CN210432099U - Integrative paster aircraft nose of paster welding is glued to point - Google Patents
Integrative paster aircraft nose of paster welding is glued to point Download PDFInfo
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- CN210432099U CN210432099U CN201921244371.9U CN201921244371U CN210432099U CN 210432099 U CN210432099 U CN 210432099U CN 201921244371 U CN201921244371 U CN 201921244371U CN 210432099 U CN210432099 U CN 210432099U
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Abstract
The utility model discloses an integrative paster aircraft nose is glued to point, its technical scheme main points are including the mounting panel, a point that is used for going up tin cream to the PCB board glues the head, a laser welder head that is used for getting the paster head of putting components and parts and is used for being fixed in components and parts on the PCB board, vertical setting of mounting panel and mounting panel are fixed in on the mobile device of chip mounter, be fixed with a plurality of guide rails on the mounting panel, the length direction of guide rail is vertical direction, the point glues the head, equal sliding connection of paster head and laser welder head is on the guide rail, still install on the mounting panel and be used for driving the point and glue the head, paster head and laser welder head are a plurality of gliding driving pieces on the guide. This paster aircraft nose not only can get and put components and parts, can also be fixed in the PCB board with components and parts on, and can reduce the proofreading error between each process, improve the precision.
Description
Technical Field
The utility model relates to an electronic equipment field, more specifically the glue is glued paster and is welded integrative paster aircraft nose that says so relates to one kind.
Background
SMT (surface mount technology) is currently the most popular technique and process in the electronics assembly industry. The surface-mounted component (SMC/SMD, chip component in Chinese) with no pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrates, and is soldered and assembled by methods such as reflow soldering or dip soldering.
A mounter, which is also called a "mounter" or a "surface mounting system", is an apparatus for accurately placing components on a PCB by moving a mounting head, and is generally disposed behind a dispenser or a screen printer in a production line for mounting components on the PCB.
In a production line for installing components on a PCB, solder paste is generally required to be applied to a part to be installed on the PCB through a dispenser, the components are placed on the part to be installed on the PCB through a piece pasting piece, and finally, the components are fixed through a welding machine. All need proofreading the operating position before point gum machine, paster spare and welding machine work, many independent proofreadings of equipment can produce the proofreading error, and current paster aircraft nose only can realize getting and put components and parts, and the function is single.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a glue is glued paster welding integrative paster aircraft nose, this paster aircraft nose not only can get puts components and parts, can also be fixed in on the PCB board with components and parts, and can reduce the proofreading error between each process, improves the precision.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a glue dispensing and chip mounting integrated paster aircraft nose, including the mounting panel, be used for to the point of tin cream on the PCB board glue the head, be used for getting the paster head of putting components and parts and be used for being fixed in the laser welder head on the PCB board, the vertical setting of mounting panel and mounting panel are fixed in the mobile device of chip mounter on, be fixed with a plurality of guide rails on the mounting panel, the length direction of guide rail is vertical direction, the equal sliding connection of point glue head, paster head and laser welder head is on the guide rail, still install on the mounting panel and be used for driving a plurality of first driving pieces of point glue head, paster head and laser welder head gliding on the guide rail.
As a further improvement, the mounting bracket is connected to the guide rail in a sliding manner, and the air cock is connected to the mounting bracket in a rotating manner and passes through the external air source of the trachea.
As a further improvement, first driving piece is driving motor, the coaxial action wheel that is fixed with on driving motor's the output shaft, it is connected with from the driving wheel to rotate on the mounting panel, the action wheel and install the drive belt from between the driving wheel, the length direction of drive belt is vertical direction, head, paster head and laser welding head glue respectively with each drive belt fixed connection.
As a further improvement, two arbitrary in head, the paster head and the laser welding head of dispensing are fixed in on same drive belt, and two fixed department transmission opposite direction of this drive belt.
