CN106304620A - Pcb board and terminal unit - Google Patents
Pcb board and terminal unit Download PDFInfo
- Publication number
- CN106304620A CN106304620A CN201610890536.4A CN201610890536A CN106304620A CN 106304620 A CN106304620 A CN 106304620A CN 201610890536 A CN201610890536 A CN 201610890536A CN 106304620 A CN106304620 A CN 106304620A
- Authority
- CN
- China
- Prior art keywords
- layer
- pcb board
- conductive layer
- high speed
- ground plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004888 barrier function Effects 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 239000012092 media component Substances 0.000 claims 1
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application proposes a kind of pcb board and terminal unit, and wherein, this pcb board includes: the conductive layer of arranged stacked and insulating barrier；Insulating barrier is arranged between the conductive layer that each two is adjacent；At least one conductive layer is the high speed signal layer being provided with HW High Way, and at least one conductive layer is ground plane, and at least one conductive layer is the interference signals layer being provided with power signal line and/or clock interference signal line；The adjacent at least one of which conductive layer of high speed signal layer is ground plane, the thickness of the insulating barrier between high speed signal layer and adjacent ground plane is the first preset thickness, the adjacent at least one of which conductive layer of interference signals layer is ground plane, and the gross thickness of the insulating barrier between interference signals layer and high speed signal layer is more than or equal to the second preset thickness, wherein, the second preset thickness is the twice of the first preset thickness.The pcb board of the application and terminal unit, the arranged stacked of pcb board is reasonable, and signal disturbing is little, and signal quality is good.
Description
Technical field
The application relates to PCB design technical field, particularly relates to a kind of PCB printed circuit board (PCB) (Printed Circuit
Board, is called for short PCB) and terminal unit.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board (PCB), is important electronic unit, in order to
Support electronic devices and components, and as the carrier of electronic devices and components electrical connection.When carrying out PCB design, need to consider in pcb board
The factors such as the reflection of signal disturbing and signal, to reach to improve the purpose of signal quality, the arranged stacked side of appropriate design pcb board
Formula, is the key improving pcb board signal quality.
Summary of the invention
One of technical problem that the application is intended to solve in correlation technique the most to a certain extent.
To this end, the first of the application purpose is to propose a kind of pcb board, the stack design of this pcb board is reasonable, and signal is done
Disturbing few, signal quality is good.
Second purpose of the application is to propose a kind of terminal unit.
For reaching above-mentioned purpose, the application first aspect embodiment proposes a kind of pcb board, including: the conduction of arranged stacked
Layer and insulating barrier；Insulating barrier is arranged between the conductive layer that each two is adjacent；
At least one conductive layer is the high speed signal layer being provided with HW High Way, and at least one conductive layer is ground plane, at least
One conductive layer is the interference signals layer being provided with power signal line and/or clock interference signal line；
The adjacent at least one of which conductive layer of described high speed signal layer is ground plane, described high speed signal layer and adjacent institute
The thickness stating the insulating barrier between ground plane is the first preset thickness, the adjacent at least one of which conductive layer of described interference signals layer
Gross thickness for the insulating barrier between ground plane, and described interference signals layer and described high speed signal layer is pre-more than or equal to second
If thickness, wherein, described second preset thickness is the twice of described first preset thickness.
The pcb board of the embodiment of the present application, the adjacent at least one of which conductive layer of high speed signal layer is ground plane, disturbs signal
The adjacent at least one of which conductive layer of layer is also ground plane, reduces the return flow path of signal the most as much as possible, reduces back
Roadlock resists, and disturbs the thickness of the insulating barrier between signals layer with high speed signal layer to be more than the high speed signal layer of twice with adjacent
The thickness of the insulating barrier between ground plane, thus, decreases the interference signals layer signal disturbing to high speed signal layer, improves letter
Number quality.
In certain embodiments of the present invention, described first preset thickness is 0.95mm-1.05mm.
In certain embodiments of the present invention, two adjacent conductive layers of described high speed signal layer are ground plane.
In certain embodiments of the present invention, the thickness of the insulating barrier between described interference signals layer and adjacent ground plane
Equal to described second preset thickness.
In certain embodiments of the present invention, described pcb board includes six layers of conductive layer and five layer insulatings, six layers of conductive layer
It is followed successively by bottom from the top of described pcb board: substrate layer, ground plane, high speed signal layer, ground plane, interference signals layer and base
Flaggy.
