CN106189082B - 一种阻燃环氧树脂组合物及其用途 - Google Patents

一种阻燃环氧树脂组合物及其用途 Download PDF

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CN106189082B
CN106189082B CN201610543629.XA CN201610543629A CN106189082B CN 106189082 B CN106189082 B CN 106189082B CN 201610543629 A CN201610543629 A CN 201610543629A CN 106189082 B CN106189082 B CN 106189082B
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刘世超
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Abstract

本发明公开了一种阻燃环氧树脂组合物及其用途,所述阻燃环氧树脂组合物由下述重量份的原料制备而成:含溴双酚A型环氧树脂95‑105份、双氰胺1.5‑2.5份、2‑十一烷基咪唑0.1‑0.5份、N,N‑二甲基甲酰胺20‑80份、高介电常数填料15‑25份、阻燃剂1‑5份。本发明的阻燃环氧树脂组合物,通过合理的配比,优选出适合的高介电常数填料、阻燃剂的种类及用量,提高了介电常数、阻燃性能和剥离强度,综合性能十分优异,填料分散效果好,成本低廉,既环保又经济。

Description

一种阻燃环氧树脂组合物及其用途
技术领域
本发明涉及化工技术领域,尤其涉及一种阻燃环氧树脂组合物及其用途。
背景技术
随着电子产品的发展趋向多功能化,电子产品的零部件也不断向轻、薄、短、小等方面发展,尤其是高密度集成电路技术的广泛应用,对民用电子产品提出高性能化、高可靠性和高安全性的要求;对工业用电子产品提出技术性能良好、低成本、低能耗的要求。因此电子产品的核心材料——印制电路板(Printed Circuit Board,简称PCB)的基材覆铜板面临着更高的技术要求、更严峻的使用环境及更高的环保要求。
覆铜板(Copper Clad Laminate,简称CCL)主要用于生产印制电路板,是以纤维纸、玻璃纤维布或玻璃纤维无纺布(俗称玻璃毡)等作为增强材料,浸以树脂,单面或双面覆以铜箔,经热压而成的一种产品。现有的覆铜板由于制造原材料及制造结构的差异性,CCL基材的技术性能各有差异。
覆铜板中的树脂液一般使用热固性树脂组合物。热固性树脂是指树脂在加热、加压下或在固化剂、紫外光作用下,进行化学反应,交联固化成为不熔物质的一大类合成树脂。常用的热固性树脂有酚醛树脂、脲醛树脂、三聚氰胺-甲醛树脂、环氧树脂、不饱和树脂、聚氨酯、聚酰亚胺等。热固性树脂和固化剂、促进剂、填料等组成热固性树脂组合物,再经调制成为树脂液在覆金属箔板中使用。为了使覆金属箔板具有较好的绝缘性能,通常在树脂液中会添加填料。
环氧树脂泛指分子中含有两个或两个以上环氧基团,以脂肪族、脂环族或芳香族等有机化合物为骨架,并能够通过环氧基团在适当的化学试剂(固化剂)存在下反应生成三维网状固化物的化合物的总称。环氧树脂由于具有良好的化学稳定性、电绝缘性、耐腐蚀性、粘结性和机械强度,作为粘结剂广泛用于印制电路板(PCB)的材料中。
因此,本领域的技术人员致力于开发一种综合技术性能优良、又具备高介电常数、更低介电损耗、较高玻璃化转变温度和较高剥离强度的高介电常数复合材料。
发明内容
针对现有技术中存在的上述不足,本发明所要解决的技术问题是提供一种阻燃环氧树脂组合物及其用途。
本发明目的是通过如下技术方案实现的:
一种阻燃环氧树脂组合物,由下述重量份的原料制备而成:含溴双酚A型环氧树脂95-105份、双氰胺1.5-2.5份、2-十一烷基咪唑0.1-0.5份、N,N-二甲基甲酰胺20-80份、高介电常数填料15-25份、阻燃剂1-5份。
优选地,所述的高介电常数填料为钛酸锶、铌酸锶、锆酸锶中一种或多种的混合物。
更优选地,所述的高介电常数填料由钛酸锶、铌酸锶、锆酸锶混合而成,所述钛酸锶、铌酸锶、锆酸锶的质量比为(1-3):(1-3):(1-3)。
优选地,所述的阻燃剂为磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯中一种或多种的混合物。
更优选地,所述的阻燃剂由磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯混合而成,所述磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯的质量比为(1-3):(1-3):(1-3)。
优选地,所述的高介电常数填料的粒径为0.01-20μm。
优选地,所述的含溴双酚A型环氧树脂可以采用市售的无锡迪爱生环氧有限公司生产的含溴双酚A型环氧树脂EPICLON153-60M,溴含量为46-50%。
本发明还提供了上述阻燃环氧树脂组合物在制备覆铜板中的应用。
覆铜板的制备方法可以为:将玻璃纤维布在本发明的阻燃环氧树脂组合物中浸渍,然后在一定的温度下烘干,除去溶剂并进行半固化,得到预浸料;然后取上述预浸料一张或多张按照一定顺序叠合在一起,将铜箔分别压覆在相互叠合的预浸料两侧,在热压机中固化制得覆铜板。
本发明的阻燃环氧树脂组合物,通过合理的配比,优选出适合的高介电常数填料、阻燃剂的种类及用量,提高了介电常数、阻燃性能和剥离强度,综合性能十分优异,填料分散效果好,成本低廉,既环保又经济。
具体实施方式
下面结合实施例对本发明做进一步的说明,以下所述,仅是对本发明的较佳实施例而已,并非对本发明做其他形式的限制,任何熟悉本专业的技术人员可能利用上述揭示的技术内容加以变更为同等变化的等效实施例。凡是未脱离本发明方案内容,依据本发明的技术实质对以下实施例所做的任何简单修改或等同变化,均落在本发明的保护范围内。
