and the carrier of substrate is referred to as wafer-supporting platform, the handing-over machine of substrate
Structure is referred to as substrate connection device.Board platform and wafer-supporting platform are respectively positioned at the mask platform subsystem of lithographic equipment and work stage point
It is the nucleus module of above-mentioned subsystem in system.In the mutual movement of board platform and wafer-supporting platform, it must ensure that mask plate and substrate begin
It is reliably positioned eventually namely aforementioned mask plate and the six-freedom degree of substrate is all locked.Substrate is needed before exposing simultaneously
Substrate is moved to wafer-supporting platform by connection device on hand from machine transmission, needs substrate connection device by substrate from holding after the completion of exposure
Piece platform moves to machine and transmits hand.
In wafer-supporting platform module, the device for being directly used in positioning substrate is referred to as sucker.Sucker is by a series of drives under it
Dynamic device driving, can generate the movement of multiple degree of freedom, so as to complete the leveling and focusing to wafer-supporting platform module, carry out substrate required
Position adjustment.
Propose in the prior art makes substrate be located in sucker upper surface by the way of vacuum suction, but used true
Empty suction type is all to connect vacuum pump with sucker and substrate connection device by gas path pipe to establish vacuum chamber absorbable substrate,
When needing sucker suction substrate, then vacuum pump is opened, extract gas path pipe and suction cup interior air, when air pressure is less than the external world greatly
Air pressure is simultaneously moved closer to when vacuum, and substrate is securely pressed on sucker by external atmosphere pressure, completes absorption of the sucker to substrate,
When needing to join substrate, then vacuum pump is closed so that the air pressure in sucker is equal with the external world, and sucker loses substrate absorption
Power, substrate are handover to machine and transmit on hand.But this substrate connection device pipeline is numerous, complicated, vacuum pump is time-consuming
It is power-consuming, it is therefore necessary to a kind of simple in structure but effective substrate connection device of invention.
Invention content
To solve the above problems, the present invention proposes a kind of passive base connecting mechanism and method, set in connection device
Put, without external vacuum pump and gas path pipe, only can need to pass through subpart with the subpart and stationary part of relative motion
The absorption that substrate can be completed and handshaking are performed relative motion to stationary part.
In order to achieve the above objectives, the present invention provides a kind of passive base connecting mechanism, special including sucker and connection device
Sign is that the suction cup interior is provided with middle chamber, and the connection device is set in the middle chamber, the handing-over
Device includes stationary part and subpart, and the stationary part runs through entire subpart, and the subpart can be described
It moves up and down in middle chamber, the subpart is disposed with the first substrate adsorbent chamber and air cavity, the gas from top to bottom
Intracavitary sets piston, and is connected with the stationary part, and the air cavity is divided into upper air cavity and lower air chamber by the piston, described
For first substrate adsorbent chamber by the first unidirectional gas channels and upper air cavity unicom, the first substrate adsorbent chamber is unidirectional by second
Gas channels and lower air chamber unicom, the setting unidirectional gas channels of third are by upper air cavity and lower air chamber unicom and extend to the mover
Member base end and extraneous unicom, when the subpart performs relative motion stationary part, gas is inhaled in air cavity and the first substrate
Attached intracavitary flows and generates air pressure change, when air pressure is less than external atmosphere pressure, completes the sucker or connection device to base
The absorption at bottom when air pressure is equal to external atmosphere pressure, completes the handing-over of substrate.
Preferably, sealing unit is formd between the subpart and the middle chamber, in the sealing unit
The first sealing ring, the second sealing ring, third sealing ring and the 4th sealing ring, the first sealing ring and second are set gradually from top to bottom
The first sealing unit is formd between sealing ring, the second sealing unit is formd between third sealing ring and the 4th sealing ring, the
Two unidirectional gas channels and the first pressure release passage of setting in the sealing unit, are set between the second sealing ring and third sealing ring
Second pressure release passage, second pressure release passage be located in the substrate and with extraneous unicom, first pressure release passage and institute
When stating the second pressure release passage unicom, the air pressure in the first substrate adsorbent chamber reverts to identical with external atmosphere pressure, and sucker stops
Only absorbable substrate.
