CN106316405A - 一种led用散热基板的制备工艺 - Google Patents
一种led用散热基板的制备工艺 Download PDFInfo
- Publication number
- CN106316405A CN106316405A CN201610654482.1A CN201610654482A CN106316405A CN 106316405 A CN106316405 A CN 106316405A CN 201610654482 A CN201610654482 A CN 201610654482A CN 106316405 A CN106316405 A CN 106316405A
- Authority
- CN
- China
- Prior art keywords
- parts
- substrate
- preparation technology
- led
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/349—Clays, e.g. bentonites, smectites such as montmorillonite, vermiculites or kaolines, e.g. illite, talc or sepiolite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/40—Metallic constituents or additives not added as binding phase
- C04B2235/401—Alkaline earth metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
- C04B2235/444—Halide containing anions, e.g. bromide, iodate, chlorite
- C04B2235/445—Fluoride containing anions, e.g. fluosilicate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
- C04B2235/447—Phosphates or phosphites, e.g. orthophosphate, hypophosphite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
- C04B2235/449—Organic acids, e.g. EDTA, citrate, acetate, oxalate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6562—Heating rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Products (AREA)
Abstract
本发明涉及一种LED用散热基板的制备工艺。该工艺包括:1)复合烧结助剂的制备;2)浆料的制备;3)成型。本发明的有益效果如下:本发明通过采用合适的烧结方法和选取合适的烧结助剂,实现了烧结体的致密化,大大提高了基板的热导率;本发明的烧结助剂可形成低熔点的物相,实现液相烧结,降低烧成温度,促进坯体的致密化,增加了基板表面的硬度和光泽度;本发明的基板导热系数大,耐热性能优,抗弯强度高,避免出现弯曲、翘曲等现象。
Description
技术领域
本发明属于LED用基板技术领域,具体涉及一种LED用散热基板的制备工艺。
背景技术
LED灯主要包括LED芯片和灯杯,通常LED芯片是用LED发光晶片以打金线、共晶或覆晶的方式连接在散热基板上形成的,再将LED芯片固定在系统的电路板上,散热基板扮演着散热、导电、绝缘三重角色,现有的散热基板主要是金属基板,但是这类金属基板连接LED发光晶片的技术存在着散热性差、绝缘性差的弊端。
随着LED照明的需求日趋迫切,大功率LED的散热问题益发受到重视(过高的温度会导致LED发光效率衰减);LED使用所产生的废热若无法有效散出,则会对LED的寿命造成致命性的影响。现阶段较普遍的散热基板有4种:直接覆铜板(DBC)、直接镀铜基板(DPC)、高温共烧多层基板(HTCC)和低温共烧多层基板(LTCC)。在实际使用中存在成本限制、绝缘性能不够等缺点,其制造成本较高,散热性能差,抗潮、抗腐蚀性能不好,导致LED灯的使用寿命较短,不能足市场需要,因此很有必要改进材料的配方,设计一种性能优越的LED基板。
发明内容
本发明针对背景技术中的存在的问题而提供一种散热性能好的LED用散热基板的制备工艺。
为了实现本发明目的而采用的技术方案为:一种LED用散热基板的制备工艺,具体制备步骤如下:
1)复合烧结助剂的制备
将氧化铝粉65~75份、镁粉5~10份、煅烧高岭土15~20份、滑石粉5~10份、氟化钙15~20份分散于无水乙醇中形成混合浆料,干燥后即制得复合烧结助剂,其中,所述氧化铝粉与无水乙醇的质量体积比为1g:5mL;
2)浆料的制备
依次加入50~60份的氮化硅粉、次磷酸钠3~6份、羟甲基纤维素3~6份、乙酸锆3~5份、聚乙烯醇6~10份和步骤1)制得的复合烧结助剂6~10份进行湿法球磨,球磨3~5小时,进行真空搅拌除泡,制得浆料;
3)成型
