CN111212522A

CN111212522A - Circuit board and terminal equipment

Info

Publication number: CN111212522A
Application number: CN201911408523.9A
Authority: CN
Inventors: 黄晓天
Original assignee: Huizhou TCL Mobile Communication Co Ltd
Current assignee: Huizhou TCL Mobile Communication Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-05-29
Also published as: WO2021134869A1

Abstract

The invention discloses a circuit board and a terminal device, wherein the circuit board comprises: a first device layer; the second device layer is arranged opposite to the first device layer; the camera module area is arranged in the middle of the first device layer and the second device layer; the first device layer is provided with an area, a processing chip and a storage chip are arranged in the area, and an included angle between the orthographic projection of the processing chip and the storage chip on the first device layer and the transverse axis direction of the first device layer is a preset angle. The processing chip and the storage chip in the L-shaped area are obliquely arranged, so that the layout of the whole circuit board is facilitated, the processing chip is convenient to spread lines outwards, the distance between the processing chip and the charging chip is increased, and the heat dissipation of the processing chip is facilitated. In addition, in the area corresponding to the area where the second device layer and the processing chip are located, enough space is provided for arranging a simulation device area, and the circuit board can be ensured to smoothly pass through the power distribution network for simulation.

Description

Circuit board and terminal equipment

Technical Field

The invention relates to the technical field of electronics, in particular to a circuit board and terminal equipment.

Background

Circuit boards have been developed from single-layer boards to double-sided boards, multi-layer boards, and flexible boards, and have been continuously developed toward high precision, high density, and high reliability. Through continuously reducing the volume, reducing the cost and improving the performance, the circuit board still keeps powerful vitality in the development process of future electronic products.

The development trend of the circuit board production and manufacturing technology in the future is to develop the circuit board production and manufacturing technology in the directions of high density, high precision, fine aperture, fine lead, small space, high reliability, multilayering, light weight and thin type.

In view of this, how to reasonably utilize the space of the circuit board and improve the working efficiency and performance of the circuit board becomes a primary research topic, so as to achieve the purpose of having more practical value.

Disclosure of Invention

The embodiment of the invention provides a circuit board and terminal equipment, which can effectively solve the problem that the layout of a processing chip and a storage chip in the existing circuit board is unreasonable.

According to an aspect of the present application, an embodiment of the present invention provides a circuit board, including: a first device layer; the second device layer is arranged opposite to the first device layer; the camera module area is arranged in the middle of the first device layer and the second device layer; the first device layer is provided with an area, a processing chip and a storage chip are arranged in the area, and an included angle formed by the orthographic projection of the processing chip and the storage chip on the first device layer and the transverse axis direction of the first device layer is a preset angle.

Further, the circuit board further includes: the third device layer is arranged between the first device layer and the second device layer and used for wiring.

Further, the preset angle is 40 degrees to 50 degrees, and preferably, the preset angle is 45 degrees.

Further, the circuit board further includes: and the charging chip is arranged at the right lower part of the first device layer.

Further, the area is substantially L-shaped, the area comprises a horizontal part and a vertical part, and the width of the horizontal part is 15.0 mm.

Further, the size of the processing chip is 12.1mm × 12.1mm, and the size of the memory chip is 13.1mm × 11.6 mm.

Further, the circuit board further includes: and the simulation device area is positioned on the second device layer and corresponds to the area of the processing chip of the first device layer.

Further, the circuit board further includes: and the radio frequency power supply management chip is positioned on the first device layer and is arranged below the camera module area.

Further, the circuit board further includes: and the fingerprint connector is positioned on the second device layer and is positioned below the camera module area.

According to another aspect of the present application, an embodiment of the present invention provides a terminal device, including the above-mentioned circuit board.

The invention has the advantages that the processing chip and the storage chip in the L-shaped area are obliquely arranged, so that the layout of the whole circuit board is facilitated, the processing chip is convenient to be scattered outwards, the distance between the processing chip and the charging chip is increased, and the heat dissipation of the processing chip is facilitated. In addition, in the area corresponding to the area where the second device layer and the processing chip are located, enough space is provided for arranging a simulation device area, and the circuit board can be ensured to smoothly pass through the power distribution network for simulation.

Drawings

The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.

Fig. 1 is a schematic top view of a first device layer structure of a circuit board according to an embodiment of the present invention.

