CN106245079A - 印刷层的电镀方法 - Google Patents
印刷层的电镀方法 Download PDFInfo
- Publication number
- CN106245079A CN106245079A CN201610308032.7A CN201610308032A CN106245079A CN 106245079 A CN106245079 A CN 106245079A CN 201610308032 A CN201610308032 A CN 201610308032A CN 106245079 A CN106245079 A CN 106245079A
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- Prior art keywords
- electro
- layer
- plated
- conductive
- conductive materials
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- 238000009713 electroplating Methods 0.000 title claims abstract description 54
- 238000007639 printing Methods 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000002923 metal particle Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 55
- 239000004020 conductor Substances 0.000 claims description 45
- 239000003973 paint Substances 0.000 claims description 39
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 238000005253 cladding Methods 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052755 nonmetal Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 239000008187 granular material Substances 0.000 claims description 4
- 238000005034 decoration Methods 0.000 abstract description 3
- 238000003854 Surface Print Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract 8
- 239000000126 substance Substances 0.000 abstract 3
- 229910003460 diamond Inorganic materials 0.000 abstract 1
- 239000010432 diamond Substances 0.000 abstract 1
- 239000003595 mist Substances 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 241001074085 Scophthalmus aquosus Species 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0027—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or layers by lamination or by fusion of the coatings or layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/28—Printing on other surfaces than ordinary paper on metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/22—Luminous paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
一种印刷层的电镀方法，包含在一被电镀物的文字或图案设定区域以导电物质或导电物质混合金属颗粒印刷出文字或图案印刷层，或可选择进一步在印刷层浸附置换层；在以导电物质印刷出的文字或图案印刷层及被电镀物表层进行电镀以形成电镀层；由于可在被电镀物直接以导电物质印刷文字或图案印刷层后进行电镀，整个印刷电镀加工流程将更为快速便捷，同时可在文字或图案印刷层的电镀表面形成特殊防剥落的立体雾状印刷、立体钻饰表面印刷文字或图案，本发明可在文字或图案印刷层形成如碎钻的类装饰表面且可有效防止该印刷层剥落或脱离。
Description
技术领域
本案主张104年06月03日提出申请第104117885号「印刷层的电镀方法」及104年07月28日提出申请第104124314号「印刷层的电镀方法」申请案的申请日为国内优先权日，本发明有关一种印刷层的电镀方法，特别是指一种在被电镀物表面直接以导电物质印刷出所须的文字或图案印刷层，并加以电镀以形成特殊凸出的电镀层文字或图案。同时，并可在文字或图案印刷层形成如碎钻之类装饰表面且可有效防止该印刷层剥落或脱离。
背景技术
在金属物品上进行电镀加工来美化产品表面，是一种常用的工业技术手段。由于电镀后，表面仅为单一金属色，无法满足部分产品的表面加工需求。为了增加美感或形成所要的广告效果，在产品电镀层上印刷如文字或图案，在厂内制造作业中，产品电镀层表面进行后续的印刷制程相当常见。
传统的印刷电镀方法，是在金属素材表面先电镀后再进行油墨印刷，所形成的印刷层会以浮凸于电镀层表面的型式呈现，但是此种传统的印刷电镀方法，由于用以形成文字或图案的印刷层是浮起凸出于产品表面，此类印刷层只要稍有异物或硬物磨擦，就很容易使印刷层脱落或受损，严重影响原先所预期的产品表面印刷效果。
如果先在金属素材上以油墨印刷然后再电镀的方法施工，由于金属素材表面必需先清洗，如再印刷的期间，金属素材就已开始氧化，而一般制造程序中的操作人员肉眼是无法清楚判别，经电镀后，会使产品不良率相对提高。即使经过防锈或抗氧化剂处理，电镀过程中，也会造成印刷油墨掉落或有电镀产品不良等问题产生。
另外，除了使用如上述传统的印刷电镀方法或其他的改良印刷电镀制程，会有印刷层易于受损脱落、制程繁复及不良品高的缺点之外，其所呈现的文字或图案亦较为单调。
发明内容
本发明目的在于提供一种印刷层的电镀方法，可在保有文字或图案印刷层防止脱落的防护作用下，使印刷电镀制造程序更为快速便捷。
本发明另一目的在提供一种印刷层的电镀方法，可于电镀完成后，在文字或图案印刷层形成迥异于现有印刷电镀的凸出立体效果。
本发明另一目的在提供一种印刷层的电镀方法，可在文字或图案印刷层形成如碎钻装饰面的防剥落印刷层。
为达到以上目的，本发明公开了一种印刷层的电镀方法，其特征在于包含以下步骤：
提供一被电镀物，所述被电镀物为金属或非金属素材；
于所述被电镀物表层设定区域以导电物质在该设定区域印刷出所需的导电物质文字或图案印刷层；
在所述以导电物质印刷出的文字或图案印刷层及被电镀物表层进行电镀以形成电镀层。
其中，所述导电物质为导电漆。
其中，所述导电物质为萤光漆。
其中，所述导电漆为银导电漆。
其中，所述导电漆为铜导电漆。
其中，所述导电漆为镍导电漆。
其中，所述被电镀物表层进一步预先设有一金属镀层作为电镀保护层。
其中，所述电镀保护层为半光镍金属镀层。
还公开了一种印刷层的电镀方法，其特征在于包含以下步骤：
提供一被电镀物；
于所述被电镀物表层设定区域以导电物质混合金属颗粒在该设定区域印刷出所需的文字或图案印刷层；
在所述以导电物质混合金属颗粒印刷出所需的文字或图案印刷层的表面及被电镀物表层进行电镀以形成电镀层。
其中，所述导电物质为导电漆。
其中，所述导电物质混合金属颗粒印刷出所需的文字或图案印刷层进一步预先浸附一置换层。
其中，所述被电镀物表层进一步预先设有一金属镀层作为电镀保护层。
其中，所述电镀保护层为半光镍金属镀层。
其中，所述导电漆为导电碳。
还公开了一种印刷层的电镀方法，其特征在于包含以下步骤：
提供一被电镀物；
于所述被电镀物表层设定区域以导电物质混合导电颗粒在该设定区域印刷出所需的文字或图案印刷层；
在所述以导电物质混合导电颗粒印刷出所需的文字或图案印刷层的表面及被电镀物表层进行电镀以形成电镀层。
其中，所述导电物质为导电漆。
其中，所述导电漆为导电碳。
其中，所述被电镀物表层进一步预先设有一金属镀层作为电镀保护层。
其中，所述电镀保护层为半光镍金属镀层。
通过上述内容，本发明实现了如下技术效果：
1.直接以导电物质进行文字图案印刷，含有印刷层的电镀产品的整个制造程序更为快速便捷。
2.文字或图案印刷层在表面含有防护电镀层，能更确定文字或图案印刷层不致于因为异物或硬物磨擦而脱落变形，更为经久耐用。
3.文字或图案印刷层成品在外观上，可形成一种完全不同的特殊立体雾状凸起效果。
4.能形成更为强固防剥落的钻饰效果文字或图案印刷层。
附图说明
图1：显示本发明制造流程图。
图2：显示如图1的实品制造流程示意图。
图3：显示图1印刷导电物质流程的立体示意图。
图4：显示为接续图3的电镀流程立体示意图。
图5：显示本发明的成品示意图。
图6：显示图5的局部放大图。
图7：显示本发明另一可行实施例制造流程图。
