CN106098686B - 一种超势垒整流器及其制备方法 - Google Patents
一种超势垒整流器及其制备方法 Download PDFInfo
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- CN106098686B CN106098686B CN201610540473.XA CN201610540473A CN106098686B CN 106098686 B CN106098686 B CN 106098686B CN 201610540473 A CN201610540473 A CN 201610540473A CN 106098686 B CN106098686 B CN 106098686B
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- Prior art keywords
- epitaxial layer
- gate trench
- suoshu
- barrier rectifier
- super barrier
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- 230000004888 barrier function Effects 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 11
- 238000005468 ion implantation Methods 0.000 claims description 10
- 230000003647 oxidation Effects 0.000 claims description 8
- 238000007254 oxidation reaction Methods 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 230000026267 regulation of growth Effects 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 238000002513 implantation Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 5
- 150000002500 ions Chemical class 0.000 description 9
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610540473.XA CN106098686B (zh) | 2016-07-11 | 2016-07-11 | 一种超势垒整流器及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610540473.XA CN106098686B (zh) | 2016-07-11 | 2016-07-11 | 一种超势垒整流器及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN106098686A CN106098686A (zh) | 2016-11-09 |
CN106098686B true CN106098686B (zh) | 2019-05-21 |
Family
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Family Applications (1)
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CN201610540473.XA Active CN106098686B (zh) | 2016-07-11 | 2016-07-11 | 一种超势垒整流器及其制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN106098686B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111668314A (zh) * | 2020-06-04 | 2020-09-15 | 重庆大学 | 一种新型的沟槽型mos势垒肖特基接触超势垒整流器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006210392A (ja) * | 2005-01-25 | 2006-08-10 | Toyota Motor Corp | 半導体装置およびその製造方法 |
CN101853850A (zh) * | 2010-03-17 | 2010-10-06 | 无锡新洁能功率半导体有限公司 | 一种超势垒半导体整流器件及其制造方法 |
CN103337523A (zh) * | 2013-06-19 | 2013-10-02 | 张家港凯思半导体有限公司 | 一种斜沟槽超势垒整流器件及其制造方法 |
CN103400840A (zh) * | 2013-07-01 | 2013-11-20 | 中航(重庆)微电子有限公司 | 一种超势垒整流器及其制备方法 |
CN203312299U (zh) * | 2013-06-26 | 2013-11-27 | 张家港凯思半导体有限公司 | 一种超势垒整流器件 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7834421B2 (en) * | 2002-08-14 | 2010-11-16 | Advanced Analogic Technologies, Inc. | Isolated diode |
US20140167152A1 (en) * | 2012-12-13 | 2014-06-19 | International Rectifier Corporation | Reduced Gate Charge Trench Field-Effect Transistor |
TW201443999A (zh) * | 2013-05-14 | 2014-11-16 | Anpec Electronics Corp | 溝渠式功率半導體元件的製作方法 |
-
2016
- 2016-07-11 CN CN201610540473.XA patent/CN106098686B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006210392A (ja) * | 2005-01-25 | 2006-08-10 | Toyota Motor Corp | 半導体装置およびその製造方法 |
CN101853850A (zh) * | 2010-03-17 | 2010-10-06 | 无锡新洁能功率半导体有限公司 | 一种超势垒半导体整流器件及其制造方法 |
CN103337523A (zh) * | 2013-06-19 | 2013-10-02 | 张家港凯思半导体有限公司 | 一种斜沟槽超势垒整流器件及其制造方法 |
CN203312299U (zh) * | 2013-06-26 | 2013-11-27 | 张家港凯思半导体有限公司 | 一种超势垒整流器件 |
CN103400840A (zh) * | 2013-07-01 | 2013-11-20 | 中航(重庆)微电子有限公司 | 一种超势垒整流器及其制备方法 |
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Publication number | Publication date |
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CN106098686A (zh) | 2016-11-09 |
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Address after: 401331 No. 25 Xiyong Avenue, Xiyong Town, Shapingba District, Chongqing Applicant after: Huarun Microelectronics (Chongqing) Co., Ltd. Address before: 401331 No. 25 Xiyong Avenue, Xiyong Town, Shapingba District, Chongqing Applicant before: China Aviation (Chongqing) Microelectronics Co., Ltd. |
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Address after: 401331 No. 25 Xiyong Avenue, Shapingba District, Chongqing Applicant after: Huarun Microelectronics (Chongqing) Co., Ltd. Address before: 401331 No. 25 Xiyong Avenue, Xiyong Town, Shapingba District, Chongqing Applicant before: Huarun Microelectronics (Chongqing) Co., Ltd. |
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