CN204206630U - A kind of chip mounter - Google Patents
A kind of chip mounter Download PDFInfo
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- CN204206630U CN204206630U CN201420426505.XU CN201420426505U CN204206630U CN 204206630 U CN204206630 U CN 204206630U CN 201420426505 U CN201420426505 U CN 201420426505U CN 204206630 U CN204206630 U CN 204206630U
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Abstract
The utility model provides a kind of chip mounter, is mounted on PCB by multiple electronic devices and components, and multiple electronic devices and components regular array is on PCB, and namely multiple electronic devices and components are according to a row arrangement or multiple row arrangement, and the electronic devices and components of each row are identical.Chip mounter comprises: bracing frame, placement head, conveyer, feeding device and control device; Placement head is arranged on bracing frame movably, comprises suction nozzle base, air control unit and multiple suction nozzle; Multiple suction nozzle is arranged on suction nozzle base according to the layout matched with regular array; Air control unit is connected with multiple suction nozzle; Conveyer transmits pcb board along the X direction; Feeding device according to regular array for placement head provides multiple electronic devices and components simultaneously; Control device is for controlling the operation of placement head, conveyer and feeding device.The utility model is applicable to mount the batch of the electronic devices and components of regular array on PCB, and production cost is low, compact conformation, and placement speed is fast, precision is high.
Description
Technical field
The utility model relates to Full Vision technical field, particularly relates to a kind of chip mounter simultaneously mounting multiple electronic devices and components on pcb board.
Background technology
Chip mounter is the visual plant in SMT (Surface Mount Technology, surface mounting technology) assembly line, is also a equipment that in SMT production line, cost is the highest with requirement.Along with the development of electron trade, require more and more higher to the attachment of PCB (Printed Circuit Board, printed circuit board) in SMT technique, also more and more higher to the requirement of chip mounter, not only will at a high speed, efficiently; But also require very high placement accuracy.The efficiency of chip mounter decides the operating efficiency of whole production line.
Existing chip mounter roughly can be divided three classes structure: arched type, rotary type tower, composite structure.Dissimilar chip mounter respectively has quality, usually depends on that application is to the requirement of system and the coupling between speed and precision.Although chip mounter is of a great variety, integrates and can be summarised as following four part compositions briefly: mounting system, feeding system, substrate transport systems and management control system.Wherein mounting system is the core component of chip mounter, completes the overall process of the pickup of electronic devices and components, correction, correct attachment, determines structure and the main performance of chip mounter.
At present, chip mounter on the market, what substantially adopt is all single absorption mount formats, that is only has single suction nozzle to carry out suction and attachment at every turn.The placement head of single suction mouth is adopted to greatly limit the attachment efficiency of chip mounter.Further, correcting to complete to the biased error of appliance component, being typically chosen on Z axis and adopting synchronous pulley, Timing Belt, line slideway and servomotor or stepping motor, be in line the convert rotational motion of motor motion.Generally, single suction nozzle is designed to a module, comprises a stepping motor being responsible for controlling the angle of circuit components; The servomotor that responsible Z axis moves up and down or stepping motor.Use such scheme, the attachment of whole chip mounter to electronic devices and components has certain precision and speed, and can combine suction nozzle quantity according to demand.But adopt such kind of drive, the volume of single module is large, quality weight, after being combined into many suction nozzles, increases the moment of inertia of placement head, simultaneously because the distance between suction nozzle is very large, suction nozzle quantity is limited to some extent, also increases volume and the cost of whole equipment.And a large feature of the arrangement of multiple electronic devices and components on pcb board is exactly compact, the module of multiple single suction mouths that volume is larger cannot carry out drawing, transport and mounting according to the compact arrangement of electronic devices and components multiple on pcb board.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of chip mounter, for solving in prior art, for multiple electronic devices and components of regular array on pcb board, the problem that the Placement efficiency of single suction mouth is too low.
