CN111999991A - Proximity contact type photoetching vacuum exposure workpiece table device - Google Patents
Proximity contact type photoetching vacuum exposure workpiece table device Download PDFInfo
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- CN111999991A CN111999991A CN202010984908.6A CN202010984908A CN111999991A CN 111999991 A CN111999991 A CN 111999991A CN 202010984908 A CN202010984908 A CN 202010984908A CN 111999991 A CN111999991 A CN 111999991A
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- driving mechanism
- lifting driving
- substrate
- vacuum
- mask plate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
Abstract
The invention discloses a proximity contact type photoetching vacuum exposure workpiece stage device which is used for realizing vacuum exposure between a substrate and a mask plate in a photoetching machine. The device takes a mask plate as a horizontal reference, a first lifting driving mechanism is utilized to drive a three-point elastic supporting mechanism, a bearing table and a substrate to ascend, after the substrate is in contact leveling with the reference mask plate, a pneumatic and control mechanism locks the three-point elastic supporting mechanism, and meanwhile, the first lifting driving mechanism stops ascending. Then the second lifting driving mechanism drives the vacuum chamber to ascend and contact with the lower surface of the mask frame to form a sealed cavity, and then the cavity is vacuumized, so that the sample wafer and the mask plate are exposed in a vacuum environment, and the exposure resolution and the exposure line uniformity are improved.
Description
Technical Field
The invention relates to the technical field of microelectronic special equipment, in particular to a proximity contact type photoetching vacuum exposure workpiece table device, which is particularly suitable for realizing vacuum-pumping exposure between a substrate and a mask plate in a proximity contact type photoetching machine.
Background
In the contact type photoetching equipment, according to an exposure resolution formula, the aim of improving the photoetching resolution can be realized by considering that the clearance between a substrate and a mask plate is small enough. And after the substrate is in contact leveling with the mask, a layer of air film still exists between the substrate and the mask, so that a certain gap exists between the substrate and the mask. In order to eliminate the air film therebetween, it is necessary to perform vacuum evacuation between the substrate and the mask plate before exposure. Some existing vacuum pumping structures mainly arrange a sealing ring on the outer side of a wafer bearing table or on the upper surface of the wafer bearing table, when a substrate and a mask are leveled, the sealing ring is also contacted with the mask, only single or one-time vacuum exposure can be carried out, and the vacuum exposure needing alignment and alignment between the substrate and the mask cannot be realized.
Disclosure of Invention
In order to avoid the contact type photoetching, the air film gap between the substrate and the mask is further eliminated, before exposure, the substrate and the mask plate are vacuumized, the photoetching line resolution is improved, and the alignment between the substrate and the mask are not influenced. The invention aims to provide a proximity contact type photoetching vacuum exposure workpiece stage device, which is particularly suitable for realizing vacuum-pumping exposure between a substrate and a mask plate in a proximity contact type photoetching machine.
The technical scheme adopted by the invention is as follows: a proximity contact type photoetching vacuum exposure workpiece table device comprises a mask plate, a mask frame, a substrate, a wafer bearing table, a positive pressure vent hole, a three-point elastic supporting mechanism, a locking cylinder, an elastic air bag, a first lifting driving mechanism, a vacuum chamber, a second lifting driving mechanism, a rotary motion table, a Y-direction motion table, an X-direction motion table, a negative pressure input end, an electric control valve, a positive pressure input end, a control circuit board, a main controller, a first sealing ring, a second sealing ring and a negative pressure pumping hole;
the mask plate is positioned above the mask frame and is fixedly connected with the mask frame; the upper surface of the mask frame is provided with a vacuum groove for adsorbing and fixing the mask; the substrate bearing table is provided with a vacuum groove for adsorbing and fixing the substrate; the three-point elastic support structure is connected with the wafer bearing table through a flexible hinge and used for leveling the substrate and the mask plate; the lifting driving mechanism comprises a first lifting driving mechanism and a second lifting driving mechanism which are respectively used for Z-direction movement of the substrate and Z-direction movement of the vacuum chamber; an elastic air bag is embedded in the first lifting driving mechanism and used for uniformly leveling the substrate through a three-point elastic supporting mechanism; the locking cylinder is used for locking the three-point elastic supporting structure; the positive pressure input end is respectively connected with the locking cylinder, the second lifting driving mechanism and the positive pressure vent hole of the wafer bearing table through an electric control valve; the negative pressure input end is respectively connected with the mask frame and the wafer bearing table through an electric control valve; and the driving control panel is respectively connected with the electric control valve and the main controller.