Fig. 2 is a schematic bottom view of a second device layer structure of the circuit board according to the embodiment of the present invention.

Fig. 3 is a schematic diagram of a positional relationship among a first device layer, a second device layer, and a third device layer of a circuit board according to an embodiment of the present invention.

Fig. 4 is a schematic diagram illustrating an included angle between a processing chip and a horizontal axis according to an embodiment of the invention.

Fig. 5 is a schematic structural diagram of a terminal device according to an embodiment of the present invention.

Fig. 6 is another schematic structural diagram of a terminal device according to an embodiment of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. In this embodiment, the analog display screen touch module is connected to the head tracking module, and is configured to obtain a moving path of a sensing cursor in the display device.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

As shown in fig. 1 and 2, the wiring board includes: a first device layer 10, a second device layer 20 and an image module region 1.

The circuit board further includes: a charging chip 5 is disposed at the lower right of the first device layer 10.

In the embodiment of the present invention, the first device layer 10 is provided with a region 2, a processing chip 3 and a memory chip 4 are disposed in the region 2, and an included angle between an orthogonal projection of the processing chip 3 and the memory chip 4 on the first device layer 10 and a transverse axis direction (i.e., 11 marks in fig. 1) of the first device layer 10 is a preset angle θ (refer to fig. 4, and fig. 4 is a schematic diagram illustrating an included angle between the processing chip 3 and the transverse axis 11). The preset angle theta is 40 degrees to 50 degrees. Due to the limitation of a manufacturing tool of the circuit board, the outgoing line angle of the manufacturing tool of the circuit board is generally 0 degree, 45 degrees or 90 degrees, other angles belong to wiring at any angle, wiring at any angle increases the wiring difficulty, and therefore the preferred preset angle is 45 degrees. The aim at that so sets up puts through the processing chip 3 with the 4 slopes of storage chip with in the L type region 2, is favorable to the overall arrangement of whole circuit board, conveniently handles chip 3 toward the line that looses outward, has increased the distance of processing chip 3 with chip 5 that charges, is favorable to handling chip 3's heat dissipation.

See also figure 3.

The circuit board further includes: at least one third device layer is disposed between the first device layer 10 and the second device layer 20, and the third device layer is used for routing. In the present embodiment, the third device layer is two layers (e.g. 30 and 40 in fig. 3), but is not limited thereto. In other embodiments, the third device layer may be disposed according to actual needs.

In the present embodiment, the region 2 is substantially L-shaped (i.e. the position indicated by reference numeral 2 in fig. 1), and the region 2 comprises a horizontal part and a vertical part, and the width of the horizontal part is 15.0mm (i.e. the dashed line indicated by reference numeral 7 in fig. 1).

In this embodiment, the processing chip 3 is SDM636, the size of the processing chip 3 is 12.1mm × 12.1mm, and the size of the memory chip 4 is 13.1mm × 11.6 mm. From this, it can be seen that if the process chip 3 having a width of 12.1mm is placed in the horizontal portion of the region 2, the process chip 3 can be just accommodated. However, there is no extra space, which is not good for processing the routing of the chip 3.

In this embodiment, the processing chip 3 and the memory chip 4 are disposed obliquely, so that the processing chip 3 and the memory chip 4 can be disposed in a favorable manner and spaced from the boundary of the L-shaped region by a certain distance. Because processing chip 3 and memory chip 4 slope are placed, will originally handle that chip 3 and memory chip 4 level are placed shared region and release, be favorable to handling chip 3's the line of walking, so set up the direction of placing of handling chip 3 and memory chip 4 moreover, can increase with the distance of charging chip 5 of first device layer 10 right below is favorable to handling chip 3's heat dissipation.

The circuit board further includes: a radio frequency power management chip 6 and a fingerprint connector 8.

The radio frequency power management chip 6 is located on the first device layer 10, and the radio frequency power management chip 6 is disposed below the camera module area 1. The fingerprint connector 8 is located on the second device layer 20, and the fingerprint connector 8 is located below the camera module area 1.

In this embodiment, there is enough space for the simulation device region 9 in the region of the second device layer 20 corresponding to the region where the processing chip 3 is located, so as to ensure that the circuit board can smoothly pass through the power distribution network for simulation. A plurality of capacitors are arranged in the simulation device region 9.