图8：显示如图7的实品制造流程示意图。
图9：显示图7的成品示意图。
图10：显示图9A部分的放大立体图。
图11：显示本发明又一可行实施例制造流程图。
图12：显示如图11的实品制造流程示意图。
图13：显示本发明又一可行实施例制造流程图。
具体实施方式
本发明新颖性及其他特点，将于配合以下附图实施例的详细说明而趋于明了。
如图1及图2所示，本发明制造流程包含以下步骤：
步骤S1：提供一被电镀物10，所述被电镀物10可为金属或非金属素材；
步骤S2：于所述被电镀物10表层设定区域以导电物质在该设定区域印刷出所需的导电物质文字或图案印刷层20；
步骤S3：在所述以导电物质印刷出所需的文字或图案印刷层20及被电镀物10表层进行电镀以形成电镀层30。
所述导电物质可为导电漆之类导电材料或萤光漆，以导电漆为例，可为含有银颗粒粉末的导电漆(银导电漆)、含有铜颗粒粉末的导电漆(铜导电漆)、含有镍颗粒粉末的导电漆(镍导电漆)或以导电碳作为导电材料。其中，铜导电漆较银导电漆在成本上较为经济，镍导电漆则具有较优良的导电性质。所选用的导电物质可视所需制作文字或图案的不同加以选择。
如图3及图4所示，本发明可直接在被电镀物10的表层设定区域直接以导电物质进行印刷成所须的文字或图案印刷层20，然后在该文字或图案印刷层20及被电镀物10表层进行电镀以形成电镀层30，使所述电镀层30除了对被电镀物10的表层进行电镀之外，同时可在被电镀物10的表层形成防护电镀层30。
现请同时参考图5及图6，由于使用如上述银导电漆、铜导电漆或镍导电漆之类含有金属颗粒粉末的导电物质作为文字或图案印刷层20，经直接在该文字或图案印刷层20表面进行电镀后，该文字或图案印刷层20区域的电镀面表层31会呈现出立体雾状的微浮起文字图案表面，迥异于现有的电镀印刷效果。同时，所述实施例于所述被电镀物10表层可进一步可如图13所示预先设有一金属镀层作为电镀保护层101。该电镀保护层101最好为使用半光镍金属镀层，使被电镀物10表面更为稳定平整。
如图7及图8所示，于另一可行实施例中，本发明制造流程包含以下步骤：
步骤S10：提供一被电镀物100，所述被电镀物100可为金属或非金属素材；
步骤S20：于所述被电镀物100表层设定区域以导电物质201混合金属颗粒202或粘上金属颗粒或其他导电颗粒在该设定区域印刷出所需的文字或图案印刷层200；
步骤S30：在所述以导电物质201混合金属颗粒202印刷出所需的文字或图案印刷层200的表面及被电镀物100表层进行电镀以形成电镀层300。
如图9及图10所示，此一实施例中，由于以导电物质201混合金属颗粒202印刷出所需的文字或图案印刷层200，成品的电镀面表层310将呈现出如含有碎钻的装饰效果。同样的，此一实施例于所述被电镀物100表层亦可进一步预先设有一金属镀层作为电镀保护层。该电镀保护层最好同样为半光镍金属镀层，使被电镀物100表面更为稳定平整。
于图11及图12所示的本发明又一可行实施例中，其包含以下步骤：
步骤S10：提供一被电镀物100，所述被电镀物100可为金属或非金属素材；
步骤S20：于所述被电镀物100表层设定区域以导电物质201混合金属颗粒202在该设定区域印刷出所需的文字或图案印刷层200；
步骤S25：预先浸附一置换层90；
步骤S30：在所述以导电物质201混合金属颗粒202印刷出所需的文字或图案印刷层200的表面及被电镀物100表层进行电镀以形成电镀层300。
在本实施例中，可选择将导电物质201混合金属颗粒202印刷出所需的文字或图案印刷层200预先浸附一置换层90，使电镀程序的固定附着能力更为提高，而更能有效防止剥落或脱离现象发生。
如图13所示，于另一可行实施例中，本发明制造流程包含以下步骤：
步骤S100：提供一被电镀物100，所述被电镀物100可为金属或非金属素材；
步骤S101：预先设有一金属镀层作为电镀保护层101；
步骤S102：于所述被电镀物100表层设定区域以导电物质201混合金属颗粒202在该设定区域印刷出所需的文字或图案印刷层200；
步骤S103：在所述以导电物质201混合金属颗粒202印刷出所需的文字或图案印刷层200的表面及被电镀物100表层进行电镀以形成电镀层300。
本发明依以上制程，至少具有以下优点：
1.直接以导电物质进行文字图案印刷，含有印刷层的电镀产品的整个制造程序更为快速便捷。
2.文字或图案印刷层20在表面含有防护电镀层30，能更确定文字或图案印刷层20不致于因为异物或硬物磨擦而脱落变形，更为经久耐用。
3.文字或图案印刷层20成品在外观上，可形成一种完全不同的特殊立体雾状凸起效果。
4.能形成更为强固防剥落的钻饰效果文字或图案印刷层。
以上实施例仅用为方便举例说明本发明，并非加以限制，对于熟习此一技艺人士依该实施例所可作的各种简易变形与修饰，均仍应含括于以下申请专利范围中。
Claims (19)
1.一种印刷层的电镀方法，其特征在于包含以下步骤：
