CN106057691A - mask for fixing conductive ball and manufacturing method thereof - Google Patents
mask for fixing conductive ball and manufacturing method thereof Download PDFInfo
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- CN106057691A CN106057691A CN201610222492.8A CN201610222492A CN106057691A CN 106057691 A CN106057691 A CN 106057691A CN 201610222492 A CN201610222492 A CN 201610222492A CN 106057691 A CN106057691 A CN 106057691A
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- mask
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- distance piece
- conducting sphere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Laser Beam Processing (AREA)
Abstract
A mask for fixing a conductive ball and a manufacturing method thereof are prvoided. The spacer for fixing a conductive ball is used for forming a bump on a substrate or a wafer. The mask has a spacer and is less likely to damage the workpiece. The thickness of the spacer is uniform throughout the mask, and is formed in a plurality of designs such as a planar shape and a linear shape, and is excellent in chemical resistance and mechanical strength. A resin thin plate such as polyimide is used as a spacer-forming member, and a spacer having a predetermined design pattern formed by ultraviolet rays is attached to a metal mask prepared by electrolytic plating or the like. Alternatively, the spacer may be processed in a state where the resin sheet is attached to the metal mask.
Description
Technical field
The present invention relates to a kind of mask, for conducting sphere being fixed on the electricity on the workpiece such as substrate or wafer
Pole.
Background technology
In semiconductor fabrication sequence, when carrying out flip-chip installation or forming projection on silicon
During electrode, generally use following methods: be arranged on the workpiece such as substrate or silicon wafer with predetermined pattern
Electrode, the fixing conducting sphere being made up of conductive metal such as solders, this is carried out reflow treatment with
Fusion welding, then it is bonded to electrode (such as, refering to patent documentation 1).
Here, the thin plate being used in metal is formed with the metal mask of the hole version of fine opening, as
For fixing the fixture of conducting sphere.This opening is formed with the pattern corresponding with the electrode on workpiece, if
Determine into when properly configuring metal mask relative to workpiece, conducting sphere can be properly secured to electricity
Extremely go up.
In this operation, electrode is coated with solder flux (flux) in advance.This is in order in reflow treatment
Time, remove the oxidation overlay film wettability with lifting electrode of electrode, and can be the most bonding molten
Solder, or conducting sphere can be avoided to put movement from location.
But, the face opposed with workpiece (hereinafter referred to as " stationary plane ") of metal mask, with workpiece
On the face (following, " by stationary plane ") being configured with electrode side contact, in order to avoid solder flux is attached
Metal mask of making dirty at stationary plane, the means used are, the stationary plane at metal mask is arranged
The distance piece of predetermined thickness, with from by stationary plane (such as, refering to patent documentation 2) spaced apart.
As the material of this distance piece, using the metal of material identical with metal mask, general employing is led to
The method crossing electrolytic plating method etc. and form.But, because metal distance piece is the hardest,
Therefore easily disfiguring workpiece by stationary plane.Therefore, widely known has, with photoresist geometric ratio
Relatively soft resin formation distance piece portion, protects by the method for stationary plane (such as, refering to patent literary composition
Offer 3).
If here, the thickness of distance piece has deviation, then distance piece not with absorption surface, have between generation
The position of gap, it is therefore possible to cause conducting sphere to roll into its gap, dissolves when backflow and makes to adjoin
Electrode is electrically short-circuited to each other.Accordingly it is desirable to, so that stationary plane and quilt certain at metal mask thickness on the whole
Conducting sphere is the most suitably fixed at the interval of stationary plane.Additionally, in order in the use of metal mask
Avoid distance piece damaged, need the mechanical strength with excellence, and in order to avoid by solder flux or metal
The ablution of mask dissolves, and needs have chemical resistance.
Here, in the case of forming metal distance piece with electrolytic plating method, utilize photoetching process, enter
The pattern formation process of the photoresist of the classes such as row photonasty dry type film or aqueous resist or electroforming
The operation of the classes such as operation, photoresist film stripping process is complex.Additionally, also problems with:
If layout becomes fine, then at the intensive place of photoresist, electric current density is concentrated, therefore electricity
The precipitation of plating becomes unstable because position is different, causes the deviation of distance piece thickness to become big.Additionally,
With the situation of resin formation similarly, because photoresist painting process, utilizing photoetching process to carry out
The pattern formation process of photoresist be necessary, so operation is complex, and be difficult to
Certain thickness is coated, so mechanical strength or chemical resistance aspect the most abundant.