In certain embodiments of the present invention, two insulation between described high speed signal layer and two adjacent ground planes
The thickness of layer is described first preset thickness, and exhausted between substrate layer and the adjacent ground plane of the top layer of described pcb board
The thickness of edge layer is described second preset thickness.
In certain embodiments of the present invention, one of them adjacent conductive layer of described high speed signal layer is ground plane,
The conductive layer that the another one of described high speed signal layer is adjacent is interference signals layer, and described high speed signal layer described is done with adjacent
The thickness disturbing the insulating barrier between signals layer is equal to described second preset thickness.
In certain embodiments of the present invention, top layer and the bottom of described pcb board is ground plane.
In certain embodiments of the present invention, described pcb board includes six layers of conductive layer and five layer insulatings, six layers of conductive layer
It is followed successively by bottom from the top of described pcb board: ground plane, interference signals layer, ground plane, high speed signal layer, interference signals layer
And ground plane.
For reaching above-mentioned purpose, second aspect present invention also provides for a kind of terminal unit, including housing, and with next or
Multiple assemblies: processor, memorizer, power circuit, multimedia groupware, audio-frequency assembly, the interface of input/output (I/O), sensing
Device assembly, and communications component, described power circuit, power for each circuit or the device for described terminal unit；Described
Memorizer is used for storing executable program code；Described processor is by reading the executable program generation of storage in described memorizer
Code runs the program corresponding with described executable program code, also includes the pcb board provided such as first aspect present invention, institute
State pcb board to be placed in the interior volume that described housing surrounds, described processor and described memorizer and be arranged on described pcb board.
Use the terminal unit of embodiment of the present invention, the beneficial effect of the pcb board of embodiment of the present invention can be realized.
The additional aspect of the present invention and advantage will part be given in the following description, and part will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Accompanying drawing explanation
The present invention above-mentioned and/or that add aspect and advantage will become from the following description of the accompanying drawings of embodiments
Substantially with easy to understand, wherein:
Fig. 1 is the structural representation of the pcb board of an embodiment of the application；
Fig. 2 is the structural representation of the pcb board of another embodiment of the application；
Fig. 3 is the structural representation of the terminal unit of the embodiment of the present application.
Detailed description of the invention
Embodiments herein is described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, it is intended to be used for explaining the application, and it is not intended that restriction to the application.
Below with reference to the accompanying drawings pcb board and the terminal unit of the embodiment of the present application are described.
Embodiment one
Fig. 1 is the structural representation of the pcb board of an embodiment of the application.
Refer to shown in accompanying drawing 1, this pcb board includes: the conductive layer (111,112,113,114,115,116) of arranged stacked
With insulating barrier (211,212,213,214,215)；Insulating barrier is arranged between the conductive layer that each two is adjacent.
At least one conductive layer is the high speed signal layer being provided with HW High Way, and at least one conductive layer is ground plane, at least
One conductive layer is the interference signals layer being provided with power signal line and/or clock interference signal line.
The adjacent at least one of which conductive layer of high speed signal layer is ground plane, between high speed signal layer and adjacent ground plane
The thickness of insulating barrier be the first preset thickness, the adjacent at least one of which conductive layer of interference signals layer is ground plane, and interference
The gross thickness of the insulating barrier between signals layer and high speed signal layer is more than or equal to the second preset thickness, and wherein, second presets thickness
Degree is the twice of the first preset thickness.
Concrete, as in Fig. 1, conductive layer includes: first conductive layer the 111, second conductive layer 112, the 3rd conductive layer 113, the
Four conductive layer the 114, the 5th conductive layer the 115, the 6th conductive layers 116.Set between the first conductive layer 111 and the second conductive layer 112
Be equipped with between insulating barrier the 211, second conductive layer 112 and the 3rd conductive layer 113 be provided with insulating barrier the 212, the 3rd conductive layer 113 with
It is provided with between 4th conductive layer 114 between insulating barrier the 213, the 4th conductive layer 114 and the 5th conductive layer 115 and is provided with insulating barrier
214, it is provided with insulating barrier 215 between the 5th conductive layer 115 and the 6th conductive layer 116.
