CN106132106A - Preheating apparatus and using method thereof - Google Patents
Preheating apparatus and using method thereof Download PDFInfo
- Publication number
- CN106132106A CN106132106A CN201610674254.0A CN201610674254A CN106132106A CN 106132106 A CN106132106 A CN 106132106A CN 201610674254 A CN201610674254 A CN 201610674254A CN 106132106 A CN106132106 A CN 106132106A
- Authority
- CN
- China
- Prior art keywords
- heating plate
- wiring board
- heating
- preheating apparatus
- mechanical arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of preheating apparatus, for heating a wiring board, described preheating apparatus includes a heating arrangement, described heating arrangement includes a tool and a workbench, described tool includes at least one mechanical arm and one first heating plate, described mechanical arm is movably installed in described first heating plate, described workbench includes one second heating plate, described mechanical arm can move and capture described wiring board relative to described first heating plate, described first heating plate and described second heating plate are generated heat and conflict with described wiring board both sides respectively, to heat described wiring board.The invention still further relates to the using method of above-mentioned preheating apparatus.
Description
Technical field
The present invention relates to a kind of preheating apparatus, particularly relate to a kind of can repeatedly heat and cool down preheating of wiring board
Device.
Background technology
Can wiring board in the fabrication process, need to test the property that keep good in temperature adverse circumstances jumpy
Energy.The especially through hole on wiring board and the blind hole contracting when high temperature and low temperature rises whether affect wiring board performance.In test
Before, wiring board through repeatedly heating and need to cool down, to simulate use state.Existing preheating apparatus cannot meet and repeatedly heats
And the requirement of cooling, need a dead lift.
Summary of the invention
In order to overcome the deficiencies in the prior art, it is an object of the invention to provide one can repeatedly heat and cool down circuit
The preheating apparatus of plate.
The purpose of the present invention realizes by the following technical solutions:
A kind of preheating apparatus, for heating one wiring board, described preheating apparatus includes a heating arrangement, described heating
Structure includes a tool and a workbench, and described tool includes at least one mechanical arm and one first heating plate, described mechanical hand
Arm is movably installed in described first heating plate, and described workbench includes one second heating plate, and described mechanical arm can be relatively described
First heating plate moves and captures described wiring board, described first heating plate and described second heating plate heating and respectively with described
Conflict in wiring board both sides, to heat described wiring board.
Preferably, described tool also includes that one first heat block, described first heat block are fixed on described first heating plate
Make described first heating plate heating.
Preferably, described at least one mechanical arm also includes that an adsorption section, described adsorption section utilize vacuum principle to adsorb institute
Stating wiring board makes described wiring board move along a first direction.
Preferably, described first direction is perpendicular to described first heating plate.
Preferably, described workbench includes that one second heat block, described second heat block are fixed on described second heating plate
Make described second heating plate heating.
Preferably, described preheating apparatus also includes that a refrigeration structure, described refrigeration structure are that a fan is described with cooling
Wiring board.
Preferably, described first heating plate is made up of aluminium sheet.
Preferably, described second heating plate is made up of aluminium sheet.
The using method of a kind of preheating apparatus, comprises the following steps: step one, described wiring board is positioned over described work
In station;Step 2, described mechanical arm move to capture described wiring board towards a first direction relative to described first heating plate;
Step 3, described first heating plate heating, the most described first heating plate of described mechanical arm towards one with described first direction phase
Anti-second direction moves, until conflicting with described first heating plate in described wiring board side;Step 4, described second heating plate
Heating is also moved until conflicting with described wiring board opposite side relative to described first heating plate towards described second direction, now described
Wiring board both sides are by described first heating plate and described second heater plate;Step 5, described first heating plate and described
Two heating plates stop heating, and described second heating plate moves back in situ towards described first direction;Step 6, described mechanical arm
Moving towards described first direction relative to described first heating plate, make described wiring board unsettled, a fan makes described wiring board lower the temperature.
Compared to existing technology, the beneficial effects of the present invention is:
The heating arrangement of preheating apparatus of the present invention makes wiring board by the first heating plate by mechanical arm absorption wiring board
And second heater plate, make wiring board cool down by refrigeration structure, thus wiring board just can be repeated many at a station
Secondary heating and cooling, make test reliable.