Furthermore, as described in patent documentation 3, distance piece is the feelings of shape in projection as pillar-shaped
Under condition, have the problem that relatively cracky, when the stationary plane of clean metal mask, because useless cloth
Easily it is hooked to pillar etc. clean apparatus, is therefore difficult to wiping etc..
[patent documentation 1] Japanese Unexamined Patent Publication 11-243274
[patent documentation 2] Japanese Unexamined Patent Publication 2005-101242
[patent documentation 3] Japanese Patent No. 4664146
Summary of the invention
It is an object of the invention to, it is provided that a kind of fixing mask of conducting sphere, there is distance piece, between being somebody's turn to do
Spacing body is certain at mask thickness on the whole, is formed with the functional design pattern such as planar, wire, resistance toization
The property learned, mechanical strength, and it is difficult to disfiguring workpiece, easily it is masked clean.
In order to reach above-mentioned purpose, the invention of technical scheme 1 is a kind of fixing mask of conducting sphere, uses
In conducting sphere is fixed on be arranged in predetermined pattern workpiece by the electrode on stationary plane, its feature
It is possess metal flat mask and the thin plate of film like；Described mask have with institute
State in the corresponding pattern of electrode is formed at face and can insert the opening of the size of conducting sphere；Described
Thin plate has: resin bed, is made up of the polyimides as heat-resisting chemically-resistant resin；And distance piece,
Being formed with certain layout excision by this thin plate in face, described certain layout is lattice
Sub-shape, wire, planar or these combination；Described mask and described thin plate with described resin bed towards
Face side, the mode of described distance piece not blocking of said openings, by the heat being made up of epoxy resin
The bonding thin plate of/pressure hardening type is bonding.
Invention described in technical scheme 2 is that a kind of conducting sphere is fixed by the manufacture method of mask, this conduction
Ball fixing with mask for conducting sphere is fixed on predetermined pattern be arranged in workpiece by stationary plane
On electrode, this manufacture method is characterised by, including mask manufacture operation, by electrolytic plating method,
Either method in laser processing method or etching method, make mask, this mask have with described electrode
In corresponding pattern is formed at face and the opening of size of conducting sphere can be inserted；Distance piece is formed
Operation, utilizes ultraviolet laser by the thin plate of film like with certain layout excision, removes institute
Stating need not part and forming distance piece of thin plate, described thin plate has by as heat-resisting chemically-resistant resin
Polyimides constitute resin bed, described certain layout be clathrate, wire, planar or
These combination；Bonding process, by described thin plate with described resin bed towards face side, described interval
The mode of part not blocking of said openings, bonding by heat/pressure hardening type of being made up of epoxy resin
Thin plate can conform to the surface of described mask with peeling off；And bonding process, with predetermined heat or pressure
The bonding described mask of power and described thin plate.
Invention described in technical scheme 3 is that a kind of conducting sphere is fixed by the manufacture method of mask, this conduction
Ball fixing with mask for conducting sphere is fixed on predetermined pattern be arranged in workpiece by stationary plane
On electrode, this manufacture method is characterised by, including mask manufacture operation, by electrolytic plating method,
Either method in laser processing method or etching method, make mask, this mask have with described electrode
In corresponding pattern is formed at face and the opening of size of conducting sphere can be inserted；Bonding process,
By there is the thin plate of the film like of resin bed by described resin bed towards in the way of face side, by by ring
The bonding thin plate of heat/pressure hardening type that epoxy resins is constituted can conform to the table of described mask with peeling off
Face, described resin bed is made up of the polyimides as heat-resisting chemically-resistant resin；Distance piece formation process,
In the face of described thin plate, utilize ultraviolet laser, processing conditions is adjusted to suitable value in order to avoid
Cut off described mask to be cut off with certain layout by described thin plate, remove being not required to of described thin plate
Want part and form distance piece, described certain layout be clathrate, wire, planar or these
Combination；And bonding process, with mask described in predetermined heat or pressure bond and described thin plate；Institute
State distance piece and be formed not blocking of said openings.
