CN106304620B - Pcb board and terminal device - Google Patents
Pcb board and terminal device Download PDFInfo
- Publication number
- CN106304620B CN106304620B CN201610890536.4A CN201610890536A CN106304620B CN 106304620 B CN106304620 B CN 106304620B CN 201610890536 A CN201610890536 A CN 201610890536A CN 106304620 B CN106304620 B CN 106304620B
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- pcb board
- conductive layer
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- 239000000758 substrate Substances 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 4
- 239000012092 media component Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application proposes a kind of pcb board and terminal device, wherein the pcb board includes: the conductive layer and insulating layer of arranged stacked；Insulating layer is set between every two adjacent conductive layer；An at least conductive layer is the high speed signal layer for being provided with HW High Way, and an at least conductive layer is ground plane, and an at least conductive layer is the interference signal layer for being provided with power signal line and/or clock interference signal line；Adjacent at least one layer of conductive layer of high speed signal layer is ground plane, insulating layer between high speed signal layer and adjacent ground plane with a thickness of the first preset thickness, adjacent at least one layer of conductive layer of interference signal layer is ground plane, and the overall thickness of the insulating layer between interference signal layer and high speed signal layer is greater than or equal to the second preset thickness, wherein, the second preset thickness is twice of the first preset thickness.The pcb board and terminal device of the application, the arranged stacked of pcb board is reasonable, and signal interference is small, and signal quality is good.
Description
Technical field
This application involves PCB design technical field more particularly to a kind of PCB printed circuit board (Printed Circuit
Board, abbreviation PCB) and terminal device.
Background technique
PCB (Printed Circuit Board), Chinese is printed circuit board, is important electronic component, to
Support electronic component, and the carrier as electronic component electrical connection.When carrying out PCB design, need to consider in pcb board
The factors such as the reflection of signal interference and signal rationally design the arranged stacked side of pcb board to achieve the purpose that improve signal quality
Formula is the key that improve pcb board signal quality.
Summary of the invention
The application is intended to solve at least some of the technical problems in related technologies.
For this purpose, first purpose of the application is to propose a kind of pcb board, the stack design of the pcb board is reasonable, and signal is dry
It disturbs less, signal quality is good.
Second purpose of the application is to propose a kind of terminal device.
In order to achieve the above object, the application first aspect embodiment proposes a kind of pcb board, comprising: the conduction of arranged stacked
Layer and insulating layer；Insulating layer is set between every two adjacent conductive layer；
An at least conductive layer is the high speed signal layer for being provided with HW High Way, and an at least conductive layer is ground plane, at least
One conductive layer is the interference signal layer for being provided with power signal line and/or clock interference signal line；
Adjacent at least one layer of conductive layer of the high speed signal layer is ground plane, the high speed signal layer and adjacent institute
State the insulating layer between ground plane with a thickness of the first preset thickness, adjacent at least one layer of conductive layer of the interference signal layer
For ground plane, and to be greater than or equal to second pre- for the overall thickness of the insulating layer between the interference signal layer and the high speed signal layer
If thickness, wherein second preset thickness is twice of first preset thickness.
The pcb board of the embodiment of the present application, adjacent at least one layer of conductive layer of high speed signal layer are ground plane, interference signal
Adjacent at least one layer of conductive layer of layer is also ground plane, thus reduces the return flow path of signal as much as possible, reduces back
Roadlock is anti-, and the thickness of the insulating layer between interference signal layer and high speed signal layer is greater than twice of high speed signal layer and adjacent
The thickness of insulating layer between ground plane reduces interference signal layer to the signal interference of high speed signal layer as a result, improves letter
Number quality.
In certain embodiments of the present invention, first preset thickness is 0.95mm-1.05mm.
In certain embodiments of the present invention, two adjacent conductive layers of the high speed signal layer are ground plane.
In certain embodiments of the present invention, the thickness of the insulating layer between the interference signal layer and adjacent ground plane
Equal to second preset thickness.
In certain embodiments of the present invention, the pcb board includes six layers of conductive layer and five layer insulatings, six layers of conductive layer
Successively from the top of the pcb board to bottom are as follows: substrate layer, ground plane, high speed signal layer, ground plane, interference signal layer and base
Plate layer.