Continue referring to Fig. 1, such as, when the 3rd conductive layer 113 is high speed signal layer, then, the second conductive layer 112 and the 4th
Conductive layer 114 therein at least one be ground plane, if the only second conductive layer 112 is as ground plane, then as high speed signal layer
The 3rd conductive layer 113 and be first to preset thickness as the thickness of the insulating barrier 212 between the second conductive layer 112 of ground plane
Degree, the first preset thickness can determine, the in the present embodiment according to the thickness of whole pcb board and required loop distance
One preset thickness can be 0.95mm-1.05mm, and this insulating barrier 212 can be 1080PP sheet (No. 1080 prepreg), thus,
Enable to high speed signal layer (the 3rd conductive layer 113) and ground plane (the second conductive layer 112) as close possible to, between the two
The thickness of insulating barrier 212 is less, and the loop of radiofrequency signal is apart from short, and signal is through insulating barrier 212 and ground plane (the second conductive layer
112) resistance run into is little, and impedance loop is little, reduces the reflection of radiofrequency signal, improves the integrity of signal.
Certainly, two adjacent conductive layers of high speed signal layer (the 3rd conductive layer 113) can also be ground plane, i.e.
Second conductive layer 112 and the 4th conductive layer 114 can be ground plane.When two adjacent conductive layers of high speed signal layer are
During ground plane, the interference signal impact on high speed signal can be reduced further, improve high speed signaling quality further.
The 5th conductive layer 115 in the present embodiment can be interference signals layer, high speed signal layer (the 3rd conductive layer 113) and
Interference signals layer (the 5th conductive layer 115) has ground plane adjacent, so respectively, it is possible to ensure its impedance and signal matter
Amount.And according to the requirement of whole pcb board thickness, the insulating barrier 215 between interference signals layer 115 and adjacent ground plane 114
Thickness can be equal to the second preset thickness.
It addition, the gross thickness of the insulating barrier between interference signals layer 115 and high speed signal layer 113 can be more than or equal to the
Two preset thickness, and the second preset thickness is equal to the twice of the first preset thickness, in the present embodiment, disturbs signals layer 115 He
It is also provided with a ground plane (the 4th conductive layer 114) between high speed signal layer 113, and is arranged on interference signals layer 115
And the insulating barrier 213 between insulating barrier 214 and high speed signal layer 113 and ground plane 114 between ground plane 114, this two-layer
The gross thickness of insulating barrier is more than or equal to the second preset thickness.Thus, under the requirement meeting pcb board thickness, increase as far as possible
Distance between big interference signals layer 115 and high speed signal layer 113, reduces the interference signal interference to high speed signal, improves letter
Number quality, improves the performance of complete machine.
The pcb board that the embodiment of the present invention provides, owing to the adjacent at least one of which conductive layer of high speed signal layer is ground plane,
The adjacent at least one of which conductive layer of interference signals layer is also ground plane, reduces the return flow path of signal the most as much as possible,
Reduce impedance loop, and disturb the thickness high speed signal layer more than twice of the insulating barrier between signals layer and high speed signal layer
And the thickness of the insulating barrier between adjacent ground plane, thus, decreases the interference signals layer signal disturbing to high speed signal layer,
Improve signal quality.
Concrete, enumerate the concrete overlapped way of a kind of pcb board below, in the present embodiment, pcb board can include six layers
Conductive layer and five layer insulatings, six layers of conductive layer are followed successively by bottom from the top of pcb board: substrate layer 111, ground plane 112, height
Speed signals layer 113, ground plane 114, interference signals layer 115 and substrate layer 116.It should be noted that substrate layer 111 and substrate layer
116 is the copper sheet layer not arranging any cabling, owing to, under current layout, having been able to ensure preferable signal quality, therefore,
For ensureing the requirement of strength of whole pcb board, substrate layer can be set, but the most do not arrange that any cabling is to save into
This.
In the present embodiment, further, between the ground plane (112,114) that high speed signal layer 113 is adjacent with two
The thickness of two insulating barriers (212,213) can be the first preset thickness, and at the substrate layer 111 of top layer of pcb board with adjacent
Ground plane 112 between the thickness of insulating barrier 211 can be the second preset thickness.Thus so that high speed signal layer 113
And between adjacent ground plane (112,114) close to, reduce signal return flow path, and, owing to pcb board is arranged on
Need on terminal unit to ensure certain structural strength, prevent from damaging, therefore, on the backflow road being not necessary to guaranty that between conductive layer
The thickness of the corresponding insulating barrier of the position in footpath increases as far as possible, through test checking, and can be by the substrate of the top layer of pcb board
The thickness of the insulating barrier 211 between layer 111 and adjacent ground plane 112 is designed as the second preset thickness, is the first of twice
Preset thickness, thickness reasonable in design, it is ensured that on the basis of the structural strength of pcb board, also manufacturing cost is controlled simultaneously
In the range of reasonably.