Accompanying drawing explanation
Fig. 1 is an axonometric chart of preheating apparatus of the present invention.
Fig. 2 is a structural representation of a heating arrangement of the preheating apparatus of Fig. 1.
Fig. 3 is a use view of the heating arrangement of Fig. 2.
Fig. 4 is another use view of the heating arrangement of Fig. 2.
Fig. 5 is the another use view of the heating arrangement of Fig. 2.
Fig. 6 is a use view of the preheating apparatus of Fig. 1.
In figure: 100, preheating apparatus;10, refrigeration structure;20, heating arrangement;22, tool;220, erecting bed;222, machine
Tool arm;2220, adsorption section;224, the first heating plate;226, the first heat block;24, workbench;240, the second heating plate;
242, the second heat block;200, wiring board.
Detailed description of the invention
Referring to Fig. 1, a kind of preheating apparatus 100 is for repeatedly heating a wiring board 200 and cool down, described pre-
Heater 100 includes refrigeration structure 10 and a heating arrangement 20.In one embodiment, described refrigeration structure 10 is a wind
Fan.
Described heating arrangement 20 includes tool 22 and a workbench 24.Described tool 22 includes an erecting bed 220, some
Mechanical arm 222,1 first heating plate 224 and one being fixed on described erecting bed 220 is fixing and described first heating plate 224
First heat block 226.Each described mechanical arm 222 is movably installed in described first heating plate 224.Each described mechanical arm
222 include an adsorption section 2220.Described some mechanical arms 222 are parallel to each other.Each described mechanical arm 222 is approximately perpendicular to
Described first heating plate 224.In one embodiment, described first heating plate 224 is made of aluminum.
Described workbench 24 includes that one second heating plate 240 and is fixed on the second heating of described second heating plate 240
Block 242.Described second heating plate 240 is roughly parallel to described first heating plate 224.In one embodiment, described second heating
Plate 240 is made of aluminum.
Please continue to refer to Fig. 2 to Fig. 6, when using described preheating apparatus, comprise the following steps: step one, by described line
Road plate 200 is positioned on described workbench 24;The most described first heating plate 224 of step 2, described mechanical arm 222 is towards one
One direction moves to capture described wiring board 200;Step 3, described first heating plate 224 are generated heat, described mechanical arm 222 phase
Described first heating plate 224 is moved towards a second direction opposite to the first direction, until described wiring board 200 side
Conflict with described first heating plate 224;Step 4, described second heating plate 240 heating the most described first heating plate 224 court
Described second direction moves until conflicting with described wiring board 200 opposite side, and the most described wiring board 200 both sides are by described first
Heating plate 224 and described second heating plate 240 heat;Step 5, described first heating plate 224 and described second heating plate 240
Stopping heating, described second heating plate 240 moves back in situ towards described first direction;Step 6, described mechanical arm 222 phase
Moving described first heating plate 224 towards described first direction, make described wiring board 200 unsettled, described refrigeration structure 10 makes institute
State wiring board 200 to lower the temperature.Repeat the above steps, just can make described wiring board 200 repeatedly heat and cool down, and reaches wanting before test
Ask.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various
Corresponding change and deformation, and all these change and deformation all should belong to the protection domain of the claims in the present invention
Within.
Claims (9)
1. a preheating apparatus, for heating one wiring board, described preheating apparatus includes a heating arrangement, and its feature exists
In: described heating arrangement includes a tool and a workbench, and described tool includes at least one mechanical arm and one first heating plate,
Described mechanical arm is movably installed in described first heating plate, and described workbench includes one second heating plate, described mechanical arm
Can move and capture described wiring board, described first heating plate and described second heating plate relative to described first heating plate to generate heat also
Conflict with described wiring board both sides, to heat described wiring board respectively.
Preheating apparatus the most according to claim 1, it is characterised in that: described tool also includes one first heat block, institute
State the first heat block be fixed on described first heating plate make described first heating plate heating.
Preheating apparatus the most according to claim 1, it is characterised in that: described at least one mechanical arm also includes an absorption
Portion, described adsorption section utilizes the vacuum principle described wiring board of absorption to make described wiring board move along a first direction.
