CN206042662U - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
CN206042662U
CN206042662U CN201621065466.0U CN201621065466U CN206042662U CN 206042662 U CN206042662 U CN 206042662U CN 201621065466 U CN201621065466 U CN 201621065466U CN 206042662 U CN206042662 U CN 206042662U
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China
Prior art keywords
heat
transfer plate
heat transfer
heat pipe
pipe
Prior art date
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Active
Application number
CN201621065466.0U
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Chinese (zh)
Inventor
单建兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Prologis Communication Technology Suzhou Co Ltd
Original Assignee
Rosenberger Technology Kunshan Co Ltd
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Priority to CN201621065466.0U priority Critical patent/CN206042662U/en
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Abstract

The utility model discloses a heat dissipation device, including heat radiation fins, heat collection block, heat transfer plate and complex root heat pipe, the heat pipe setting is on the heat transfer plate, and it has heat collection block to press above the heat pipe again, and heat pipe one end is connected with the heat collection block contact, and the other end extends to in the heat radiation fins to with the heat radiation fins hot link, heat radiation fins passes through the heat dissipation of fan compulsory convection, the utility model discloses an after increasing heat transfer path, after a route directly became invalid in heat pipe cooling, other heat pipe also can normally be worked, and the reliability obtains guaranteeing, did to assist through the heat transfer plate and conducted heat, and can play supported effects, and the heat dissipation device structure is more firm.

Description

A kind of heat abstractor
Technical field
This utility model is related to a kind of Cooling Technology of Electronic Device, more particularly, to a kind of heat abstractor.
Background technology
With electronics, the fast development of power technology, the modularity and integrated level of electronic component are increased substantially, integrated level Higher, the heat that electronic component is produced is higher, if can not disperse these heats in time, the reliability of electronic device works Will be greatly lowered, or even occur normally running, for guaranteeing that heat-generating electronic elements normally can run, generally in heating electric Heat abstractor is installed in subcomponent, the heat produced by which is discharged.
Fig. 1 shows a kind of existing heat-pipe radiating apparatus 8, including radiating fin 2, fan 3, heat pipe 4 and heat-collecting block 5, heat Pipe 4 has evaporator section 40, adiabatic section 42 and condensation segment 44.Evaporator section 40 is embedded in the groove 50 on heat-collecting block 5, and condensation segment 44 is then worn In the through hole 20 of radiating fin 2, fan 3 is installed on the side of radiating fin 2, and during use, heat-collecting block 5 is such as electric with thermal source The directly contacts such as subcomponent, after the evaporator section 40 of heat pipe 4 absorbs heat, its internal liquid working media for filling is vaporized, the work of vaporization Medium is spread from 40 Jing adiabatic sections 42 of evaporator section to condensation segment 44, and condensation segment 44 transfers heat to the radiating fin being attached thereto 2, subsequently heat is blown away by fan 3, the working media being now in condensation segment 44 is condensed liquefaction, the working media of liquefaction Evaporator section 40 is back to by the capillary force effect of the capillary structure being attached on 4 inwall of heat pipe, so moving in circles, it is right to realize The radiating of thermal source.
During the program plays effective radiating effect, but the technology to electronic component, heat abstractor only has a heat pipe path Heat transfer to fin, as heat pipe is a high vacuum and redox arrangement, in work, can there is asking for failure Topic, once heat pipe failure, whole cooling system operational failure, affect electronic component normally to run.
In addition, prior art can adapt to the radiating of general electronic component, for extensive electronic device is needed with more The radiator of high cooling efficiency, this radiator with high cooling efficiency become insider's problem demanding prompt solution it One.
Utility model content
The purpose of this utility model is the defect for overcoming prior art, there is provided a kind of heat abstractor, this utility model knot Structure is reliable and stable, good heat dissipation effect, and is applicable to high-power electronic device radiating.
For achieving the above object, the utility model proposes following technical scheme:A kind of heat abstractor, including heat-collecting block, dissipates Hot fin, fan and complex root heat pipe, the contact of described heat pipe one end and the heat-collecting block are connected, the other end of the heat pipe and institute Radiating fin connection is stated, the fan is oppositely arranged with the radiating fin.
Preferably, the heat abstractor also includes heat transfer plate, and described in complex root, heat pipe is supported by the heat transfer plate.
Preferably, the heat transfer plate includes the first heat transfer plate and the second heat transfer plate, first heat transfer plate and described second Heat transfer plate is fixedly connected, and on first heat transfer plate, second heat transfer plate extends to the radiating to complex root heat pipe standoff On fin.
Preferably, first heat transfer plate and second heat transfer plate are made into integration.
The beneficial effects of the utility model are:
1st, by increasing heat-transfer path, the reliability of radiating can be improved, radiating effect can be improved again.
2nd, auxiliary heat transfer is made by heat transfer plate, plays support effect to heat abstractor, structure is more consolidated.
Description of the drawings
Fig. 1 is the structural representation of prior art;
Fig. 2 is construction for heat radiating device schematic diagram in this utility model.
This utility model reference:
11st, heat pipe, 12, radiating fin, 13, heat-collecting block, the 14, first heat transfer plate, the 15, second heat transfer plate, 16, fan.
Specific embodiment
Below in conjunction with accompanying drawing of the present utility model, the technical scheme of this utility model embodiment is carried out clear, complete Description.
As shown in Fig. 2 the heat abstractor includes complex root heat pipe 11, radiating fin 12, heat-collecting block 13 and heat transfer plate, heat Pipe 11 is arranged on heat transfer plate, and heat transfer plate plays a part of to support and auxiliary heat conduction, then above heat pipe 11 is pressed with heat-collecting block 13, 11 one end of the heat pipe is connected with the contact of the heat-collecting block 13, and the other end of the heat pipe 11 extends to the radiating fin 12 It is interior, and thermally coupled is formed with radiating fin, the heat pipe plays a part of heat transfer, and the radiating fin 12 passes through fan Final 16 system Heat loss through convection.This utility model one side is after increasing heat-transfer path, after in heat pipe heat radiation, paths fail, other Heat pipe also can normal work, reliability is guaranteed, and on the other hand, makees auxiliary heat transfer by heat transfer plate, and can play support effect Really, construction for heat radiating device is more consolidated.
Specifically, the heat transfer plate includes the first heat transfer plate 14 and the second heat transfer plate 15, first heat transfer plate and institute State the second heat transfer plate to be made into integration by copper material, also can be connected by modes such as welding, bolt fixations, complex root heat pipe 11 Support arranges extension on first heat transfer plate 14 on second heat transfer plate 15, extension extends to the radiating fin On, fan 16 is oppositely arranged with the radiating fin, and fan 16 can also play radiating by heat transfer plate during air-supply Effect.
After increasing heat-transfer path, integral heat sink effect more preferably, by equation below it is inferred that r < r1, r < r2, according to heat Resistance network connection in series-parallel principle, thermal resistance r of heat transfer process are expressed as:
By a plurality of sinking path of this utility model, radiating effect is substantially increased, in practice it has proved that this utility model structure In heat-collecting block be applicable not only to the heat collection of common electronic products (such as CPU), be also applied for high-power electronic device radiating, Guarantee radiating effect.
Technology contents of the present utility model and technical characteristic have revealed that as above, but those of ordinary skill in the art still may be used A variety of replacements and modification without departing substantially from this utility model spirit can be made based on teaching of the present utility model and announcement, therefore, this Utility model protection scope should be not limited to the content disclosed in embodiment, and should include various without departing substantially from replacement of the present utility model And modification, and covered by present patent application claim.

