CN106183230B - 一种抗菌高频覆铜板 - Google Patents

一种抗菌高频覆铜板 Download PDF

Info

Publication number
CN106183230B
CN106183230B CN201610562086.6A CN201610562086A CN106183230B CN 106183230 B CN106183230 B CN 106183230B CN 201610562086 A CN201610562086 A CN 201610562086A CN 106183230 B CN106183230 B CN 106183230B
Authority
CN
China
Prior art keywords
copper
layers
clad plate
epoxy resin
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610562086.6A
Other languages
English (en)
Other versions
CN106183230A (zh
Inventor
刘世超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mingguang Ruizhi Electronic Technology Co ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201610562086.6A priority Critical patent/CN106183230B/zh
Publication of CN106183230A publication Critical patent/CN106183230A/zh
Application granted granted Critical
Publication of CN106183230B publication Critical patent/CN106183230B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
    • B32B17/064—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B32B2307/7145—Rot proof, resistant to bacteria, mildew, mould, fungi
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

本发明公开了一种抗菌高频覆铜板，包括两层铜层、及位于该两层铜层之间的绝缘介质层；所述绝缘介质层由1‑3张聚四氟乙烯薄膜和2‑6张预浸料组成；所述预浸料由玻璃纤维布在环氧树脂粘胶剂中浸渍后烘干得到，所述环氧树脂粘胶剂由下述重量份的原料制备而成：双环戊二烯型酚醛环氧树脂95‑105份、苯酚型酚醛环氧树脂20‑30份、2‑丁酮15‑45份、固化促进剂0.01‑1份、无机抗菌剂1‑10份。本发明的抗菌高频覆铜板，通过合理的配比，优选出适合的无机抗菌剂、固化促进剂的种类及用量，提高了抗菌性能和剥离强度，综合性能十分优异，填料分散效果好，成本低廉，既环保又经济。