As a further improvement, the chip mounting head is provided with a plurality of chip mounting heads which are arranged at intervals between the dispensing head and the laser welding head.
As a further improvement of the utility model, the quantity of the paster head is 3.
As a further improvement of the present invention, a plurality of reset sensors and a plurality of limit sensors are fixed on the mounting plate, the number of the limit sensors is consistent with the number of the reset sensors, and each limit sensor is located below each reset sensor, the dispensing head, the mounting head and the laser welding head are all fixed with a separation blade for cooperating with the reset sensors and the limit sensors, and the separation blade cooperates with the reset sensors to reset the sliding of the dispensing head, the mounting head and the laser welding head; the separation blade and the limiting sensor are matched to limit the downward sliding of the dispensing head, the chip mounting head and the laser welding head.
As a further improvement of the present invention, a calibration camera for correcting the position is further fixed to the mounting plate.
The utility model has the advantages that: through the arrangement of the mounting plate, the dispensing head, the chip mounting head and the laser welding head, the chip mounting head can realize multiple processes of solder paste feeding, component taking and placing and component welding on a PCB, and the chip mounting head can complete all processes of fixing components on the PCB at one time, so that the chip mounting head is powerful in function; and because the horizontal distance of the dispensing head, the chip mounting head and the laser welding head on the mounting plate is fixed, in the processes of solder paste feeding, component placing and welding, only one-time position correction is needed before the solder paste feeding, and then the chip mounting head and the laser welding head can be sequentially aligned to the position of the component to be mounted on the PCB through the accurate movement of the mounting plate, so that repeated correction errors among a plurality of processes can be avoided, and the precision is improved.
Drawings
FIG. 1 is a schematic perspective view of a dispenser head integrated with a dispenser and a chip mounter;
FIG. 2 is a schematic structural view of a dispenser head integrated with a dispenser and a chip mounter;
fig. 3 is a schematic perspective view of the placement head.
Reference numerals: 1. mounting a plate; 11. a guide rail; 12. a first driving member; 13. a driving wheel; 14. a driven wheel; 15. a transmission belt; 16. resetting the sensor; 17. a limit sensor; 18. calibrating the camera; 2. dispensing a glue head; 3. a chip mounting head; 31. a mounting frame; 32. an air tap; 33. a second driving member; 34. a baffle plate; 4. and (5) welding a head by laser.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "bottom" and "top," "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Referring to fig. 1, fig. 2 shows, integrative paster aircraft nose is glued to point of this embodiment, including mounting panel 1, a glue dispensing head 2 for going up the tin cream to the PCB, a laser welder head 4 for getting and putting paster head 3 of components and parts and being used for being fixed in on the PCB with components and parts, mounting panel 1 is vertical to be set up and mounting panel 1 is fixed in on the mobile device of chip mounter, be fixed with a plurality of guide rails 11 on mounting panel 1, the length direction of guide rail 11 is vertical direction, glue dispensing head 2, equal sliding connection of paster head 3 and laser welder head 4 is on guide rail 11, still install on mounting panel 1 and be used for driving glue dispensing head 2, a plurality of first driving pieces 12 of paster head 3 and laser welder head 4 gliding on guide rail 11.