Claims (4)

1. a kind of heat abstractor, it is characterised in that the heat abstractor includes heat-collecting block, radiating fin, fan and complex root heat Pipe, described heat pipe one end are connected with heat-collecting block contact, and the other end of the heat pipe is connected with the radiating fin, the wind Fan is oppositely arranged with the radiating fin.
2. heat abstractor according to claim 1, it is characterised in that the heat abstractor also includes heat transfer plate, complex root The heat pipe is supported by the heat transfer plate.
3. heat abstractor according to claim 2, it is characterised in that the heat transfer plate includes that the first heat transfer plate and second is passed Hot plate, first heat transfer plate are fixedly connected with second heat transfer plate, complex root heat pipe standoff on first heat transfer plate, Second heat transfer plate is extended on the radiating fin.
4. heat abstractor according to claim 3, it is characterised in that first heat transfer plate and second heat transfer plate one System into.
CN201621065466.0U 2016-09-20 2016-09-20 Heat dissipation device Active CN206042662U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621065466.0U CN206042662U (en) 2016-09-20 2016-09-20 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621065466.0U CN206042662U (en) 2016-09-20 2016-09-20 Heat dissipation device

Publications (1)

Publication Number Publication Date
CN206042662U true CN206042662U (en) 2017-03-22

Family

ID=58295856

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621065466.0U Active CN206042662U (en) 2016-09-20 2016-09-20 Heat dissipation device

Country Status (1)

Country Link
CN (1) CN206042662U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109257904A (en) * 2017-07-13 2019-01-22 罗森伯格技术(昆山)有限公司 A kind of radiator and cabinet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109257904A (en) * 2017-07-13 2019-01-22 罗森伯格技术(昆山)有限公司 A kind of radiator and cabinet

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Kunshan Dianshan Lake Town City Suzhou city Jiangsu province 215345 Shen road, No. 6

Patentee after: Rosenberg Technology Co.,Ltd.

Address before: Kunshan Dianshan Lake Town City Suzhou city Jiangsu province 215345 Shen road, No. 6

Patentee before: ROSENBERGER TECHNOLOGY ( KUNSHAN) Co.,Ltd.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 215300 No.6 Shen'an Road, Dianshanhu Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee after: ProLogis Communication Technology (Suzhou) Co.,Ltd.

Address before: 215345 No. 6 Shen'an Road, Dianshan Lake Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: Rosenberg Technology Co.,Ltd.