CN106338890A - Passive substrate transferring mechanism and method - Google Patents
Passive substrate transferring mechanism and method Download PDFInfo
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- CN106338890A CN106338890A CN201510415980.6A CN201510415980A CN106338890A CN 106338890 A CN106338890 A CN 106338890A CN 201510415980 A CN201510415980 A CN 201510415980A CN 106338890 A CN106338890 A CN 106338890A
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Abstract
The invention provides a passive substrate transferring mechanism and method. According to the invention, a mover part moves relative to a stator part; during substrate transferring before exposure, the mover part moves downwards and the air pressure of a lower air chamber decreases, so an adsorption chamber of a first substrate has an air pressure smaller than outer atmospheric pressure, which enables the substrate to be adsorbed onto a transferring device; and when a first pressure release channel is communicated with the outside and the air pressure in the chamber is equal to outer atmospheric pressure, the substrate has been transferred onto a sucker. During exposure, the mover part moves downwards and a second substrate adsorption chamber is formed between the transferring device and the substrate; and the volume of the second substrate adsorption chamber increases and air pressure in the chamber is smaller than outer atmospheric pressure, so the substrate is adsorbed onto the sucker. During substrate transferring after exposure, the mover part moves upwards and the air pressure in the second substrate adsorption chamber increases until the air pressure is equal to outer atmospheric pressure, so the substrate separated from the sucker is transferred to a mechanical conveying hand. Thus, the passive substrate transferring mechanism provided by the invention realizes adsorption of the substrate onto the transferring device without air pipelines and vacuum pumps, is simple and effective in structure and reduces cost.
Description
Technical field
The present invention relates to a kind of connecting mechanism and method, particularly to a kind of passive base connecting mechanism and method.
Background technology
Lithographic equipment be a kind of by mask pattern exposure image to suprabasil equipment.Known lithographic equipment bag
Include stepping repetitive and step-by-step scanning type.In above-mentioned lithographic equipment, need to have corresponding device as covering
The carrier of template and substrate and the connecting mechanism of mask plate and substrate, are mounted with the load of mask plate or substrate
Body produces accurately mutually motion to meet photoetching needs.The carrier of aforementioned mask plate is referred to as board platform,
The carrier of substrate is referred to as wafer-supporting platform, and the connecting mechanism of substrate is referred to as substrate connection device.Board platform and
Wafer-supporting platform is located in the mask platform subsystem and work stage subsystem of lithographic equipment respectively, is above-mentioned subsystem
Nucleus module.In the mutual motion of board platform and wafer-supporting platform, mask plate and substrate must be ensured all the time by reliability
Ground positions, namely the six-freedom degree of aforementioned mask plate and substrate is all locked.Need base before exposing simultaneously
Substrate is moved to wafer-supporting platform on hand by bottom connection device from machine transmission, needs substrate handing-over dress after the completion of exposure
Put and substrate is moved to machine transmission handss from wafer-supporting platform.
In wafer-supporting platform module, the device being directly used in positioning substrate is referred to as sucker.Sucker is by under it
Series of driver drives, and can produce the motion of multiple degree of freedom, thus complete the leveling to wafer-supporting platform module adjusting
Jiao, makes substrate carry out necessary position adjustment.
Propose in prior art and make substrate be positioned at sucker upper surface by the way of vac sorb, but adopted
Vac sorb mode is all, by gas path pipe, with sucker and substrate connection device, vacuum pump is connected foundation
Vacuum chamber absorbable substrate, when needing sucker suction substrate, then opens vacuum pump, extracts gas path pipe and suction
Disk inner air, when air pressure is less than external atmosphere pressure and when moving closer in vacuum, external atmosphere pressure is by substrate
Firmly it is pressed against on sucker, completes the absorption to substrate for the sucker, when needing to join substrate, then close vacuum
So that the air pressure in sucker is equal with the external world, sucker loses absorption affinity to pump to substrate, and substrate is handover to machine
Device transmits on hand.But this substrate connection device pipeline is numerous, complex structure, vacuum pump is time-consuming to take electricity,
It is therefore desirable to inventing that a kind of structure is simple but effective substrate connection device.
Content of the invention
For solving the above problems, the present invention proposes a kind of passive base connecting mechanism and method, in handing-over dress
Center can with the subpart of relative motion and stationary part, need not external vacuum pump and gas path pipe,
Only absorption and the handshaking that substrate can be completed need to be performed relative motion by subpart to stationary part.