Embodiment two
Fig. 2 is the structural representation of the pcb board of another embodiment of the application；The present embodiment is similar with embodiment one,
Refer to shown in accompanying drawing 2, conductive layer includes: first conductive layer the 121, second conductive layer the 122, the 3rd conductive layer the 123, the 4th conduction
Layer the 124, the 5th conductive layer the 125, the 6th conductive layer 126.And also it is respectively provided with insulating barrier, its cloth between the most adjacent conductive layer
Mode of putting is identical with embodiment one, does not repeats them here.
The present embodiment is unlike embodiment one, and only one adjacent conductive layer of high speed signal layer is ground plane,
And the adjacent conductive layer of the another one of high speed signal layer is interference signals layer, high speed signal layer and adjacent interference signals layer it
Between the thickness of insulating barrier equal to described second preset thickness.In the present embodiment, such as, the 4th conductive layer 124 is to believe at a high speed
Number floor, then the 3rd conductive layer 123 can be ground plane, corresponding, the 5th conductive layer 125 can be to disturb signals layer, same,
As the 4th conductive layer 124 of high speed signal layer and as the insulating barrier 224 between the 5th conductive layer 125 of interference signals layer
Thickness can be the second preset thickness.
Further, top layer and the bottom of pcb board can be ground plane.
Enumerating the concrete overlapped way of another kind of pcb board below, similar with embodiment one, pcb board can include that six layers are led
Electric layer and five layer insulatings, and unlike embodiment one, six layers of conductive layer are followed successively by bottom from the top of pcb board: connect
Stratum 121, interference signals layer 122, ground plane 123, high speed signal layer 124, interference signals layer 125 and ground plane 126.This kind
The arranged stacked mode of pcb board, it is possible to ensureing that the loop distance of high speed signal is less, impedance loop is less, being subject to of high speed signal
The interference of interference signal is less, and signal quality is preferable.
It should be noted that two adjacent conductive layers of interference signals layer 122 are ground plane (ground plane 121 and connecing
Stratum 123), thus interference signal effectively can be shielded, further reduce interference signal to high speed signal layer 124
Impact.
Embodiment three
Fig. 3 is the structural representation of the terminal unit of the embodiment of the present application.As it is shown on figure 3, the present embodiment provides a kind of whole
End equipment, this terminal unit 1000 includes housing 1001, and following one or more assembly: processor 1002, memorizer
1003, power circuit 1004, multimedia groupware 1005, audio-frequency assembly 1006, the interface 1007 of input/output (I/O), sensor
Assembly 1008, and communications component 1009, power circuit 1004 is powered for each circuit or the device for terminal unit 1000；
Memorizer 1003 is used for storing executable program code；Processor 1002 is by reading the performed journey of storage in memorizer 1003
Sequence code runs the program corresponding with executable program code, also includes the pcb board provided such as above-mentioned any embodiment
1100, pcb board 1100 is placed in the interior volume that housing 1001 surrounds, processor 1002 and memorizer 1003 and is arranged on pcb board
On 1100.
Terminal unit in the present embodiment can be computer or mobile phone.
The structure of the pcb board of terminal unit in the present embodiment and embodiment one, embodiment two are identical, the most superfluous at this
State.
The embodiment of the present invention provide terminal unit, owing to including the pcb board of above-described embodiment, and this pcb board due to
The adjacent at least one of which conductive layer of its high speed signal layer is set to ground plane, and the adjacent at least one of which of interference signals layer is led
Electric layer is also configured as ground plane, thus can reduce the return flow path of signal as much as possible, reduce impedance loop, and disturb
The thickness of the insulating barrier between signals layer with high speed signal layer is more than between high speed signal layer and the adjacent ground plane of twice
The thickness of insulating barrier, thus, decreases the interference signals layer signal disturbing to high speed signal layer, improves signal quality, and then
Improve the communication performance of terminal unit.