For achieving the above object and other relevant objects, the utility model provides a kind of chip mounter, multiple electronic devices and components are mounted on pcb board, multiple described electronic devices and components regular array is on described pcb board, described regular array is that multiple described electronic devices and components are arranged on described pcb board according to a row arrangement or multiple row, wherein, the multiple described electronic devices and components of each row arrangement are identical, the electronic devices and components of different lines are identical or different, and in each row, the number of the described electronic devices and components of arrangement is identical or different; It is characterized in that, described chip mounter comprises: bracing frame, placement head, conveyer, feeding device and control device; Described placement head is arranged on support frame as described above movably, and is positioned at the top of described conveyer; Comprise suction nozzle base, air control unit and multiple suction nozzle; Wherein, multiple described suction nozzle is arranged on described suction nozzle base, and presents the layout matched with described regular array; Described air control unit is connected with multiple described suction nozzle, controls multiple described suction nozzle simultaneously and draws and mount multiple described electronic devices and components; Described conveyer transmits described pcb board along the X direction; Described feeding device provides multiple described electronic devices and components for described placement head simultaneously; Described control device is for controlling the operation of described placement head, described conveyer and described feeding device.
Alternatively, described conveyer is a hollow conveyer belt transmitted along the X direction.
Alternatively, described feeding device is positioned at the bottom of described conveyer belt, and corresponding with the position of described placement head.
Alternatively, described placement head has moved up and down along the Z direction draw described electronic devices and components from described feeding device and mount described electronic devices and components on described pcb board on support frame as described above.
Alternatively, described feeding device is positioned at the side of described conveyer.
Alternatively, described placement head, on the bracket by move left and right along the Y direction and move up and down along the Z direction, draws described electronic devices and components and by described electronic devices and components attachment on described pcb board to complete from described feeding device.
Alternatively, described feeding device comprises for flitch and feeding part; Described for flitch surface there is the penetration type groove identical with the columns quantity of described regular array; The width of described groove matches with the carrier band preserving multiple described electronic devices and components, groove described in each provides Transfer pipe for a described carrier band, and the multiple described electronic devices and components just in described carrier band are supplied to described placement head unifiedly to draw simultaneously; Described feeding part is for driving the described carrier band identical with the columns quantity of described regular array along described groove transmission.
Alternatively, multiple described suction nozzle is fixedly mounted on described suction nozzle base by described regular array.
Alternatively, multiple described suction nozzle is arranged on described suction nozzle base according to described regular array is rotatable.
Alternatively, described placement head also comprises drive unit, multiple tooth bar and multiple gear; Described gear is fixedly mounted on described suction nozzle, described tooth bar and described gear match, described drive unit rotates while controlling the described gear on suction nozzle described in the multiple row of described regular array by multiple described tooth bar, and drives suction nozzle described in the multiple row of described regular array to rotate simultaneously.
As mentioned above, multiple electronic devices and components are mounted on pcb board according to regular array by chip mounter of the present utility model, and regular array is that multiple electronic devices and components are mounted on pcb board according to a row arrangement or multiple row arrangement.Multiple suction nozzle is arranged on suction nozzle base according to regular array by placement head.Because current electronic devices and components are by bringing preservation, a carrier band is for preserving multiple same electronic devices and components, based on this characteristic, on pcb board, the electronic devices and components of each row of regular array are also identical, further, feeding device also according to the electronic devices and components of regular array on pcb board, by the electronic devices and components being classified as placement head and providing required simultaneously, and columns is identical with the columns of regular array, each row provides same electronic devices and components.If multiple row, the spacing of adjacent column is identical with the spacing of the adjacent column of regular array.And, because feeding device may to exist the deviation of consistent angle with the electronic devices and components on pcb board at the electronic devices and components provided for placement head, so the multiple suction nozzles on placement head are also set to rotate, to realize the correction of placement head to multiple electronic devices and components by unified driving by the utility model.Chip mounter of the present utility model designs corresponding placement head and feeding device according to multiple electronic devices and components of regular array on pcb board, feeding device provides multiple electronic devices and components of regular array for placement head simultaneously, multiple suction nozzles of placement head are drawn according to regular array and transport multiple electronic devices and components, and simultaneously correcting electronic components and parts, on pcb board, finally mount multiple electronic devices and components of regular array.Therefore, mount while chip mounter of the present utility model is applicable to carry out the electronic devices and components of regular array to pcb board, to adapt to the large batch of production of pcb board, and chip mounter production cost of the present utility model is lower, compact conformation, placement speed is fast, and placement accuracy is high.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of a kind of chip mounter disclosed in the utility model embodiment.