For reaching above-mentioned purpose, the present invention provides a kind of passive base connecting mechanism, including sucker and handing-over dress
Put it is characterised in that described suction cup interior is provided with middle chamber, and institute is set in described middle chamber
State connection device, described connection device includes stationary part and subpart, described stationary part runs through whole
Subpart, described subpart can move up and down in described middle chamber, and described subpart is from up to
Under be disposed with the first substrate adsorbent chamber and air cavity, setting piston in described air cavity, and with described stator department
Split-phase connects, and described air cavity is divided into upper air cavity and lower air chamber by described piston, and described first substrate adsorbent chamber is led to
Cross the first unidirectional gas channels and upper air cavity UNICOM, described first substrate adsorbent chamber is passed through the second unidirectional gas circuit and led to
Road and lower air chamber UNICOM, upper air cavity with lower air chamber UNICOM and is extended to described by setting the 3rd unidirectional gas channels
Subpart bottom and extraneous UNICOM, when described subpart performs relative motion to stationary part, gas is in gas
Chamber and the first substrate absorption intracavity flow and produce air pressure change, when air pressure is less than external atmosphere pressure, complete
The absorption to substrate of described sucker or connection device, when air pressure is equal to external atmosphere pressure, completes substrate
Handing-over.
Preferably, defining sealing unit between described subpart and described middle chamber, described sealing
The first sealing ring, the second sealing ring, the 3rd sealing ring and the 4th sealing ring is set gradually from top to bottom in unit,
The first sealing unit, the 3rd sealing ring and the 4th sealing ring is defined between first sealing ring and the second sealing ring
Between define the second sealing unit, the second unidirectional gas channels and setting the first pressure release in described sealing unit
Passage, arranges the second pressure release passage between the second sealing ring and the 3rd sealing ring, described second pressure release passage position
During in described substrate and with extraneous UNICOM, described first pressure release passage and described second pressure release passage UNICOM,
The air pressure that described first substrate adsorbs intracavity reverts to, sucker stopping absorbable substrate identical with external atmosphere pressure.
Preferably, described first unidirectional gas channels and the second unidirectional gas channels are each arranged in passage
One switch, respectively first switch and second switch, described 3rd unidirectional gas channels are being joined with upper air cavity
Logical place setting the 3rd switch, is arranging the 4th switch with lower air chamber connection position.
Preferably, when substrate is adsorbed on sucker, and described subpart moves downward with described substrate it
Between formed cavity be set to the second substrate adsorbent chamber, described sucker is around around described second substrate adsorbent chamber
3rd substrate adsorbent chamber is set, and pass through the mutual UNICOM of sucker vacuum passage, when described second substrate adsorbent chamber,
3rd substrate adsorbent chamber is less than external atmosphere pressure with the air pressure in sucker vacuum passage, and described substrate is adsorbed in institute
State on sucker.
Preferably, described first substrate adsorbent chamber or the second substrate adsorbent chamber or the 3rd substrate adsorbent chamber
On accent, sealing ring is set, described sealing ring arranges flexible material ring.
Preferably, the difference in height of described sealing ring and flexible material ring is between 0.1mm～0.2mm, described
The hardness of seal ring material is more than the hardness of flexible material ring material.
Preferably, described subpart arranges driving means, drive described subpart to described stator department
It is allocated as relative motion.
Preferably, described subpart height is more than described sucker height, described stationary part is fixed on institute
State on the machine below substrate connecting mechanism and do not produce motion.
Preferably, described first unidirectional gas channels and the second unidirectional gas channels are one-way conduction, gas
Body reversely then can only seal from described first substrate adsorbent chamber to described upper air cavity or lower air chamber circulation.
Preferably, described substrate transmits handss by machine being transferred on described sucker.
The present invention also provides a kind of substrate handover method using above-mentioned passive base connecting mechanism, including such as
Lower step:
Step one: when joining substrate before exposure, described connection device bottom is maintained an equal level with described sucker bottom phase,
Described connection device top is higher than described sucker top, and machine transmission handss are by described substrate transfer to described handing-over
On device, form contact sealing state, described first switch, the 3rd switch and the 4th switch are in closing shape
State, described second switch is in open mode, and described piston is located at air cavity bottom；
Step 2: described subpart moves downward, makes until lower air chamber air pressure is less than described first substrate
The air pressure of absorption intracavity, gas flows to institute from described first substrate absorption intracavity by the second unidirectional gas channels
State therapeutic method to keep the adverse QI flowing downwards intracavity；
Step 3: described subpart moves downward, the first pressure release passage and described first sealing unit UNICOM,
It is in sealing state, when the air pressure that described first substrate adsorbs intracavity is less than external atmosphere pressure, described substrate
It is pressed on described connection device by external atmosphere pressure；
Step 4: when described subpart moves downward so that described connection device top and described sucker top
When fair, described substrate is handover on described sucker；
Step 5: described subpart continues to move downward so that described first pressure release passage and the first sealing are single
Unit depart from and with described second pressure release passage UNICOM, described substrate upper and lower surface air pressure is equal, and with described friendship
Connection device departs from, and before exposure, substrate is handover to sucker and completes；
Step 6: in exposure, described subpart continues to move downward generation second and described substrate between
Substrate adsorbent chamber, the volume of described second substrate adsorbent chamber becomes larger, described first pressure release passage with described
Second sealing unit UNICOM, described second unidirectional gas channels are in sealing state；
Step 7: the volume of the second substrate adsorbent chamber becomes larger, until air pressure is less than external atmosphere pressure, institute
State substrate to be then pressed on described sucker by ambient pressure, substrate absorption completes, substrate is by sucker suction until exposing
Photoreduction process completes；
Step 8: when joining substrate after exposure, described subpart moves upwards, described second substrate is inhaled
Attached cavity volume diminishes, until intracavity air pressure is equal to external atmosphere pressure, described substrate is departed from sucker, opens institute
State the 4th switch；
Step 9: open described first switch, close described second switch, described subpart continues up
Motion, described upper air cavity volume becomes big, and therapeutic method to keep the adverse QI flowing downwards cavity volume diminishes, and the gas of therapeutic method to keep the adverse QI flowing downwards intracavity passes through the described 3rd
Unidirectional gas channels flow to the external world, and described first pressure release passage is gradually joined with described first sealing unit
Logical formation sealing state；
Step 10: described connection device top is higher than gradually described sucker top, described upper air cavity volume becomes big,
The gas that described first substrate adsorbs intracavity flow to described upper air cavity by the first unidirectional gas channels, and described the
One substrate adsorbent chamber air pressure inside diminishes, until less than external atmosphere pressure, described substrate is then by ambient pressure pressure
On described connection device, and follow described subpart and move to described machine transmission handss delivery position；
Step 11: described first pressure release passage moves upwards with described subpart and seals list with first
Unit departs from, and with described sucker vacuum passage UNICOM, described substrate upper and lower surface air pressure is equal, described substrate
Depart from described connection device and walked by machine transmission hand strap, after exposure, substrate is handover to machine transmission handss and completes.
Compared with prior art, the invention has the beneficial effects as follows: present invention setting subpart and stationary part,
By subpart, stationary part is performed relative motion so that upper air cavity is changed with the volume of lower air chamber,
Air pressure changes, thus the air pressure of substrate lower surface produces change and completes absorption and the handshaking of substrate.
When substrate is handover to sucker suction before exposure, described subpart moves downward with respect to stationary part, under
Air cavity volume becomes big, and air pressure declines so that the first substrate adsorbent chamber gas flow therapeutic method to keep the adverse QI flowing downwards intracavity, leads to intracavity
Air pressure makes substrate adsorb on connection device less than external atmosphere pressure, until the first pressure release passage and extraneous connection
Lead to so that the first substrate adsorbent chamber internal gas pressure is equal with the external world, now substrate has been handover on sucker；?
During exposure, subpart continues to move downward, and produces the second substrate adsorbent chamber between connection device and substrate,
Subpart moves downward so that the second substrate absorption cavity volume increases, and air pressure is less than external atmosphere pressure, substrate
It is attracted on sucker；When joining substrate after completion of the exposure, subpart moves upwards, and the second substrate is inhaled
Attached cavity volume diminishes, air pressure rise in external atmosphere pressure equal so that substrate and sucker depart from is handover to
Machine transmits handss, and the therefore present invention be can achieve with vacuum pump without using gas path pipe and substrate is adsorbed in
Connection device, structure is simple, effective, has the effect of reduces cost.