In describing the invention, it is to be understood that term " " center ", " longitudinally ", " laterally ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward ", " up time
Pin ", " counterclockwise ", " axially ", " radially ", the orientation of the instruction such as " circumferential " or position relationship be based on orientation shown in the drawings or
Position relationship, is for only for ease of the description present invention and simplifies description rather than instruction or imply that the device of indication or element must
Must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In describing the invention, " multiple " are meant that two or more,
Unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；It can be direct phase
Even, it is also possible to be indirectly connected to by intermediary, can be connecting or the interaction pass of two elements of two element internals
System.For the ordinary skill in the art, above-mentioned term in the present invention concrete can be understood as the case may be
Implication.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score permissible
It is that the first and second features directly contact, or the first and second features are by intermediary mediate contact.
In describing the invention, reference term " embodiment ", " some embodiments ", " example ", " concrete example ",
Or specific features, structure, material or the feature bag that the description of " some examples " etc. means to combine this embodiment or example describes
It is contained at least one embodiment or the example of the application.In this manual, to the schematic representation of above-mentioned term necessarily
It is directed to identical embodiment or example.And, the specific features of description, structure, material or feature can be at any one
Or multiple embodiment or example combine in an appropriate manner.Additionally, in the case of the most conflicting, those skilled in the art
Member the feature of the different embodiments described in this specification or example and different embodiment or example can be combined and
Combination.
Last it is noted that various embodiments above is only in order to illustrate technical scheme, it is not intended to limit；To the greatest extent
The present invention has been described in detail by pipe with reference to foregoing embodiments, it will be understood by those within the art that: it depends on
So the technical scheme described in foregoing embodiments can be modified, or the most some or all of technical characteristic is entered
Row equivalent；And these amendments or replacement, do not make the essence of appropriate technical solution depart from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a pcb board, it is characterised in that including: the conductive layer of arranged stacked and insulating barrier；Insulating barrier is arranged at each two phase
Between adjacent conductive layer；
At least one conductive layer is the high speed signal layer being provided with HW High Way, and at least one conductive layer is ground plane, and at least one leads
Electric layer is to be provided with the interference signals layer of power signal line and/or clock interference signal line；
The adjacent at least one of which conductive layer of described high speed signal layer is ground plane, and described high speed signal layer connects described in adjacent
The thickness of the insulating barrier between stratum is the first preset thickness, and the adjacent at least one of which conductive layer of described interference signals layer is for connecing
The gross thickness of the insulating barrier between stratum, and described interference signals layer and described high speed signal layer presets thickness more than or equal to second
Degree, wherein, described second preset thickness is the twice of described first preset thickness.
Pcb board the most according to claim 1, it is characterised in that described first preset thickness is 0.95mm-1.05mm.
Pcb board the most according to claim 1 and 2, it is characterised in that two adjacent conductive layers of described high speed signal layer are equal
For ground plane.
Pcb board the most according to claim 3, it is characterised in that between described interference signals layer and adjacent ground plane
The thickness of insulating barrier is equal to described second preset thickness.
Pcb board the most according to claim 4, it is characterised in that described pcb board includes six layers of conductive layer and five layers of insulation
Layer, six layers of conductive layer are followed successively by bottom from the top of described pcb board: substrate layer, ground plane, high speed signal layer, ground plane, dry
Disturb signals layer and substrate layer.
Pcb board the most according to claim 5, it is characterised in that described high speed signal layer and two adjacent ground planes it
Between the thickness of two insulating barriers be described first preset thickness, and in the substrate layer of top layer of described pcb board and adjacent connecing
The thickness of the insulating barrier between stratum is described second preset thickness.
Pcb board the most according to claim 1 and 2, it is characterised in that one of them adjacent leading of described high speed signal layer
Electric layer is ground plane, and the conductive layer that the another one of described high speed signal layer is adjacent is interference signals layer, described high speed signal layer
And the thickness of the insulating barrier between adjacent described interference signals layer is equal to described second preset thickness.
Pcb board the most according to claim 7, it is characterised in that top layer and the bottom of described pcb board are ground plane.
Pcb board the most according to claim 8, it is characterised in that described pcb board includes six layers of conductive layer and five layers of insulation
Layer, six layers of conductive layer are followed successively by bottom from the top of described pcb board: ground plane, interference signals layer, ground plane, high speed signal
Layer, interference signals layer and ground plane.