The invention has the advantages that the processing chip and the storage chip in the L-shaped area are obliquely arranged, so that the layout of the whole circuit board is facilitated, the processing chip is convenient to be scattered outwards, the distance between the processing chip and the charging chip is increased, and the heat dissipation of the processing chip is facilitated. And in the area corresponding to the area of the second device layer and the processing chip, enough space is provided for arranging a simulation device area, so that the circuit board can be ensured to smoothly pass through the power distribution network for simulation.

As shown in fig. 5, a terminal device is further provided for the embodiment of the present invention, where the terminal device adopts the circuit board according to the embodiment, and the terminal device may be a smart phone, a tablet computer, or other devices. Specifically, as shown in fig. 5, the terminal device 200 includes a processor 201 and a memory 202. The processor 201 is electrically connected to the memory 202.

The processor 201 is a control center of the terminal device 200, connects various parts of the entire terminal device by using various interfaces and lines, and performs various functions of the terminal device and processes data by running or loading an application program stored in the memory 202 and calling data stored in the memory 202, thereby performing overall monitoring of the terminal device.

Fig. 6 shows a specific structural block diagram of a terminal device according to an embodiment of the present invention. The terminal device 300 may be a smart phone or a tablet computer.

The terminal device may further include the following components. The RF circuit 310 is used for receiving and transmitting electromagnetic waves, and performing interconversion between the electromagnetic waves and electrical signals, thereby communicating with a communication network or other devices. RF circuitry 310 may include various existing circuit elements for performing these functions, such as an antenna, a radio frequency transceiver, a digital signal processor, an encryption/decryption chip, a Subscriber Identity Module (SIM) card, memory, and so forth. RF circuit 310 may communicate with various networks such as the internet, an intranet, a wireless network, or with other devices over a wireless network. The wireless network may comprise a cellular telephone network, a wireless local area network, or a metropolitan area network. The Wireless network may use various Communication standards, protocols and technologies, including but not limited to Global System for Mobile Communication (GSM), Enhanced Data GSM Environment (EDGE), Wideband Code Division Multiple Access (WCDMA), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Wireless Fidelity (Wi-Fi) (e.g., IEEE802.11 a, IEEE802.11b, IEEE802.11g and/or IEEE802.11 n), Voice over Internet Protocol (VoIP), world wide Internet Protocol (Microwave Access for micro), and other short message protocols for instant messaging, as well as any other suitable communication protocols, and may even include those that have not yet been developed.

The memory 320 may be used to store software programs and modules, and the processor 380 executes various functional applications and data processing by operating the software programs and modules stored in the memory 320. The memory 320 may include high speed random access memory and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, memory 320 may further include memory located remotely from processor 380, which may be connected to terminal device 300 via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.

The input unit 330 may be used to receive input numeric or character information and generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function control. In particular, the input unit 330 may include a touch-sensitive surface 331 as well as other input devices 332. The touch-sensitive surface 331, also referred to as a touch screen or touch pad, may collect touch operations by a user on or near the touch-sensitive surface 331 (e.g., operations by a user on or near the touch-sensitive surface 331 using a finger, a stylus, or any other suitable object or attachment), and drive the corresponding connection device according to a predetermined program. Alternatively, the touch sensitive surface 331 may comprise two parts, a touch detection means and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 380, and can receive and execute commands sent by the processor 380. In addition, the touch-sensitive surface 331 may be implemented using various types of resistive, capacitive, infrared, and surface acoustic waves. The input unit 330 may comprise other input devices 332 in addition to the touch sensitive surface 331. In particular, other input devices 332 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like.

The display unit 340 may be used to display information input by or provided to the user and various graphic user interfaces of the terminal apparatus 300, which may be configured by graphics, text, icons, video, and any combination thereof. The Display unit 340 may include a Display panel 341, and optionally, the Display panel 341 may be configured in the form of an LCD (Liquid Crystal Display), an OLED (Organic Light-Emitting Diode), or the like. Further, touch-sensitive surface 331 may overlay display panel 341, and when touch-sensitive surface 331 detects a touch operation thereon or thereabout, communicate to processor 380 to determine the type of touch event, and processor 380 then provides a corresponding visual output on display panel 341 in accordance with the type of touch event. Although in FIG. 6, touch-sensitive surface 331 and display panel 341 are implemented as two separate components for input and output functions, in some embodiments, touch-sensitive surface 331 and display panel 341 may be integrated for input and output functions.