将步骤2)制得的浆料压入模具中,自然放置完成凝胶过程;取出坯片在70~80℃温度中,进行干燥处理3~5小时;然后放入热压模具中进行烧结压制,在温度为1200~1400℃下保温1~2小时,继续提高温度至1400℃~1700℃下保温1~2小时,再降温冷却得到基板。
本发明的有益效果如下:
本发明通过采用合适的烧结方法和选取合适的烧结助剂,实现了烧结体的致密化,大大提高了基板的热导率;本发明的烧结助剂可形成低熔点的物相,实现液相烧结,降低烧成温度,促进坯体的致密化,增加了基板表面的硬度和光泽度;本发明的基板导热系数大,耐热性能优,抗弯强度高,避免出现弯曲、翘曲等现象。
具体实施方式
下面结合实施例对本发明作进一步的描述。
实施例1:
本发明实施例一种LED用散热基板的制备工艺,具体制备步骤如下:
1)复合烧结助剂的制备
将氧化铝粉65份、镁粉5份、煅烧高岭土15份、滑石粉5份、氟化钙15份分散于无水乙醇中形成混合浆料,干燥后即制得复合烧结助剂,其中,所述氧化铝粉与无水乙醇的质量体积比为1g:5mL;
2)浆料的制备
依次加入50份的氮化硅粉、次磷酸钠3份、羟甲基纤维素3份、乙酸锆3份、聚乙烯醇6份和步骤1)制得的复合烧结助剂6份进行湿法球磨,球磨3小时,进行真空搅拌除泡,制得浆料;
3)成型
将步骤2)制得的浆料压入模具中,自然放置完成凝胶过程;取出坯片在70~80℃温度中,进行干燥处理3小时;然后放入热压模具中进行烧结压制,在温度为1200~1400℃下保温1小时,继续提高温度至1400℃~1700℃下保温1小时,再降温冷却得到基板。
实施例2:
本发明实施例一种LED用散热基板的制备工艺,具体制备步骤如下:
1)复合烧结助剂的制备
将氧化铝粉75份、镁粉10份、煅烧高岭土20份、滑石粉10份、氟化钙20份分散于无水乙醇中形成混合浆料,干燥后即制得复合烧结助剂,其中,所述氧化铝粉与无水乙醇的质量体积比为1g:5mL;
2)浆料的制备
依次加入60份的氮化硅粉、次磷酸钠6份、羟甲基纤维素6份、乙酸锆5份、聚乙烯醇10份和步骤1)制得的复合烧结助剂10份进行湿法球磨,球磨5小时,进行真空搅拌除泡,制得浆料;
3)成型
将步骤2)制得的浆料压入模具中,自然放置完成凝胶过程;取出坯片在70~80℃温度中,进行干燥处理5小时;然后放入热压模具中进行烧结压制,在温度为1200~1400℃下保温2小时,继续提高温度至1400℃~1700℃下保温2小时,再降温冷却得到基板。
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。
Claims (1)
1.一种LED用散热基板的制备工艺,其特征在于具体制备工艺如下:
1)复合烧结助剂的制备
将氧化铝粉65~75份、镁粉5~10份、煅烧高岭土15~20份、滑石粉5~10份、氟化钙15~20份分散于无水乙醇中形成混合浆料,干燥后即制得复合烧结助剂,其中,所述氧化铝粉与无水乙醇的质量体积比为1g:5mL;
2)浆料的制备
依次加入50~60份的氮化硅粉、次磷酸钠3~6份、羟甲基纤维素3~6份、乙酸锆3~5份、聚乙烯醇6~10份和步骤1)制得的复合烧结助剂6~10份进行湿法球磨,球磨3~5小时,进行真空搅拌除泡,制得浆料;
3)成型
将步骤2)制得的浆料压入模具中,自然放置完成凝胶过程;取出坯片在70~80℃温度中,进行干燥处理3~5小时;然后放入热压模具中进行烧结压制,在温度为1200~1400℃下保温1~2小时,继续提高温度至1400℃~1700℃下保温1~2小时,再降温冷却得到基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610654482.1A CN106316405A (zh) | 2016-08-11 | 2016-08-11 | 一种led用散热基板的制备工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610654482.1A CN106316405A (zh) | 2016-08-11 | 2016-08-11 | 一种led用散热基板的制备工艺 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106316405A true CN106316405A (zh) | 2017-01-11 |
Family
ID=57740091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610654482.1A Withdrawn CN106316405A (zh) | 2016-08-11 | 2016-08-11 | 一种led用散热基板的制备工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106316405A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109485953A (zh) * | 2018-10-10 | 2019-03-19 | 安徽科比电子科技有限公司 | 一种提高散热性能的铝壳电阻器内填充料 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1557709A (zh) * | 2004-02-10 | 2004-12-29 | 中国科学院上海硅酸盐研究所 | 自蔓延高温合成氮化硅镁粉体的制备方法 |