In certain embodiments of the present invention, two insulation between the high speed signal layer and two adjacent ground planes
Layer with a thickness of first preset thickness, and it is exhausted between the substrate layer of the top layer of the pcb board and adjacent ground plane
Edge layer with a thickness of second preset thickness.
In certain embodiments of the present invention, one of them adjacent conductive layer of the high speed signal layer is ground plane,
Another adjacent conductive layer of the high speed signal layer is interference signal layer, the high speed signal layer and adjacent described dry
The thickness for disturbing the insulating layer between signals layer is equal to second preset thickness.
In certain embodiments of the present invention, the top layer of the pcb board and bottom are ground plane.
In certain embodiments of the present invention, the pcb board includes six layers of conductive layer and five layer insulatings, six layers of conductive layer
Successively from the top of the pcb board to bottom are as follows: ground plane, interference signal layer, ground plane, high speed signal layer, interference signal layer
And ground plane.
In order to achieve the above object, second aspect of the present invention also provides a kind of terminal device, including shell, and with next or
Multiple components: processor, memory, power circuit, multimedia component, audio component, the interface of input/output (I/O), sensing
Device assembly and communication component, the power circuit, for each circuit or the device power supply for the terminal device；It is described
Memory is for storing executable program code；The processor is by reading the executable program generation stored in the memory
Code runs program corresponding with the executable program code, further includes the pcb board as provided by first aspect present invention, institute
It states pcb board and is placed in the space interior that the shell surrounds, the processor and the memory are arranged on the pcb board.
Using the terminal device of embodiment of the present invention, it is able to achieve the beneficial effect of the pcb board of embodiment of the present invention.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention will become from the following description of the accompanying drawings of embodiments
Obviously and it is readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the pcb board of one embodiment of the application；
Fig. 2 is the structural schematic diagram of the pcb board of another embodiment of the application；
Fig. 3 is the structural schematic diagram of the terminal device of the embodiment of the present application.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the application, and should not be understood as the limitation to the application.
Below with reference to the accompanying drawings the pcb board and terminal device of the embodiment of the present application are described.
Embodiment one
Fig. 1 is the structural schematic diagram of the pcb board of one embodiment of the application.
It please refers to shown in attached drawing 1, which includes: the conductive layer (111,112,113,114,115,116) of arranged stacked
With insulating layer (211,212,213,214,215)；Insulating layer is set between every two adjacent conductive layer.
An at least conductive layer is the high speed signal layer for being provided with HW High Way, and an at least conductive layer is ground plane, at least
One conductive layer is the interference signal layer for being provided with power signal line and/or clock interference signal line.
Adjacent at least one layer of conductive layer of high speed signal layer is ground plane, between high speed signal layer and adjacent ground plane
Insulating layer with a thickness of the first preset thickness, adjacent at least one layer of conductive layer of interference signal layer is ground plane, and is interfered
The overall thickness of insulating layer between signals layer and high speed signal layer is greater than or equal to the second preset thickness, wherein the second default thickness
Degree is twice of the first preset thickness.
Specifically, conductive layer includes: the first conductive layer 111, the second conductive layer 112, third conductive layer 113, as shown in figure 1
Four conductive layers 114, the 5th conductive layer 115, the 6th conductive layer 116.It is set between the first conductive layer 111 and the second conductive layer 112
Be equipped between insulating layer 211, the second conductive layer 112 and third conductive layer 113 be provided with insulating layer 212, third conductive layer 113 with
It is provided between 4th conductive layer 114 between insulating layer 213, the 4th conductive layer 114 and the 5th conductive layer 115 and is provided with insulating layer
214, insulating layer 215 is provided between the 5th conductive layer 115 and the 6th conductive layer 116.
Please continue to refer to Fig. 1, for example, when third conductive layer 113 is high speed signal layer, then, the second conductive layer 112 and the 4th
Conductive layer 114 it is therein at least one be ground plane, if only the second conductive layer 112 be used as ground plane, be used as high speed signal layer
Third conductive layer 113 and as insulating layer 212 between the second conductive layer 112 of ground plane with a thickness of the first default thickness
Degree, the first preset thickness can determine according to the thickness of entire pcb board and required circuit distance, the in the present embodiment
One preset thickness can be 0.95mm-1.05mm, which can be 1080PP piece (No. 1080 prepregs), as a result,
Enable to high speed signal layer (third conductive layer 113) and ground plane (the second conductive layer 112) as close possible between the two
The thickness of insulating layer 212 is smaller, and apart from short, signal passes through insulating layer 212 and ground plane (the second conductive layer for the circuit of radiofrequency signal
112) resistance encountered is small, and impedance loop is small, reduces the reflection of radiofrequency signal, improves the integrality of signal.
