CN106211619A - A kind of chip mounter - Google Patents
A kind of chip mounter Download PDFInfo
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- CN106211619A CN106211619A CN201510217582.3A CN201510217582A CN106211619A CN 106211619 A CN106211619 A CN 106211619A CN 201510217582 A CN201510217582 A CN 201510217582A CN 106211619 A CN106211619 A CN 106211619A
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- chip mounter
- electronic devices
- components
- mounting seat
- assembly
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Abstract
The present invention provides a kind of chip mounter, including frame, transporter, drawing-in device, polaroid attaching head device, feeding mounting seat and control device；Polaroid attaching head device draws the multiple electronic devices and components according to regular array for simultaneously, and it is mounted on pcb board simultaneously；Polaroid attaching head device includes trachea, mobile parts, runner assembly and placement head assembly；Mobile parts are fixed together with runner assembly；Placement head assembly includes nozzle base, gas seat board and multiple suction nozzle；Wherein, multiple suction nozzles are arranged on nozzle base according to regular array；The one side of gas seat board is tightly connected with nozzle base, and another side is detachably connected with the base of runner assembly；A centrally disposed passage of gas seat board, has the first space between gas seat board and nozzle base, trachea is connected with vent seal, draws simultaneously and mounts multiple electronic devices and components controlling multiple suction nozzle；Drawing-in device is removably mounted in frame by feeding mounting seat.
Description
Technical field
The present invention relates to Full Vision technical field, particularly relate to a kind of on pcb board, mount multiple electronic devices and components simultaneously
Chip mounter.
Background technology
Chip mounter is the visual plant in SMT (Surface Mount Technology, surface mounting technology) assembly line,
Also it is a equipment that in SMT production line, cost is the highest with requirement.Along with the development of electron trade, to PCB in SMT technique
The attachment of (Printed Circuit Board, printed circuit board) requires more and more higher, and the requirement to chip mounter is more and more higher, no
Only want at a high speed, efficiently；But also require there is the highest placement accuracy.The efficiency of chip mounter decides the work effect of whole production line
Rate.
Existing chip mounter substantially can be divided three classes from structure: arched type, rotary type tower, composite structure.Different types of
Chip mounter is respectively arranged with quality, generally depends on the coupling applied between the requirement to system and speed and precision.Although chip mounter kind
Various, integrate can be briefly summarized as following four parts composition: mounting system, feeding system, substrate transport system and
Management control system.Wherein mounting system is the core component of chip mounter, completes the pickup of electronic devices and components, correction, correctly pastes
The overall process of dress, determines structure and the main performance of chip mounter.
Chip mounter on the market, basic employing is all single absorption mount formats, that is the most single suction nozzle carries out suction
And attachment.The placement head using single suction mouth greatly limit the attachment efficiency of chip mounter.Further, in order to complete electronic devices and components
Biased error be corrected, be typically chosen on Z axis employing synchronous pulley, Timing Belt, line slideway and servomotor or step
Entering motor, be in line motion by the convert rotational motion of motor.Typically, single suction nozzle is designed to a module, bears including one
Blame the motor that the angle to electronic devices and components is controlled；The servomotor of one responsible Z axis up and down motion or motor.
Using such scheme, whole chip mounter has certain accuracy and speed to the attachment of electronic devices and components, and can be according to need
Seek combination suction nozzle quantity.But using such kind of drive, the volume of single module is big, quality weight, after being combined into many suction nozzles,
Increase the rotary inertia of placement head, simultaneously because the distance between suction nozzle is very big, suction nozzle quantity has been limited, has also increased whole
The volume of equipment and cost.And the one of the arrangement of the multiple electronic devices and components on pcb board big feature is exactly compact, volume is bigger
The module of multiple single suction mouths be cannot to carry out drawing, transport and pasting according to the compact arrangement of electronic devices and components multiple on pcb board
Dress.
Summary of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of chip mounter, is used for solving prior art
In, the problem that the placement head of the chip mounter that can simultaneously carry out multiple electronic devices and components attachment of regular array cannot be dismantled.
For achieving the above object and other relevant purposes, the present invention provides a kind of chip mounter, including frame, transporter, feeding
Device, polaroid attaching head device and control device；Described transporter is for transmitting pcb board along the X direction；Described control device is used
In controlling described polaroid attaching head device, described transporter and the operation of described drawing-in device；Described polaroid attaching head device is for inhaling simultaneously
Take the multiple described electronic devices and components according to regular array, and the multiple described electronic devices and components drawn are mounted on described simultaneously
On pcb board；Described polaroid attaching head device includes trachea, mobile parts, runner assembly and placement head assembly；Described mobile parts are used
In driving described runner assembly and described placement head assembly to move up and down along Z-direction, it is fixedly connected on described runner assembly
Together, and described mobile parts are movably mounted in described frame along Y direction；Described runner assembly is used for driving described
Placement head assembly carries out fine rotational, including main shaft and base；Described main shaft is hollow, and described trachea is positioned at described main shaft；
Described base is fixing with described main shaft to be connected, and for being removably connected with described placement head assembly, and is provided with on described base
Through hole, described trachea is tightly connected with described placement head assembly by described through hole；Described placement head assembly include nozzle base,
Gas seat board and multiple suction nozzle；Wherein, multiple described suction nozzles are arranged on described nozzle base, and present and described regular array
The layout matched；The one side of described gas seat board is tightly connected with described nozzle base, and another side is described with described runner assembly
Base is detachably connected；A centrally disposed passage of described gas seat board, has between described gas seat board and described nozzle base
The first space, described trachea is had to be connected with described vent seal, to control the absorption of multiple described suction nozzle and to mount multiple institute simultaneously
State electronic devices and components；Described chip mounter also includes feeding mounting seat；Described drawing-in device is for carrying for described placement head assembly simultaneously
For multiple electronic devices and components, it is removably mounted in described frame by described feeding mounting seat.
Alternatively, described frame includes that platform and crossbeam, described crossbeam are arranged on above described platform along Y direction；And institute
Stating and be provided with guide rail on crossbeam, described polaroid attaching head device slides on described crossbeam along described guide rail.
Alternatively, described chip mounter includes two described drawing-in devices, two described feeding mounting seats and two polaroid attaching head devices；
Described drawing-in device is separately mounted to the two ends of described platform by described feeding mounting seat, and described transporter is arranged on described flat
The centre position of platform, and it is perpendicular to described crossbeam；Described polaroid attaching head device is separately mounted to the both sides of described crossbeam.
Alternatively, described nozzle base is also equipped with two calibration suction nozzles, and described calibration suction nozzle is positioned at the edge of described nozzle base,
And the line between two described calibration suction nozzles is parallel or perpendicular to Y-axis.
Alternatively, multiple described suction nozzles are fixedly mounted on described nozzle base by described regular array.
Alternatively, multiple described suction nozzles are rotatably mounted on described nozzle base according to described regular array.
Alternatively, described placement head also includes driver part, multiple tooth bar and multiple gear；Described gear is fixedly mounted on described
On suction nozzle, described tooth bar matches with described gear, and described driver part controls described regular array by multiple described tooth bars
Rotate while described gear on suction nozzle described in multiple row, and drive suction nozzle described in the multiple row of described regular array to rotate simultaneously.
Alternatively, described drawing-in device includes for flitch, feeding material component, wound membrane assembly and charging tray frame；Described feeding material component, institute
State wound membrane assembly and described charging tray frame is fixedly mounted on described on flitch；The described surface for flitch has and described regular array
The identical penetration type groove of columns quantity；The width of described groove and the carrier band preserving multiple described electronic devices and components match,
Each described groove is a described carrier band offer Transfer pipe, and with regard to the multiple described electronic devices and components in described carrier band simultaneously
It is supplied to described placement head so that unification is drawn；Described feeding material component is identical with the columns quantity of described regular array for driving
Carrier band is along described groove transmission；The overlay film that described wound membrane assembly tears off from multiple described carrier bands for retracting；Described charging tray frame
For putting the carrier band of multiple described electronic devices and components, and described charging tray frame is fixed on described confession flitch away from described polaroid attaching head device
One end.
Alternatively, described drawing-in device includes that multiple described charging tray frame, multiple described charging tray framves are arranged on described confession flitch alternately
On.
Alternatively, described feeding mounting seat includes mounting seat, pressing plate and guiding adjustable plate；Described mounting seat and described frame
Fixing connection；Described pressing plate and described guiding adjustable plate are removably mounted on described in described mounting seat for flitch；Described
Regulation screw it is provided with, for finely tuning the described position for flitch in mounting seat.
As it has been described above, the chip mounter of the present invention, design the patch of correspondence according to multiple electronic devices and components of regular array on pcb board
Sheet head unit and drawing-in device, drawing-in device provides multiple electronic devices and components of regular array simultaneously, and multiple suction nozzles of placement head are pressed
Draw and transport multiple electronic devices and components, and correcting electronic components and parts simultaneously, finally attachment rule on pcb board according to regular array
Multiple electronic devices and components of arrangement；And the placement head assembly of drawing-in device and polaroid attaching head device is all detachably accepted to chip mounter
Frame on, this is it is to say, the placement head assembly of the present invention and drawing-in device are all removable, therefore, according to different
Pcb board, uses corresponding placement head assembly and drawing-in device can complete the attachment of multiple electronic devices and components.The paster of the present invention
The machine scope of application is more extensive, and more adapts to the production in enormous quantities of pcb board, and, the chip mounter production cost of the present invention is relatively
Low, compact conformation, placement speed is fast, and placement accuracy is high.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of a kind of chip mounter disclosed in the embodiment of the present invention.
Fig. 2 is shown as the structural representation of the drawing-in device of a kind of chip mounter disclosed in the embodiment of the present invention.
Fig. 3 is shown as the decomposing schematic representation of the feeding mounting seat of a kind of chip mounter disclosed in the embodiment of the present invention.
Fig. 4 is shown as drawing-in device and the structural representation of feeding mounting seat of a kind of chip mounter disclosed in the embodiment of the present invention.
Fig. 5, Fig. 6 and Fig. 7 are shown as the structural representation of the polaroid attaching head device of a kind of chip mounter disclosed in the embodiment of the present invention.
Fig. 8 is shown as the structural representation of the placement head assembly of a kind of chip mounter disclosed in the embodiment of the present invention.
Fig. 9 is shown as the structural representation of the placement head assembly of the rotatable suction nozzle of a kind of chip mounter disclosed in the embodiment of the present invention.
Figure 10 is shown as the structural representation of a kind of chip mounter disclosed in another embodiment of the present invention.
Element numbers explanation
100 frames
110 platforms
120 crossbeams
200 transporters
300 drawing-in devices
310 for flitch
320 feeding material components
330 wound membrane assemblies
331 drive gear
332 wound membrane dishes
340 charging tray framves
341 charging tray supports
342 through holes
343 regulation through holes
400 feeding mounting seats
410 mounting seat
411 regulation screws
420 pressing plates
430 guide adjustable plate
500 polaroid attaching head devices
510 tracheas
520 move parts
530 runner assemblies
531 main shafts
532 bases
533 guide pillar holes
540 placement head assemblies
541 nozzle base
542 gas seat boards
543 suction nozzles
544 gears
545 tooth bars
546 guide pillars
600 pcb boards
Detailed description of the invention
By particular specific embodiment, embodiments of the present invention being described below, those skilled in the art can be taken off by this specification
The content of dew understands other advantages and effect of the present invention easily.
It should be clear that structure depicted in this specification institute accompanying drawings, ratio, size etc., the most only in order to coordinate disclosed in description
Content, understands for those skilled in the art and reads, being not limited to the enforceable qualifications of the present invention, therefore do not have
Technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size, do not affecting institute of the present invention energy
Under the effect produced and the purpose that can reach, all should still fall in the range of disclosed technology contents can be contained.
Meanwhile, in this specification cited as " on ", D score, "left", "right", the use of " middle " and " one " etc.
Language, is merely convenient to understanding of narration, and is not used to limit the enforceable scope of the present invention, being altered or modified of its relativeness,
Changing under technology contents without essence, when being also considered as the enforceable category of the present invention.
Multiple electronic devices and components are mounted on pcb board 600 by chip mounter disclosed by the invention, and multiple electronic devices and components are at PCB
According to regular array on plate 600, and, the multiple electronic devices and components in regular array can be all of electricity on pcb board 600
Sub-components and parts, it is also possible to the simply electronic devices and components of the part on pcb board 600.Wherein, regular array is multiple electronics unit
Device is arranged on pcb board 600 according to one or more columns per page, and in every string, multiple electronic devices and components of arrangement are identical, often
The quantity of multiple electronic devices and components of string arrangement both can be identical, it is also possible to is different；The electronics of different row arrangements
Components and parts can be identical, it is also possible to is different.
Embodiment 1
Embodiment discloses a kind of chip mounter, concrete as it is shown in figure 1, include frame 100, transporter 200, drawing-in device
300, feeding mounting seat 400, polaroid attaching head device 500 and control device.Control device in the accompanying drawings and to be not drawn into.
Frame 100 is used for fixedly mounting transporter 200, drawing-in device 300, polaroid attaching head device 500 and feeding mounting seat 400.
Further, in the present embodiment, frame 100 includes platform 110 and crossbeam 120；And crossbeam 120 is arranged on along Y direction
Above platform 110.Wherein, X-direction, Y direction and Z-direction are concrete as shown in Figure 1.
Wherein, transporter 200 and feeding mounting seat 400 are fixedly mounted on platform 110；And transporter 200 is along X
Direction of principal axis is arranged on the middle part of platform 110；Feeding mounting seat 400 is fixedly mounted on the side of platform 110 along X-direction.
Polaroid attaching head device 500 is removably mounted on crossbeam 120.Further, owing to the weight of polaroid attaching head device 500 is relatively big,
In order to ensure polaroid attaching head device 500 can smooth movement on crossbeam 120, one can be respectively provided with on the two sides of crossbeam 120
Guide rail, polaroid attaching head device 500 is along slide.
Transporter 200 is for being docked with platform along X-direction from connection platform (not marking in the accompanying drawings) by pcb board 600
The center of 110.Transporter generally uses and transmits the transmission having brought pcb board 600.In the present embodiment, by PCB
Plate 600 is placed on conveyer belt, and step motor control conveyer belt moves along X-direction with drive pcb board.
Drawing-in device 300 is for providing multiple electronic devices and components for polaroid attaching head device 400 simultaneously.Drawing-in device 300 is removably
It is arranged in feeding mounting seat 400.The preserving type of the most relatively common electronic devices and components preserves for carrier band.The tape base of carrier band
On preserve electronic devices and components at regular intervals in receiving in space, and space sealing will be received with overlay film.Drawing-in device 300 is wanted
The overlay film of multiple carrier bands is separated and furls, and the receiving space that will expose electronic devices and components after separating overlay film presents to paste
Sheet head unit 500, in order to polaroid attaching head device 500 draws electronic devices and components simultaneously.As in figure 2 it is shown, drawing-in device 300 wraps
Include for flitch 310, feeding material component 320, wound membrane assembly 330 and charging tray frame 340.
Wherein, for being provided with the groove of one or more penetration type on flitch 310, the quantity of groove and the rule on pcb board 600
The columns of the multiple electronic devices and components then arranged is identical, and groove is based on carrier band and designs.The most any electronics unit
The carrier band of device, the width of its tape base is certain, so, being dimensioned to and tape base phase for the groove on flitch 310
Join.Further, the quantity of groove and the arrangement of multiple groove with the electronic devices and components of regular array on pcb board 600 to corresponding:
Multiple electronic devices and components of the regular array on pcb board 600 are multiple row, then groove is also multiple and adjacent groove
The spacing that spacing is arranged with the adjacent column of regular array is consistent；Or between the adjacent column arrangement of the spacing of adjacent grooves and regular array
Away from inconsistent, and it be based on the structure pitch of drawing-in device and arrange, and drive suction nozzle change in location with right on polaroid attaching head device
Answer the position of electronic devices and components on pcb board.The groove of penetration type is for transmitting carrier band, and by the electronic devices and components in carrier band
It is simultaneously supplied to polaroid attaching head device 500.For on flitch 310, carrying incoming one end is feeding end, and one end that carrier band is sent is
Discharge end.
Feeding material component 320 is fixedly mounted on the discharge end for flitch 310, and it includes multiple transmission gear.Transmission gear and feed
Groove on plate 310 is corresponding: a transmission gear drives a carrier band recessed along supply flitch 310 one from charging tray frame 340
Groove transmits.
Further, supplying to reach the automatization of electronic devices and components, wound membrane assembly 330 is arranged on for flitch 310 near sending
The side of material end, the overlay film torn off from multiple carrier bands for retracting.It includes multiple driving gear 331 and multiple wound membrane dish 332,
Gear 331 and wound membrane dish 332 is driven to support the use, and corresponding with for the groove on flitch 310, and one drives gear 331
Drive a wound membrane dish 332 to rotate, thus the overlay film that a carrier band is separated before entering the groove for flitch 310 is carried out certainly
Dynamic retracting.
Charging tray frame 340 is positioned at the outside for flitch 310, and it is fixed on the feeding end for flitch 310, is used for fixing multiple load
Band, carrier band is rotatably mounted on charging tray frame 340 by spool.Further, in the present embodiment, charging tray frame 340 also includes
Charging tray support 341, charging tray support 341 is fixedly mounted on the feeding end for flitch 310；Charging tray frame 340 and charging tray support 341
Connect.Further, arranging one group of through hole 342 on charging tray frame 340, many group regulations that charging tray support 341 be arranged in parallel are logical
Hole 343, by through hole 342 and a group in many group regulation through holes 343, charging tray support 341 and charging tray frame 340 utilize screw
It is fixed together.By selecting the regulation through hole 343 of diverse location, with the length of adjusting feedstuff pan frame 340.
As shown in Figure 3 and Figure 4, feeding mounting seat 400 includes mounting seat 410, pressing plate 420 and guides adjustable plate 430.
Wherein, mounting seat 410 is to be fixed on the side of platform 110 along X-direction, and drawing-in device 300 is removably to pacify
It is contained in mounting seat 410.
Pressing plate 420 and guiding adjustable plate 430 are for being accurately fixed on mounting seat 410 by the flitch 310 that supplies of drawing-in device 300
On.Pressing plate 420 and mounting seat 410 are fixing for flitch 310 in the Z-axis direction；Guide adjustable plate 430 in the Y-axis direction
Fixing for flitch 310.
For the attachment of electronic devices and components, the requirement of its precision is the highest.Owing to drawing-in device 300 is removably, and
And, flitch 310 is supplied for different, it is not duplicate yet.Therefore, in the present embodiment, in mounting seat 410
On be also provided with regulating screw 411, for being finely adjusted for the position of flitch 310.
Polaroid attaching head device 500 draws the multiple electronic devices and components according to regular array, and the multiple electronics unit that will draw for simultaneously
Device is mounted on pcb board simultaneously.As shown in Fig. 5, Fig. 6 and Fig. 7, polaroid attaching head device 500 includes trachea 510, moves
Parts 520, runner assembly 530 and placement head assembly 540.
Trachea 510, for for controlling device offer gas circuit, is controlled device and is drawn by this gas circuit control placement head assembly 540 simultaneously
With the multiple electronic devices and components of attachment.
Mobile parts 520 are movably connected together with crossbeam 120.By mobile parts 520, whole polaroid attaching head device 500
Move along Y-axis.Further, move parts 520 to be used for driving runner assembly 530 and placement head assembly 540 along Z-direction
Lower movement.
Being placed on transporter 200 or when being linked into transporter 200 from connection platform at pcb board 600, pcb board can be deposited
In small deflection.Therefore, runner assembly 530 is added in the present embodiment to solve this problem.Runner assembly 530 with
Mobile parts 520 are fixed together.Runner assembly 530 includes main shaft 531 and base 532.One end of main shaft 531 with
Mobile parts 520 are rotatably coupled, and the other end is fixing with base 532 to be connected.And main shaft 531 is quill shaft, trachea 510
It is placed in main shaft 531.Base 532 is removably joined together with placement head assembly 540, and, heart position wherein
Place is additionally provided with a through hole, and trachea 510 is tightly connected with placement head assembly 540 by through hole.Control device by main shaft 531
Rotate thus drive placement head assembly 540 to rotate.Further, base 532 arranges multiple guide pillar hole 533, is used for positioning patch
The installation site of head assembly 540.It is preferred that arrange 2 guide pillar holes 533 on base 532.
As shown in Figure 8, placement head assembly 540 includes nozzle base 541, gas seat board 542 and multiple suction nozzle 543.Multiple suction nozzles
543 are arranged on nozzle base 541, and the multiple suction nozzles 543 being arranged on nozzle base 541 present one and regular array
The layout matched.And the layout of multiple suction nozzle 543 can be along with the rule of the part or all of electronic devices and components on pcb board 600
Then arrange and change.
Multiple suction nozzles 543 can be fixedly mounted on nozzle base 541, i.e. suction nozzle 543 cannot rotate；Multiple suction nozzles
543 can also be rotatably mounted on nozzle base 541.Drawing-in device 300 provide electronic devices and components position with
The mounting position of the electronic devices and components on pcb board 600 does not has complete one_to_one corresponding, then can be by the rotation of suction nozzle 543 to electricity
The position of sub-components and parts is corrected.As it is shown in figure 9, in the present embodiment, multiple row suction nozzle 543 is by driving means, many
Individual gear 544 and multiple tooth bar 545 complete the Spin Control of the multiple suction nozzles 543 to regular array, in the accompanying drawings, drive
Dynamic device does not identify.Gear 544 is fixedly mounted on suction nozzle 543, i.e. the rotation of gear 544 can drive suction nozzle 543
Rotate, and multiple gear 544 is also according to regular array.Generally, milling is used between gear 544 and suction nozzle 543
The combination type of flat shape and key connects.Driving means controls the rotation of multiple gears 544 of every string simultaneously, so that it may complete suction
Control while the rotation of all suction nozzles 543 on gonys seat 541.In the present embodiment, driving means is by multiple tooth bars
Gear 544 on multiple suction nozzles 543 of 545 pairs of every string carries out rotating control.Rotation to multiple suction nozzles 543 is controlled
The method of system is completed by driving means and gear except what the present embodiment provided, and the most a lot of other methods, at this
Repeat the most one by one in bright.
The one side of gas seat board 542 is sealed connected together with nozzle base 541, and between gas seat board 542 and nozzle base 541
Having the first space, the one end open of multiple suction nozzles 543 is in this first space.The another side of gas seat board 642 and runner assembly
The base 532 of 530 is detachably connected, and at gas seat board 542 towards setting and the guide pillar hole 533 of the one side of runner assembly 530
Corresponding multiple guide pillars 546.By guide pillar 546 and guide pillar hole 533, the position of placement head assembly 540 can be precisely located.
The center of gas seat board 542 is additionally provided with a passage, and trachea 510 is connected with vent seal.By trachea 510
The gas circuit provided, controls device and utilizes electromagnetic valve to control gas circuit, controls multiple suction nozzle 543 and draws simultaneously and mount multiple electronics unit
Device.Further, the passage position on gas seat board 542 is corresponding with the lead to the hole site on the base 532 of runner assembly 530.
Additionally, due to the chip mounter of the present invention is the absorption carrying out multiple electronic devices and components simultaneously, and, drawing-in device 200 He
Placement head assembly 540 is all dismountable, and polaroid attaching head device 500 moves left and right only along crossbeam 120, and therefore, feeding fills
Put 300 and polaroid attaching head device 500 necessarily be in same level position.Therefore, at the nozzle base 541 of placement head assembly 540
On be additionally provided with laser calibration parts, these laser calibration parts launch laser along X-direction to drawing-in device 300, according to
The position of laser projections, the installation site of precise positioning drawing-in device 300.
Further, in addition to drawing-in device 200 and polaroid attaching head device 500 are accurately positioned, also need placement head assembly
540 are accurately positioned with pcb board 600, in order to complete accurate placement while the multiple electronic devices and components to pcb board.Cause
This, before carrying out electronic devices and components attachment, also can carry out examination attachment, in order to again carry out the calibration of mounting position.But,
It is exactly to mount multiple electronic devices and components that the chip mounter of the present invention once mounts simultaneously, and this will certainly cause waste.Ask to solve this
Topic, arranges two calibrations suction nozzle (not marking in the accompanying drawings), between two calibration suction nozzles in the edge of nozzle base 541
It is parallel or perpendicular to Y-axis continuously.When trying mount electronic components and parts, it is only that pcb board is mounted by calibration suction nozzle.So,
While preventing waste, also reach the calibration again to mounting position.
Chip mounter must also include that controls a device, installs for Collaborative Control transporter 200, drawing-in device 300, feeding
Seat 400 and polaroid attaching head device 500 carry out the attachment of pcb board 600, and (wherein, drawing-in device 300 and placement head assembly 540 are
Corresponding with pcb board 600):
First, control device control polaroid attaching head device 500 and draw multiple electronic devices and components that drawing-in device 300 provides: control patch
Sheet head unit 500 moves left and right on crossbeam 120 along Y direction, and moves polaroid attaching head device 500 as drawing-in device
300 corresponding positions, control the most again the mobile parts 520 of polaroid attaching head device 500 along the Z direction on crossbeam 120 to
Lower movement so that placement head assembly 540 is close to drawing-in device 300, to draw electronic devices and components；Further, at polaroid attaching head device
After 500 have drawn the electronic devices and components that drawing-in device 400 provides, control device drawing-in device to be controlled 300 feed again；
Secondly, after polaroid attaching head device 500 has drawn electronic devices and components, the mobile parts 520 of polaroid attaching head device 500 again along
Z-direction moves upward on crossbeam 120, moves left and right on crossbeam 120 further along Y direction, and is moved to pass
Send the position of device 200；
Then, transporter 200 transmits pcb board 600: pcb board 600 to be mounted is sent to and pastes by transporter 200
The position that sheet head unit 500 is corresponding；
Finally, pcb board 600 is mounted by polaroid attaching head device 500: polaroid attaching head device 500 is along the Z direction at crossbeam 120
On move down, pcb board 600 is mounted, after having mounted, again by placement head along the Z direction on crossbeam 120
Move up, homing.
As carried out the attachment of next pcb board 600 (arrangement of the electronic devices and components on pcb board 600 does not changes),
Only need to repeat aforesaid operations.
As carried out the attachment of another pcb board 600 (arrangement of the electronic devices and components on pcb board 600 there occurs change),
Then the drawing-in device 300 corresponding with pcb board 600 and placement head assembly 540 are changed to chip mounter, and to drawing-in device
300 and the position of placement head assembly 540 position, then repeat and carry out aforesaid operations.
Embodiment 2
The chip mounter structure of the present embodiment is identical with embodiment 1, also includes frame 100, transporter 200, drawing-in device
300, feeding mounting seat 400, polaroid attaching head device 500 and control device.But, as shown in Figure 10, the paster of the present embodiment
Machine includes 300, two feeding mounting seats 400 of two drawing-in devices and two polaroid attaching head devices 500.Two feeding mounting seats 400
The both sides of the platform 110 of mounting seat frame 100 symmetrically, drawing-in device 300 is removably mounted in feeding mounting seat 400；
Two polaroid attaching head devices 500 are arranged on the both sides of the crossbeam 120 of frame 100.By increasing drawing-in device 300, feeding is installed
Seat 400 and polaroid attaching head device 500, two polaroid attaching head devices 500 with blocked operation, can substantially increase the work effect of chip mounter
Rate.
Further, the chip mounter of the present invention can be for the patch of multiple electronic devices and components of the pcb board with Different Rule arrangement
Dress.When the columns of multiple electronic devices and components of regular array is too much, owing to the carrier band location comparison of electronic devices and components is little, so
Have no effect on the setting for flitch 310 upper groove, but correspondence, charging tray frame 340 fixes carrier band by spool.Volume
The size carrier band to be far longer than of axle, this is possible to the situation that a charging tray frame 340 is not enough occur.In the present embodiment,
Drawing-in device 300 can also include two or more charging tray frame 340.Charging tray frame 340 is fixedly mounted on by charging tray support 341
For on flitch 310.Further, by the setting angle of adjusting feedstuff pan support 341, and charging tray frame 340 and charging tray support are selected
The position of 341 through holes connected, interlock in the Z-axis direction laid out in parallel by two or more charging tray framves 340, concrete such as Figure 10
Shown in.
Additionally, for the innovative part highlighting the present invention, the technology proposed by the invention with solution is not asked by the present embodiment
The assembly introducing that topic relation is the closest, but this is not intended that in the present embodiment the assembly that there is not other.
It should be noted that the diagram provided in the present embodiment illustrates the basic conception of the present invention the most in a schematic way, the most graphic
In component count, shape and size time only display with relevant assembly in the present invention rather than is implemented according to reality draw, its reality
During enforcement, the kenel of each assembly, quantity and ratio can be a kind of random change, and its assembly layout kenel is likely to increasingly complex.
In sum, the chip mounter of the present invention, designs the patch of correspondence according to multiple electronic devices and components of regular array on pcb board
Sheet head unit and drawing-in device, drawing-in device provides multiple electronic devices and components of regular array simultaneously, and multiple suction nozzles of placement head are pressed
Draw and transport multiple electronic devices and components, and correcting electronic components and parts simultaneously, finally attachment rule on pcb board according to regular array
Multiple electronic devices and components of arrangement；And the placement head assembly of drawing-in device and polaroid attaching head device is all detachably accepted to chip mounter
Frame on, this is it is to say, the placement head assembly of the present invention and drawing-in device are all removable, therefore, according to different
Pcb board, uses corresponding placement head assembly and drawing-in device can complete the attachment of multiple electronic devices and components.The paster of the present invention
The machine scope of application is more extensive, and more adapts to the production in enormous quantities of pcb board, and, the chip mounter production cost of the present invention is relatively
Low, compact conformation, placement speed is fast, and placement accuracy is high.So, the present invention effectively overcomes various shortcoming of the prior art
And have high industrial utilization.
The principle of above-described embodiment only illustrative present invention and effect thereof, not for limiting the present invention.Any it is familiar with this skill
Above-described embodiment all can be modified under the spirit and the scope of the present invention or change by the personage of art.Therefore, such as
All that in art, tool usually intellectual is completed under without departing from disclosed spirit and technological thought etc.
Effect is modified or changes, and must be contained by the claim of the present invention.
Claims (10)
1. a chip mounter, including frame, transporter, drawing-in device, polaroid attaching head device and control device；Described transporter is used
In transmitting pcb board along the X direction；Described control device is used for controlling described polaroid attaching head device, described transporter and institute
State the operation of drawing-in device；It is characterized in that,
Described polaroid attaching head device draws the multiple described electronic devices and components according to regular array for simultaneously, and multiple by draw
Described electronic devices and components are mounted on described pcb board simultaneously；Described polaroid attaching head device includes trachea, mobile parts, rotating group
Part and placement head assembly；
Described mobile parts are used for driving described runner assembly and described placement head assembly to move up and down along Z-direction, its with
Described runner assembly is fixed together, and described mobile parts are movably mounted in described frame along Y direction；
Described runner assembly is used for driving described placement head assembly to carry out fine rotational, including main shaft and base；Described main shaft is
Hollow, described trachea is positioned at described main shaft；Described base is fixing with described main shaft to be connected, for removably with described
Placement head assembly connects, and is provided with through hole on described base, and described trachea is close with described placement head assembly by described through hole
Envelope connects；
Described placement head assembly includes nozzle base, gas seat board and multiple suction nozzle；Wherein, multiple described suction nozzles are arranged on described
On nozzle base, and present the layout matched with described regular array；The one side of described gas seat board and described nozzle base
Being tightly connected, another side is detachably connected with the described base of described runner assembly；Centrally disposed one of described gas seat board
Passage, has the first space between described gas seat board and described nozzle base, described trachea is connected with described vent seal,
Draw simultaneously and mount multiple described electronic devices and components with the multiple described suction nozzles of control；
Described chip mounter also includes feeding mounting seat；Described drawing-in device is for providing multiple electricity for described placement head assembly simultaneously
Sub-components and parts, it is removably mounted in described frame by described feeding mounting seat.
Chip mounter the most according to claim 1, it is characterised in that: described frame includes platform and crossbeam, and described crossbeam is along Y
Direction of principal axis is arranged on above described platform；And be provided with guide rail on described crossbeam, described polaroid attaching head device along described guide rail in institute
State and slide on crossbeam.
Chip mounter the most according to claim 2, it is characterised in that: described chip mounter includes two described drawing-in devices, two institutes
State feeding mounting seat and two polaroid attaching head devices；Described drawing-in device is separately mounted to described platform by described feeding mounting seat
Two ends, described transporter is arranged on the centre position of described platform, and is perpendicular to described crossbeam；Described polaroid attaching head device
It is separately mounted to the both sides of described crossbeam.
Chip mounter the most according to claim 1, it is characterised in that: described nozzle base is also equipped with two calibration suction nozzles, described
Calibration suction nozzle is positioned at the edge of described nozzle base, and the line between two described calibration suction nozzles is parallel or perpendicular to Y-axis.
Chip mounter the most according to claim 1, it is characterised in that: multiple described suction nozzles are fixedly mounted on institute by described regular array
State on nozzle base.
Chip mounter the most according to claim 1, it is characterised in that: multiple described suction nozzles are according to the rotatable peace of described regular array
It is contained on described nozzle base.
Chip mounter the most according to claim 6, it is characterised in that: described placement head also includes driver part, multiple tooth bar and many
Individual gear；
Described gear is fixedly mounted on described suction nozzle, and described tooth bar matches with described gear, and described driver part is by many
Rotate while described gear on suction nozzle described in the multiple row of the individual described tooth bar described regular array of control, and drive described rule
Suction nozzle described in the multiple row of arrangement rotates simultaneously.
Chip mounter the most according to claim 1, it is characterised in that: described drawing-in device includes for flitch, feeding material component, wound membrane
Assembly and charging tray frame；Described feeding material component, described wound membrane assembly and described charging tray frame are fixedly mounted on described on flitch；
The described surface for flitch has the penetration type groove identical with the columns quantity of described regular array；The width of described groove
The carrier band spent and preserve multiple described electronic devices and components matches, and each described groove provides for a described carrier band and transmits
Passage, and described placement head is simultaneously supplied to regard to the multiple described electronic devices and components in described carrier band so that unification is drawn；
Described feeding material component is for driving the carrier band identical with the columns quantity of described regular array along described groove transmission；
The overlay film that described wound membrane assembly tears off from multiple described carrier bands for retracting；
Described charging tray frame is for putting the carrier band of multiple described electronic devices and components, and described charging tray frame is fixed on described remote for flitch
One end from described polaroid attaching head device.
Chip mounter the most according to claim 8, it is characterised in that: described drawing-in device includes multiple described charging tray frame, Duo Gesuo
State charging tray frame and be arranged on described on flitch alternately.
Chip mounter the most according to claim 8, it is characterised in that: described feeding mounting seat includes mounting seat, pressing plate and leads
To adjustable plate；
Described mounting seat is fixing with described frame to be connected；Described pressing plate and described guiding adjustable plate are by described detachable for flitch
Be arranged in described mounting seat；
Regulation screw it is provided with, for finely tuning the described position for flitch in described mounting seat.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510217582.3A CN106211619B (en) | 2015-04-30 | 2015-04-30 | A kind of chip mounter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510217582.3A CN106211619B (en) | 2015-04-30 | 2015-04-30 | A kind of chip mounter |
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| CN106211619A true CN106211619A (en) | 2016-12-07 |
| CN106211619B CN106211619B (en) | 2019-01-01 |
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Cited By (6)
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| CN106604563A (en) * | 2017-01-24 | 2017-04-26 | 深圳市朤科自动化设备有限公司 | Mechanical correction device and method for chip mounter |
| CN110267463A (en) * | 2019-07-18 | 2019-09-20 | 安徽天通精电新科技有限公司 | A kind of electronic component attachment processing automatic placement machine and its operating method |
| CN112770621A (en) * | 2019-11-02 | 2021-05-07 | 陈斌 | Synchronous surface mounting table type chip mounter |
| CN112770530A (en) * | 2021-01-27 | 2021-05-07 | 朱锃琪 | Automatic chip mounter for electronic components |
| CN113573567A (en) * | 2021-09-26 | 2021-10-29 | 深圳市凯泰精密设备有限公司 | Mistake proofing feedway for SMT chip mounter |
| CN117641881A (en) * | 2024-01-25 | 2024-03-01 | 中山市晶威电子科技有限公司 | High-speed chip mounter and mounting method |
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| CN117641881A (en) * | 2024-01-25 | 2024-03-01 | 中山市晶威电子科技有限公司 | High-speed chip mounter and mounting method |
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| Publication number | Publication date |
|---|---|
| CN106211619B (en) | 2019-01-01 |
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