CN104529470A (zh) * | 2014-12-08 | 2015-04-22 | 北京中材人工晶体研究院有限公司 | 一种氮化硅粉料的制备方法 |
CN105254308A (zh) * | 2015-11-04 | 2016-01-20 | 苏州知瑞光电材料科技有限公司 | 一种陶瓷散热复合材料的制备方法 |
CN105272176A (zh) * | 2015-11-04 | 2016-01-27 | 苏州知瑞光电材料科技有限公司 | 一种大功率led散热用陶瓷基板 |
CN105304795A (zh) * | 2015-11-04 | 2016-02-03 | 苏州知瑞光电材料科技有限公司 | 一种led用陶瓷散热基板 |
-
2016
- 2016-08-11 CN CN201610654482.1A patent/CN106316405A/zh not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1557709A (zh) * | 2004-02-10 | 2004-12-29 | 中国科学院上海硅酸盐研究所 | 自蔓延高温合成氮化硅镁粉体的制备方法 |
CN104529470A (zh) * | 2014-12-08 | 2015-04-22 | 北京中材人工晶体研究院有限公司 | 一种氮化硅粉料的制备方法 |
CN105254308A (zh) * | 2015-11-04 | 2016-01-20 | 苏州知瑞光电材料科技有限公司 | 一种陶瓷散热复合材料的制备方法 |
CN105272176A (zh) * | 2015-11-04 | 2016-01-27 | 苏州知瑞光电材料科技有限公司 | 一种大功率led散热用陶瓷基板 |
CN105304795A (zh) * | 2015-11-04 | 2016-02-03 | 苏州知瑞光电材料科技有限公司 | 一种led用陶瓷散热基板 |
Non-Patent Citations (1)
Title |
---|
黄伟九: "《刀具材料速查手册》", 28 February 2011, 机械工业出版社 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109485953A (zh) * | 2018-10-10 | 2019-03-19 | 安徽科比电子科技有限公司 | 一种提高散热性能的铝壳电阻器内填充料 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105272176A (zh) | 一种大功率led散热用陶瓷基板 | |
CN105254308A (zh) | 一种陶瓷散热复合材料的制备方法 | |
CN101591747B (zh) | 一种铝合金及应用有该铝合金的led灯基板 | |
JP2012180275A (ja) | 熱放射部材用セラミックスの製造方法、熱放射部材用セラミックス、該セラミックスを用いてなる太陽電池モジュールおよびled発光モジュール | |
CN104591702B (zh) | 一种led用高抗热震氧化铝陶瓷基板及制造方法 | |
CN103755351A (zh) | Led用低成本氮化铝陶瓷基片的生产方法 | |
CN102569625A (zh) | 一种大功率led散热用覆铜线路铝碳化硅陶瓷基板 | |
CN103435334B (zh) | Led节能灯基座用复合陶瓷材料 | |
CN104696832A (zh) | Led路灯 | |
CN104310976A (zh) | 一种高耐磨耐高温陶瓷 | |
CN102336523A (zh) | 高导热稀土/AlN/微晶玻璃复合材料及其制备方法 | |
CN103060596A (zh) | 一种SiC增强Al基复合材料的制备方法 | |
CN102503382A (zh) | LED散热基板用Al2O3陶瓷材料 | |
CN105254285A (zh) | 一种大功率led散热用陶瓷基板的制备工艺 | |
CN106316405A (zh) | 一种led用散热基板的制备工艺 | |
CN106316407A (zh) | 一种led用高硬度基板的制备工艺 | |
CN105405955A (zh) | 一种led用陶瓷散热基板的制备工艺 | |
CN105304795A (zh) | 一种led用陶瓷散热基板 | |
CN106316406A (zh) | 一种led用抗腐蚀性基板的制备工艺 | |
CN106316408A (zh) | 一种led用高光泽度基板的制备工艺 | |
CN106830690A (zh) | 一种自增强增韧的氮化硅/氮化铝/镧钡铝硅酸盐微晶玻璃三元复合材料及其制备方法 | |
CN204029854U (zh) | Led灯 | |
CN203521463U (zh) | 一种高导热的led-cob封装基板 | |
CN105254286A (zh) | 一种高导热陶瓷材料及其制造方法 | |
CN106348761A (zh) | 一种led用高导热性基板的制备工艺 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170111 |
|
WW01 | Invention patent application withdrawn after publication |