The mask frame is a horizontal reference surface, a vacuum groove is distributed on the upper surface, and the mask plate is fixed above the mask frame through negative pressure.
The three-point elastic supporting mechanism is connected with the wafer bearing table through a flexible hinge and is uniformly distributed along the radial direction at an included angle of 120 degrees, so that the leveling between the sample wafer and the mask plate can be realized.
The first lifting driving mechanism is embedded with an elastic air bag, constant-pressure air is filled in the air bag, and the elastic air bag is connected with the three-point elastic mechanism, so that the three-point elastic supporting mechanism can provide uniform leveling pressure for the substrate; the leveling force of the substrate and the mask plate can be adjusted at any time by changing the air pressure of the elastic air bag.
The vacuum chamber is driven by the second lifting driving mechanism through the first sealing ring and the second sealing ring, so that the substrate and the mask are positioned in a sealed cavity, the negative pressure vent hole is communicated with negative pressure, and the substrate and the mask are positioned in a vacuum environment, thereby realizing vacuum exposure.
The outer contour of the first lifting driving mechanism and the inner contour of the vacuum chamber are arc surfaces, the outer contour of the first lifting driving mechanism and the inner contour of the vacuum chamber are in interference fit with a sealing ring, and good sealing performance is guaranteed between the outer contour of the first lifting driving mechanism and the inner contour of the vacuum chamber when the vacuum chamber moves up and down. The sealing ring is 0.8mm higher than the upper surface of the vacuum chamber. The first sealing ring and the second sealing ring are made of silica gel materials or can be made of other elastic materials of the sealing rings.
The first lifting driving mechanism is connected with the rotary motion table, the X-direction motion table and the Y-direction motion table, and X, Y theta-direction relative motion between the substrate and the mask is realized.
The first lifting driving mechanism and the second lifting mechanism are driven by one of a motor and an air cylinder; the actions of the electric control valve, the locking cylinder, the first lifting driving mechanism and the second lifting driving mechanism are all driven and controlled by the main controller.
Wherein, the main controller selects one of a microcontroller and a singlechip.
The invention relates to a using method and a working principle of a proximity contact type photoetching vacuum exposure workpiece stage device, which are as follows:
when the mask is used, firstly, a mask plate is placed above a mask frame, and the mask plate is fixed through negative pressure; after the substrate is placed, the control panel starts the first lifting driving mechanism to drive the substrate to ascend, the sample wafer is in contact with the mask plate through the three-point elastic supporting mechanism and then leveled, the first lifting driving mechanism stops moving, and the locking cylinder locks the three-point elastic supporting mechanism; then the first lifting driving mechanism drives the substrate to move downwards for an alignment gap with the distance S (20-30 mu m); the alignment of the marks of the substrate and the mask is realized through X, Y and a theta-direction moving platform, and then the first lifting driving mechanism moves upwards for a distance S; then, the second lifting driving mechanism drives the vacuum chamber to move upwards, and the second sealing ring is contacted with the mask frame, so that a sealed cavity exists between the substrate and the mask plate; and then, the vacuum chamber is vacuumized through the negative pressure air exhaust hole, so that the vacuum-pumping exposure between the substrate and the mask plate is realized.