Certainly, two adjacent conductive layers of high speed signal layer (third conductive layer 113) can also be ground plane, that is,
Second conductive layer 112 and the 4th conductive layer 114 can be ground plane.When two adjacent conductive layers of high speed signal layer are
When ground plane, influence of the interference signal to high speed signal can be further decreased, high speed signaling quality is further increased.
The 5th conductive layer 115 in the present embodiment can be interference signal layer, high speed signal layer (third conductive layer 113) and
Interference signal layer (the 5th conductive layer 115) has ground plane adjacent respectively, so, can guarantee its impedance and signal matter
Amount.And according to the requirement of entire pcb board thickness, insulating layer 215 between interference signal layer 115 and adjacent ground plane 114
Thickness can be equal to the second preset thickness.
In addition, the overall thickness of the insulating layer between interference signal layer 115 and high speed signal layer 113 can be greater than or equal to the
Two preset thickness, and the second preset thickness is equal to twice of the first preset thickness, in the present embodiment, 115 He of interference signal layer
It is also provided with a ground plane (the 4th conductive layer 114), and is arranged in interference signal layer 115 between high speed signal layer 113
The insulating layer 213 between insulating layer 214 and high speed signal layer 113 and ground plane 114 between ground plane 114, this is two layers
The overall thickness of insulating layer is greater than or equal to the second preset thickness.As a result, under the requirement for meeting pcb board thickness, increase as far as possible
The distance between big interference signal layer 115 and high speed signal layer 113, reduce interference of the interference signal to high speed signal, improve letter
Number quality, improves the performance of complete machine.
Pcb board provided in an embodiment of the present invention, since adjacent at least one layer of conductive layer of high speed signal layer is ground plane,
Adjacent at least one layer of conductive layer of interference signal layer is also ground plane, thus reduces the return flow path of signal as much as possible,
Impedance loop is reduced, and the thickness of the insulating layer between interference signal layer and high speed signal layer is greater than twice of high speed signal layer
The thickness of insulating layer between adjacent ground plane, reduces interference signal layer to the signal interference of high speed signal layer as a result,
Improve signal quality.
Specifically, enumerating a kind of specific overlapped way of pcb board below, in the present embodiment, pcb board may include six layers
Conductive layer and five layer insulatings, six layers of conductive layer from the top of pcb board to bottom successively are as follows: it is substrate layer 111, ground plane 112, high
Fast signals layer 113, ground plane 114, interference signal layer 115 and substrate layer 116.It should be noted that substrate layer 111 and substrate layer
116 be the copper sheet layer for not arranging any cabling, guarantees preferable signal quality due to having been able under current arrangement, therefore,
For the intensity requirement for guaranteeing entire pcb board, substrate layer can be set, but do not arrange any cabling to save on the substrate layer
This.
In the present embodiment, further, between high speed signal layer 113 and two adjacent ground planes (112,114)
The thickness of two insulating layers (212,213) can be the first preset thickness, and the substrate layer of the top layer of pcb board 111 with it is adjacent
Ground plane 112 between the thickness of insulating layer 211 can be the second preset thickness.In this way, make high speed signal layer 113
Close to reducing signal return flow path, also, since pcb board is mounted between adjacent ground plane (112,114)
It needs to guarantee certain structural strength on terminal device, prevents from damaging, therefore, on the reflux road being not necessary to guaranty that between conductive layer
The thickness of corresponding insulating layer at the position of diameter increases as far as possible, verifies by test, can be by the substrate of the top layer of pcb board
Layer 111 and adjacent ground plane 112 between insulating layer 211 thickness design be the second preset thickness, as the first of twice
Preset thickness designs reasonable thickness, on the basis of the structural strength that ensure that pcb board, while also controlling manufacturing cost
In reasonable range.