实施例中各原料介绍:
含溴双酚A型环氧树脂,采用无锡迪爱生环氧有限公司生产的含溴双酚A型环氧树脂EPICLON153-60M,溴含量为46-50%,环氧当量400g/eq。
双氰胺,CAS号:461-58-5。
2-十一烷基咪唑,CAS号:16731-68-3。
N,N-二甲基甲酰胺,CAS号:68-12-2。
钛酸锶,CAS号:12060-59-2,粒径0.1μm。
铌酸锶,CAS号:12034-89-8,粒径0.1μm。
锆酸锶,CAS号:12036-39-4,粒径0.1μm。
磷酸三乙酯,CAS号:78-40-0。
三(2-氯乙基)磷酸酯,CAS号:115-96-8。
磷酸三(1-氯-2-丙基)酯,CAS号:13674-84-5。
实施例1
阻燃环氧树脂组合物原料(重量份):含溴双酚A型环氧树脂100份、双氰胺2份、2-十一烷基咪唑0.1份、N,N-二甲基甲酰胺20份、高介电常数填料18份、阻燃剂3份。
所述的高介电常数填料由钛酸锶、铌酸锶、锆酸锶按质量比为1:1:1搅拌混合均匀得到。
所述的阻燃剂由磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯按质量比为1:1:1搅拌混合均匀得到。
阻燃环氧树脂组合物制备:
将含溴双酚A型环氧树脂、N,N-二甲基甲酰胺以400转/分搅拌5分钟,然后加入双氰胺、2-十一烷基咪唑以300转/分搅拌10分钟,最后加入高介电常数填料、阻燃剂以300转/分搅拌60分钟。得到实施例1制备的阻燃环氧树脂组合物。
覆铜板制备:将玻璃纤维布(采用东莞市广鸿复合材料有限公司提供的E级玻璃纤维布106,克重为25g/m2,厚度为0.03mm)浸渍在实施例1制备的阻燃环氧树脂组合物中得到浸渍布,控制玻璃纤维布的含量为10wt%(即浸渍布中玻璃纤维布的含量为10wt%,阻燃环氧树脂组合物的含量为90wt%),然后将浸渍布置于100℃的烘箱中,烘烤2h,去除溶剂,得到预浸料;使用五张预浸料相互叠合得到基板,在基板两相面对表面覆盖30μm厚的铜层(采用东莞市桥头金佰橡塑制品厂提供的型号为TU25的铜箔)进行层压,施加压力400PSI,最低温度为50℃,最高温度为380℃,以速率为3℃/min升温,达到最高温度380℃后保持40min。得到实施例1的覆铜板。
实施例2
与实施例1基本相同,区别仅在于:所述的高介电常数填料由铌酸锶、锆酸锶按质量比为1:1搅拌混合均匀得到。得到实施例2的阻燃环氧树脂组合物和覆铜板。
实施例3
与实施例1基本相同,区别仅在于:所述的高介电常数填料由钛酸锶、锆酸锶按质量比为1:1搅拌混合均匀得到。得到实施例3的阻燃环氧树脂组合物和覆铜板。
实施例4
与实施例1基本相同,区别仅在于:所述的高介电常数填料由钛酸锶、铌酸锶按质量比为1:1搅拌混合均匀得到。得到实施例4的阻燃环氧树脂组合物和覆铜板。
实施例5
与实施例1基本相同,区别仅在于:所述的阻燃剂由三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯按质量比为1:1搅拌混合均匀得到。得到实施例5的阻燃环氧树脂组合物和覆铜板。
实施例6
与实施例1基本相同,区别仅在于:所述的阻燃剂由磷酸三乙酯、磷酸三(1-氯-2-丙基)酯按质量比为1:1搅拌混合均匀得到。得到实施例6的阻燃环氧树脂组合物和覆铜板。
实施例7
与实施例1基本相同,区别仅在于:所述的阻燃剂由磷酸三乙酯、三(2-氯乙基)磷酸酯按质量比为1:1搅拌混合均匀得到。得到实施例7的阻燃环氧树脂组合物和覆铜板。
测试例1
分别将实施例1-7制得的覆铜板的介电常数(Dk)、剥离强度、阻燃性能进行测试。测试方法如下:介电性能Dk/Df:采用平板电容法测定1GHz下板材的介电常数Dk和介电损耗Df。玻璃化转变温度Tg:按照IPC-TM-6502.4.24所规定的DMA方法进行测定。剥离强度PS:按照IPC-TM-6502.4.8方法中“热应力后”实验条件,测试板材的剥离强度。极限氧指数采用SH5706型塑料燃烧氧指数测定仪(广州信禾电子设备有限公司)按照GB/T2406-2009的方法进行测试。具体结果见表1。
表1:测试结果表
本发明实施例1的介电损耗Df测试结果为0.0072,可以同时达到高介电常数、低介电损耗、高玻璃化转变温度、高剥离强度等性能,综合性能十分优异。比较实施例1与实施例2-4,实施例1(钛酸锶、铌酸锶、锆酸锶复配)测试结果明显优于实施例2-4(钛酸锶、铌酸锶、锆酸锶中任意二者复配);比较实施例1与实施例5-7,实施例1(磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯复配)测试结果明显优于实施例5-7(磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯中任意二者复配)。
测试例2
分别将实施例1-7制得的覆铜板的耐电弧进行测试。耐电弧:按标准Q/GDSY6050-20122.5.1进行测试。具体测试结果见表2。
表2:绝缘性能测试结果表
样品 耐电弧,Kv
实施例1 148
实施例2 143
实施例3 145
实施例4 146
实施例5 141
实施例6 138
实施例7 141
比较实施例1与实施例2-4,实施例1(钛酸锶、铌酸锶、锆酸锶复配)绝缘性能明显优于实施例2-4(钛酸锶、铌酸锶、锆酸锶中任意二者复配);比较实施例1与实施例5-7,实施例1(磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯复配)绝缘性能明显优于实施例5-7(磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯中任意二者复配)。

