CN106132106A - Preheating apparatus and using method thereof - Google Patents

Preheating apparatus and using method thereof Download PDF

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Publication number
CN106132106A
CN106132106A CN201610674254.0A CN201610674254A CN106132106A CN 106132106 A CN106132106 A CN 106132106A CN 201610674254 A CN201610674254 A CN 201610674254A CN 106132106 A CN106132106 A CN 106132106A
Authority
CN
China
Prior art keywords
heating plate
wiring board
heating
preheating apparatus
mechanical arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610674254.0A
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Chinese (zh)
Other versions
CN106132106B (en
Inventor
文东升
赵志刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU COLIN SOURCE ELECTRONIC CO Ltd
Original Assignee
SUZHOU COLIN SOURCE ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU COLIN SOURCE ELECTRONIC CO Ltd filed Critical SUZHOU COLIN SOURCE ELECTRONIC CO Ltd
Priority to CN201610674254.0A priority Critical patent/CN106132106B/en
Publication of CN106132106A publication Critical patent/CN106132106A/en
Application granted granted Critical
Publication of CN106132106B publication Critical patent/CN106132106B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0195Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111Preheating, e.g. before soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Abstract

The invention discloses a kind of preheating apparatus, for heating a wiring board, described preheating apparatus includes a heating arrangement, described heating arrangement includes a tool and a workbench, described tool includes at least one mechanical arm and one first heating plate, described mechanical arm is movably installed in described first heating plate, described workbench includes one second heating plate, described mechanical arm can move and capture described wiring board relative to described first heating plate, described first heating plate and described second heating plate are generated heat and conflict with described wiring board both sides respectively, to heat described wiring board.The invention still further relates to the using method of above-mentioned preheating apparatus.

