CN106132106B - Preheating apparatus and its application method - Google Patents

Preheating apparatus and its application method Download PDF

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Publication number
CN106132106B
CN106132106B CN201610674254.0A CN201610674254A CN106132106B CN 106132106 B CN106132106 B CN 106132106B CN 201610674254 A CN201610674254 A CN 201610674254A CN 106132106 B CN106132106 B CN 106132106B
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CN
China
Prior art keywords
heating plate
wiring board
heating
preheating apparatus
mechanical arm
Prior art date
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Application number
CN201610674254.0A
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Chinese (zh)
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CN106132106A (en
Inventor
文东升
赵志刚
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SUZHOU COLIN SOURCE ELECTRONIC CO Ltd
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SUZHOU COLIN SOURCE ELECTRONIC CO Ltd
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Priority to CN201610674254.0A priority Critical patent/CN106132106B/en
Publication of CN106132106A publication Critical patent/CN106132106A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0195Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111Preheating, e.g. before soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a kind of preheating apparatus, for heating a wiring board, the preheating apparatus includes a heating structure, the heating structure includes a jig and a workbench, the jig includes an at least mechanical arm and one first heating plate, the mechanical arm is movably installed in first heating plate, the workbench includes one second heating plate, the mechanical arm can be mobile relative to first heating plate and grabs the wiring board, first heating plate and second heating plate fever are simultaneously contradicted with the wiring board two sides respectively, to heat the wiring board.The invention further relates to the application methods of above-mentioned preheating apparatus.