Description

一种抗菌高频覆铜板
技术领域
本发明涉及化工技术领域，尤其涉及一种抗菌高频覆铜板。
背景技术
随着电子产品的发展趋向多功能化，电子产品的零部件也不断向轻、薄、短、小等方面发展，尤其是高密度集成电路技术的广泛应用，对民用电子产品提出高性能化、高可靠性和高安全性的要求；对工业用电子产品提出技术性能良好、低成本、低能耗的要求。因此电子产品的核心材料——印制电路板(Printed Circuit Board，简称PCB)的基材覆铜板面临着更高的技术要求、更严峻的使用环境及更高的环保要求。
覆铜板(Copper Clad Laminate，简称CCL)主要用于生产印制电路板，是以纤维纸、玻璃纤维布或玻璃纤维无纺布(俗称玻璃毡)等作为增强材料，浸以树脂，单面或双面覆以铜箔，经热压而成的一种产品。现有的覆铜板由于制造原材料及制造结构的差异性，CCL基材的技术性能各有差异。
覆铜板中的树脂液一般使用热固性树脂组合物。热固性树脂是指树脂在加热、加压下或在固化剂、紫外光作用下，进行化学反应，交联固化成为不熔物质的一大类合成树脂。常用的热固性树脂有酚醛树脂、脲醛树脂、三聚氰胺-甲醛树脂、环氧树脂、不饱和树脂、聚氨酯、聚酰亚胺等。热固性树脂和固化剂、促进剂、填料等组成热固性树脂组合物，再经调制成为树脂液在覆金属箔板中使用。为了使覆金属箔板具有较好的绝缘性能，通常在树脂液中会添加填料。
环氧树脂泛指分子中含有两个或两个以上环氧基团，以脂肪族、脂环族或芳香族等有机化合物为骨架，并能够通过环氧基团在适当的化学试剂(固化剂)存在下反应生成三维网状固化物的化合物的总称。环氧树脂由于具有良好的化学稳定性、电绝缘性、耐腐蚀性、粘结性和机械强度，作为粘结剂广泛用于印制电路板(PCB)的材料中。
因此，本领域的技术人员致力于开发一种综合技术性能优良、又具备较高玻璃化转变温度和较高剥离强度的抗菌高频覆铜板。
发明内容
针对现有技术中存在的上述不足，本发明所要解决的技术问题是提供一种抗菌高频覆铜板。
本发明目的是通过如下技术方案实现的：
一种抗菌高频覆铜板，包括两层铜层、及位于该两层铜层之间的绝缘介质层；所述绝缘介质层由1-3张聚四氟乙烯薄膜和2-6张预浸料组成；所述预浸料由玻璃纤维布在环氧树脂粘胶剂中浸渍后烘干得到。
优选地，所述环氧树脂粘胶剂由下述重量份的原料制备而成：双环戊二烯型酚醛环氧树脂95-105份、苯酚型酚醛环氧树脂20-30份、2-丁酮15-45份、固化促进剂0.01-1份、无机抗菌剂1-10份。
优选地，所述的无机抗菌剂为钨酸银、碘化银、磷酸银中一种或多种的混合物。
更优选地，所述的无机抗菌剂由钨酸银、碘化银、磷酸银混合而成，所述钨酸银、碘化银、磷酸银的质量比为(1-3)：(1-3)：(1-3)。
优选地，所述的固化促进剂为4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑中一种或多种的混合物。
更优选地，所述的固化促进剂由4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑混合而成，所述4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑的质量比为(1-3)：(1-3)：(1-3)。
优选地，所述的无机抗菌剂的粒径为0.01-20μm。
优选地，所述的双环戊二烯型酚醛环氧树脂可以采用市售的大日本油墨化学工业株式会社生产的型号为HP-7200L的双环戊二烯型酚醛环氧树脂，环氧当量247g/eq。
优选地，所述的苯酚型酚醛环氧树脂可以采用市售的台湾长春人造树脂厂生产的牌号为PNE177的苯酚型酚醛环氧树脂，环氧当量177g/eq。
优选地，所述的预浸料由玻璃纤维布在环氧树脂粘胶剂中浸渍得到基板，所述基板中玻璃纤维布的质量分数为75-95％，所述基板中环氧树脂粘胶剂的质量分数为5-25％，然后将基板置于80-120℃的烘箱中，烘烤1-3h得到。
优选地，所述的所述绝缘介质层由1-3张聚四氟乙烯薄膜和2-6张预浸料相互叠合而成。
优选地，所述的抗菌高频覆铜板由两层铜层、及位于该两层铜层之间的绝缘介质层在热压机中热压得到。
优选地，所述的铜层的厚度为3-150μm。
本发明的抗菌高频覆铜板，通过合理的配比，优选出适合的无机抗菌剂、固化促进剂的种类及用量，提高了抗菌性能和剥离强度，综合性能十分优异，填料分散效果好，成本低廉，既环保又经济。
具体实施方式
下面结合实施例对本发明做进一步的说明，以下所述，仅是对本发明的较佳实施例而已，并非对本发明做其他形式的限制，任何熟悉本专业的技术人员可能利用上述揭示的技术内容加以变更为同等变化的等效实施例。凡是未脱离本发明方案内容，依据本发明的技术实质对以下实施例所做的任何简单修改或等同变化，均落在本发明的保护范围内。
实施例中各原料介绍：
双环戊二烯型酚醛环氧树脂，采用大日本油墨化学工业株式会社生产的型号为HP-7200L的双环戊二烯型酚醛环氧树脂，环氧当量247g/eq。
苯酚型酚醛环氧树脂，采用台湾长春人造树脂厂生产的牌号为PNE177的苯酚型酚醛环氧树脂，环氧当量177g/eq。
2-丁酮，CAS号：78-93-3。
钨酸银，CAS号：13465-93-5，粒径0.1μm。
碘化银，CAS号：7783-96-2，粒径0.1μm。
磷酸银，CAS号：7784-09-0，粒径0.1μm。
4-甲基-2-苯基咪唑，CAS号：827-43-0。
1-氰乙基-2-甲基咪唑，CAS号：23996-55-6。
1-(β-羟乙基)-2-甲基咪唑，CAS号：1615-15-2。