Description

Preheating apparatus and using method thereof
Technical field
The present invention relates to a kind of preheating apparatus, particularly relate to a kind of can repeatedly heat and cool down preheating of wiring board Device.
Background technology
Can wiring board in the fabrication process, need to test the property that keep good in temperature adverse circumstances jumpy Energy.The especially through hole on wiring board and the blind hole contracting when high temperature and low temperature rises whether affect wiring board performance.In test Before, wiring board through repeatedly heating and need to cool down, to simulate use state.Existing preheating apparatus cannot meet and repeatedly heats And the requirement of cooling, need a dead lift.
Summary of the invention
In order to overcome the deficiencies in the prior art, it is an object of the invention to provide one can repeatedly heat and cool down circuit The preheating apparatus of plate.
The purpose of the present invention realizes by the following technical solutions:
A kind of preheating apparatus, for heating one wiring board, described preheating apparatus includes a heating arrangement, described heating Structure includes a tool and a workbench, and described tool includes at least one mechanical arm and one first heating plate, described mechanical hand Arm is movably installed in described first heating plate, and described workbench includes one second heating plate, and described mechanical arm can be relatively described First heating plate moves and captures described wiring board, described first heating plate and described second heating plate heating and respectively with described Conflict in wiring board both sides, to heat described wiring board.
Preferably, described tool also includes that one first heat block, described first heat block are fixed on described first heating plate Make described first heating plate heating.
Preferably, described at least one mechanical arm also includes that an adsorption section, described adsorption section utilize vacuum principle to adsorb institute Stating wiring board makes described wiring board move along a first direction.
Preferably, described first direction is perpendicular to described first heating plate.
Preferably, described workbench includes that one second heat block, described second heat block are fixed on described second heating plate Make described second heating plate heating.
Preferably, described preheating apparatus also includes that a refrigeration structure, described refrigeration structure are that a fan is described with cooling Wiring board.
Preferably, described first heating plate is made up of aluminium sheet.
Preferably, described second heating plate is made up of aluminium sheet.
The using method of a kind of preheating apparatus, comprises the following steps: step one, described wiring board is positioned over described work In station;Step 2, described mechanical arm move to capture described wiring board towards a first direction relative to described first heating plate; Step 3, described first heating plate heating, the most described first heating plate of described mechanical arm towards one with described first direction phase Anti-second direction moves, until conflicting with described first heating plate in described wiring board side;Step 4, described second heating plate Heating is also moved until conflicting with described wiring board opposite side relative to described first heating plate towards described second direction, now described Wiring board both sides are by described first heating plate and described second heater plate;Step 5, described first heating plate and described Two heating plates stop heating, and described second heating plate moves back in situ towards described first direction;Step 6, described mechanical arm Moving towards described first direction relative to described first heating plate, make described wiring board unsettled, a fan makes described wiring board lower the temperature.
Compared to existing technology, the beneficial effects of the present invention is:
The heating arrangement of preheating apparatus of the present invention makes wiring board by the first heating plate by mechanical arm absorption wiring board And second heater plate, make wiring board cool down by refrigeration structure, thus wiring board just can be repeated many at a station Secondary heating and cooling, make test reliable.
Accompanying drawing explanation
Fig. 1 is an axonometric chart of preheating apparatus of the present invention.
Fig. 2 is a structural representation of a heating arrangement of the preheating apparatus of Fig. 1.
Fig. 3 is a use view of the heating arrangement of Fig. 2.
Fig. 4 is another use view of the heating arrangement of Fig. 2.
Fig. 5 is the another use view of the heating arrangement of Fig. 2.
Fig. 6 is a use view of the preheating apparatus of Fig. 1.
In figure: 100, preheating apparatus;10, refrigeration structure;20, heating arrangement;22, tool;220, erecting bed;222, machine Tool arm;2220, adsorption section;224, the first heating plate;226, the first heat block;24, workbench;240, the second heating plate; 242, the second heat block;200, wiring board.
Detailed description of the invention
Referring to Fig. 1, a kind of preheating apparatus 100 is for repeatedly heating a wiring board 200 and cool down, described pre- Heater 100 includes refrigeration structure 10 and a heating arrangement 20.In one embodiment, described refrigeration structure 10 is a wind Fan.
Described heating arrangement 20 includes tool 22 and a workbench 24.Described tool 22 includes an erecting bed 220, some Mechanical arm 222,1 first heating plate 224 and one being fixed on described erecting bed 220 is fixing and described first heating plate 224 First heat block 226.Each described mechanical arm 222 is movably installed in described first heating plate 224.Each described mechanical arm 222 include an adsorption section 2220.Described some mechanical arms 222 are parallel to each other.Each described mechanical arm 222 is approximately perpendicular to Described first heating plate 224.In one embodiment, described first heating plate 224 is made of aluminum.
Described workbench 24 includes that one second heating plate 240 and is fixed on the second heating of described second heating plate 240 Block 242.Described second heating plate 240 is roughly parallel to described first heating plate 224.In one embodiment, described second heating Plate 240 is made of aluminum.
Please continue to refer to Fig. 2 to Fig. 6, when using described preheating apparatus, comprise the following steps: step one, by described line Road plate 200 is positioned on described workbench 24;The most described first heating plate 224 of step 2, described mechanical arm 222 is towards one One direction moves to capture described wiring board 200;Step 3, described first heating plate 224 are generated heat, described mechanical arm 222 phase Described first heating plate 224 is moved towards a second direction opposite to the first direction, until described wiring board 200 side Conflict with described first heating plate 224;Step 4, described second heating plate 240 heating the most described first heating plate 224 court Described second direction moves until conflicting with described wiring board 200 opposite side, and the most described wiring board 200 both sides are by described first Heating plate 224 and described second heating plate 240 heat;Step 5, described first heating plate 224 and described second heating plate 240 Stopping heating, described second heating plate 240 moves back in situ towards described first direction;Step 6, described mechanical arm 222 phase Moving described first heating plate 224 towards described first direction, make described wiring board 200 unsettled, described refrigeration structure 10 makes institute State wiring board 200 to lower the temperature.Repeat the above steps, just can make described wiring board 200 repeatedly heat and cool down, and reaches wanting before test Ask.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various Corresponding change and deformation, and all these change and deformation all should belong to the protection domain of the claims in the present invention Within.