Fig. 2 is shown as the structural representation of the placement head of a kind of chip mounter disclosed in the utility model embodiment.
Fig. 3 is shown as a kind of multiple electronic devices and components disclosed in the utility model embodiment according to the schematic diagram of the pcb board of regular array.
Fig. 4 is shown as the schematic layout pattern of the multiple suction nozzles corresponding with Fig. 3 of a kind of chip mounter disclosed in the utility model embodiment.
Fig. 5 is shown as another kind of multiple electronic devices and components disclosed in the utility model embodiment according to the schematic diagram of the pcb board of regular array.
Fig. 6 is shown as the schematic layout pattern of the multiple suction nozzles corresponding with Fig. 5 of a kind of chip mounter disclosed in the utility model embodiment.
Fig. 7 is shown as the structural representation of another placement head of a kind of chip mounter disclosed in the utility model embodiment.
Fig. 8 is shown as the structural representation of the feeding device of a kind of chip mounter disclosed in the utility model embodiment.
Fig. 9 is shown as the generalized section of the feeding device of a kind of chip mounter disclosed in the utility model embodiment.
Figure 10 is shown as the vertical view of the feeding device of a kind of chip mounter disclosed in the utility model embodiment.
Figure 11 is shown as the structural representation of the conveyer of a kind of chip mounter disclosed in the utility model embodiment.
Figure 12 is shown as the structural representation of a kind of chip mounter disclosed in another embodiment of the utility model.
Element numbers explanation
100 bracing frames
200 placement heads
210 suction nozzle bases
220 suction nozzles
221 gears
222 tooth bars
300 conveyers
400 feeding devices
410 material discs
420 for flitch
430 feeding parts
440 overlay film dishes
500 pcb boards
The predeterminated position of the electronic devices and components on 510 pcb boards
Embodiment
By particular specific embodiment, execution mode of the present utility model is described below, person skilled in the art scholar the content disclosed by this specification can understand other advantages of the present utility model and effect easily.
Refer to Fig. 1 to Figure 12.Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the utility model, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the utility model can produce and the object that can reach, still all should drop on technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the utility model.
Multiple electronic devices and components are mounted on pcb board 500 by chip mounter disclosed in the utility model, multiple electronic devices and components on pcb board 500 according to regular array, and, multiple electronic devices and components in regular array can be electronic devices and components all on pcb board 500, also can be the electronic devices and components of the part on pcb board 500.Wherein, regular array is that multiple electronic devices and components are arranged on pcb board 500 according to row or multiple row, and multiple electronic devices and components of arrangement are identical in each row, the quantity of multiple electronic devices and components of each row arrangement both can be identical, also can be different; The electronic devices and components of different row arrangements can be identical, also can be different.
Embodiment 1
Present embodiment discloses a kind of chip mounter, specifically as shown in Figure 1, comprise bracing frame 100, placement head 200, conveyer 300, feeding device 400 and control device.Control device does not draw in the accompanying drawings.
Placement head 200 is arranged on bracing frame 100 movably; Placement head 200 can move left and right along the Y direction along bracing frame 100 and move up and down along the Z direction.X-direction, Y-direction and Z-direction direction as shown in Figure 1.Placement head 200 comprises suction nozzle base 210, air control unit and multiple suction nozzle 220, and as shown in Figure 2, air control unit does not mark in the accompanying drawings.