Brief description
Fig. 1 exposes front substrate connecting mechanism schematic diagram for the embodiment of the present invention one；
Fig. 2 is substrate connecting mechanism schematic diagram when the embodiment of the present invention one exposes；
Fig. 3 is substrate connecting mechanism schematic diagram after the embodiment of the present invention one exposure；
Fig. 4 is the embodiment of the present invention two substrate contact portion and substrate contact schematic diagram.
In figure: 01- substrate, 02- sucker, 021- the 3rd substrate adsorbent chamber, 022- sucker vacuum passage, 023-
Second substrate adsorbent chamber, 024- second pressure release passage, 025- rolling mechanism, 026- middle chamber, 0261- first
Sealing ring, 0262- second sealing ring, 0263- the 3rd sealing ring, 0264- the 4th sealing ring, 03- connection device,
031- subpart, 0310- first sealing unit, 0311- second sealing unit, 032- stationary part, 0321-
The upper air cavity of piston, 033-, 034- lower air chamber, 035- the first substrate adsorbent chamber, the unidirectional gas channels of 036- second,
0361- second switch, the unidirectional gas channels of 037- first, 0371- first switch, the unidirectional gas circuit of 038- the 3rd are led to
Road, 0381- the 3rd switch, 0382- the 4th switch, 039- first pressure release passage, 04- substrate contact part, 041-
Substrate adsorbent chamber, 042- flexible material ring, 043- sealing ring.
Specific embodiment
Understandable for enabling the above objects, features and advantages of the present invention to become apparent from, right below in conjunction with the accompanying drawings
The specific embodiment of the present invention is described in detail.
Embodiment one
Refer to shown in Fig. 1, Fig. 2 and Fig. 3, passive base connecting mechanism of the present invention includes sucker
02 is located on described sucker 02 with connection device 03, substrate 01, and wherein, described sucker 02 is internal to be arranged
There is middle chamber 026, and described connection device 03 is set in middle chamber 026.
It is preferred that the height of connection device 03 is greater than the height of sucker 02.
Connection device 03 includes stationary part 032 and subpart 031, and described stationary part 032 runs through whole
Individual subpart 031, described subpart 031 can move up and down in described middle chamber 026.Described
Stationary part 032 is fixed on the machine below substrate connecting mechanism and does not produce motion.
It is preferred that arranging some groups of rolling mechanisms 025 so that subpart 031 relies on rolling in subpart
Mechanism 025 is along middle chamber 026 scroll-up/down, reducing friction resistance.
Described subpart 031 is disposed with the first substrate adsorbent chamber 035 and air cavity from top to bottom, described
Setting piston 0321 in air cavity, and being connected with described stationary part 032, described piston 0321 is by described gas
Chamber is divided into air cavity 033 and lower air chamber 034, and described first substrate adsorbent chamber 035 is passed through the first unidirectional gas circuit and led to
Road 037 and upper air cavity 033 UNICOM, and first switch 0371 is set in the first unidirectional gas channels 037,
Described first substrate adsorbent chamber 035 passes through the second unidirectional gas channels 036 and lower air chamber 034 UNICOM, setting
Upper air cavity 033 with lower air chamber 034 UNICOM and is extended to described subpart by the 3rd unidirectional gas channels 038
031 bottom and ambient atmosphere UNICOM.
Form an annular seal space between subpart 031 and described middle chamber 026, specifically, described sealing
Be provided with four groups of sealing rings in unit, be followed successively by from top to bottom the first sealing ring 0261, the second sealing ring 0262,
3rd sealing ring 0263 and the 4th sealing ring 0264, described four groups of sealing rings by sealing unit be divided into three close
Envelope unit, defines the first sealing list between sealing unit the first sealing ring 0261 and the second sealing ring 0262
Unit 0310, defines the second sealing unit 0311 between the 3rd sealing ring 0263 and the 4th sealing ring 0264,
Second unidirectional gas channels 036 and setting the first pressure release passage 039, the second sealing ring in described sealing unit
0262 and the 3rd arranges the second pressure release passage 024 between sealing ring 0263, described second pressure release passage 024
On sucker 02 and with extraneous UNICOM, when described first pressure release passage 039 and described second pressure release passage 024
When in same sealing unit, the two UNICOM, the air pressure in described first substrate adsorbent chamber 035 recovers
It is identical with external atmosphere pressure so that sucker 02 stops absorbable substrate 01.