Embodiment two
Fig. 2 is the structural schematic diagram of the pcb board of another embodiment of the application；The present embodiment is similar with embodiment one,
It please refers to shown in attached drawing 2, conductive layer includes: the first conductive layer 121, the second conductive layer 122, the 123, the 4th conduction of third conductive layer
Layer the 124, the 5th conductive layer 125, the 6th conductive layer 126.And insulating layer, cloth are also respectively provided between adjacent conductive layer two-by-two
The mode of setting is the same as example 1, specifically: insulating layer is provided between the first conductive layer 121 and the second conductive layer 122
221, insulating layer 222, third conductive layer 123 and the 4th conductive layer are provided between the second conductive layer 122 and third conductive layer 123
It is provided between 124 and is provided with insulating layer the 224, the 5th between insulating layer 223, the 4th conductive layer 124 and the 5th conductive layer 125 and leads
Insulating layer 225 is provided between electric layer 125 and the 6th conductive layer 126.
The present embodiment what is different from the first embodiment is that only one of them adjacent conductive layer of high speed signal layer be ground plane,
And another adjacent conductive layer of high speed signal layer is interference signal layer, high speed signal layer and adjacent interference signal layer it
Between insulating layer thickness be equal to second preset thickness.In the present embodiment, for example, the 4th conductive layer 124 is that high speed is believed
Number floor, then third conductive layer 123 can be ground plane, corresponding, and the 5th conductive layer 125 can be interference signal layer, likewise,
As the 4th conductive layer 124 of high speed signal layer and as the insulating layer 224 between the 5th conductive layer 125 of interference signal layer
Thickness can be the second preset thickness.
Further, the top layer of pcb board and bottom can be ground plane.
The specific overlapped way of another pcb board is enumerated below, and similar with embodiment one, pcb board, which may include six layers, leads
Electric layer and five layer insulatings, and what is different from the first embodiment is that six layers of conductive layer from the top of pcb board to bottom successively are as follows: connect
Stratum 121, interference signal layer 122, ground plane 123, high speed signal layer 124, interference signal layer 125 and ground plane 126.This kind
The arranged stacked mode of pcb board, can guarantee high speed signal circuit distance it is smaller, impedance loop is smaller, high speed signal by
The interference of interference signal is less, and signal quality is preferable.
It should be noted that two adjacent conductive layers of interference signal layer 122 are that ground plane (ground plane 121 and connects
Stratum 123), it is possible thereby to effectively be shielded to interference signal, the further interference signal that reduces is to high speed signal layer 124
It influences.
Embodiment three
Fig. 3 is the structural schematic diagram of the terminal device of the embodiment of the present application.As shown in figure 3, the present embodiment provides a kind of ends
End equipment, the terminal device 1000 include shell 1001 and following one or more components: processor 1002, memory
1003, power circuit 1004, multimedia component 1005, audio component 1006, the interface 1007 of input/output (I/O), sensor
Component 1008 and communication component 1009, each circuit or the device power supply that power circuit 1004 is used for as terminal device 1000；
Memory 1003 is for storing executable program code；Processor 1002 is by reading the executable journey stored in memory 1003
Sequence code runs program corresponding with executable program code, further includes the pcb board as provided by above-mentioned any embodiment
1100, pcb board 1100 is placed in the space interior that shell 1001 surrounds, and processor 1002 and memory 1003 are arranged in pcb board
On 1100.
Terminal device in the present embodiment can be computer or mobile phone.
The structure of the pcb board of terminal device in the present embodiment is identical as embodiment one, embodiment two, no longer superfluous herein
It states.
Terminal device provided in an embodiment of the present invention, due to including the pcb board of above-described embodiment, and the pcb board due to
Ground plane is set by adjacent at least one layer of conductive layer of its high speed signal layer, the adjacent at least one layer of interference signal layer is led
Electric layer is also configured as ground plane, it is possible thereby to reduce the return flow path of signal as much as possible, reduces impedance loop, and interferes
Between high speed signal layer and adjacent ground plane of the thickness of insulating layer between signals layer and high speed signal layer greater than twice
The thickness of insulating layer reduces interference signal layer to the signal interference of high speed signal layer as a result, improves signal quality, in turn
Improve the communication performance of terminal device.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be direct phase
Even, can also indirectly connected through an intermediary, the interaction that can be connection or two elements inside two elements is closed
System.For the ordinary skill in the art, above-mentioned term in the present invention specific can be understood as the case may be
Meaning.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.