The invention has the following beneficial effects:
1. an elastic air bag is embedded in the first lifting driving mechanism, constant-pressure air is filled in the air bag, and the elastic air bag is connected with a three-point elastic mechanism, so that the three-point elastic supporting mechanism can provide uniform leveling pressure for a substrate; the leveling force of the substrate and the mask plate can be adjusted at any time by changing the air pressure of the elastic air bag.
2. The vacuum chamber is driven by the second lifting driving mechanism through the first sealing ring and the second sealing ring, so that the substrate and the mask are positioned in a sealed cavity, negative pressure is communicated through the negative pressure vent hole, and the substrate and the mask are positioned in a vacuum environment, thereby realizing vacuum exposure. The first sealing ring and the second sealing ring are not in direct contact with the mask and the sample wafer, and relative movement between the substrate and the mask can be realized before vacuum-pumping exposure, so that alignment and alignment can be carried out.
3. According to the invention, the outer contour of the first lifting driving mechanism and the inner contour of the vacuum chamber are arc surfaces, and the first lifting driving mechanism and the vacuum chamber are in interference fit with each other through the sealing ring, so that good sealing performance is ensured between the first lifting driving mechanism and the vacuum chamber when the vacuum chamber moves up and down.
4. The first lifting driving mechanism is connected with the rotary motion platform, the X-direction motion platform and the Y-direction motion platform, so that X, Y and theta-direction relative motion between the substrate and the mask is realized. After the alignment operation of the substrate and the mask is completed, the second lifting driving mechanism drives the vacuum chamber to move, so that the substrate and the mask are in a sealed chamber, and the vacuum exposure after the alignment of the substrate and the mask is realized.
5. If the substrate and the mask need to be exposed in the inert gas environment, the vacuum chamber is vacuumized, and then the appointed inert gas can be introduced through the positive pressure vent hole on the vacuum chamber, so that the substrate and the mask can be exposed in the special gas environment.
Drawings
FIG. 1 is a schematic structural diagram of a proximity contact type vacuum lithography exposure stage apparatus according to the present invention;
in the figure, 1-mask plate; 2-mask holder; 3-a substrate; 4-a wafer bearing platform; 5-three-point elastic supporting mechanism; 6-a first lifting driving mechanism; 7-a vacuum chamber; 8-a second lifting driving mechanism; a 9-Y direction motion table; 10-positive pressure input; 11-a negative pressure input; 12-an electrically controlled valve; 13-a control circuit board; 14-a master controller; 15-a first sealing ring; 16-a second sealing ring; 17-negative pressure air extraction holes; 18-positive pressure vent; 19-locking the cylinder; a 20-X direction motion platform; 21-an elastic balloon; 22-rotating motion stage.
Detailed Description
The invention is further illustrated by the following examples in connection with the accompanying drawings.
As shown in fig. 1, a proximity contact type photolithography vacuum exposure workpiece stage device is a system for realizing vacuum exposure between a substrate and a mask plate in a photolithography machine, and comprises a mask plate 1, a mask frame 2, a substrate 3, a substrate bearing table 4, a positive pressure vent hole 18, a three-point elastic support mechanism 5, a locking cylinder 19, an elastic air bag 21, a first lifting drive mechanism 6, a vacuum chamber 7, a second lifting drive mechanism 8, a rotary motion table 22, a Y-direction motion table 9, an X-direction motion table 20, a negative pressure input end 11, an electric control valve 12, a positive pressure input end 10, a control circuit board 13, a main controller 14, a first seal ring 15, a second seal ring 16 and a negative pressure suction hole 17.