Multiple suction nozzle 220 is arranged on suction nozzle base 210, and the multiple suction nozzles 220 be arranged on suction nozzle base 210 present a layout matched with regular array, as shown in Fig. 3 and Fig. 4, Fig. 5 and Fig. 6.Fig. 3 and Fig. 5 is pcb board 500 vertical view, wherein the predeterminated position of 510 expression electronic devices and components.In Fig. 3, be mounted on multiple electronic devices and components on pcb board 500 and be arranged on pcb board 500 according to multiple row, and the number of the electronic devices and components of the upper arrangement of each row is identical; In Fig. 5, being mounted on multiple electronic element on pcb board 500 is also be arranged on pcb board 500 according to multiple row, but the number of the electronic devices and components of the upper arrangement of each row is not quite similar.Fig. 4 and Fig. 6 is shown as the layout of multiple suction nozzle 220 on suction nozzle base 210.The regular array of multiple electronic devices and components on pcb board 500 shown in the layout of the multiple suction nozzles 220 shown in Fig. 4 and Fig. 3 matches; Multiple electronic devices and components shown in the layout of the multiple suction nozzles 220 shown in Fig. 6 and Fig. 5 on pcb board regular array match.The layout of multiple suction nozzle 220 can change along with the regular array of the part or all of electronic devices and components on pcb board 500.For the pcb board 500 shown in Fig. 3 and Fig. 5, because it is all only have the electronic devices and components of part on pcb board 500 according to regular array, so use the placement head shown in Fig. 4 and Fig. 6 only to mount the portions of electronics components and parts of regular array on pcb board on Fig. 3 and Fig. 5 500 simultaneously, being mounted in the utility model of remaining electronic devices and components is not just considered.Certainly, if the whole electronic devices and components on pcb board 500 are all regular array, the multiple suction nozzles being so used in regular array on suction nozzle base just can complete the attachment to whole pcb board simultaneously.
Multiple suction nozzle 220 can be fixedly mounted on suction nozzle base 210, and namely suction nozzle 220 cannot rotate; Multiple suction nozzle 220 also can be installed in rotation on suction nozzle base 210.The mounting position of the electronic devices and components on the position of the electronic devices and components provided at feeding device 400 and pcb board 500 does not have complete one_to_one corresponding, then can be corrected by the position of the rotation of suction nozzle 220 to electronic devices and components.As shown in Figure 7, in the present embodiment, multiple row suction nozzle 220 has come to control the rotation of multiple suction nozzles 220 of regular array by drive unit, multiple gear 221 and multiple tooth bar 222, and in the accompanying drawings, drive unit does not identify.Gear 221 is fixedly mounted on suction nozzle 220, and namely the rotation of gear 221 can drive the rotation of suction nozzle 220, and multiple gear 221 is also according to regular array.Generally, milling flat shape is adopted to be connected with the composite type of key between gear 221 and suction nozzle 220.Drive unit controls the rotation of multiple gears 221 of each row simultaneously, controls while just can completing the rotation to all suction nozzles 220 on suction nozzle base 210.In the present embodiment, drive unit carries out rotating control to the gear 221 on each multiple suction nozzle 220 arranged by multiple tooth bar 222.What the method controlled the rotation of multiple suction nozzle 220 provided except the present embodiment has been come by drive unit and gear, also has other method a lot, just repeats no longer one by one in the utility model.
One end of multiple suction nozzle 220 is connected with air control unit.Air control unit controls multiple suction nozzle 220 simultaneously and draws electronic devices and components from feeding device 300, or to pcb board mount electronic components and parts.
Feeding device 400 for providing multiple electronic devices and components for placement head 200 simultaneously, and is positioned at the side of conveyer 300.The preserving type of electronic devices and components more common is at present that carrier band is preserved.The tape base of carrier band is preserved at regular intervals electronic devices and components in receiving space, and will space sealing be received with overlay film.The overlay film of multiple carrier band will be separated by feeding device 400, and placement head 200 is presented to, so that placement head 200 draws electronic devices and components simultaneously in the receiving space exposing electronic devices and components after separation overlay film.As shown in Fig. 8, Fig. 9 and Figure 10, feeding device 400 comprises one for flitch 420 and feeding part 430; For groove flitch 420 being provided with one or more penetration type.The quantity of groove is identical with the columns of multiple electronic devices and components of the regular array on pcb board 500, and groove designs according to carrier band.Be no matter the carrier band of any electronic devices and components, the width of its tape base is certain, so, be set to match with tape base for the groove on flitch 420.If multiple electronic devices and components of the regular array on pcb board are multiple row, so groove is also multiple, and the spacing of adjacent groove is consistent with the spacing that the adjacent column of regular array is arranged; Or the spacing that the adjacent column of the spacing of adjacent grooves and regular array is arranged is inconsistent, but arrange according to the structure pitch of feeding device, and on placement head, drive suction nozzle change in location with corresponding pcb board component locations.The groove of penetration type is for transmitting carrier band, and the electronic devices and components in carrier band are supplied to placement head 200 simultaneously.For on flitch 420, one end that carrier band imports into is feeding end, and one end that carrier band is sent is discharge end.