Description

Preheating apparatus and its application method
Technical field
The present invention relates to a kind of preheating apparatus, more particularly to a kind of preheating that can heat and cool down repeatedly wiring board Device.
Background technique
In the fabrication process, can need to test keep good property to wiring board in temperature adverse circumstances jumpy Energy.The contracting of through-hole and blind hole in high temperature and low temperature especially on wiring board rises whether influence wiring board performance.In test Before, wiring board need to be by heating repeatedly and cooling, to simulate use state.Existing preheating apparatus is unable to satisfy to be heated repeatedly And cooling requirement, need manual handling.
Summary of the invention
For overcome the deficiencies in the prior art, the purpose of the present invention is to provide one kind can heat and cool down repeatedly route The preheating apparatus of plate.
The purpose of the present invention is implemented with the following technical solutions:
A kind of preheating apparatus, for heating a wiring board, the preheating apparatus includes a heating structure, the heating Structure includes a jig and a workbench, and the jig includes an at least mechanical arm and one first heating plate, the manipulator Arm is movably installed in first heating plate, and the workbench includes one second heating plate, and the mechanical arm can be relatively described First heating plate is mobile simultaneously grab the wiring board, first heating plate and second heating plate fever and respectively with it is described Wiring board two sides contradict, to heat the wiring board.
Preferably, the jig further includes one first heat block, and first heat block is fixed on first heating plate First heating plate is set to generate heat.
Preferably, an at least mechanical arm further includes an adsorption section, and institute is adsorbed using vacuum principle in the adsorption section Stating wiring board moves the wiring board along a first direction.
Preferably, the first direction is perpendicular to first heating plate.
Preferably, the workbench includes one second heat block, and second heat block is fixed on second heating plate Second heating plate is set to generate heat.
Preferably, the preheating apparatus further includes a refrigeration structure, and the refrigeration structure is a fan described in cooling Wiring board.
Preferably, first heating plate is made of aluminium sheet.
Preferably, second heating plate is made of aluminium sheet.
A kind of application method of preheating apparatus, comprising the following steps: Step 1: the wiring board is placed in the work Make on platform;Step 2: the mechanical arm is mobile to grab the wiring board towards a first direction relative to first heating plate; Step 3: first heating plate fever, relatively described first heating plate of the mechanical arm is towards one and the first direction phase Anti- second direction is mobile, until the wiring board side and first heating plate contradict;Step 4: second heating plate It generates heat and is contradicted towards the second direction is mobile up to the wiring board other side relative to first heating plate, it is described at this time Wiring board two sides are by first heating plate and second heater plate;Step 5: first heating plate and described Two heating plates stop heating, and second heating plate moves back to original position towards the first direction;Step 6: the mechanical arm It is mobile towards the first direction relative to first heating plate, keep the wiring board hanging, a fan makes the wiring board cool down.
Compared with prior art, the beneficial effects of the present invention are:
The heating structure of preheating apparatus of the present invention, which adsorbs wiring board by mechanical arm, makes wiring board by the first heating plate And second heater plate, keep wiring board cooling by refrigeration structure, thus wiring board can be repeated more in a station Secondary heating and cooling keep test reliable.
Detailed description of the invention
Fig. 1 is a perspective view of preheating apparatus of the present invention.
Fig. 2 is a structural schematic diagram of a heating structure of the preheating apparatus of Fig. 1.
Fig. 3 is a use state diagram of the heating structure of Fig. 2.
Fig. 4 is another use state diagram of the heating structure of Fig. 2.
Fig. 5 is the another use state diagram of the heating structure of Fig. 2.
Fig. 6 is a use state diagram of the preheating apparatus of Fig. 1.
In figure: 100, preheating apparatus;10, refrigeration structure;20, heating structure;22, jig;220, erecting bed;222, machine Tool arm;2220, adsorption section;224, the first heating plate;226, the first heat block;24, workbench;240, the second heating plate; 242, the second heat block;200, wiring board.
Specific embodiment
Referring to Fig. 1, a kind of preheating apparatus 100 is for being heated and being cooled down repeatedly to a wiring board 200, it is described pre- Heating device 100 includes a refrigeration structure 10 and a heating structure 20.In one embodiment, the refrigeration structure 10 is a wind Fan.
The heating structure 20 includes a jig 22 and a workbench 24.The jig 22 includes an erecting bed 220, several Mechanical arm 222, one first heating plate 224 and one for being fixed on the erecting bed 220 are fixed and first heating plate 224 First heat block 226.Each mechanical arm 222 is movably installed in first heating plate 224.Each mechanical arm 222 include an adsorption section 2220.Several mechanical arms 222 are parallel to each other.Each mechanical arm 222 is approximately perpendicular to First heating plate 224.In one embodiment, first heating plate 224 is made of aluminum.
The workbench 24 includes that one second heating plate 240 and one are fixed on the second heating of second heating plate 240 Block 242.Second heating plate 240 is roughly parallel to first heating plate 224.In one embodiment, second heating Plate 240 is made of aluminum.
Please continue to refer to Fig. 2 to Fig. 6, when using the preheating apparatus, comprising the following steps: Step 1: by the line Road plate 200 is placed on the workbench 24;Step 2: relatively described first heating plate 224 of the mechanical arm 222 is towards one One direction is mobile to grab the wiring board 200;Step 3: first heating plate 224 is generated heat, 222 phase of mechanical arm It is mobile towards a second direction opposite to the first direction to first heating plate 224, until 200 side of wiring board It is contradicted with first heating plate 224;Step 4: the fever of the second heating plate 240 and relatively described first heating plate, 224 court The second direction is mobile until contradicting with 200 other side of wiring board, 200 two sides of wiring board are by described first at this time Heating plate 224 and second heating plate 240 heating;Step 5: first heating plate 224 and second heating plate 240 Stop heating, second heating plate 240 moves back to original position towards the first direction;Step 6: 222 phase of mechanical arm It is mobile towards the first direction to first heating plate 224, keep the wiring board 200 hanging, the refrigeration structure 10 makes institute State the cooling of wiring board 200.It repeats the above steps, the wiring board 200 can be made to heat and cool down repeatedly, wanted before reaching test It asks.
It will be apparent to those skilled in the art that can make various other according to the above description of the technical scheme and ideas Corresponding change and deformation, and all these changes and deformation all should belong to the protection scope of the claims in the present invention Within.