Each arrange in passage in the described first unidirectional gas channels 037 and the second unidirectional gas channels 036
One switch, respectively first switch 0371 and second switch 0361, described 3rd unidirectional gas channels 038
Switching 0381 with upper air cavity 033 connection position setting the 3rd, opening with lower air chamber 034 connection position setting the 4th
Close 0382.It is preferred that described first unidirectional gas channels 037 and the second unidirectional gas channels 036 all have
Non-return valve function, that is, gas can only from described first substrate adsorbent chamber 035 to described upper air cavity 033 or
Air cavity 034 circulates, and reversely then seals.
When substrate 01 is adsorbed on sucker 02, and described subpart 031 moves downward with described substrate 01
Between formed cavity be the second substrate adsorbent chamber 023, described sucker 02 is around described second substrate adsorbent chamber
023 surrounding arranges the 3rd substrate adsorbent chamber 021, and passes through the mutual UNICOM of sucker vacuum passage 022, when described
Air pressure in second substrate adsorbent chamber 023, the 3rd substrate adsorbent chamber 021 and sucker vacuum passage 022 is less than outer
Boundary's atmospheric pressure, can make described substrate 01 adsorb on described sucker 02, the second substrate adsorbent chamber 023 and
Three substrate adsorbent chamber 021 increase the adsorption area to substrate 01 so that pressure suffered by substrate 01 surface
Uniformly, it is to avoid substrate 01 produces damage because the pressure being subject to excessively is concentrated.
It is preferred that described subpart 031 setting driving means (not shown), for driving described mover portion
031 pair of stationary part 032 is divided relatively to move up and down.
It is preferred that described substrate 01 transmits handss by machine being transferred on described sucker 02.
The present invention also provides a kind of substrate handover method using passive base connecting mechanism described above, including
Following steps:
Step one: refer to Fig. 1, when joining substrate 01 before exposure, driven using driving means described dynamic
Subdivision 031 move upwards with respect to stationary part 032 so that described connection device 03 bottom with described
Sucker 02 bottom phase maintains an equal level, then described connection device 03 top is higher than described sucker 02 top, and machine transmits
Described substrate 01 is delivered on described connection device 03 handss, forms contact sealing state, closes described the
One switch the 0371, the 3rd switch 0381 switchs 0382 so that described first unidirectional gas channels 037 with the 4th
Close with the 3rd unidirectional gas channels 038, described piston 0321 is located at air cavity bottom it is ensured that upper air cavity 033
Volume is in maximum, lower air chamber 034 volume is in minimum state；
Step 2: open second switch 0361 so that described second unidirectional gas channels 036 are open-minded, utilize
Driving means drive described subpart 031 to move downward so that under described with respect to stationary part 032
Air cavity 034 volume becomes big, and air pressure declines, until less than the air pressure in described first substrate adsorbent chamber 035,
Then gas just in described first substrate adsorbent chamber 035 by the second unidirectional gas channels 036 flow to described
In air cavity 034, now, the first pressure release passage 039 is located at different sealing lists from the second pressure release passage 024
In unit；
Step 3: described subpart 031 moves downward so that the first pressure release passage 039 is close with described first
Seal unit 0310 UNICOM and be in sealing state, outside the air pressure in described first substrate adsorbent chamber 035 is less than
During boundary's atmospheric pressure, described substrate 01 is pressed on described connection device 03 by external atmosphere pressure, as shown in Figure 2；
Step 4: continue referring to Fig. 2, when described subpart 031 moves downward so that described connection device
When 03 top is maintained an equal level with described sucker 02 top, described substrate 01 is handover on described sucker 02；
Step 5: described subpart 031 continues to move downward so that described first pressure release passage 039 and
One sealing unit 0310 depart from and with described second pressure release passage 024 UNICOM, then described first substrate adsorbent chamber
035 with ambient atmosphere UNICOM and pressure release, described substrate 01 upper and lower surface air pressure is equal, and with described handing-over dress
Set to 03 disengagings, before exposure, substrate 01 is handover to sucker 02 and completes；
Step 6: refer to Fig. 3, in exposure, described subpart 031 continues to move downward and described base
The second substrate adsorbent chamber 023 is produced, the volume of described second substrate adsorbent chamber 023 becomes larger between bottom 01,
Described first pressure release passage 039 move downward with described subpart 031 and with described second sealing unit
0311 UNICOM, then in sealing state, leads to the described second unidirectional gas channels 036 to be also at sealing shape
State；
Step 7: the volume with the second substrate adsorbent chamber 023 becomes larger, until air pressure is less than the external world greatly