实施例1
环氧树脂粘胶剂原料(重量份)：双环戊二烯型酚醛环氧树脂100份、苯酚型酚醛环氧树脂24份、2-丁酮20份、固化促进剂0.3份、无机抗菌剂3份。
所述的无机抗菌剂由钨酸银、碘化银、磷酸银按质量比为1:1:1搅拌混合均匀得到。
所述的固化促进剂由4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑按质量比为1:1:1搅拌混合均匀得到。
抗菌高频覆铜板制备：
(1)将双环戊二烯型酚醛环氧树脂、2-丁酮以400转/分搅拌5分钟，然后加入苯酚型酚醛环氧树脂、固化促进剂以300转/分搅拌10分钟，最后加入无机抗菌剂以300转/分搅拌60分钟。得到实施例1制备的环氧树脂粘胶剂。
(2)将玻璃纤维布(采用东莞市广鸿复合材料有限公司提供的E级玻璃纤维布106，克重为25g/m2，厚度为0.03mm)浸渍在实施例1制备的抗菌高频覆铜板中得到浸渍布，控制玻璃纤维布的含量为10wt％(即浸渍布中玻璃纤维布的含量为10wt％，抗菌高频覆铜板的含量为90wt％)，然后将浸渍布置于100℃的烘箱中，烘烤2h，去除溶剂，得到预浸料；
(3)将1张聚四氟乙烯薄膜两相面对表面分别覆盖2张预浸料，相互叠合得到基板，再在基板两相面对表面覆盖30μm厚的铜层(采用东莞市桥头金佰橡塑制品厂提供的型号为TU25的铜箔)进行层压，施加压力400PSI，最低温度为50℃，最高温度为380℃，以速率为3℃/min升温，达到最高温度380℃后保持40min。得到实施例1的抗菌高频覆铜板。
实施例2
与实施例1基本相同，区别仅在于：所述的无机抗菌剂由碘化银、磷酸银按质量比为1:1搅拌混合均匀得到。得到实施例2的抗菌高频覆铜板。
实施例3
与实施例1基本相同，区别仅在于：所述的无机抗菌剂由钨酸银、磷酸银按质量比为1:1搅拌混合均匀得到。得到实施例3的抗菌高频覆铜板。
实施例4
与实施例1基本相同，区别仅在于：所述的无机抗菌剂由钨酸银、碘化银按质量比为1:1搅拌混合均匀得到。得到实施例4的抗菌高频覆铜板。
实施例5
与实施例1基本相同，区别仅在于：所述的固化促进剂由1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑按质量比为1:1搅拌混合均匀得到。得到实施例5的抗菌高频覆铜板。
实施例6
与实施例1基本相同，区别仅在于：所述的固化促进剂由4-甲基-2-苯基咪唑、1-(β-羟乙基)-2-甲基咪唑按质量比为1:1搅拌混合均匀得到。得到实施例6的抗菌高频覆铜板。
实施例7
与实施例1基本相同，区别仅在于：所述的固化促进剂由4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑按质量比为1:1搅拌混合均匀得到。得到实施例7的抗菌高频覆铜板。
测试例1
分别将实施例1-7制得的覆铜板的玻璃化转变温度、剥离强度进行测试。测试方法如下：玻璃化转变温度Tg：按照IPC-TM-6502.4.24所规定的DMA方法进行测定。剥离强度PS：按照IPC-TM-6502.4.8方法中“热应力后”实验条件，测试板材的剥离强度。具体结果见表1。
表1：玻璃化转变温度、剥离强度测试结果表
比较实施例1与实施例2-4，实施例1(钨酸银、碘化银、磷酸银复配)玻璃化转变温度、剥离强度测试结果明显优于实施例2-4(钨酸银、碘化银、磷酸银中任意二者复配)；比较实施例1与实施例5-7，实施例1(4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑复配)玻璃化转变温度、剥离强度测试结果明显优于实施例5-7(4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑中任意二者复配)。
测试例2
分别将实施例1-7制得的预浸料的抗菌性能进行测试。按QB/T2591-2003方法进行测定。大肠杆菌ATYCC 25922、金黄色葡萄球菌ATCC6538。具体测试结果见表2。
表2：抗菌性能测试结果表
样品 大肠杆菌杀菌率，％ 金黄色葡萄球菌杀菌率，％
实施例1 98.1 99.6
实施例2 92.4 94.7
实施例3 92.5 94.9
实施例4 93.1 94.2
实施例5 94.4 96.8
实施例6 94.0 96.1
实施例7 95.3 96.5
比较实施例1与实施例2-4，实施例1(钨酸银、碘化银、磷酸银复配)抗菌性能明显优于实施例2-4(钨酸银、碘化银、磷酸银中任意二者复配)；比较实施例1与实施例5-7，实施例1(4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑复配)抗菌性能明显优于实施例5-7(4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑中任意二者复配)。
测试例3
分别将实施例1与实施例5-7制得的覆铜板的耐电弧进行测试。耐电弧：按标准Q/GDSY6050-20122.5.1进行测试。具体测试结果见表3。
表3：绝缘性能测试结果表
样品 耐电弧，Kv
实施例1 150
实施例5 137
实施例6 141
实施例7 142
比较实施例1与实施例5-7，实施例1(4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑复配)绝缘性能明显优于实施例5-7(4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑中任意二者复配)。

Claims (6)

1.一种抗菌高频覆铜板，包括两层铜层、及位于该两层铜层之间的绝缘介质层；所述绝缘介质层由1-3张聚四氟乙烯薄膜和2-6张预浸料组成；所述预浸料由玻璃纤维布在环氧树脂粘胶剂中浸渍后烘干得到，其特征在于：所述环氧树脂粘胶剂由下述重量份的原料制备而成：双环戊二烯型酚醛环氧树脂95-105份、苯酚型酚醛环氧树脂20-30份、2-丁酮15-45份、固化促进剂0.01-1份、无机抗菌剂1-10份；
所述的无机抗菌剂由钨酸银、碘化银、磷酸银混合而成，所述钨酸银、碘化银、磷酸银的质量比为(1-3)：(1-3)：(1-3)；
所述的固化促进剂由4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑混合而成，所述4-甲基-2-苯基咪唑、1-氰乙基-2-甲基咪唑、1-(β-羟乙基)-2-甲基咪唑的质量比为(1-3)：(1-3)：(1-3)。
2.如权利要求1所述的抗菌高频覆铜板，其特征在于：所述的无机抗菌剂的粒径为0.01-20μm。
3.如权利要求1所述的抗菌高频覆铜板，其特征在于：所述的预浸料由玻璃纤维布在环氧树脂粘胶剂中浸渍得到基板，所述基板中玻璃纤维布的质量分数为75-95％，所述基板中环氧树脂粘胶剂的质量分数为5-25％，然后将基板置于80-120℃的烘箱中，烘烤1-3h得到。
4.如权利要求1所述的抗菌高频覆铜板，其特征在于：所述的绝缘介质层由1-3张聚四氟乙烯薄膜和2-6张预浸料相互叠合而成。
5.如权利要求1所述的抗菌高频覆铜板，其特征在于：所述的抗菌高频覆铜板由两层铜层、及位于该两层铜层之间的绝缘介质层在热压机中热压得到。
6.如权利要求1所述的抗菌高频覆铜板，其特征在于：所述的铜层的厚度为3-150μm。
CN201610562086.6A 2016-07-18 2016-07-18 一种抗菌高频覆铜板 Active CN106183230B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610562086.6A CN106183230B (zh) 2016-07-18 2016-07-18 一种抗菌高频覆铜板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610562086.6A CN106183230B (zh) 2016-07-18 2016-07-18 一种抗菌高频覆铜板

Publications (2)

Publication Number Publication Date
CN106183230A CN106183230A (zh) 2016-12-07
CN106183230B true CN106183230B (zh) 2018-06-26

Family

ID=57474805

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610562086.6A Active CN106183230B (zh) 2016-07-18 2016-07-18 一种抗菌高频覆铜板

Country Status (1)