The mask plate 1 is positioned above the mask frame 2 and is fixedly connected with the mask frame; the upper surface of the mask frame 2 is provided with a vacuum groove for adsorbing and fixing the mask plate 1; the substrate bearing table 4 is provided with a vacuum groove for adsorbing and fixing the substrate 3; the three-point elastic support structure 5 is connected with the wafer bearing table 4 through a flexible hinge and is used for leveling the substrate 3 and the mask plate 1; the lifting driving mechanism comprises a first lifting driving mechanism 6 and a second lifting driving mechanism 8 which are respectively used for the Z-direction movement of the substrate 3 and the Z-direction movement of the vacuum chamber 7; an elastic air bag 21 is embedded in the first lifting driving mechanism 6 and used for providing uniform leveling pressure for the substrate 3 through the three-point elastic supporting mechanism 5; the locking cylinder 19 is used for locking the three-point elastic supporting structure 5; the positive pressure input end 10 is respectively connected with a locking cylinder 19, a second lifting driving mechanism 8, a wafer bearing table 4 and a positive pressure vent hole 18 through an electric control valve 12; the negative pressure input end 11 is respectively connected with the mask frame 2 and the wafer bearing table 4 through an electric control valve 12; the drive control panel is respectively connected with the electric control valve 12 and the main controller 14.
The mask frame 2 is a horizontal reference surface, a vacuum groove is distributed on the upper surface, and the mask plate 1 is fixed above the mask frame 2 through negative pressure, but the mask plate is not limited to the above template fixing mechanism, such as a mechanical clamping structure. The three-point elastic supporting mechanism 5 is connected with the wafer bearing table 4 through a flexible hinge and is uniformly distributed along the radial direction at an included angle of 120 degrees, so that the leveling between the sample wafer and the mask plate 1 can be realized. An elastic air bag 21 is embedded in the first lifting driving mechanism 6, constant-pressure air is filled in the elastic air bag 21, and the elastic air bag 21 is connected with the three-point elastic supporting mechanism 5, so that the three-point elastic supporting mechanism 5 can provide uniform leveling pressure for the substrate 3; the leveling force between the substrate 3 and the mask plate 1 can be adjusted at any time by changing the air pressure of the elastic air bag 21.
The vacuum chamber 7 is driven by the second lifting driving mechanism 8 through the first sealing ring 15 and the second sealing ring 16, so that the substrate 3 and the mask are in a sealed cavity, the negative pressure vent hole is communicated with negative pressure, and the substrate 3 and the mask are in a vacuum environment, thereby realizing vacuum exposure.
The first lifting drive mechanism 6 is connected with the rotary motion table 22, the X-direction motion table 20 and the Y-direction motion table 9, and X, Y and theta-direction relative motion between the substrate 3 and the mask is realized. The first lifting driving mechanism 6 and the second lifting driving mechanism 8 are driven by one of a motor and an air cylinder; the actions of the electric control valve 12, the locking cylinder 19, the first lifting driving mechanism 6 and the second lifting driving mechanism 8 are all driven and controlled by the main controller 14. The main controller 14 is one of a microcontroller and a single chip microcomputer.
The working process of the proximity contact type photoetching vacuum exposure device is as follows:
when in use, firstly, the mask plate 1 is placed above the mask frame 2, and the mask plate 1 is fixed through negative pressure; after the substrate 3 coated with the glue is placed, the substrate 3 is fixed on a substrate bearing table 4 through negative pressure, then a control panel starts a first lifting driving mechanism 6 to drive the substrate 3 to ascend, the substrate 3 is in contact with a mask plate 1 through a three-point elastic supporting mechanism 5 and then leveled, the first lifting driving mechanism 6 stops moving, and a locking cylinder 19 locks the three-point elastic supporting mechanism 5 and keeps a leveling state; then the first lifting driving mechanism 6 drives the substrate 3 to move downwards for an alignment gap with a distance S (20-30 μm); the alignment between the substrate 3 and the mark of the mask plate 1 is realized through the X-direction moving table 20, the Y-direction moving table 9 and the theta-direction moving table, and the alignment gap is eliminated when the first lifting driving mechanism 6 moves upwards for the distance S after the alignment is finished; then, the second lifting driving mechanism 8 drives the vacuum chamber 7 to move upwards, and the second sealing ring 16 is contacted with the mask frame 2, so that a sealed cavity exists between the substrate 3 and the mask plate 1; then, the vacuum chamber 7 is vacuumized through the negative pressure pumping hole 17, and the substrate 3 and the mask plate 1 are in a vacuum environment, so that the vacuumized exposure between the substrate 3 and the mask plate 1 is realized.