Claims (7)

1. a kind of preheating apparatus, for heating a wiring board, the preheating apparatus includes a heating structure, and feature exists In: the heating structure includes a jig and a workbench, and the jig includes an at least mechanical arm and one first heating plate, The mechanical arm is movably installed in first heating plate, and the workbench includes one second heating plate, the mechanical arm Relative to the first heating plate movement and the wiring board can be grabbed, first heating plate and second heating plate fever are simultaneously It is contradicted respectively with the wiring board two sides, to heat the wiring board;The jig further includes one first heat block, and described first Heat block, which is fixed on first heating plate, makes first heating plate generate heat;An at least mechanical arm further includes an absorption Portion, the wiring board is adsorbed using vacuum principle in the adsorption section moves the wiring board along a first direction.
2. preheating apparatus according to claim 1, it is characterised in that: the first direction is perpendicular to first heating Plate.
3. preheating apparatus according to claim 1, it is characterised in that: the workbench includes one second heat block, institute Stating the second heat block and being fixed on second heating plate makes second heating plate generate heat.
4. preheating apparatus according to claim 1, it is characterised in that: the preheating apparatus further includes a refrigeration knot Structure, the refrigeration structure are a fan with the cooling wiring board.
5. preheating apparatus according to claim 1, it is characterised in that: first heating plate is made of aluminium sheet.
6. preheating apparatus according to claim 1, it is characterised in that: second heating plate is made of aluminium sheet.
7. a kind of application method of preheating apparatus as described in claim 1, it is characterised in that: the following steps are included:
Step 1: the wiring board is placed on the workbench;
Step 2: the mechanical arm is mobile to grab the wiring board towards a first direction relative to first heating plate;
Step 3: first heating plate fever, relatively described first heating plate of the mechanical arm is towards one and the first party It is mobile to opposite second direction, until the wiring board side and first heating plate contradict;
Step 4: second heating plate is generated heat and relative to first heating plate towards second direction movement until with described The wiring board other side contradicts, and the wiring board two sides are by first heating plate and second heater plate at this time;
Step 5: first heating plate and second heating plate stop heating, second heating plate is towards the first party To moving back to original position;
Step 6: the mechanical arm is mobile towards the first direction relative to first heating plate, keep the wiring board hanging, One fan makes the wiring board cool down.
CN201610674254.0A 2016-08-16 2016-08-16 Preheating apparatus and its application method Active CN106132106B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610674254.0A CN106132106B (en) 2016-08-16 2016-08-16 Preheating apparatus and its application method

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Application Number Priority Date Filing Date Title
CN201610674254.0A CN106132106B (en) 2016-08-16 2016-08-16 Preheating apparatus and its application method

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CN106132106A CN106132106A (en) 2016-11-16
CN106132106B true CN106132106B (en) 2019-01-18

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117031257B (en) * 2023-10-10 2023-12-08 深圳市百能达电子有限公司 Electronic product mainboard detection device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2663154Y (en) * 2003-12-02 2004-12-15 上海申贝办公机械有限公司办公设备分公司 Automatic hot pressing fault resetting device for hot-pressing plastic-pipe binding machine
CN202174739U (en) * 2011-04-22 2012-03-28 苏州市科林源电子有限公司 PCB (printed circuit board) hot-press jig
CN206136469U (en) * 2016-08-16 2017-04-26 苏州市科林源电子有限公司 Preheating device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087944A (en) * 2002-08-28 2004-03-18 Denso Corp Manufacturing method of logomark-bearing board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2663154Y (en) * 2003-12-02 2004-12-15 上海申贝办公机械有限公司办公设备分公司 Automatic hot pressing fault resetting device for hot-pressing plastic-pipe binding machine
CN202174739U (en) * 2011-04-22 2012-03-28 苏州市科林源电子有限公司 PCB (printed circuit board) hot-press jig
CN206136469U (en) * 2016-08-16 2017-04-26 苏州市科林源电子有限公司 Preheating device

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