Country Link
CN (1) CN106183230B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111775517A (zh) * 2020-06-03 2020-10-16 航天材料及工艺研究所 一种结构与生物安全一体化轻质蜂窝夹层结构及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101684191A (zh) * 2009-08-27 2010-03-31 广东生益科技股份有限公司 无卤高频树脂组合物及用其制成的预浸料与层压板
CN102633990A (zh) * 2012-04-05 2012-08-15 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板
CN102794949A (zh) * 2012-08-09 2012-11-28 广东生益科技股份有限公司 覆铜板
CN103073846A (zh) * 2013-01-18 2013-05-01 腾辉电子（苏州）有限公司 无卤低介电环氧树脂组合物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002212262A (ja) * 2001-01-17 2002-07-31 Arakawa Chem Ind Co Ltd 電気絶縁用樹脂組成物、電子材料用絶縁材料およびその製造方法
JP2003055435A (ja) * 2001-08-16 2003-02-26 Arakawa Chem Ind Co Ltd 電気絶縁用樹脂組成物、電子材料用絶縁材料およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101684191A (zh) * 2009-08-27 2010-03-31 广东生益科技股份有限公司 无卤高频树脂组合物及用其制成的预浸料与层压板
CN102633990A (zh) * 2012-04-05 2012-08-15 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板
CN102794949A (zh) * 2012-08-09 2012-11-28 广东生益科技股份有限公司 覆铜板
CN103073846A (zh) * 2013-01-18 2013-05-01 腾辉电子（苏州）有限公司 无卤低介电环氧树脂组合物

Also Published As

Publication number Publication date
CN106183230A (zh) 2016-12-07

Similar Documents

Publication Publication Date Title
CN106046685B (zh) 一种高剥离强度环氧树脂组合物及其用途
CN101024715B (zh) 树脂组合物、预浸料坯和覆金属箔层的压板
CN102093670B (zh) 无卤阻燃环氧树脂组合物及使用其制作的覆铜板
CN102127289B (zh) 无卤阻燃环氧树脂组合物及使用其制作的胶膜与覆铜板
CN102311614B (zh) 树脂组合物及使用其制作的半固化片
CN101684191A (zh) 无卤高频树脂组合物及用其制成的预浸料与层压板
JP5260400B2 (ja) 多層プリント配線板を作製するための多層板
US20160244471A1 (en) Phenoxycyclotriphosphazene active ester, halogen-free resin composition and uses thereof
CN103980708A (zh) 用于集成电路的无卤阻燃热固性树脂组合物、半固化片及层压板
KR20130027519A (ko) 에폭시 수지 조성물, 프리프레그, 금속클래드 적층판 및 프린트 배선판
CN106084667B (zh) 一种高介电常数环氧树脂组合物及其用途
CN106189083B (zh) 一种玻璃纤维布增强的覆铜板
CN103980667A (zh) 集成电路用热固性树脂组合物、半固化片及层压板
CN106183230B (zh) 一种抗菌高频覆铜板
CN106065161B (zh) 一种绝缘性好的环氧树脂组合物及其用途
CN108117723A (zh) 一种热固性树脂组合物及使用它的预浸料和印制电路用层压板
EP3156451B1 (en) Halogen-free resin composition, and prepreg and laminated board for printed circuit using same
CN106065162B (zh) 一种无卤抗菌环氧树脂组合物及其用途
CN106183237B (zh) 一种环保型覆铜板的制备方法
CN106189082B (zh) 一种阻燃环氧树脂组合物及其用途
JP2004115634A (ja) プリント配線板用エポキシ樹脂組成物、プリプレグ、金属張積層板、多層プリント配線板
JP2001040069A (ja) エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔、接着シート、積層板及び多層板
JPS5874726A (ja) プリプレグの製造方法
JP2000063492A (ja) エポキシ樹脂組成物及びプリプレグ及び金属箔張り積層板
JPH01146928A (ja) フェノール樹脂銅張積層板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20180716

Address after: 239400 Industrial Park of Mingguang City, Chuzhou, Anhui

Patentee after: MINGGUANG RUIZHI ELECTRONIC TECHNOLOGY CO.,LTD.

Address before: 200092 302, 3 Lane 248 lane, Tianbao West Road, Hongkou District, Shanghai.

Patentee before: Liu Shichao

TR01 Transfer of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: A type of antibacterial high-frequency copper clad plate

Granted publication date: 20180626

Pledgee: Mingguang Company limited by guarantee financing

Pledgor: MINGGUANG RUIZHI ELECTRONIC TECHNOLOGY CO.,LTD.

Registration number: Y2024980002225

PE01 Entry into force of the registration of the contract for pledge of patent right