Preheating apparatus the most according to claim 2, it is characterised in that: described first direction is perpendicular to described first heating
Plate.
Preheating apparatus the most according to claim 1, it is characterised in that: described workbench includes one second heat block, institute
State the second heat block be fixed on described second heating plate make described second heating plate heating.
Preheating apparatus the most according to claim 1, it is characterised in that: described preheating apparatus also includes a refrigeration knot
Structure, described refrigeration structure is that a fan is to cool down described wiring board.
Preheating apparatus the most according to claim 1, it is characterised in that: described first heating plate is made up of aluminium sheet.
Preheating apparatus the most according to claim 1, it is characterised in that: described second heating plate is made up of aluminium sheet.
9. the using method of a preheating apparatus as claimed in claim 1, it is characterised in that: comprise the following steps:
Step one, described wiring board is positioned on described workbench;
Step 2, described mechanical arm move to capture described wiring board towards a first direction relative to described first heating plate;
Step 3, described first heating plate heating, the most described first heating plate of described mechanical arm towards one with described first party
Move to contrary second direction, until conflicting with described first heating plate in described wiring board side;
Step 4, described second heating plate heating are also moved until with described relative to described first heating plate towards described second direction
Wiring board opposite side is conflicted, and the most described wiring board both sides are by described first heating plate and described second heater plate;
Step 5, described first heating plate and described second heating plate stop heating, and described second heating plate is towards described first party
To moving back in situ;
Step 6, described mechanical arm move towards described first direction relative to described first heating plate, make described wiring board unsettled,
One fan makes described wiring board lower the temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610674254.0A CN106132106B (en) | 2016-08-16 | 2016-08-16 | Preheating apparatus and its application method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610674254.0A CN106132106B (en) | 2016-08-16 | 2016-08-16 | Preheating apparatus and its application method |
Publications (2)
Publication Number | Publication Date |
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CN106132106A true CN106132106A (en) | 2016-11-16 |
CN106132106B CN106132106B (en) | 2019-01-18 |
Family
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Family Applications (1)
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CN201610674254.0A Active CN106132106B (en) | 2016-08-16 | 2016-08-16 | Preheating apparatus and its application method |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117031257A (en) * | 2023-10-10 | 2023-11-10 | 深圳市百能达电子有限公司 | Electronic product mainboard detection device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004087944A (en) * | 2002-08-28 | 2004-03-18 | Denso Corp | Manufacturing method of logomark-bearing board |
CN2663154Y (en) * | 2003-12-02 | 2004-12-15 | 上海申贝办公机械有限公司办公设备分公司 | Automatic hot pressing fault resetting device for hot-pressing plastic-pipe binding machine |
CN202174739U (en) * | 2011-04-22 | 2012-03-28 | 苏州市科林源电子有限公司 | PCB (printed circuit board) hot-press jig |
CN206136469U (en) * | 2016-08-16 | 2017-04-26 | 苏州市科林源电子有限公司 | Preheating device |
-
2016
- 2016-08-16 CN CN201610674254.0A patent/CN106132106B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004087944A (en) * | 2002-08-28 | 2004-03-18 | Denso Corp | Manufacturing method of logomark-bearing board |
CN2663154Y (en) * | 2003-12-02 | 2004-12-15 | 上海申贝办公机械有限公司办公设备分公司 | Automatic hot pressing fault resetting device for hot-pressing plastic-pipe binding machine |
CN202174739U (en) * | 2011-04-22 | 2012-03-28 | 苏州市科林源电子有限公司 | PCB (printed circuit board) hot-press jig |
CN206136469U (en) * | 2016-08-16 | 2017-04-26 | 苏州市科林源电子有限公司 | Preheating device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117031257A (en) * | 2023-10-10 | 2023-11-10 | 深圳市百能达电子有限公司 | Electronic product mainboard detection device |
CN117031257B (en) * | 2023-10-10 | 2023-12-08 | 深圳市百能达电子有限公司 | Electronic product mainboard detection device |
Also Published As
Publication number | Publication date |
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CN106132106B (en) | 2019-01-18 |
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