The moving device of the chip mounter is a device for driving the mounting plate 1 to move horizontally, and can comprise linear motors with mutually vertical driving directions. The first driving member 12 is a device capable of driving the dispensing head 2, the placement head 3 and the laser welding head 4 to slide up and down, and can be driven by a linear motor, or driven by a servo motor and a lead screw in a matching manner, or driven by a stepping motor and a gear rack in a matching manner. In the working process, the moving device drives the chip mounting head 3 to move to a component feeding position through the mounting plate 1, the first driving piece 12 drives the chip mounting head 3 to move up and down, and the chip mounting head 3 absorbs components; then the moving assembly drives the dispensing head 2 to move to a position of a component to be mounted on the PCB through the mounting plate 1, the first driving piece 12 drives the dispensing head 2 to move up and down, and the dispensing head 2 is used for soldering paste at the position; then the moving assembly drives the chip mounting head 3 to move to a position of a component to be mounted on the PCB through the mounting plate 1, the first driving piece 12 drives the chip mounting head 3 to move up and down, and the chip mounting head 3 places the component to the position of the component to be mounted; and finally, the moving assembly drives the laser welding head 4 to move to the position of a component to be mounted on the PCB through the mounting plate 1, the first driving piece 12 drives the laser welding head 4 to move up and down, and the laser welding head 4 welds the component on the PCB. Therefore, the chip mounter head can realize multiple processes of solder paste feeding, component taking and placing and welding of the components on the PCB, and the chip mounter head can complete all processes of fixing the components on the PCB at one time, so that the chip mounter head is powerful in function; and because the horizontal distance of the dispensing head 2, the mounting head 3 and the laser welding head 4 on the mounting plate 1 is fixed, in the processes of solder paste feeding, component placing and welding, only one-time position correction is needed before the solder paste feeding, and then the mounting plate 1 can be moved accurately to enable the mounting head 3 and the laser welding head 4 to be aligned to the position of the component to be mounted on the PCB in sequence, so that repeated correction errors among a plurality of processes can be avoided, and the precision is improved.
As a modified specific embodiment, referring to fig. 3, the chip mounting head 3 includes a mounting frame 31, an air nozzle 32 and a second driving member 33, the mounting frame 31 is slidably connected to the guide rail 11, the air nozzle 32 is rotatably connected to the mounting frame 31, the air nozzle 32 is connected to an external air source through an air pipe, and the second driving member 33 is mounted on the mounting frame 31 and drives the air nozzle 32 to rotate.
The external air source can be an air pump. The second driving member 33 is a device for driving the air nozzle 32 to rotate, and a stepping motor can be used. When the chip mounting head 3 moves to the component feeding position, the air nozzle 32 sucks air to adsorb components; when the mounting head 3 moves to a position where a component is to be mounted, the second driving member 33 drives the air nozzle 32 to rotate, the air nozzle 32 drives the component to be adjusted to a proper angle, and then the component is not adsorbed by the air nozzle 32, so that the component falls to a specified position. This paster head 3's simple structure is practical, and the setting up of second driving piece 33 makes components and parts can adjust installation angle, improves the installation accuracy of components and parts.
As a modified specific embodiment, referring to fig. 1 and 2, the first driving member 12 is a driving motor, an output shaft of the driving motor is coaxially fixed with a driving wheel 13, the mounting plate 1 is rotatably connected with a driven wheel 14, a transmission belt 15 is installed between the driving wheel 13 and the driven wheel 14, the length direction of the transmission belt 15 is a vertical direction, and the dispensing head 2, the mounting head 3 and the laser welding head 4 are respectively and fixedly connected with the transmission belts 15.
The dispensing head 2, the patch head 3 and the laser welding head 4 are all pressed and buckled with the driving belt 15 through the synchronous belt, when the driving motor works, the driving belt 15 drives the dispensing head 2 or the patch head 3 or the laser welding head 4 to slide on the guide rail 11, and the driving structure is simple and practical, and the production and use cost is low.
As a modified specific embodiment, referring to fig. 1 and 2, any two of the dispensing head 2, the placement head 3, and the laser welding head 4 are fixed on the same belt 15, and the two fixing positions of the belt 15 have opposite transmission directions.
Two arbitrary settings that are fixed in on same drive belt 15 in dispensing head 2, paster head 3 and the laser welding head 4 for a driving motor and a drive belt 15 can drive two devices and go up and down, are favorable to less driving motor, action wheel 13, from the quantity of driving wheel 14 and drive belt 15, reduction in production cost.
As an improved specific embodiment, referring to fig. 1 and 2, a plurality of chip mounting heads 3 are provided, and a plurality of chip mounting heads 3 are arranged at intervals between the dispensing head 2 and the laser welding head 4.