Feeding part 430 comprises multiple transmission gear, and transmission gear is arranged on the discharge end for flitch 420.Transmission gear is corresponding with the groove for flitch 420: a transmission gear drives a carrier band to transmit from material disc 410 along a groove for flitch 420.
The feeding device 400 of the present embodiment is in order to reach the automation supply of electronic devices and components, and feeding device 400 also comprises material disc 410 and overlay film dish 440.
Material disc 410 is near the feeding end for flitch 420, and for fixing multiple carrier band, carrier band is rotatably mounted on material disc 410 by spool.
Overlay film dish 440, near the feeding end for flitch 420, comprises multiple film rolling tooth.Multiple film rolling tooth is separated the overlay film of carrier band, and furls isolated overlay film and furled by the overlay film of separation.The quantity of film rolling tooth is consistent with the number of recesses for flitch 422.
Conveyer 300 is for transmitting pcb board 500 along the X direction.Usual employing conveyer belt completes the transmission of pcb board 500 as conveyer.The conveyer 300 of the present embodiment is the conveyer belt of a hollow, and as shown in figure 11, pcb board 500 frame, at the two ends of conveyer belt, is moved along the X direction by conveyer belt.Further, pcb board 500 is equally spaced on a moving belt, and spacing is greater than the length of pcb board 500.Certainly, because feeding device 400 is positioned at the side of conveyer 300 in the present embodiment, so the conveyer 300 of the present embodiment adopts conventional conveyer belt.
Chip mounter also must comprise a control device, for Collaborative Control placement head 200, conveyer 300 and feeding device 400:
First, control device control placement head 200 draws multiple electronic devices and components that feeding device 400 provides: control placement head 200 and move left and right on bracing frame 100 along the Y direction, and placement head 200 is moved as the corresponding position of feeding device 400, and then control placement head 200 and move down on bracing frame 100 along the Z direction, make placement head 200 close to feeding device 400, to draw electronic devices and components; Further, after placement head 200 has drawn the electronic devices and components that feeding device 400 provides, control device also will control feeding device 400 feed again;
Secondly, after placement head 200 has drawn electronic devices and components, placement head 200 moves upward again along the Z direction on bracing frame 100, then moves left and right on bracing frame 100 along the Y direction, and is moved to the position of conveyer 300;
Then, the transmission of conveyer 300, is sent to the position corresponding with placement head 300 by the pcb board 500 with attachment on conveyer 300;
Finally, placement head 200 pairs of pcb boards 500 mount: placement head 200 moves down along the Z direction on bracing frame, mounts pcb board 500, after having mounted, is again moved up on bracing frame along the Z direction by placement head, homing.
As the attachment of next pcb board 500 will be carried out, only aforesaid operations need be repeated.
Embodiment 2
The structure of the present embodiment is identical with embodiment 1, also comprises bracing frame 100, placement head 200, conveyer 300 and feeding device 400.But in the present embodiment, as shown in figure 12, feeding device 400 is different from the position of embodiment 1, feeding device 400 is positioned at immediately below conveyer 300, the position corresponding with placement head 200.
Why the position of feeding device 400 being changed, its objective is the motion in order to reduce placement head 200, increase the accuracy that placement head 200 mounts.Because feeding device 400 is positioned on the position corresponding with placement head 200, so placement head 200, when drawing the operation of electronic devices and components, only needs to move up and down on bracing frame 100 along the Z direction and can complete.The shift action of placement head 200 is fewer, and the location between placement head 200 and pcb board 500 is easier, and the accuracy of attachment is also higher.And, the placement head 200 of the present embodiment only Z-direction need move up and down on bracing frame 100, like this, bracing frame 100 can not need to arrange the beam guideway for meeting in the Y-direction that placement head 200 Y-direction moves left and right, and this also just in a disguised form has saved cost.