Claims (5)

1.一种阻燃环氧树脂组合物,其特征在于:由下述重量份的原料制备而成:含溴双酚A型环氧树脂95-105份、双氰胺1.5-2.5份、2-十一烷基咪唑0.1-0.5份、N,N-二甲基甲酰胺20-80份、高介电常数填料15-25份、阻燃剂1-5份;
所述的高介电常数填料由钛酸锶、铌酸锶、锆酸锶混合而成,所述钛酸锶、铌酸锶、锆酸锶的质量比为(1-3):(1-3):(1-3)。
2.如权利要求1所述的阻燃环氧树脂组合物,其特征在于:所述的阻燃剂为磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯中一种或多种的混合物。
3.如权利要求2所述的阻燃环氧树脂组合物,其特征在于:所述的阻燃剂由磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯混合而成,所述磷酸三乙酯、三(2-氯乙基)磷酸酯、磷酸三(1-氯-2-丙基)酯的质量比为(1-3):(1-3):(1-3)。
4.如权利要求1所述的阻燃环氧树脂组合物,其特征在于:所述的高介电常数填料的粒径为0.01-20μm。
5.如权利要求1-4中任一项所述的阻燃环氧树脂组合物在制备覆铜板中的应用。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103351581A (zh) * 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种高介电常数树脂组合物及其用途
CN103992622A (zh) * 2014-06-10 2014-08-20 广东生益科技股份有限公司 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
CN105131597A (zh) * 2014-06-05 2015-12-09 广东生益科技股份有限公司 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
CN105482753A (zh) * 2015-12-29 2016-04-13 陕西生益科技有限公司 一种高cti树脂组合物及其应用

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103351581A (zh) * 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种高介电常数树脂组合物及其用途
CN105131597A (zh) * 2014-06-05 2015-12-09 广东生益科技股份有限公司 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
CN103992622A (zh) * 2014-06-10 2014-08-20 广东生益科技股份有限公司 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
CN105482753A (zh) * 2015-12-29 2016-04-13 陕西生益科技有限公司 一种高cti树脂组合物及其应用

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