The arrangement of the plurality of patch heads 3 enables a plurality of components to be taken once, so that the components can be mounted at a plurality of positions after the materials are taken once, and the component mounting efficiency is improved.
As a specific embodiment of the improvement, referring to fig. 1 and 2, the number of the placement heads 3 is 3. If the number of the chip mounting heads 3 is too small, the component mounting efficiency is not high enough; if the number of the chip mounting heads 3 is too large, the weight of the mounting plate 1 is too large, the moving energy consumption of the mounting plate 1 is large, and the use cost is high.
As an improved specific embodiment, referring to fig. 1 and 2, a plurality of reset sensors 16 and a plurality of limit sensors 17 are fixed on a mounting plate 1, the number of the limit sensors 17 is the same as that of the reset sensors 16, each limit sensor 17 is located below each reset sensor 16, separation blades 34 used for being matched with the reset sensors 16 and the limit sensors 17 are fixed on a dispensing head 2, a mounting head 3 and a laser welding head 4, and the separation blades 34 are matched with the reset sensors 16 to reset sliding of the dispensing head 2, the mounting head 3 and the laser welding head 4; the stop piece 34 is matched with the limit sensor 17 to limit the downward sliding of the dispensing head 2, the patch head 3 and the laser welding head 4.
Dispensing head 2, laser welder head 4 and every paster head 3 top all are provided with a reset sensor 16 and spacing sensor 17, separation blade 34 growth strip sets up, and length direction is vertical direction, after the machine is started at every turn, all need dispensing head 2, paster head 3 and laser welder head 4 reset, first driving piece 12 drives dispensing head 2 promptly, paster head 3 and laser welder head 4 reciprocate, it just is blocked by dispensing head 2 to reach each reset sensor 16's signal, separation blade 34 top on paster head 3 and the laser welder head 4, dispensing head 2 this moment, paster head 3 and laser welder head 4 all are located initial position. When the first driving member 12 drives the dispensing head 2, the mounting head 3 and the laser welding head 4 to move downwards, if the separation blade 34 no longer blocks the signal sent by the limit sensor 17, the downward sliding distance of the dispensing head 2 or the mounting head 3 or the laser welding head 4 is too large, and at this time, the first driving member 12 driving the dispensing head 2 or the mounting head 3 or the laser welding head 4 to slide stops driving the dispensing head 2 or the mounting head 3 or the laser welding head 4 to slide downwards. Through the arrangement of the reset sensor 16, the accurate reset of the adhesive head 2, the chip mounting head 3 and the laser welding head 4 is realized when the equipment is started; through the setting of limit sensor 17, can avoid dispensing head 2 or paster head 3 or laser welding head 4 to slide down too big, influence the installation quality of components and parts.
As a modified specific embodiment, referring to fig. 1 and 2, a calibration camera 18 for correcting the position is further fixed on the mounting plate 1. After the moving device drives the mounting plate 1 to move for a certain distance, the position calibration can be performed by the calibration camera 18, so that the moving precision of the mounting plate 1 is improved.