提供一被电镀物，所述被电镀物为金属或非金属素材；
于所述被电镀物表层设定区域以导电物质在该设定区域印刷出所需的导电物质文字或图案印刷层；
在所述以导电物质印刷出的文字或图案印刷层及被电镀物表层进行电镀以形成电镀层。
2.如权利要求1所述印刷层的电镀方法，其特征在于，所述导电物质为导电漆。
3.如权利要求1所述印刷层的电镀方法，其特征在于，所述导电物质为萤光漆。
4.如权利要求2所述印刷层的电镀方法，其特征在于，所述导电漆为银导电漆。
5.如权利要求2所述印刷层的电镀方法，其特征在于，所述导电漆为铜导电漆。
6.如权利要求2所述印刷层的电镀方法，其特征在于，所述导电漆为镍导电漆。
7.如权利要求1所述印刷层的电镀方法，其特征在于，所述被电镀物表层进一步预先设有一金属镀层作为电镀保护层。
8.如权利要求7所述印刷层的电镀方法，其特征在于，所述电镀保护层为半光镍金属镀层。
9.一种印刷层的电镀方法，其特征在于包含以下步骤：
提供一被电镀物；
于所述被电镀物表层设定区域以导电物质混合金属颗粒在该设定区域印刷出所需的文字或图案印刷层；
在所述以导电物质混合金属颗粒印刷出所需的文字或图案印刷层的表面及被电镀物表层进行电镀以形成电镀层。
10.如权利要求9所述印刷层的电镀方法，其特征在于，所述导电物质为导电漆。
11.如权利要求9所述印刷层的电镀方法，其特征在于，所述导电物质混合金属颗粒印刷出所需的文字或图案印刷层进一步预先浸附一置换层。
12.如权利要求9所述印刷层的电镀方法，其特征在于，所述被电镀物表层进一步预先设有一金属镀层作为电镀保护层。
13.如权利要求12所述印刷层的电镀方法，其特征在于，所述电镀保护层为半光镍金属镀层。
14.如权利要求10所述印刷层的电镀方法，其特征在于，所述导电漆为导电碳。
15.一种印刷层的电镀方法，其特征在于包含以下步骤：
提供一被电镀物；
于所述被电镀物表层设定区域以导电物质混合导电颗粒在该设定区域印刷出所需的文字或图案印刷层；
在所述以导电物质混合导电颗粒印刷出所需的文字或图案印刷层的表面及被电镀物表层进行电镀以形成电镀层。
16.如权利要求15所述印刷层的电镀方法，其特征在于，所述导电物质为导电漆。
17.如权利要求16所述印刷层的电镀方法，其特征在于，所述导电漆为导电碳。
18.如权利要求15所述印刷层的电镀方法，其特征在于，所述被电镀物表层进一步预先设有一金属镀层作为电镀保护层。
19.如权利要求18所述印刷层的电镀方法，其特征在于，所述电镀保护层为半光镍金属镀层。
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| Application Number | Priority Date | Filing Date | Title |
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| TW104117885 | 2015-06-03 | ||
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| TW104124314 | 2015-07-28 | ||
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- 2016-05-06 US US15/148,191 patent/US9951424B2/en active Active
- 2016-05-10 DE DE102016108596.0A patent/DE102016108596A1/de not_active Withdrawn
- 2016-05-11 CN CN201610308032.7A patent/CN106245079A/zh active Pending
- 2016-05-16 KR KR1020160059609A patent/KR20160142764A/ko unknown
- 2016-05-20 JP JP2016101290A patent/JP2016223010A/ja active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| US20160355929A1 (en) | 2016-12-08 |
| JP2016223010A (ja) | 2016-12-28 |
| US9951424B2 (en) | 2018-04-24 |
| DE102016108596A1 (de) | 2016-12-08 |
| KR20160142764A (ko) | 2016-12-13 |
| TW201643277A (zh) | 2016-12-16 |
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