Air pressure, described substrate 01 is then pressed on described sucker 02 by ambient pressure, and substrate 01 absorption completes, substrate
01 is adsorbed until exposure process completes by sucker 02；
Step 8: when joining substrate 01 after exposure, described subpart 031 moves upwards, described second
Substrate adsorbent chamber 023 volume diminishes, until intracavity air pressure is equal to external atmosphere pressure, described substrate 01 and sucker
02 departs from naturally, opens described 4th switch 0382, makes described lower air chamber 034 and described 3rd unidirectional gas circuit
Passage 038 UNICOM；
Step 9: open described first switch 0371 and make the described first unidirectional gas channels 037 open-minded, close
Close described second switch 0361 so that the second unidirectional gas channels 036 are closed, described subpart 031 continues
Move upwards, described upper air cavity 033 volume becomes big, and lower air chamber 034 volume diminishes, in lower air chamber 034
Gas flows to the external world by the described 3rd unidirectional gas channels 038, and described first pressure release passage 039
Gradually form sealing state with described first sealing unit 0310 UNICOM；
Step 10: refer to Fig. 1, continue up with described subpart 031, described connection device
03 top is higher than gradually described sucker 02 top, and described upper air cavity 033 volume becomes big, and described first substrate is inhaled
Gas in attached chamber 035 flow to described upper air cavity 033 by the first unidirectional gas channels 037 so that described
One substrate adsorbent chamber 035 air pressure inside diminishes, until less than external atmosphere pressure, described substrate 01 is then extraneous
Air pressure is pressed on described connection device 03, and follows described subpart 031 and move to described machine transmission handss
Delivery position；
Step 11: described first pressure release passage 039 moves with described subpart 031 and upwards with
One sealing unit 0310 departs from, and with described sucker vacuum passage 022 UNICOM, be connected with ambient atmosphere,
Lead to described substrate 01 upper and lower surface air pressure equal, described substrate 01 is departed from and quilt with described connection device 03
Described machine transmission hand strap is walked, and after exposure, substrate 01 is handover to machine transmission handss and completes.
Embodiment two
Refer to Fig. 4, the present embodiment is with the difference of embodiment one, connection device 03 or sucker 02 with
The contact portion of substrate 01 is substrate contact part 04, has base between substrate contact part 04 and substrate 01
The first substrate adsorbent chamber 035 in bottom adsorbent chamber 041, such as embodiment one, the second substrate adsorbent chamber 023, the
Three substrate adsorbent chamber 021, arrange sealing ring 043 in substrate adsorbent chamber 041 accent, and on sealing ring 043
Setting flexible material ring 042 is used for buffering the absorption to substrate 01 for the substrate contact part 04.
It is preferred that difference in height h between flexible material ring 042 and sealing ring 043 0.1mm～0.2mm it
Between, sealing ring 043 material is high hardness material, and the material of flexible material ring 042 is flexible material.
The present invention is described to above-described embodiment, but the present invention is not limited only to above-described embodiment.Obviously originally
The technical staff in field can carry out various change and modification is without deviating from the spirit of the present invention and model to invention
Enclose.So, if these modifications of the present invention and modification belong to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to including these changes and modification.
Claims (11)
1. a kind of passive base connecting mechanism, including sucker and connection device it is characterised in that described sucker
It is internally provided with middle chamber, and described connection device, described connection device are set in described middle chamber
Including stationary part and subpart, described stationary part runs through whole subpart, described subpart energy
Move up and down in described middle chamber, described subpart is disposed with the first substrate absorption from top to bottom
Chamber and air cavity, setting piston in described air cavity, and be connected with described stationary part, described piston will be described
Air cavity is divided into air cavity and lower air chamber, and described first substrate adsorbent chamber passes through the first unidirectional gas channels and upper gas
Chamber UNICOM, described first substrate adsorbent chamber passes through the second unidirectional gas channels and lower air chamber UNICOM, arranges the 3rd
Upper air cavity with lower air chamber UNICOM and is extended to described subpart bottom and extraneous UNICOM by unidirectional gas channels,
When described subpart performs relative motion to stationary part, gas is in air cavity and the absorption intracavity flowing of the first substrate
And produce air pressure change, when air pressure is less than external atmosphere pressure, complete described sucker or connection device to base
The absorption at bottom, when air pressure is equal to external atmosphere pressure, completes the handing-over of substrate.