Preferably, the first unidirectional gas channels and the second unidirectional gas channels respectively set one in channel and open
It closing, respectively first switch and second switch, the unidirectional gas channels of third are switched with upper air cavity connection position setting third,
It is switched with lower air chamber connection position setting the 4th.
Preferably, when substrate is adsorbed on sucker, formed between the substrate when subpart moves downward
Cavity be set as the second substrate adsorbent chamber, sucker setting third substrate absorption around the second substrate adsorbent chamber
Chamber, and pass through the mutual unicom of sucker vacuum passage, when the second substrate adsorbent chamber, third substrate adsorbent chamber and sucker vacuum are led to
Air pressure in road is less than external atmosphere pressure, and the substrate absorption is on the sucker.
Preferably, the first substrate adsorbent chamber is either on the second substrate adsorbent chamber or third substrate adsorbent chamber accent
Sealing ring is set, flexible material ring is set on the sealing ring.
Preferably, the difference in height of the sealing ring and flexible material ring is between 0.1mm~0.2mm, the sealing ring
The hardness of material is more than the hardness of flexible material ring material.
Preferably, the subpart setting driving device, drives the subpart to be allocated as phase to the stator department
To movement.
Preferably, the subpart height is more than the sucker height, the stationary part is fixed on the substrate
On machine below connecting mechanism and do not generate movement.
Preferably, the first unidirectional gas channels and the second unidirectional gas channels are one-way conduction, gas can only
It circulates from the first substrate adsorbent chamber to the upper air cavity or lower air chamber, reversely then seals.
It is transferred on the sucker preferably, the substrate transmits hand by machine.
The present invention also provides a kind of substrate handover method using above-mentioned passive base connecting mechanism, including walking as follows
Suddenly：
Step 1：When joining substrate before exposure, the connection device bottom mutually maintains an equal level with the sucker bottom, the friendship
Higher than at the top of the sucker at the top of connection device, machine transmits hand by the substrate transfer to the connection device, forms contact
Sealing state, the first switch, third switch and the 4th switch are closed, and the second switch is in open shape
State, the piston are located at air cavity bottom；
Step 2：The subpart moves downward, and makes until lower air chamber air pressure is less than the first substrate adsorbent chamber
Interior air pressure, gas are flowed to by the second unidirectional gas channels in the lower air chamber out of described first substrate adsorbent chamber；
Step 3：The subpart moves downward, the first pressure release passage and the first sealing unit unicom, in close
Envelope state, when the air pressure in the first substrate adsorbent chamber is less than external atmosphere pressure, the substrate is pressed in by external atmosphere pressure
On the connection device；
Step 4：When the subpart is moved downward so that with maintaining an equal level at the top of the sucker at the top of the connection device
When, the substrate is handover on the sucker；
Step 5：The subpart continues to move downward so that first pressure release passage and the first sealing unit are detached from
And with the second pressure release passage unicom, the substrate upper and lower surface air pressure is equal, and with the connection device be detached from, before exposure
Substrate is handover to sucker completion；
Step 6：In exposure, the subpart continues to move downward generates the suction of the second substrate between the substrate
Attached chamber, the volume of the second substrate adsorbent chamber become larger, first pressure release passage and the second sealing unit unicom,
The second unidirectional gas channels are in sealing state；
Step 7：The volume of second substrate adsorbent chamber becomes larger, until air pressure is less than external atmosphere pressure, the substrate is then
It is pressed on the sucker by ambient pressure, substrate absorption is completed, and substrate is by sucker suction until exposure process is completed；
Step 8：When joining substrate after exposure, the subpart moves upwards, and second substrate adsorbs cavity volume
Become smaller, until intracavitary air pressure is equal to external atmosphere pressure, the substrate is detached from sucker, opens the 4th switch；
Step 9：The first switch is opened, closes the second switch, the subpart continues up, institute
It states air cavity volume to become larger, lower air chamber volume becomes smaller, and the gas in lower air chamber is flowed to by the unidirectional gas channels of the third
The external world, and first pressure release passage gradually forms sealing state with the first sealing unit unicom；
Step 10：Gradually higher than at the top of the sucker at the top of the connection device, the upper air cavity volume becomes larger, and described the
Gas in one substrate adsorbent chamber flow to the upper air cavity by the first unidirectional gas channels, inside the first substrate adsorbent chamber
Air pressure becomes smaller, until less than external atmosphere pressure, the substrate is then pressed in by ambient pressure on the connection device, and follows described
Subpart moves to the machine and transmits hand delivery position；
Step 11：First pressure release passage is as the subpart moves upwards and is taken off with the first sealing unit
From, and with the sucker vacuum passage unicom, the substrate upper and lower surface air pressure is equal, and the substrate takes off with the connection device
Hand strap is transmitted from and by machine to walk, substrate is handover to machine and transmits hand completion after exposure.