In sum, multiple electronic devices and components are mounted on pcb board according to regular array by chip mounter of the present utility model, and regular array is that multiple electronic devices and components are mounted on pcb board according to a row arrangement or multiple row arrangement.Multiple suction nozzle is arranged on suction nozzle base according to regular array by placement head.Because current electronic devices and components are by bringing preservation, a carrier band is for preserving multiple same electronic devices and components, based on this characteristic, on pcb board, the electronic devices and components of each row of regular array are also identical, further, feeding device also according to the electronic devices and components of regular array on pcb board, by the electronic devices and components being classified as placement head and providing required simultaneously, and columns is identical with the columns of regular array, each row provides same electronic devices and components.If multiple row, the spacing of adjacent column is identical with the spacing of the adjacent column of regular array.And, because feeding device is in the deviation that may there is consistent angle with the electronic devices and components on pcb board of the electronic devices and components provided for placement head, so the multiple suction nozzles on placement head are also set to rotate, to realize the correction of placement head to multiple electronic devices and components by unified driving by the utility model.Chip mounter of the present utility model designs corresponding placement head and feeding device according to multiple electronic devices and components of regular array on pcb board, feeding device provides multiple electronic devices and components of regular array for placement head simultaneously, multiple suction nozzles of placement head are drawn according to regular array and transport multiple electronic devices and components, and simultaneously correcting electronic components and parts, on pcb board, finally mount multiple electronic devices and components of regular array.Therefore, mount while chip mounter of the present utility model is applicable to carry out the electronic devices and components of regular array to pcb board, to adapt to the large batch of production of pcb board, and chip mounter production cost of the present utility model is lower, compact conformation, placement speed is fast, and placement accuracy is high.So the utility model effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all without prejudice under spirit of the present utility model and category, can modify above-described embodiment or changes.Therefore, such as have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the utility model discloses, must be contained by claim of the present utility model.
Claims (10)
1. a chip mounter, multiple electronic devices and components are mounted on pcb board, multiple described electronic devices and components regular array is on described pcb board, described regular array is that multiple described electronic devices and components are arranged on described pcb board according to a row arrangement or multiple row, wherein, the multiple described electronic devices and components of each row arrangement are identical, and the electronic devices and components of different lines are identical or different, and in each row, the number of the described electronic devices and components of arrangement is identical or different; It is characterized in that, described chip mounter comprises: bracing frame, placement head, conveyer, feeding device and control device;
Described placement head is arranged on support frame as described above movably, and is positioned at the top of described conveyer; Comprise suction nozzle base, air control unit and multiple suction nozzle; Wherein, multiple described suction nozzle is arranged on described suction nozzle base, and presents the layout matched with described regular array; Described air control unit is connected with multiple described suction nozzle, controls multiple described suction nozzle simultaneously and draws and mount multiple described electronic devices and components;
Described conveyer transmits described pcb board along the X direction;
Described feeding device provides multiple described electronic devices and components for described placement head simultaneously;
Described control device is for controlling the operation of described placement head, described conveyer and described feeding device.
2. chip mounter according to claim 1, is characterized in that, described conveyer is a hollow conveyer belt transmitted along the X direction.
3. chip mounter according to claim 2, is characterized in that, described feeding device is positioned at the bottom of described conveyer belt, and corresponding with the position of described placement head.
4. chip mounter according to claim 3, is characterized in that, described placement head has moved up and down along the Z direction draw described electronic devices and components from described feeding device and mount described electronic devices and components on described pcb board on support frame as described above.
5. chip mounter according to claim 1, is characterized in that, described feeding device is positioned at the side of described conveyer.
6. chip mounter according to claim 5, it is characterized in that, described placement head by move left and right along the Y direction and move up and down along the Z direction, draws described electronic devices and components and by described electronic devices and components attachment on described pcb board to complete from described feeding device on support frame as described above.
