CN106062633A - 尤其在微光刻投射曝光设备中的光学组件的分组件 - Google Patents

尤其在微光刻投射曝光设备中的光学组件的分组件 Download PDF

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Publication number
CN106062633A
CN106062633A CN201580009184.0A CN201580009184A CN106062633A CN 106062633 A CN106062633 A CN 106062633A CN 201580009184 A CN201580009184 A CN 201580009184A CN 106062633 A CN106062633 A CN 106062633A
Authority
CN
China
Prior art keywords
subassembly
tubular portion
cooling medium
temperature control
projection exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580009184.0A
Other languages
English (en)
Chinese (zh)
Inventor
T.施沃特纳
S.菲格雷多
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Publication of CN106062633A publication Critical patent/CN106062633A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201580009184.0A 2014-02-21 2015-02-11 尤其在微光刻投射曝光设备中的光学组件的分组件 Pending CN106062633A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014203144.3 2014-02-21
DE102014203144.3A DE102014203144A1 (de) 2014-02-21 2014-02-21 Baugruppe eines optischen Systems, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage
PCT/EP2015/052825 WO2015124471A1 (en) 2014-02-21 2015-02-11 Subassembly of an optical system, in particular in a microlithographic projection exposure apparatus

Publications (1)

Publication Number Publication Date
CN106062633A true CN106062633A (zh) 2016-10-26

Family

ID=52598721

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580009184.0A Pending CN106062633A (zh) 2014-02-21 2015-02-11 尤其在微光刻投射曝光设备中的光学组件的分组件

Country Status (7)

Country Link
US (1) US20160334719A1 (enExample)
JP (1) JP2017507358A (enExample)
KR (1) KR20160124102A (enExample)
CN (1) CN106062633A (enExample)
DE (1) DE102014203144A1 (enExample)
TW (1) TWI663479B (enExample)
WO (1) WO2015124471A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114174882A (zh) * 2019-05-22 2022-03-11 振幅公司 用于控制光束的光学部件安装座和相关系统
CN115790222A (zh) * 2021-09-09 2023-03-14 珠海德标光电科技有限公司 一种柔性热管的制备方法以及一种柔性热管

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017202653A1 (de) 2017-02-20 2018-08-23 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Halbleiterlithographie mit verbessertem Wärmeübergang
KR102374206B1 (ko) 2017-12-05 2022-03-14 삼성전자주식회사 반도체 장치 제조 방법
KR102678312B1 (ko) 2018-10-18 2024-06-25 삼성전자주식회사 Euv 노광 장치와 노광 방법, 및 그 노광 방법을 포함한 반도체 소자 제조 방법
WO2022028710A1 (en) * 2020-08-07 2022-02-10 Carl Zeiss Smt Gmbh Optical system and method of operating an optical system
DE102023207048A1 (de) 2022-09-20 2024-03-21 Carl Zeiss Smt Gmbh Baugruppe eines optischen Systems sowie Verfahren zum Temperieren eines Spiegels, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage
DE102022212277A1 (de) 2022-11-18 2024-05-23 Carl Zeiss Smt Gmbh Baugruppe eines optischen Systems
DE102022212279A1 (de) 2022-11-18 2024-05-23 Carl Zeiss Smt Gmbh Baugruppe eines optischen Systems
DE102022213142A1 (de) 2022-12-06 2024-06-06 Carl Zeiss Smt Gmbh Spiegelanordnung mit gekühlten Spiegelelementen und Lithographiesystem
DE102023202039A1 (de) 2023-03-07 2024-03-28 Carl Zeiss Smt Gmbh Verfahren zum Kühlen einer Komponente und Lithographiesystem
DE102023208751A1 (de) * 2023-09-11 2024-07-18 Carl Zeiss Smt Gmbh Optische Anordnung mit einer zu temperierenden Komponente

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JP2004153064A (ja) * 2002-10-31 2004-05-27 Nikon Corp 露光装置
US20100051254A1 (en) * 2008-08-28 2010-03-04 Mitsubishi Electric Corporation Variable conductance heat pipe
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CN104115068A (zh) * 2012-02-23 2014-10-22 Asml荷兰有限公司 装置、光刻设备、用于引导辐射的方法以及装置制造方法

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JP2004029314A (ja) * 2002-06-25 2004-01-29 Nikon Corp 光学素子冷却装置、光学素子冷却方法及び露光装置
JP4273813B2 (ja) * 2003-04-04 2009-06-03 株式会社ニコン 光学素子保持冷却装置及び露光装置
EP1376239A3 (en) * 2002-06-25 2005-06-29 Nikon Corporation Cooling device for an optical element
JP4333090B2 (ja) * 2002-07-03 2009-09-16 株式会社ニコン ミラー冷却装置及び露光装置
JP2004039905A (ja) * 2002-07-04 2004-02-05 Nikon Corp 露光装置、ミラーの冷却方法、反射マスクの冷却方法及び露光方法
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JP4717813B2 (ja) 2003-09-12 2011-07-06 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィ投影露光設備のための照明系
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JP4606355B2 (ja) * 2006-03-14 2011-01-05 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
DE102008009600A1 (de) 2008-02-15 2009-08-20 Carl Zeiss Smt Ag Facettenspiegel zum Einsatz in einer Projektionsbelichtungsanlage für die Mikro-Lithographie
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DE102011010462A1 (de) * 2011-01-28 2012-08-02 Carl Zeiss Laser Optics Gmbh Optische Anordnung für eine EUV-Projektionsbelichtungsanlage sowie Verfahren zum Kühlen eines optischen Bauelements
EP2515170B1 (en) * 2011-04-20 2020-02-19 ASML Netherlands BV Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method
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DE102012200733A1 (de) 2012-01-19 2013-01-24 Carl Zeiss Smt Gmbh Spiegelanordnung, insbesondere zum Einsatz in einem optischen System, insbesondere einer mikrolithographischen Projektionsbelichtungsanlage
WO2013113634A2 (en) * 2012-01-30 2013-08-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102013111801A1 (de) * 2012-11-29 2014-03-13 Asml Netherlands B.V. Kühlsystem für zumindest eine Systemkomponente eines optischen Systems für EUV-Anwendungen sowie derartige Systemkomponente und derartiges optisches System

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004153064A (ja) * 2002-10-31 2004-05-27 Nikon Corp 露光装置
US20100051254A1 (en) * 2008-08-28 2010-03-04 Mitsubishi Electric Corporation Variable conductance heat pipe
JP2010054122A (ja) * 2008-08-28 2010-03-11 Mitsubishi Electric Corp 可変コンダクタンスヒートパイプ
US20100195074A1 (en) * 2009-02-04 2010-08-05 Nikon Corporation Thermal regulation of vibration-sensitive objects
DE102011078521A1 (de) * 2011-07-01 2012-08-16 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zur fluidmechanischen Entstörung
CN104115068A (zh) * 2012-02-23 2014-10-22 Asml荷兰有限公司 装置、光刻设备、用于引导辐射的方法以及装置制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114174882A (zh) * 2019-05-22 2022-03-11 振幅公司 用于控制光束的光学部件安装座和相关系统
CN115790222A (zh) * 2021-09-09 2023-03-14 珠海德标光电科技有限公司 一种柔性热管的制备方法以及一种柔性热管

Also Published As

Publication number Publication date
US20160334719A1 (en) 2016-11-17
WO2015124471A1 (en) 2015-08-27
KR20160124102A (ko) 2016-10-26
TW201533545A (zh) 2015-09-01
TWI663479B (zh) 2019-06-21
JP2017507358A (ja) 2017-03-16
DE102014203144A1 (de) 2015-08-27

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20161026