10. a terminal unit, including housing, and following one or more assembly: processor, memorizer, power circuit is many
Media component, audio-frequency assembly, the interface of input/output (I/O), sensor cluster, and communications component, described power circuit,
For powering for each circuit of described terminal unit or device；Described memorizer is used for storing executable program code；Described
Processor runs corresponding with described executable program code by reading the executable program code of storage in described memorizer
Program, it is characterised in that also include that the pcb board as described in any one of claim 1-9, described pcb board are placed in described shell
The interior volume that body surrounds, described processor and described memorizer are arranged on described pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610890536.4A CN106304620B (en) | 2016-10-12 | 2016-10-12 | Pcb board and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610890536.4A CN106304620B (en) | 2016-10-12 | 2016-10-12 | Pcb board and terminal device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106304620A true CN106304620A (en) | 2017-01-04 |
| CN106304620B CN106304620B (en) | 2019-03-29 |
Family
ID=57717184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610890536.4A Expired - Fee Related CN106304620B (en) | 2016-10-12 | 2016-10-12 | Pcb board and terminal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304620B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212522A (en) * | 2019-12-31 | 2020-05-29 | 惠州Tcl移动通信有限公司 | Circuit board and terminal equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1344132A (en) * | 2000-09-18 | 2002-04-10 | 神达电脑股份有限公司 | Technology for laminating 6-layer circuit board suitable for high-speed signals and its product |
| JP2002151854A (en) * | 2000-11-15 | 2002-05-24 | Genesis Technology Kk | Multilayer printed wiring board and manufacturing method therefor |
| CN201207714Y (en) * | 2008-05-15 | 2009-03-11 | 青岛海信移动通信技术股份有限公司 | Slave module for CDMA mobile terminal |
| CN202262021U (en) * | 2011-09-01 | 2012-05-30 | 青岛海信电器股份有限公司 | Six-layer circuit board and electronic terminal |
-
2016
- 2016-10-12 CN CN201610890536.4A patent/CN106304620B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1344132A (en) * | 2000-09-18 | 2002-04-10 | 神达电脑股份有限公司 | Technology for laminating 6-layer circuit board suitable for high-speed signals and its product |
| JP2002151854A (en) * | 2000-11-15 | 2002-05-24 | Genesis Technology Kk | Multilayer printed wiring board and manufacturing method therefor |
| CN201207714Y (en) * | 2008-05-15 | 2009-03-11 | 青岛海信移动通信技术股份有限公司 | Slave module for CDMA mobile terminal |
| CN202262021U (en) * | 2011-09-01 | 2012-05-30 | 青岛海信电器股份有限公司 | Six-layer circuit board and electronic terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212522A (en) * | 2019-12-31 | 2020-05-29 | 惠州Tcl移动通信有限公司 | Circuit board and terminal equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106304620B (en) | 2019-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203521683U (en) | Power supply connector assembly | |
| US8559189B2 (en) | Riser card for power supply | |
| CN102843898B (en) | Connecting structure and method of attachment | |
| US9485880B2 (en) | Electric device for electric vehicle | |
| KR102229847B1 (en) | Receptacle Connentor | |
| JP2013058178A (en) | Usb application device and method for assembling usb application device | |
| CN105071821A (en) | Mobile terminal | |
| CN205141320U (en) | Electron card tray and electron card connecting device | |
| CN106304620A (en) | Pcb board and terminal unit | |
| CN106254583A (en) | Mobile terminal | |
| US7883373B2 (en) | Plug component for an electrical control unit | |
| CN206341470U (en) | Circuit board assemblies and electronic equipment | |
| CN204349060U (en) | Connector with a locking member | |
| CN203554855U (en) | Support, housing, support assembly and sensor | |
| KR101348141B1 (en) | Multi type receptacle connector and Plug connector applied for it | |
| US20070196715A1 (en) | Fuel cell device adapted to slim-type CD-ROM drive | |
| KR101321656B1 (en) | Connector for a high speed memory card adaptor and a socket | |
| CN202958076U (en) | Board-level interconnection structure and electrical equipment | |
| CN103474837B (en) | Electric connector | |
| CN201248193Y (en) | Printed circuit board and electronic equipment | |
| CN205621898U (en) | Universal serial bus connector and electronic equipment | |
| CN201498812U (en) | electrical connector | |
| CN216391532U (en) | Multilayer concatenation type PCB board | |
| CN205820585U (en) | A kind of flexible circuit board | |
| CN106711643B (en) | Electronic card connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190329 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |