CN106316405A - 一种led用散热基板的制备工艺 - Google Patents

一种led用散热基板的制备工艺 Download PDF

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CN106316405A
CN106316405A CN201610654482.1A CN201610654482A CN106316405A CN 106316405 A CN106316405 A CN 106316405A CN 201610654482 A CN201610654482 A CN 201610654482A CN 106316405 A CN106316405 A CN 106316405A
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陈加根
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Wave Island Anhui Recreation Facility Co Ltd
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Abstract

本发明涉及一种LED用散热基板的制备工艺。该工艺包括：1)复合烧结助剂的制备；2)浆料的制备；3)成型。本发明的有益效果如下：本发明通过采用合适的烧结方法和选取合适的烧结助剂，实现了烧结体的致密化，大大提高了基板的热导率；本发明的烧结助剂可形成低熔点的物相，实现液相烧结，降低烧成温度，促进坯体的致密化，增加了基板表面的硬度和光泽度；本发明的基板导热系数大，耐热性能优，抗弯强度高，避免出现弯曲、翘曲等现象。

Description

一种LED用散热基板的制备工艺
技术领域
本发明属于LED用基板技术领域，具体涉及一种LED用散热基板的制备工艺。
背景技术
LED灯主要包括LED芯片和灯杯，通常LED芯片是用LED发光晶片以打金线、共晶或覆晶的方式连接在散热基板上形成的，再将LED芯片固定在系统的电路板上，散热基板扮演着散热、导电、绝缘三重角色，现有的散热基板主要是金属基板，但是这类金属基板连接LED发光晶片的技术存在着散热性差、绝缘性差的弊端。
随着LED照明的需求日趋迫切，大功率LED的散热问题益发受到重视(过高的温度会导致LED发光效率衰减)；LED使用所产生的废热若无法有效散出，则会对LED的寿命造成致命性的影响。现阶段较普遍的散热基板有4种：直接覆铜板(DBC)、直接镀铜基板(DPC)、高温共烧多层基板(HTCC)和低温共烧多层基板(LTCC)。在实际使用中存在成本限制、绝缘性能不够等缺点，其制造成本较高，散热性能差，抗潮、抗腐蚀性能不好，导致LED灯的使用寿命较短，不能足市场需要，因此很有必要改进材料的配方，设计一种性能优越的LED基板。
发明内容
本发明针对背景技术中的存在的问题而提供一种散热性能好的LED用散热基板的制备工艺。
为了实现本发明目的而采用的技术方案为：一种LED用散热基板的制备工艺，具体制备步骤如下：
1)复合烧结助剂的制备
将氧化铝粉65～75份、镁粉5～10份、煅烧高岭土15～20份、滑石粉5～10份、氟化钙15～20份分散于无水乙醇中形成混合浆料，干燥后即制得复合烧结助剂，其中，所述氧化铝粉与无水乙醇的质量体积比为1g：5mL；
2)浆料的制备
依次加入50～60份的氮化硅粉、次磷酸钠3～6份、羟甲基纤维素3～6份、乙酸锆3～5份、聚乙烯醇6～10份和步骤1)制得的复合烧结助剂6～10份进行湿法球磨，球磨3～5小时，进行真空搅拌除泡，制得浆料；
3)成型
将步骤2)制得的浆料压入模具中，自然放置完成凝胶过程；取出坯片在70～80℃温度中，进行干燥处理3～5小时；然后放入热压模具中进行烧结压制，在温度为1200～1400℃下保温1～2小时，继续提高温度至1400℃～1700℃下保温1～2小时，再降温冷却得到基板。
本发明的有益效果如下：
本发明通过采用合适的烧结方法和选取合适的烧结助剂，实现了烧结体的致密化，大大提高了基板的热导率；本发明的烧结助剂可形成低熔点的物相，实现液相烧结，降低烧成温度，促进坯体的致密化，增加了基板表面的硬度和光泽度；本发明的基板导热系数大，耐热性能优，抗弯强度高，避免出现弯曲、翘曲等现象。
具体实施方式
下面结合实施例对本发明作进一步的描述。
实施例1：
本发明实施例一种LED用散热基板的制备工艺，具体制备步骤如下：
1)复合烧结助剂的制备
将氧化铝粉65份、镁粉5份、煅烧高岭土15份、滑石粉5份、氟化钙15份分散于无水乙醇中形成混合浆料，干燥后即制得复合烧结助剂，其中，所述氧化铝粉与无水乙醇的质量体积比为1g：5mL；
2)浆料的制备
依次加入50份的氮化硅粉、次磷酸钠3份、羟甲基纤维素3份、乙酸锆3份、聚乙烯醇6份和步骤1)制得的复合烧结助剂6份进行湿法球磨，球磨3小时，进行真空搅拌除泡，制得浆料；
3)成型
将步骤2)制得的浆料压入模具中，自然放置完成凝胶过程；取出坯片在70～80℃温度中，进行干燥处理3小时；然后放入热压模具中进行烧结压制，在温度为1200～1400℃下保温1小时，继续提高温度至1400℃～1700℃下保温1小时，再降温冷却得到基板。
实施例2：
本发明实施例一种LED用散热基板的制备工艺，具体制备步骤如下：
1)复合烧结助剂的制备
将氧化铝粉75份、镁粉10份、煅烧高岭土20份、滑石粉10份、氟化钙20份分散于无水乙醇中形成混合浆料，干燥后即制得复合烧结助剂，其中，所述氧化铝粉与无水乙醇的质量体积比为1g：5mL；
2)浆料的制备
依次加入60份的氮化硅粉、次磷酸钠6份、羟甲基纤维素6份、乙酸锆5份、聚乙烯醇10份和步骤1)制得的复合烧结助剂10份进行湿法球磨，球磨5小时，进行真空搅拌除泡，制得浆料；
3)成型
将步骤2)制得的浆料压入模具中，自然放置完成凝胶过程；取出坯片在70～80℃温度中，进行干燥处理5小时；然后放入热压模具中进行烧结压制，在温度为1200～1400℃下保温2小时，继续提高温度至1400℃～1700℃下保温2小时，再降温冷却得到基板。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (1)

1.一种LED用散热基板的制备工艺，其特征在于具体制备工艺如下：
1)复合烧结助剂的制备
将氧化铝粉65～75份、镁粉5～10份、煅烧高岭土15～20份、滑石粉5～10份、氟化钙15～20份分散于无水乙醇中形成混合浆料，干燥后即制得复合烧结助剂，其中，所述氧化铝粉与无水乙醇的质量体积比为1g：5mL；
2)浆料的制备
依次加入50～60份的氮化硅粉、次磷酸钠3～6份、羟甲基纤维素3～6份、乙酸锆3～5份、聚乙烯醇6～10份和步骤1)制得的复合烧结助剂6～10份进行湿法球磨，球磨3～5小时，进行真空搅拌除泡，制得浆料；
3)成型
将步骤2)制得的浆料压入模具中，自然放置完成凝胶过程；取出坯片在70～80℃温度中，进行干燥处理3～5小时；然后放入热压模具中进行烧结压制，在温度为1200～1400℃下保温1～2小时，继续提高温度至1400℃～1700℃下保温1～2小时，再降温冷却得到基板。
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CN109485953A (zh) * 2018-10-10 2019-03-19 安徽科比电子科技有限公司 一种提高散热性能的铝壳电阻器内填充料

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