Compared with prior art, the beneficial effects of the invention are as follows：Present invention setting subpart and stationary part, by dynamic
Subdivision performs relative motion stationary part so that and the volume of upper air cavity and lower air chamber changes, and air pressure changes, so as to
The air pressure of substrate lower surface generates absorption and the handshaking for changing and completing substrate.Substrate is handover to sucker suction before exposure
When, the subpart is moved downward relative to stationary part, and lower air chamber volume becomes larger, and air pressure declines so that the first substrate is inhaled
In attached chamber gas flow lower air chamber, intracavitary air pressure is caused to cause substrate absorption on connection device less than external atmosphere pressure, until
First pressure release passage and extraneous unicom so that air pressure is equal with the external world in the first substrate adsorbent chamber, and substrate has been handover at this time
On sucker；In exposure, subpart continues to move downward, and the second substrate adsorbent chamber is generated between connection device and substrate, moves
Subdivision moves downward so that the absorption cavity volume increase of the second substrate, air pressure are less than external atmosphere pressure, and substrate is attracted to sucker
On；When joining substrate after completion of the exposure, subpart moves upwards, and the second substrate absorption cavity volume becomes smaller, and air pressure rises to
It is equal in external atmosphere pressure so that substrate is handover to machine with sucker disengaging and transmits hand, therefore the present invention is without using gas circuit
The connection device that is adsorbed in substrate can be realized with vacuum pump for pipeline, simple in structure, effective, have the effect for reducing cost.
Description of the drawings
Substrate connecting mechanism schematic diagram before Fig. 1 is exposed for the embodiment of the present invention one；
Substrate connecting mechanism schematic diagram when Fig. 2 is exposed for the embodiment of the present invention one；
Substrate connecting mechanism schematic diagram after Fig. 3 is exposed for the embodiment of the present invention one；
Fig. 4 contacts schematic diagram for two substrate contact portion of the embodiment of the present invention with substrate.
In figure：01- substrates, 02- suckers, 021- third substrates adsorbent chamber, 022- suckers vacuum passage, the second substrates of 023-
Adsorbent chamber, the second pressure release passages of 024-, 025- rolling mechanisms, 026- middle chambers, the first sealing rings of 0261-, 0262- second are close
Seal, 0263- thirds sealing ring, the 4th sealing rings of 0264-, 03- connection devices, 031- subparts, 0310- first seal list
Member, the second sealing units of 0311-, 032- stationary parts, 0321- pistons, the upper air cavitys of 033-, 034- lower air chambers, the first bases of 035-
Bottom adsorbent chamber, the second unidirectional gas channels of 036-, 0361- second switches, the first unidirectional gas channels of 037-, 0371- first are opened
Pass, the unidirectional gas channels of 038- thirds, 0381- thirds switch, the switches of 0382- the 4th, the first pressure release passages of 039-, 04- substrates
Contact portion, 041- substrates adsorbent chamber, 042- flexible materials ring, 043- sealing rings.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
Embodiment one
It please refers to shown in Fig. 1, Fig. 2 and Fig. 3, passive base connecting mechanism of the present invention includes sucker 02 and filled with handing-over
3 are set to 0, substrate 01 is located on the sucker 02, wherein, the sucker 02 is internally provided with middle chamber 026, and in middle chamber
The setting connection device 03 in 026.
Preferably, the height of connection device 03 is greater than the height of sucker 02.
Connection device 03 includes stationary part 032 and subpart 031, and the stationary part 032 runs through entire mover portion
Divide 031, the subpart 031 can move up and down in the middle chamber 026.The stationary part 032 is fixed on base
On machine below the connecting mechanism of bottom and do not generate movement.
Preferably, several groups of rolling mechanisms 025 are set in subpart so that subpart 031 relies on rolling mechanism 025
Along 026 scroll-up/down of middle chamber, reducing friction resistance.
The subpart 031 is disposed with the first substrate adsorbent chamber 035 and air cavity from top to bottom, is set in the air cavity
Piston 0321 is put, and is connected with the stationary part 032, the air cavity is divided into upper air cavity 033 under by the piston 0321
Air cavity 034, the first substrate adsorbent chamber 035 is by the first unidirectional gas channels 037 and upper 033 unicom of air cavity, and first
Setting first switch 0371, the first substrate adsorbent chamber 035 pass through the second unidirectional gas channels in unidirectional gas channels 037
036 with 034 unicom of lower air chamber, the setting unidirectional gas channels 038 of third are by upper air cavity 033 and 034 unicom of lower air chamber and extend to
031 bottom end of subpart and ambient atmosphere unicom.
An annular seal space is formed between subpart 031 and the middle chamber 026, specifically, is set in the sealing unit
There are four groups of sealing rings, be followed successively by the first sealing ring 0261, the second sealing ring 0262, third sealing ring 0263 and the 4th from top to bottom
Sealing unit is divided into three sealing units, the first sealing ring of sealing unit 0261 by sealing ring 0264, four groups of sealing rings
The first sealing unit 0310 is formd between the second sealing ring 0262, between 0263 and the 4th sealing ring 0264 of third sealing ring
Form the second sealing unit 0311, the second unidirectional gas channels 036 and the first pressure release passage of setting in the sealing unit
039, the second pressure release passage 024, second pressure release passage 024 are set between second sealing ring 0262 and third sealing ring 0263
On sucker 02 and with extraneous unicom, when first pressure release passage 039 and second pressure release passage 024 be located at it is same
When in sealing unit, the two unicom, the air pressure in the first substrate adsorbent chamber 035 reverts to identical with external atmosphere pressure, makes
It obtains sucker 02 and stops absorbable substrate 01.
One is respectively set in channel in the described first unidirectional 037 and second unidirectional gas channels 036 of gas channels to open
Close, respectively first switch 0371 and second switch 0361, the unidirectional gas channels 038 of third with upper 033 unicom of air cavity
Place's setting third switchs 0381, and 0382 is being switched with 034 connection position of lower air chamber setting the 4th.Preferably, the first unidirectional gas
037 and second unidirectional gas channels 036 of paths all have non-return valve function, i.e. gas can only be from the first substrate adsorbent chamber
035 circulates to the upper air cavity 033 or lower air chamber 034, reversely then seals.
It is formed between the substrate 01 when substrate 01 is adsorbed on sucker 02, and the subpart 031 is moved downward
Cavity for the second substrate adsorbent chamber 023, the sucker 02 sets third substrate around 023 surrounding of the second substrate adsorbent chamber
Adsorbent chamber 021, and pass through 022 mutual unicom of sucker vacuum passage, when the second substrate adsorbent chamber 023, third substrate are adsorbed
Chamber 021 is less than external atmosphere pressure with the air pressure in sucker vacuum passage 022, and the substrate 01 can be made to adsorb in the sucker 02
On, the second substrate adsorbent chamber 023 increases the adsorption area to substrate 01 with third substrate adsorbent chamber 021 so that 01 table of substrate
Pressure suffered by face is uniform, avoids substrate 01 since the pressure being subject to excessively is concentrated and generates damage.
Preferably, the subpart 031 sets driving device (not shown), for driving the subpart 031 right
Stationary part 032 relatively moves up and down.
It is transferred on the sucker 02 preferably, the substrate 01 transmits hand by machine.
The present invention also provides a kind of substrate handover method using passive base connecting mechanism as described above, including walking as follows
Suddenly：
Step 1：Fig. 1 is please referred to, when joining substrate 01 before exposure, the subpart 031 is driven using driving device
It is moved upwards relative to stationary part 032 so that 03 bottom of connection device mutually maintains an equal level with 02 bottom of sucker, then institute
03 top of connection device is stated higher than 02 top of sucker, machine transmits hand and the substrate 01 is transmitted to the connection device 03
On, contact sealing state is formed, closes the first switch 0371,0381 and the 4th switch 0382 of third switch so that described
The first unidirectional gas channels 038 unidirectional with third of gas channels 037 are closed, and the piston 0321 is located at air cavity bottom, in guarantee
033 volume of air cavity is in maximum, 034 volume of lower air chamber is in minimum state；
Step 2：Open second switch 0361 so that the second unidirectional gas channels 036 are open-minded, utilize driving device
The subpart 031 is driven to be moved downward relative to stationary part 032 so that 034 volume of lower air chamber becomes larger, air pressure
Decline, until less than the air pressure in the first substrate adsorbent chamber 035, then gas is just out of described first substrate adsorbent chamber 035
It is flowed in the lower air chamber 034 by the second unidirectional gas channels 036, at this point, the first pressure release passage 039 and the second pressure release passage
024 is located in different sealing units；
Step 3：The subpart 031 moves downward so that the first pressure release passage 039 and first sealing unit
0310 unicom and in sealing state, when the air pressure in the first substrate adsorbent chamber 035 is less than external atmosphere pressure, the base
Bottom 01 is pressed in by external atmosphere pressure on the connection device 03, as shown in Figure 2；
Step 4：Please continue to refer to Fig. 2, when the subpart 031 is moved downward so that 03 top of the connection device
When maintaining an equal level with 02 top of sucker, the substrate 01 is handover on the sucker 02；
Step 5：The subpart 031 continues to move downward so that the sealing of first pressure release passage 039 and first is single
Member 0310 be detached from and with 024 unicom of the second pressure release passage, then the first substrate adsorbent chamber 035 and ambient atmosphere unicom and
Pressure release, the 01 upper and lower surface air pressure of substrate are equal, and are detached from the connection device 03, and substrate 01 is handover to sucker before exposure
02 completes；
Step 6：Fig. 3 is please referred to, in exposure, the subpart 031 continues to move downward between the substrate 01
The second substrate adsorbent chamber 023 is generated, the volume of the second substrate adsorbent chamber 023 becomes larger, first pressure release passage 039
With the subpart 031 move downward and with 0311 unicom of the second sealing unit, then in sealing state, cause
The second unidirectional gas channels 036 are also at sealing state；
Step 7：As the volume of the second substrate adsorbent chamber 023 becomes larger, until air pressure is less than external atmosphere pressure, institute
It states substrate 01 to be then pressed on the sucker 02 by ambient pressure, the absorption of substrate 01 is completed, and substrate 01 is adsorbed by sucker 02 until exposing
Photoreduction process is completed；
Step 8：When joining substrate 01 after exposure, the subpart 031 moves upwards, the second substrate absorption
023 volume of chamber becomes smaller, until intracavitary air pressure is equal to external atmosphere pressure, the substrate 01 is detached from naturally with sucker 02, described in opening
4th switch 0382, makes the lower air chamber 034 and unidirectional 038 unicom of gas channels of the third；
Step 9：The first switch 0371 is opened so that the first unidirectional gas channels 037 are open-minded, closes described the
Two switches 0361 are so that the second unidirectional gas channels 036 are closed, and the subpart 031 continues up, the upper air cavity
033 volume becomes larger, and 034 volume of lower air chamber becomes smaller, and the gas in lower air chamber 034 is flowed by the unidirectional gas channels 038 of the third
It moves to the external world, and first pressure release passage 039 gradually forms sealing state with 0310 unicom of the first sealing unit；
Step 10：Please refer to Fig. 1, as the subpart 031 continues up, 03 top of the connection device by
Gradually higher than 02 top of sucker, upper 033 volume of air cavity becomes larger, and the gas in the first substrate adsorbent chamber 035 passes through
First unidirectional gas channels 037 flow to the upper air cavity 033 so that 035 air pressure inside of the first substrate adsorbent chamber becomes smaller, directly
To external atmosphere pressure is less than, the substrate 01 is then pressed in by ambient pressure on the connection device 03, and follows the mover portion
Divide 031 to move to the machine and transmit hand delivery position；
Step 11：First pressure release passage 039 seals single as the subpart 031 is moved upwards with first
Member 0310 be detached from, and with 022 unicom of sucker vacuum passage, be connected with ambient atmosphere, lead to following table in the substrate 01
Face air pressure is equal, and the substrate 01 is detached from and transmits hand strap by the machine to walk with the connection device 03, substrate 01 after exposure
It is handover to machine and transmits hand completion.
Embodiment two
Fig. 4 is please referred to, the difference between this embodiment and the first embodiment lies in, connection device 03 or sucker 02 and substrate 01
Contact portion is substrate contact portion 04, has substrate adsorbent chamber 041 between substrate contact portion 04 and substrate 01, such as embodiment
The first substrate adsorbent chamber 035, the second substrate adsorbent chamber 023, third substrate adsorbent chamber 021 in one, in 041 chamber of substrate adsorbent chamber
Mouth setting sealing ring 043, and flexible material ring 042 is set for buffering substrate contact portion 04 to substrate on sealing ring 043
01 absorption.
Preferably, the difference in height h between flexible material ring 042 and sealing ring 043 is between 0.1mm~0.2mm, sealing ring
043 material is high hardness material, and the material of flexible material ring 042 is flexible material.
Above-described embodiment is described in the present invention, but the present invention is not limited only to above-described embodiment.Obvious this field
Technical staff can carry out various modification and variations without departing from the spirit and scope of the present invention to invention.If in this way, this hair
These bright modifications and variations belong within the scope of the claims in the present invention and its equivalent technologies, then the present invention is also intended to include
Including these modification and variations.
Claims (11)
1. a kind of passive base connecting mechanism, including sucker and connection device, which is characterized in that during the suction cup interior is provided with
Between cavity, and the connection device is set in the middle chamber, the connection device includes stationary part and subpart,
The stationary part runs through entire subpart, and the subpart can move up and down in the middle chamber, the mover
Part is disposed with the first substrate adsorbent chamber and air cavity from top to bottom, setting piston in the air cavity, and with the stator department
Split-phase connects, and the air cavity is divided into upper air cavity and lower air chamber by the piston, and the first substrate adsorbent chamber is unidirectional by first
Gas channels and upper air cavity unicom, the first substrate adsorbent chamber pass through the second unidirectional gas channels and lower air chamber unicom, setting
The unidirectional gas channels of third are by upper air cavity and lower air chamber unicom and extend to the subpart bottom end and extraneous unicom, described dynamic
When subdivision performs relative motion stationary part, gas flows in air cavity and the first substrate adsorbent chamber and generates air pressure change,
When air pressure is less than external atmosphere pressure, the absorption of the sucker or connection device to substrate is completed, when air pressure is equal to the external world greatly
During air pressure, the handing-over of substrate is completed.
2. passive base connecting mechanism as described in claim 1, which is characterized in that the subpart and the middle chamber
Between form sealing unit, it is close that the first sealing ring, the second sealing ring, third are set gradually in the sealing unit from top to bottom
Seal and the 4th sealing ring form the first sealing unit, third sealing ring and between the first sealing ring and the second sealing ring
The second sealing unit is formd between four sealing rings, the second unidirectional gas channels lead to the first pressure release of setting in the sealing unit
Road, sets the second pressure release passage between the second sealing ring and third sealing ring, second pressure release passage is located in the substrate
And during with extraneous unicom, first pressure release passage and the second pressure release passage unicom, in the first substrate adsorbent chamber
Air pressure reverts to, sucker stopping absorbable substrate identical with external atmosphere pressure.
3. passive base connecting mechanism as described in claim 1, which is characterized in that the first unidirectional gas channels and second
Unidirectional gas channels respectively set a switch, respectively first switch and second switch, the unidirectional gas of third in channel
Paths are switched with upper air cavity connection position setting third, are switched with lower air chamber connection position setting the 4th.
4. passive base connecting mechanism as described in claim 1, which is characterized in that described dynamic when substrate is adsorbed on sucker
The cavity formed between the substrate when subdivision moves downward is set as the second substrate adsorbent chamber, and the sucker is around described
Third substrate adsorbent chamber around the second substrate adsorbent chamber is set, and passes through the mutual unicom of sucker vacuum passage, when second base
Bottom adsorbent chamber, third substrate adsorbent chamber and the air pressure in sucker vacuum passage are less than external atmosphere pressure, and the substrate absorption is in institute
It states on sucker.
5. passive base connecting mechanism as claimed in claim 4, which is characterized in that the first substrate adsorbent chamber or second
Sealing ring in substrate adsorbent chamber or third substrate adsorbent chamber accent is set, flexible material ring is set on the sealing ring.
6. passive base connecting mechanism as claimed in claim 5, which is characterized in that the height of the sealing ring and flexible material ring
For degree difference between 0.1mm~0.2mm, the hardness of the seal ring material is more than the hardness of flexible material ring material.
7. passive base connecting mechanism as described in claim 1, which is characterized in that the subpart sets driving device,
The subpart is driven to perform relative motion the stationary part.
8. passive base connecting mechanism as described in claim 1, which is characterized in that the subpart height is more than the suction
Disk height does not generate on the machine that the stationary part is fixed below the substrate connecting mechanism and movement.
9. passive base connecting mechanism as described in claim 1, which is characterized in that the first unidirectional gas channels and second
Unidirectional gas channels are one-way conduction, and gas can only be from the first substrate adsorbent chamber to the upper air cavity or lower air chamber stream
It is logical, reversely then seal.
10. passive base connecting mechanism as described in claim 1, which is characterized in that the substrate is transmitted hand by machine and passed
It is handed on the sucker.
11. a kind of substrate handover method of passive base connecting mechanism using as described in claim 1~10 any one,
It is characterized in that, includes the following steps：
Step 1：When joining substrate before exposure, the connection device bottom mutually maintains an equal level with the sucker bottom, the handing-over dress
Higher than at the top of the sucker, machine, which transmits hand, in the substrate transfer to the connection device, to form contact sealing in top set portion
State, first switch, third switch and the 4th switch are closed, and second switch is in opening state, the piston position
In air cavity bottom；
Step 2：The subpart moves downward, and makes until lower air chamber air pressure is less than in the first substrate adsorbent chamber
Air pressure, gas are flowed to by the second unidirectional gas channels in the lower air chamber out of described first substrate adsorbent chamber；
Step 3：The subpart moves downward, after the first pressure release passage and the first sealing unit unicom, in seal shape
State, when the air pressure in the first substrate adsorbent chamber is less than external atmosphere pressure, the substrate is pressed in described by external atmosphere pressure
On connection device；
Step 4：When the subpart move downward so that the connection device at the top of with the sucker at the top of maintain an equal level when, institute
Substrate is stated to be handover on the sucker；
Step 5：The subpart continues to move downward so that first pressure release passage is detached from first sealing unit
And with the second pressure release passage unicom, the substrate upper and lower surface air pressure is equal, and with the connection device be detached from, substrate before exposure
It is handover to sucker completion；
Step 6：In exposure, the subpart continues to move downward generates the second substrate adsorbent chamber between the substrate,
The volume of the second substrate adsorbent chamber becomes larger, first pressure release passage and the second sealing unit unicom, and described second
Unidirectional gas channels are in sealing state；
Step 7：The volume of second substrate adsorbent chamber becomes larger, until air pressure is less than external atmosphere pressure, the substrate is then outer
Boundary's air pressure is pressed on the sucker, and substrate absorption is completed, and substrate is by sucker suction until exposure process is completed；
Step 8：When joining substrate after exposure, the subpart moves upwards, and the second substrate absorption cavity volume becomes
Small, until intracavitary air pressure is equal to external atmosphere pressure, the substrate is detached from sucker, opens the 4th switch；
Step 9：Open the first switch, close the second switch, the subpart continues up, it is described on
Air cavity volume becomes larger, and lower air chamber volume becomes smaller, and the gas in lower air chamber flows to the external world by the unidirectional gas channels of the third,
And first pressure release passage gradually forms sealing state with the first sealing unit unicom；
Step 10：Gradually higher than at the top of the sucker at the top of the connection device, the upper air cavity volume becomes larger, first base
Gas in the adsorbent chamber of bottom flow to the upper air cavity, the first substrate adsorbent chamber air pressure inside by the first unidirectional gas channels
Become smaller, until less than external atmosphere pressure, the substrate is then pressed in by ambient pressure on the connection device, and follows the mover
Componental movement to the machine transmits hand delivery position；
Step 11：First pressure release passage is detached from as the subpart is moved upwards with the first sealing unit, and
With the sucker vacuum passage unicom, the substrate upper and lower surface air pressure is equal, and the substrate is detached from simultaneously with the connection device
Hand strap is transmitted by machine to walk, substrate is handover to machine and transmits hand completion after exposure.
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| CN109597279B (en) * | 2017-09-30 | 2023-09-29 | 上海微电子装备（集团）股份有限公司 | Vacuum adsorption hand, substrate handing-over device and photoetching machine |
| CN110032044B (en) * | 2018-01-12 | 2021-03-19 | 上海微电子装备（集团）股份有限公司 | Substrate handover mechanism, photoetching machine and substrate handover method |
| CN108144790B (en) * | 2018-01-20 | 2024-05-03 | 梵利特智能科技（苏州）有限公司 | Automatic card gluing and hot pressing device |
| CN108706140B (en) * | 2018-06-23 | 2024-05-10 | 吕扬效 | Sucking disc and wrapping bag conveyer |
| CN113410174B (en) * | 2021-06-25 | 2024-01-30 | 上海隐冠半导体技术有限公司 | Adsorption mechanism and adsorption system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888265A (en) * | 1994-09-19 | 1996-04-02 | Canon Inc | Positioning stage |
| JP2006073963A (en) * | 2004-09-06 | 2006-03-16 | Tokyo Electron Ltd | Wafer chuck |
| CN102049730A (en) * | 2010-12-29 | 2011-05-11 | 清华大学 | Wafer replacing device used in chemical mechanical polishing equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6935466B2 (en) * | 2001-03-01 | 2005-08-30 | Applied Materials, Inc. | Lift pin alignment and operation methods and apparatus |
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2015
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0888265A (en) * | 1994-09-19 | 1996-04-02 | Canon Inc | Positioning stage |
| JP2006073963A (en) * | 2004-09-06 | 2006-03-16 | Tokyo Electron Ltd | Wafer chuck |
| CN102049730A (en) * | 2010-12-29 | 2011-05-11 | 清华大学 | Wafer replacing device used in chemical mechanical polishing equipment |
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