The working principle is as follows:
the moving device drives the chip mounting head 3 to move to a component feeding position through the mounting plate 1, the driving motor drives the chip mounting head 3 to move up and down through the driving belt 15, and the chip mounting head 3 sucks components through the air nozzle 32; then the moving assembly drives the dispensing head 2 to move to a position of a component to be mounted on the PCB through the mounting plate 1, the driving motor drives the dispensing head 2 to move up and down through the driving belt 15, and the dispensing head 2 is filled with solder paste at the position; then the moving assembly drives the chip mounting head 3 to move to a position, where a component is to be mounted, on the PCB through the mounting plate 1, the driving motor drives the chip mounting head 3 to move up and down through the driving belt 15, at the moment, the second driving piece 33 drives the air nozzle 32 to rotate, the air nozzle 32 drives the component to be adjusted to a proper angle, and then the air nozzle 32 does not adsorb the component any more, so that the component falls to a specified position; and finally, the moving assembly drives the laser welding head 4 to move to the position of a component to be mounted on the PCB through the mounting plate 1, the driving motor drives the laser welding head 4 to move up and down through the driving belt 15, and the laser welding head 4 welds the component on the PCB. Therefore, the chip mounter head can realize multiple processes of solder paste feeding, component taking and placing and welding of the components on the PCB, and the chip mounter head can complete all processes of fixing the components on the PCB at one time, so that the chip mounter head is powerful in function; and because the horizontal distance of the dispensing head 2, the mounting head 3 and the laser welding head 4 on the mounting plate 1 is fixed, in the processes of solder paste feeding, component placing and welding, only one-time position correction is needed before the solder paste feeding, and then the mounting plate 1 can be moved accurately to enable the mounting head 3 and the laser welding head 4 to be aligned to the position of the component to be mounted on the PCB in sequence, so that repeated correction errors among a plurality of processes can be avoided, and the precision is improved. Two arbitrary settings that are fixed in on same drive belt 15 in dispensing head 2, paster head 3 and the laser welding head 4 for a driving motor and a drive belt 15 can drive two devices and go up and down, are favorable to less driving motor, action wheel 13, from the quantity of driving wheel 14 and drive belt 15, reduction in production cost. The arrangement of the plurality of patch heads 3 enables a plurality of components to be taken once, so that the components can be mounted at a plurality of positions after the materials are taken once, and the component mounting efficiency is improved. Through the arrangement of the reset sensor 16, the accurate reset of the adhesive head 2, the chip mounting head 3 and the laser welding head 4 is realized when the equipment is started; through the setting of limit sensor 17, can avoid dispensing head 2 or paster head 3 or laser welding head 4 to slide down too big, influence the installation quality of components and parts.
Above only the utility model discloses an it is preferred embodiment, the utility model discloses a scope of protection not only limits in above-mentioned embodiment, and the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. The utility model provides an integrative paster aircraft nose is welded in some adhesive tape which characterized in that: including mounting panel (1), be used for on the PCB board solder paste point glue head (2), be used for getting put the paster head (3) of components and parts and be used for being fixed in laser welder head (4) on the PCB board with components and parts, mounting panel (1) vertical setting and mounting panel (1) are fixed in the mobile device of chip mounter, be fixed with a plurality of guide rails (11) on mounting panel (1), the length direction of guide rail (11) is vertical direction, glue head (2), paster head (3) and the equal sliding connection of laser welder head (4) on guide rail (11), still install on mounting panel (1) and be used for driving point glue head (2), paster head (3) and laser welder head (4) a plurality of gliding driving pieces (12) on guide rail (11).
2. A chip on adhesive (dispensing) and chip on adhesive (bonding) head as claimed in claim 1, wherein: paster head (3) is including mounting bracket (31), air cock (32) and second driving piece (33), mounting bracket (31) sliding connection is on guide rail (11), air cock (32) rotate to be connected on mounting bracket (31), just air cock (32) are through the external air supply of trachea, second driving piece (33) are installed on mounting bracket (31) and are driven air cock (32) and rotate.
3. A chip on adhesive (dispensing) and chip on adhesive (bonding) head as claimed in claim 1, wherein: first driving piece (12) are driving motor, coaxial drive wheel (13) of being fixed with on driving motor's the output shaft, it is connected with from driving wheel (14) to rotate on mounting panel (1), drive wheel (13) and from installing drive belt (15) between driving wheel (14), the length direction of drive belt (15) is vertical direction, head (2), paster head (3) and laser welder head (4) are glued respectively with each drive belt (15) fixed connection.