7. chip mounter according to claim 1, is characterized in that, described feeding device comprises for flitch and feeding part;
The described surface for flitch has the penetration type groove identical with the columns quantity of described regular array; The width of described groove matches with the carrier band preserving multiple described electronic devices and components, groove described in each provides Transfer pipe for a described carrier band, and the multiple described electronic devices and components just in described carrier band are supplied to described placement head unifiedly to draw simultaneously;
Described feeding part is for driving the described carrier band identical with the columns quantity of described regular array along described groove transmission.
8. chip mounter according to claim 1, is characterized in that, multiple described suction nozzle is fixedly mounted on described suction nozzle base by described regular array.
9. chip mounter according to claim 1, is characterized in that, multiple described suction nozzle is arranged on described suction nozzle base according to described regular array is rotatable.
10. chip mounter according to claim 9, is characterized in that, described placement head also comprises drive unit, multiple tooth bar and multiple gear;
Described gear is fixedly mounted on described suction nozzle, described tooth bar and described gear match, described drive unit rotates while controlling the described gear on suction nozzle described in the multiple row of described regular array by multiple described tooth bar, and drives suction nozzle described in the multiple row of described regular array to rotate simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420426505.XU CN204206630U (en) | 2014-07-30 | 2014-07-30 | A kind of chip mounter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420426505.XU CN204206630U (en) | 2014-07-30 | 2014-07-30 | A kind of chip mounter |
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| CN204206630U true CN204206630U (en) | 2015-03-11 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323975A (en) * | 2014-07-30 | 2016-02-10 | 上海儒竞电子科技有限公司 | Chip mounter |
| CN105514009A (en) * | 2015-12-14 | 2016-04-20 | 重庆远创光电科技有限公司 | Chip carrying apparatus for chip visual detection |
| CN105514008A (en) * | 2015-12-14 | 2016-04-20 | 重庆远创光电科技有限公司 | Chip carrying apparatus with light source |
| CN105513992A (en) * | 2015-12-14 | 2016-04-20 | 重庆远创光电科技有限公司 | Chip carrying apparatus for chip visual detection |
| CN106211619A (en) * | 2015-04-30 | 2016-12-07 | 上海儒竞电子科技有限公司 | A kind of chip mounter |
| CN110267463A (en) * | 2019-07-18 | 2019-09-20 | 安徽天通精电新科技有限公司 | A kind of electronic component attachment processing automatic placement machine and its operating method |
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2014
- 2014-07-30 CN CN201420426505.XU patent/CN204206630U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323975A (en) * | 2014-07-30 | 2016-02-10 | 上海儒竞电子科技有限公司 | Chip mounter |
| CN105323975B (en) * | 2014-07-30 | 2018-10-12 | 上海儒竞电子科技有限公司 | A kind of chip mounter |
| CN106211619A (en) * | 2015-04-30 | 2016-12-07 | 上海儒竞电子科技有限公司 | A kind of chip mounter |
| CN106211619B (en) * | 2015-04-30 | 2019-01-01 | 上海儒竞电子科技有限公司 | A kind of chip mounter |
| CN105514009A (en) * | 2015-12-14 | 2016-04-20 | 重庆远创光电科技有限公司 | Chip carrying apparatus for chip visual detection |
| CN105514008A (en) * | 2015-12-14 | 2016-04-20 | 重庆远创光电科技有限公司 | Chip carrying apparatus with light source |
| CN105513992A (en) * | 2015-12-14 | 2016-04-20 | 重庆远创光电科技有限公司 | Chip carrying apparatus for chip visual detection |
| CN110267463A (en) * | 2019-07-18 | 2019-09-20 | 安徽天通精电新科技有限公司 | A kind of electronic component attachment processing automatic placement machine and its operating method |
| CN110267463B (en) * | 2019-07-18 | 2020-05-29 | 安徽天通精电新科技有限公司 | Automatic chip mounter for mounting and processing electronic components and operation method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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Effective date of registration: 20160914 Address after: 200433 Shanghai City, Yangpu District National Road No. 323 room 1102-125 Patentee after: Shanghai Auto Control System Co., Ltd. Address before: 200433 Shanghai City, Yangpu District National Road No. 335 Building No. 2, 1803, 1805, 1806, 1807. Patentee before: Shanghai Ruking Electronic Science & Technology Co., Ltd. |