The present invention has not been described in detail in part with regard to the known art.
Claims (9)
1. A proximity contact type photoetching vacuum exposure workpiece stage device is characterized in that: the mask comprises a mask plate (1), a mask frame (2), a substrate (3), a wafer bearing table (4), a positive pressure vent hole (18), a three-point elastic supporting mechanism (5), a locking cylinder (19), an elastic air bag (21), a first lifting driving mechanism (6), a vacuum chamber (7), a second lifting driving mechanism (8), a rotary motion table (22), a Y-direction motion table (9), an X-direction motion table (20), a negative pressure input end (11), an electric control valve (12), a positive pressure input end (10), a control circuit board (13), a main controller (14), a first sealing ring (15), a second sealing ring (16) and a negative pressure pumping hole (17); wherein:
the mask plate (1) is positioned above the mask frame (2) and is fixedly connected with the mask frame; the upper surface of the mask frame (2) is provided with a vacuum groove for adsorbing and fixing the mask plate (1); the wafer bearing table (4) is provided with a vacuum groove for adsorbing and fixing the substrate (3); the three-point elastic support structure (5) is connected with the wafer bearing table (4) through a flexible hinge and is used for leveling the substrate (3) and the mask plate (1); the lifting driving mechanism comprises a first lifting driving mechanism (6) and a second lifting driving mechanism (8) which are respectively used for the Z-direction movement of the substrate and the Z-direction movement of the vacuum chamber (7); an elastic air bag (21) is embedded in the first lifting driving mechanism (6) and is used for leveling the substrate (3) uniformly through the three-point elastic supporting mechanism (5); the locking cylinder (19) is used for locking the three-point elastic supporting structure (5); the positive pressure input end (10) is respectively connected with the locking cylinder (19), the second lifting driving mechanism (8) and the positive pressure vent hole (18) of the wafer bearing table (3) through the electric control valve (12); the negative pressure input end (11) is respectively connected with the mask frame (2) and the wafer bearing table (4) through an electric control valve (12); the drive control circuit board (13) is respectively connected with the electric control valve (12) and the main controller (14); the first sealing ring (15) is embedded between the first lifting driving mechanism (6) and the vacuum chamber (7); the second sealing ring (16) is embedded in the upper surface of the vacuum chamber (7), and the negative pressure air exhaust hole (17) is communicated with the cavity chamber (7); the first lifting driving mechanism (6) is connected with the rotary motion table (22), the X-direction motion table (20) and the Y-direction motion table (9).
2. A proximity contact lithography vacuum exposure workpiece stage apparatus as claimed in claim 1 wherein: the mask frame (2) is a horizontal reference surface, a vacuum groove is distributed on the upper surface, and the mask plate (1) is fixed above the mask frame (2) through negative pressure, but the mask plate is not limited to the above template fixing mechanism, such as a mechanical clamping structure.
3. A proximity contact lithography vacuum exposure workpiece stage apparatus as claimed in claim 1 wherein: the three-point elastic supporting mechanism (5) is connected with the wafer bearing table (4) through a flexible hinge and is uniformly distributed along the radial direction at an included angle of 120 degrees, so that the leveling between the sample wafer and the mask plate can be realized.
4. A proximity contact lithography vacuum exposure workpiece stage apparatus as claimed in claim 1 wherein: an elastic air bag (21) is embedded in the first lifting driving mechanism (6), constant-pressure air is filled in the elastic air bag (21), and the elastic air bag (21) is connected with the three-point elastic mechanism (5) so that the three-point elastic supporting mechanism (5) can provide uniform leveling pressure for the substrate (3); the leveling force of the substrate (3) and the mask plate (1) can be adjusted at any time by changing the air pressure of the elastic air bag (21).