Claims (9)

1. a preheating apparatus, for heating one wiring board, described preheating apparatus includes a heating arrangement, and its feature exists In: described heating arrangement includes a tool and a workbench, and described tool includes at least one mechanical arm and one first heating plate, Described mechanical arm is movably installed in described first heating plate, and described workbench includes one second heating plate, described mechanical arm Can move and capture described wiring board, described first heating plate and described second heating plate relative to described first heating plate to generate heat also Conflict with described wiring board both sides, to heat described wiring board respectively.
Preheating apparatus the most according to claim 1, it is characterised in that: described tool also includes one first heat block, institute State the first heat block be fixed on described first heating plate make described first heating plate heating.
Preheating apparatus the most according to claim 1, it is characterised in that: described at least one mechanical arm also includes an absorption Portion, described adsorption section utilizes the vacuum principle described wiring board of absorption to make described wiring board move along a first direction.
Preheating apparatus the most according to claim 2, it is characterised in that: described first direction is perpendicular to described first heating Plate.
Preheating apparatus the most according to claim 1, it is characterised in that: described workbench includes one second heat block, institute State the second heat block be fixed on described second heating plate make described second heating plate heating.
Preheating apparatus the most according to claim 1, it is characterised in that: described preheating apparatus also includes a refrigeration knot Structure, described refrigeration structure is that a fan is to cool down described wiring board.
Preheating apparatus the most according to claim 1, it is characterised in that: described first heating plate is made up of aluminium sheet.
Preheating apparatus the most according to claim 1, it is characterised in that: described second heating plate is made up of aluminium sheet.
9. the using method of a preheating apparatus as claimed in claim 1, it is characterised in that: comprise the following steps:
Step one, described wiring board is positioned on described workbench;
Step 2, described mechanical arm move to capture described wiring board towards a first direction relative to described first heating plate;
Step 3, described first heating plate heating, the most described first heating plate of described mechanical arm towards one with described first party Move to contrary second direction, until conflicting with described first heating plate in described wiring board side;
Step 4, described second heating plate heating are also moved until with described relative to described first heating plate towards described second direction Wiring board opposite side is conflicted, and the most described wiring board both sides are by described first heating plate and described second heater plate;
Step 5, described first heating plate and described second heating plate stop heating, and described second heating plate is towards described first party To moving back in situ;
Step 6, described mechanical arm move towards described first direction relative to described first heating plate, make described wiring board unsettled, One fan makes described wiring board lower the temperature.
CN201610674254.0A 2016-08-16 2016-08-16 Preheating apparatus and its application method Active CN106132106B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610674254.0A CN106132106B (en) 2016-08-16 2016-08-16 Preheating apparatus and its application method

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Application Number Priority Date Filing Date Title
CN201610674254.0A CN106132106B (en) 2016-08-16 2016-08-16 Preheating apparatus and its application method

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CN106132106A true CN106132106A (en) 2016-11-16
CN106132106B CN106132106B (en) 2019-01-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117031257A (en) * 2023-10-10 2023-11-10 深圳市百能达电子有限公司 Electronic product mainboard detection device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087944A (en) * 2002-08-28 2004-03-18 Denso Corp Manufacturing method of logomark-bearing board
CN2663154Y (en) * 2003-12-02 2004-12-15 上海申贝办公机械有限公司办公设备分公司 Automatic hot pressing fault resetting device for hot-pressing plastic-pipe binding machine
CN202174739U (en) * 2011-04-22 2012-03-28 苏州市科林源电子有限公司 PCB (printed circuit board) hot-press jig
CN206136469U (en) * 2016-08-16 2017-04-26 苏州市科林源电子有限公司 Preheating device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087944A (en) * 2002-08-28 2004-03-18 Denso Corp Manufacturing method of logomark-bearing board
CN2663154Y (en) * 2003-12-02 2004-12-15 上海申贝办公机械有限公司办公设备分公司 Automatic hot pressing fault resetting device for hot-pressing plastic-pipe binding machine
CN202174739U (en) * 2011-04-22 2012-03-28 苏州市科林源电子有限公司 PCB (printed circuit board) hot-press jig
CN206136469U (en) * 2016-08-16 2017-04-26 苏州市科林源电子有限公司 Preheating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117031257A (en) * 2023-10-10 2023-11-10 深圳市百能达电子有限公司 Electronic product mainboard detection device
CN117031257B (en) * 2023-10-10 2023-12-08 深圳市百能达电子有限公司 Electronic product mainboard detection device

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