In the description of the present invention, reference term " one embodiment ", " some embodiments ", " example ", " specific example ",
Or the description of " some examples " etc. means particular features, structures, materials, or characteristics packet described in conjunction with this embodiment or example
In at least one embodiment or example contained in the application.In the present specification, schematic expression of the above terms are necessarily
It is directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be at any one
Or it can be combined in any suitable manner in multiple embodiment or examples.In addition, without conflicting with each other, those skilled in the art
Member the feature of different embodiments or examples described in this specification and different embodiments or examples can be combined and
Combination.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (3)
1. a kind of pcb board characterized by comprising the conductive layer and insulating layer of arranged stacked；Insulating layer is set to every two phase
Between adjacent conductive layer, the pcb board includes six layers of conductive layer and five layer insulatings, and six layers of conductive layer are from the top of the pcb board
Portion to bottom successively are as follows: substrate layer, ground plane, high speed signal layer, ground plane, interference signal layer and substrate layer；
Wherein two insulating layers between the high speed signal layer and two adjacent ground planes with a thickness of the first preset thickness,
And the insulating layer between the substrate layer of the top layer of the pcb board and adjacent ground plane with a thickness of the second preset thickness, institute
The thickness for stating the insulating layer between interference signal layer and adjacent ground plane is equal to second preset thickness, and the interference is believed
The overall thickness of insulating layer number between floor and the high speed signal floor is greater than or equal to the second preset thickness, wherein described second
Preset thickness is twice of first preset thickness.
2. pcb board according to claim 1, which is characterized in that first preset thickness is 0.95mm-1.05mm.
3. a kind of terminal device, including shell and following one or more components: processor, memory, power circuit are more
Media component, audio component, the interface of input/output (I/O), sensor module and communication component, the power circuit,
For each circuit or the device power supply for the terminal device；The memory is for storing executable program code；It is described
Processor is corresponding with the executable program code to run by reading the executable program code stored in the memory
Program, which is characterized in that further include such as the described in any item pcb boards of claim 1-2, the pcb board is placed in the shell
The space interior that body surrounds, the processor and the memory are arranged on the pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610890536.4A CN106304620B (en) | 2016-10-12 | 2016-10-12 | Pcb board and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610890536.4A CN106304620B (en) | 2016-10-12 | 2016-10-12 | Pcb board and terminal device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106304620A CN106304620A (en) | 2017-01-04 |
| CN106304620B true CN106304620B (en) | 2019-03-29 |
Family
ID=57717184
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610890536.4A Expired - Fee Related CN106304620B (en) | 2016-10-12 | 2016-10-12 | Pcb board and terminal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304620B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212522A (en) * | 2019-12-31 | 2020-05-29 | 惠州Tcl移动通信有限公司 | Circuit board and terminal equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1344132A (en) * | 2000-09-18 | 2002-04-10 | 神达电脑股份有限公司 | Technology for laminating 6-layer circuit board suitable for high-speed signals and its product |
| CN201207714Y (en) * | 2008-05-15 | 2009-03-11 | 青岛海信移动通信技术股份有限公司 | Slave module for CDMA mobile terminal |
| CN202262021U (en) * | 2011-09-01 | 2012-05-30 | 青岛海信电器股份有限公司 | Six-layer circuit board and electronic terminal |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002151854A (en) * | 2000-11-15 | 2002-05-24 | Genesis Technology Kk | Multilayer printed wiring board and manufacturing method therefor |
-
2016
- 2016-10-12 CN CN201610890536.4A patent/CN106304620B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1344132A (en) * | 2000-09-18 | 2002-04-10 | 神达电脑股份有限公司 | Technology for laminating 6-layer circuit board suitable for high-speed signals and its product |
| CN201207714Y (en) * | 2008-05-15 | 2009-03-11 | 青岛海信移动通信技术股份有限公司 | Slave module for CDMA mobile terminal |
| CN202262021U (en) * | 2011-09-01 | 2012-05-30 | 青岛海信电器股份有限公司 | Six-layer circuit board and electronic terminal |
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| Publication number | Publication date |
|---|---|
| CN106304620A (en) | 2017-01-04 |
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