The terminal device 300 may also include at least one sensor 350, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor that may adjust the brightness of the display panel 341 according to the brightness of ambient light, and a proximity sensor that may turn off the display panel 341 and/or the backlight when the terminal device 300 is moved to the ear. As one of the motion sensors, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally, three axes), can detect the magnitude and direction of gravity when the mobile phone is stationary, and can be used for applications of recognizing the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like; as for other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which can be configured in the terminal device 300, detailed descriptions thereof are omitted.

Audio circuitry 360, speaker 361, microphone 362 may provide an audio interface between a user and terminal device 300. The audio circuit 360 may transmit the electrical signal converted from the received audio data to the speaker 361, and the audio signal is converted by the speaker 361 and output; on the other hand, the microphone 362 converts the collected sound signal into an electrical signal, which is received by the audio circuit 360 and converted into audio data, which is then processed by the audio data output processor 380 and then transmitted to, for example, another terminal via the RF circuit 310, or the audio data is output to the memory 320 for further processing. The audio circuit 360 may also include an earbud jack to provide communication of peripheral headphones with the terminal device 300.

The terminal device 300 may assist the user in e-mail, web browsing, streaming media access, etc. through the transmission module 370 (e.g., a Wi-Fi module), which provides the user with wireless broadband internet access. Although fig. 6 shows the transmission module 370, it is understood that it does not belong to the essential constitution of the terminal device 300, and may be omitted entirely as needed within the scope not changing the essence of the invention.

The processor 380 is a control center of the terminal device 300, connects various parts of the entire mobile phone using various interfaces and lines, and performs various functions of the terminal device 300 and processes data by running or executing software programs and/or modules stored in the memory 320 and calling data stored in the memory 320, thereby performing overall monitoring of the mobile phone. Optionally, processor 380 may include one or more processing cores; in some embodiments, processor 380 may integrate an application processor, which primarily handles operating systems, user interfaces, applications, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into processor 380.

Terminal device 300 also includes a power supply 390 (e.g., a battery) for powering the various components, which may be logically coupled to processor 380 via a power management system in some embodiments to manage charging, discharging, and power consumption management functions via the power management system. The power supply 390 may also include any component including one or more of a dc or ac power source, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, and the like.

Although not shown, the terminal device 300 may further include a camera (e.g., a front camera, a rear camera), a bluetooth module, and the like, which are not described in detail herein.

In specific implementation, the above modules may be implemented as independent entities, or may be combined arbitrarily to be implemented as the same or several entities, and specific implementation of the above modules may refer to the foregoing method embodiments, which are not described herein again.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The principle and the implementation of the present invention are explained in the present text by applying specific examples, and the above description of the examples is only used to help understanding the technical solution and the core idea of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A circuit board, comprising:

a first device layer;

the second device layer is arranged opposite to the first device layer; and

the camera module area is arranged in the middle of the first device layer and the second device layer;

the first device layer is provided with an area, a processing chip and a storage chip are arranged in the area, and an included angle formed by the orthographic projection of the processing chip and the storage chip on the first device layer and the transverse axis direction of the first device layer is a preset angle.

2. The wiring board of claim 1, further comprising: the third device layer is arranged between the first device layer and the second device layer and used for wiring.

3. The wiring board of claim 1, wherein the predetermined angle is 40 to 50 degrees, preferably 45 degrees.

4. The wiring board of claim 1, further comprising: and the charging chip is arranged at the right lower part of the first device layer.

5. The circuit board of claim 1, wherein the region is substantially L-shaped, the region comprising a horizontal portion and a vertical portion, the horizontal portion having a width of 15.0 mm.

6. The wiring board of claim 5, wherein the processing chip has a size of 12.1mm by 12.1mm, and the memory chip has a size of 13.1mm by 11.6 mm.

7. The wiring board of claim 1, further comprising: and the simulation device area is positioned on the second device layer and corresponds to the area of the processing chip of the first device layer.

8. The wiring board of claim 1, further comprising: and the radio frequency power supply management chip is positioned on the first device layer and is arranged below the camera module area.

9. The wiring board of claim 1, further comprising: and the fingerprint connector is positioned on the second device layer and is positioned below the camera module area.

10. A terminal device, characterized by comprising a wiring board according to any one of claims 1 to 9.