2. passive base connecting mechanism as claimed in claim 1 is it is characterised in that described subpart and institute
State and define sealing unit between middle chamber, in described sealing unit, set gradually the first sealing from top to bottom
Circle, the second sealing ring, the 3rd sealing ring and the 4th sealing ring, shape between the first sealing ring and the second sealing ring
Become the first sealing unit, between the 3rd sealing ring and the 4th sealing ring, define the second sealing unit, second
Unidirectional gas channels and setting the first pressure release passage, the second sealing ring and the 3rd sealing ring in described sealing unit
Between the second pressure release passage is set, described second pressure release passage be located at described substrate on and with extraneous UNICOM, institute
When stating the first pressure release passage with described second pressure release passage UNICOM, the air pressure that described first substrate adsorbs intracavity is extensive
It is identical with external atmosphere pressure again, sucker stops absorbable substrate.
3. passive base connecting mechanism as claimed in claim 1 is it is characterised in that described first unidirectional gas circuit
Passage and the second unidirectional gas channels each arrange a switch, respectively first switch and second in passage
Switch, described 3rd unidirectional gas channels are being switched with upper air cavity connection position setting the 3rd, are joining with lower air chamber
Logical place setting the 4th switch.
4. passive base connecting mechanism as claimed in claim 1 is it is characterised in that when substrate is adsorbed in sucker
On, the cavity being formed and described substrate between when described subpart moves downward is set to the second substrate absorption
Chamber, described sucker arranges the 3rd substrate adsorbent chamber around around described second substrate adsorbent chamber, and passes through sucker
The mutual UNICOM of vacuum passage, when described second substrate adsorbent chamber, the 3rd substrate adsorbent chamber and sucker vacuum passage
Interior air pressure is less than external atmosphere pressure, and described substrate is adsorbed on described sucker.
5. passive base connecting mechanism as claimed in claim 4 is it is characterised in that described first substrate is adsorbed
On chamber or the second substrate adsorbent chamber or the 3rd substrate adsorbent chamber accent, sealing ring is set, on described sealing ring
Setting flexible material ring.
6. passive base connecting mechanism as claimed in claim 5 it is characterised in that described sealing ring with soft
Between 0.1mm～0.2mm, the hardness of described seal ring material is more than flexible material ring to the difference in height of rings of material
The hardness of material.
7. passive base connecting mechanism as claimed in claim 1 is it is characterised in that described subpart is arranged
Driving means, drive described subpart that described stationary part is performed relative motion.
8. passive base connecting mechanism as claimed in claim 1 it is characterised in that described subpart height
More than described sucker height, described stationary part is fixed on the machine below described substrate connecting mechanism and not
Produce motion.
9. passive base connecting mechanism as claimed in claim 1 is it is characterised in that described first unidirectional gas circuit
Passage and the second unidirectional gas channels are one-way conduction, and gas can only be from described first substrate adsorbent chamber to institute
State air cavity or lower air chamber circulation, reversely then seal.
10. passive base connecting mechanism as claimed in claim 1 is it is characterised in that described substrate passes through machine
Device transmission handss are transferred on described sucker.
A kind of 11. substrates using the passive base connecting mechanism as described in claim 1～10 any one are handed over
Connect method it is characterised in that comprising the steps:
Step one: when joining substrate before exposure, described connection device bottom is maintained an equal level with described sucker bottom phase,
Described connection device top is higher than described sucker top, and machine transmission handss are by described substrate transfer to described handing-over
On device, form contact sealing state, described first switch, the 3rd switch and the 4th switch are in closing shape
State, described second switch is in open mode, and described piston is located at air cavity bottom；
Step 2: described subpart moves downward, makes until lower air chamber air pressure is less than described first substrate
The air pressure of absorption intracavity, gas flows to institute from described first substrate absorption intracavity by the second unidirectional gas channels
State therapeutic method to keep the adverse QI flowing downwards intracavity；
Step 3: described subpart moves downward, the first pressure release passage and described first sealing unit UNICOM
Afterwards, it is in sealing state, when the air pressure that described first substrate adsorbs intracavity is less than external atmosphere pressure, described
Substrate is pressed on described connection device by external atmosphere pressure；
Step 4: when described subpart moves downward so that described connection device top and described sucker top
When fair, described substrate is handover on described sucker；
Step 5: described subpart continues to move downward so that described first pressure release passage and the first sealing are single
Unit depart from and with described second pressure release passage UNICOM, described substrate upper and lower surface air pressure is equal, and with described friendship
Connection device departs from, and before exposure, substrate is handover to sucker and completes；
Step 6: in exposure, described subpart continues to move downward generation second and described substrate between
Substrate adsorbent chamber, the volume of described second substrate adsorbent chamber becomes larger, described first pressure release passage with described
Second sealing unit UNICOM, described second unidirectional gas channels are in sealing state；
Step 7: the volume of the second substrate adsorbent chamber becomes larger, until air pressure is less than external atmosphere pressure, institute
State substrate to be then pressed on described sucker by ambient pressure, substrate absorption completes, substrate is by sucker suction until exposing
Photoreduction process completes；
Step 8: when joining substrate after exposure, described subpart moves upwards, described second substrate is inhaled
Attached cavity volume diminishes, until intracavity air pressure is equal to external atmosphere pressure, described substrate is departed from sucker, opens institute
State the 4th switch；
Step 9: open described first switch, close described second switch, described subpart continues up
Motion, described upper air cavity volume becomes big, and therapeutic method to keep the adverse QI flowing downwards cavity volume diminishes, and the gas of therapeutic method to keep the adverse QI flowing downwards intracavity passes through the described 3rd
Unidirectional gas channels flow to the external world, and described first pressure release passage is gradually joined with described first sealing unit
Logical formation sealing state；
Step 10: described connection device top is higher than gradually described sucker top, described upper air cavity volume becomes big,
The gas that described first substrate adsorbs intracavity flow to described upper air cavity by the first unidirectional gas channels, and described the
One substrate adsorbent chamber air pressure inside diminishes, until less than external atmosphere pressure, described substrate is then by ambient pressure pressure
On described connection device, and follow described subpart and move to described machine transmission handss delivery position；
Step 11: described first pressure release passage moves upwards with described subpart and seals list with first
Unit departs from, and with described sucker vacuum passage UNICOM, described substrate upper and lower surface air pressure is equal, described substrate
Depart from described connection device and walked by machine transmission hand strap, after exposure, substrate is handover to machine transmission handss and completes.
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| CN201510415980.6A CN106338890B (en) | 2015-07-15 | 2015-07-15 | A kind of passive base connecting mechanism and method |
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| CN201510415980.6A CN106338890B (en) | 2015-07-15 | 2015-07-15 | A kind of passive base connecting mechanism and method |
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| CN106338890B CN106338890B (en) | 2018-06-29 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108144790A (en) * | 2018-01-20 | 2018-06-12 | 梵利特智能科技（苏州）有限公司 | A kind of card automatic glue application hot-press arrangement |
| CN108706140A (en) * | 2018-06-23 | 2018-10-26 | 吕扬效 | Sucker and packaging bag transporter |
| WO2019062911A1 (en) * | 2017-09-30 | 2019-04-04 | 上海微电子装备（集团）股份有限公司 | Vacuum suction manipulator, substrate transfer device, and photoetching machine |
| WO2019137497A1 (en) * | 2018-01-12 | 2019-07-18 | 上海微电子装备（集团）股份有限公司 | Substrate transfer mechanism, photoetching machine and substrate transfer method |
| CN113410174A (en) * | 2021-06-25 | 2021-09-17 | 上海隐冠半导体技术有限公司 | Adsorption mechanism and adsorption system |
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| WO2019062911A1 (en) * | 2017-09-30 | 2019-04-04 | 上海微电子装备（集团）股份有限公司 | Vacuum suction manipulator, substrate transfer device, and photoetching machine |
| WO2019137497A1 (en) * | 2018-01-12 | 2019-07-18 | 上海微电子装备（集团）股份有限公司 | Substrate transfer mechanism, photoetching machine and substrate transfer method |
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| CN113410174B (en) * | 2021-06-25 | 2024-01-30 | 上海隐冠半导体技术有限公司 | Adsorption mechanism and adsorption system |
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|---|---|
| CN106338890B (en) | 2018-06-29 |
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