4. A chip on adhesive (paste) dispenser and chip on adhesive (paste) dispenser head as claimed in claim 3, wherein: any two of the glue dispensing head (2), the patch head (3) and the laser welding head (4) are fixed on the same transmission belt (15), and the transmission directions of the two fixing positions of the transmission belt (15) are opposite.
5. A chip on adhesive (dispensing) and chip on adhesive (bonding) head as claimed in claim 1, wherein: the chip mounting heads (3) are arranged in a plurality, and the chip mounting heads (3) are arranged between the dispensing heads (2) and the laser welding heads (4) at intervals.
6. A one-piece head for dispensing, pasting and welding as claimed in claim 5, wherein: the number of the patch heads (3) is 3.
7. A chip on adhesive (dispensing) and chip on adhesive (bonding) head as claimed in claim 1, wherein: a plurality of reset sensors (16) and a plurality of limit sensors (17) are fixed on the mounting plate (1), the number of the limit sensors (17) is consistent with that of the reset sensors (16), each limit sensor (17) is positioned below each reset sensor (16), blocking pieces (34) used for being matched with the reset sensors (16) and the limit sensors (17) are fixed on the dispensing head (2), the patch head (3) and the laser welding head (4), and the blocking pieces (34) are matched with the reset sensors (16) to reset the sliding of the dispensing head (2), the patch head (3) and the laser welding head (4); the separation blade (34) and the limit sensor (17) are matched to limit the downward sliding of the dispensing head (2), the patch head (3) and the laser welding head (4).
8. A chip on adhesive (dispensing) and chip on adhesive (bonding) head as claimed in claim 1, wherein: and a calibration camera (18) for correcting the position is also fixed on the mounting plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921244371.9U CN210432099U (en) | 2019-08-02 | 2019-08-02 | Integrative paster aircraft nose of paster welding is glued to point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921244371.9U CN210432099U (en) | 2019-08-02 | 2019-08-02 | Integrative paster aircraft nose of paster welding is glued to point |
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| CN210432099U true CN210432099U (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921244371.9U Active CN210432099U (en) | 2019-08-02 | 2019-08-02 | Integrative paster aircraft nose of paster welding is glued to point |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337195A (en) * | 2019-08-02 | 2019-10-15 | 杭州亿奥光电有限公司 | A kind of patch head that dispensing patch is welded |
| CN112672541A (en) * | 2020-12-31 | 2021-04-16 | 华芯智造微电子(重庆)有限公司 | Intelligent transistor die bonder |
| CN115135029A (en) * | 2022-07-13 | 2022-09-30 | 浙江登新科技有限公司 | Chip mounter and chip mounting process |
| CN115533350A (en) * | 2022-10-12 | 2022-12-30 | 深圳睿晟自动化技术有限公司 | Laser welding equipment and welding method thereof |
| CN115135029B (en) * | 2022-07-13 | 2024-06-11 | 浙江登新科技有限公司 | Chip mounter and chip mounting process |
-
2019
- 2019-08-02 CN CN201921244371.9U patent/CN210432099U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110337195A (en) * | 2019-08-02 | 2019-10-15 | 杭州亿奥光电有限公司 | A kind of patch head that dispensing patch is welded |
| CN112672541A (en) * | 2020-12-31 | 2021-04-16 | 华芯智造微电子(重庆)有限公司 | Intelligent transistor die bonder |
| CN112672541B (en) * | 2020-12-31 | 2022-03-11 | 华芯智造微电子(重庆)有限公司 | Intelligent transistor die bonder |
| CN115135029A (en) * | 2022-07-13 | 2022-09-30 | 浙江登新科技有限公司 | Chip mounter and chip mounting process |
| CN115135029B (en) * | 2022-07-13 | 2024-06-11 | 浙江登新科技有限公司 | Chip mounter and chip mounting process |
| CN115533350A (en) * | 2022-10-12 | 2022-12-30 | 深圳睿晟自动化技术有限公司 | Laser welding equipment and welding method thereof |
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