5. A proximity contact lithography vacuum exposure workpiece stage apparatus as claimed in claim 1 wherein: the vacuum chamber (7) is driven by the second lifting driving mechanism (8) through the first sealing ring (15) and the second sealing ring (16), so that the substrate (3) and the mask plate (1) are in a sealed cavity, the negative pressure vent hole (17) is communicated with negative pressure, and the substrate (3) and the mask plate (1) are in a vacuum environment, thereby realizing vacuum exposure.
6. A proximity contact lithography vacuum exposure workpiece stage apparatus as claimed in claim 1 wherein: the outer contour of the first lifting driving mechanism (6) and the inner contour of the vacuum chamber (7) are arc surfaces, a first sealing ring (15) is in interference fit between the outer contour of the first lifting driving mechanism and the inner contour of the vacuum chamber (7), good sealing performance is achieved between the vacuum chamber (7) and the inner contour of the vacuum chamber, the second sealing ring (16) is 0.8mm higher than the upper surface of the vacuum chamber (7), and the first sealing ring (15) and the second sealing ring (16) are made of silica gel materials or can be made of other elastic materials serving as sealing rings.
7. A proximity contact lithography vacuum exposure workpiece stage apparatus as claimed in claim 1 wherein: the first lifting driving mechanism (6) is connected with the rotary motion platform (22), the X-direction motion platform (20) and the Y-direction motion platform (9) to realize X, Y and theta-direction relative motion between the substrate (3) and the mask plate (1).
8. A proximity contact lithography vacuum exposure workpiece stage apparatus as claimed in claim 1 wherein: the first lifting driving mechanism (6) and the second lifting mechanism (8) are driven by one of a motor and an air cylinder; the actions of the electric control valve (12), the locking cylinder (6), the first lifting driving mechanism (6) and the second lifting driving mechanism (8) are all driven and controlled by the main controller (14).
9. A proximity contact lithography vacuum exposure workpiece stage apparatus as claimed in claim 1 wherein: the main controller (14) is one of a microcontroller and a singlechip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010984908.6A CN111999991A (en) | 2020-09-18 | 2020-09-18 | Proximity contact type photoetching vacuum exposure workpiece table device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010984908.6A CN111999991A (en) | 2020-09-18 | 2020-09-18 | Proximity contact type photoetching vacuum exposure workpiece table device |
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| CN111999991A true CN111999991A (en) | 2020-11-27 |
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|---|---|---|---|
| CN202010984908.6A Pending CN111999991A (en) | 2020-09-18 | 2020-09-18 | Proximity contact type photoetching vacuum exposure workpiece table device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965343A (en) * | 2021-02-08 | 2021-06-15 | 上海度宁科技有限公司 | Workpiece table structure, photoetching system comprising same and exposure method thereof |
| CN114879452A (en) * | 2022-04-26 | 2022-08-09 | 中国科学院光电技术研究所 | High-uniform contact type alignment exposure device for flexible film |
| CN117406560A (en) * | 2023-11-03 | 2024-01-16 | 苏州天准科技股份有限公司 | Multi-degree-of-freedom adjusting table and exposure equipment |
-
2020
- 2020-09-18 CN CN202010984908.6A patent/CN111999991A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965343A (en) * | 2021-02-08 | 2021-06-15 | 上海度宁科技有限公司 | Workpiece table structure, photoetching system comprising same and exposure method thereof |
| CN114879452A (en) * | 2022-04-26 | 2022-08-09 | 中国科学院光电技术研究所 | High-uniform contact type alignment exposure device for flexible film |
| CN117406560A (en) * | 2023-11-03 | 2024-01-16 | 苏州天准科技股份有限公司 | Multi-degree-of-freedom adjusting table and exposure equipment |
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