A kind of heat abstractor
Technical field
This utility model is related to a kind of Cooling Technology of Electronic Device, more particularly, to a kind of heat abstractor.
Background technology
With electronics, the fast development of power technology, the modularity and integrated level of electronic component are increased substantially, integrated level
Higher, the heat that electronic component is produced is higher, if can not disperse these heats in time, the reliability of electronic device works
Will be greatly lowered, or even occur normally running, for guaranteeing that heat-generating electronic elements normally can run, generally in heating electric
Heat abstractor is installed in subcomponent, the heat produced by which is discharged.
Fig. 1 shows a kind of existing heat-pipe radiating apparatus 8, including radiating fin 2, fan 3, heat pipe 4 and heat-collecting block 5, heat
Pipe 4 has evaporator section 40, adiabatic section 42 and condensation segment 44.Evaporator section 40 is embedded in the groove 50 on heat-collecting block 5, and condensation segment 44 is then worn
In the through hole 20 of radiating fin 2, fan 3 is installed on the side of radiating fin 2, and during use, heat-collecting block 5 is such as electric with thermal source
The directly contacts such as subcomponent, after the evaporator section 40 of heat pipe 4 absorbs heat, its internal liquid working media for filling is vaporized, the work of vaporization
Medium is spread from 40 Jing adiabatic sections 42 of evaporator section to condensation segment 44, and condensation segment 44 transfers heat to the radiating fin being attached thereto
2, subsequently heat is blown away by fan 3, the working media being now in condensation segment 44 is condensed liquefaction, the working media of liquefaction
Evaporator section 40 is back to by the capillary force effect of the capillary structure being attached on 4 inwall of heat pipe, so moving in circles, it is right to realize
The radiating of thermal source.
During the program plays effective radiating effect, but the technology to electronic component, heat abstractor only has a heat pipe path
Heat transfer to fin, as heat pipe is a high vacuum and redox arrangement, in work, can there is asking for failure
Topic, once heat pipe failure, whole cooling system operational failure, affect electronic component normally to run.
In addition, prior art can adapt to the radiating of general electronic component, for extensive electronic device is needed with more
The radiator of high cooling efficiency, this radiator with high cooling efficiency become insider's problem demanding prompt solution it
One.
Utility model content
The purpose of this utility model is the defect for overcoming prior art, there is provided a kind of heat abstractor, this utility model knot
Structure is reliable and stable, good heat dissipation effect, and is applicable to high-power electronic device radiating.
For achieving the above object, the utility model proposes following technical scheme:A kind of heat abstractor, including heat-collecting block, dissipates
Hot fin, fan and complex root heat pipe, the contact of described heat pipe one end and the heat-collecting block are connected, the other end of the heat pipe and institute
Radiating fin connection is stated, the fan is oppositely arranged with the radiating fin.
Preferably, the heat abstractor also includes heat transfer plate, and described in complex root, heat pipe is supported by the heat transfer plate.
Preferably, the heat transfer plate includes the first heat transfer plate and the second heat transfer plate, first heat transfer plate and described second
Heat transfer plate is fixedly connected, and on first heat transfer plate, second heat transfer plate extends to the radiating to complex root heat pipe standoff
On fin.
Preferably, first heat transfer plate and second heat transfer plate are made into integration.
The beneficial effects of the utility model are:
1st, by increasing heat-transfer path, the reliability of radiating can be improved, radiating effect can be improved again.
2nd, auxiliary heat transfer is made by heat transfer plate, plays support effect to heat abstractor, structure is more consolidated.
Description of the drawings
Fig. 1 is the structural representation of prior art;
Fig. 2 is construction for heat radiating device schematic diagram in this utility model.
This utility model reference:
11st, heat pipe, 12, radiating fin, 13, heat-collecting block, the 14, first heat transfer plate, the 15, second heat transfer plate, 16, fan.
Specific embodiment
Below in conjunction with accompanying drawing of the present utility model, the technical scheme of this utility model embodiment is carried out clear, complete
Description.
As shown in Fig. 2 the heat abstractor includes complex root heat pipe 11, radiating fin 12, heat-collecting block 13 and heat transfer plate, heat
Pipe 11 is arranged on heat transfer plate, and heat transfer plate plays a part of to support and auxiliary heat conduction, then above heat pipe 11 is pressed with heat-collecting block 13,
11 one end of the heat pipe is connected with the contact of the heat-collecting block 13, and the other end of the heat pipe 11 extends to the radiating fin 12
It is interior, and thermally coupled is formed with radiating fin, the heat pipe plays a part of heat transfer, and the radiating fin 12 passes through fan Final 16 system
Heat loss through convection.This utility model one side is after increasing heat-transfer path, after in heat pipe heat radiation, paths fail, other
Heat pipe also can normal work, reliability is guaranteed, and on the other hand, makees auxiliary heat transfer by heat transfer plate, and can play support effect
Really, construction for heat radiating device is more consolidated.
Specifically, the heat transfer plate includes the first heat transfer plate 14 and the second heat transfer plate 15, first heat transfer plate and institute
State the second heat transfer plate to be made into integration by copper material, also can be connected by modes such as welding, bolt fixations, complex root heat pipe 11
Support arranges extension on first heat transfer plate 14 on second heat transfer plate 15, extension extends to the radiating fin
On, fan 16 is oppositely arranged with the radiating fin, and fan 16 can also play radiating by heat transfer plate during air-supply
Effect.
After increasing heat-transfer path, integral heat sink effect more preferably, by equation below it is inferred that r < r1, r < r2, according to heat
Resistance network connection in series-parallel principle, thermal resistance r of heat transfer process are expressed as:
By a plurality of sinking path of this utility model, radiating effect is substantially increased, in practice it has proved that this utility model structure
In heat-collecting block be applicable not only to the heat collection of common electronic products (such as CPU), be also applied for high-power electronic device radiating,
Guarantee radiating effect.
Technology contents of the present utility model and technical characteristic have revealed that as above, but those of ordinary skill in the art still may be used
A variety of replacements and modification without departing substantially from this utility model spirit can be made based on teaching of the present utility model and announcement, therefore, this
Utility model protection scope should be not limited to the content disclosed in embodiment, and should include various without departing substantially from replacement of the present utility model
And modification, and covered by present patent application claim.