Invention described in technical scheme 4 is the fixing mask of the conducting sphere as described in technical scheme 1 or 2
Manufacture method, it is characterised in that described mask with after the bonding process of described thin plate, bonding work
Before sequence, utilizing described ultraviolet laser, processing conditions being adjusted to suitable value in order to avoid cutting off described
Described thin plate is cut off and processes air groove or airport by thin plate.
According to the invention of technical scheme 1 because use the homogeneous thin plate of thickness as the material of distance piece,
So the thickness of distance piece is in mask maintains certain scope on the whole, distance piece is good with workpiece
Ground contiguity, so can prevent conducting sphere from rolling into both gaps, thus can reduce bad generation.
According to the invention of technical scheme 2, by the polyimides that use mechanical strength or chemical resistance are high
As the resin bed of thin plate, compared with situation about being formed by metal, it is possible to formed and be less susceptible to damage work
Part by stationary plane, be less susceptible to dissolve or the distance piece of breakage.Furthermore, have the effect that due to
There is high-fire resistance, therefore can be appropriately cut off by ultraviolet, and reduce the viscous of thin plate and mask
Connect the thermal deformation in operation.
According to the invention of technical scheme 3, a kind of fixing mask of conducting sphere can be obtained, prop up with conventional
Columnar phase ratio, distance piece is less susceptible to damage, and be easier to be masked cleans.
According to the invention of technical scheme 4, because ultraviolet can cut off polyimides gallantly, so energy
Enough form the distance piece that dimensional accuracy, shape are the best.
Accompanying drawing explanation
Fig. 1 is that the conducting sphere of embodiment of the present invention is fixed by the front view (a) of mask, side cross-sectional
Figure (b).
Fig. 2 is the front view of the mask of embodiment of the present invention.
Fig. 3 is the front view of the thin plate of embodiments of the present invention.
Fig. 4 is that the conducting sphere of embodiments of the present invention is fixed and regarded with the master making the midway stage of mask
Figure.
Fig. 5 is that the conducting sphere of embodiments of the present invention is fixed with the manufacturing flow chart of mask.
Fig. 6 is that the conducting sphere of embodiments of the present invention is fixed with the use state diagram (sectional view) of mask.
Fig. 7 is that the conducting sphere of another embodiment of the present invention is fixed with the front view of mask.
Fig. 8 is that the conducting sphere of another embodiment of the present invention is fixed with the front view of mask.
Fig. 9 is that the conducting sphere of another embodiment of the present invention is fixed with the front view of mask.
Figure 10 is that the conducting sphere of another embodiment of the present invention is fixed with the front view of mask.
Figure 11 is the making work carried out by electrolytic plating method of the mask of another embodiment of the present invention
The flow chart of sequence.
Figure 12 is the manufacturing process carried out by etching method of the mask of another embodiment of the present invention
Flow chart.
Figure 13 is the making work carried out by laser processing method of the mask of another embodiment of the present invention
The flow chart of sequence.
Description of reference numerals
1,4,7,10,13: the fixing mask of conducting sphere
2,5,8,11,14: metal mask (mask)
21,51,81,111,141: opening
3,6,9,12,15: resin sheet (thin plate)
31,61,91,121,151: distance piece
Detailed description of the invention
Fig. 1 is that the conducting sphere of embodiment is fixed with the front view (a) of mask 1 and sectional view (b).
First, conducting sphere is fixing generally comprises metal mask (mask) 2 and resin sheet (thin plate) with mask 1
3, metal mask 2 is fitted by bonding thin plate (omitting diagram) with resin sheet 3.
Metal mask 2 is with the thin plate of the metal such as nickel, rustless steel as material, it is however generally that, thickness is
0.015mm～0.2mm, overall dimensions is the tetragon (square for 100mm～600mm
Or rectangle).Here, the manufacture method of metal mask 2, there are electrolytic plating method, etching as described later
Method, laser processing method etc., but in the present embodiment, any of which also can be used.
In the face of metal mask 2, in order to allow conducting sphere insert, it is formed with multiple with predetermined patternThrough hole i.e. opening 21.Here, in order to conducting sphere can be inserted swimmingly
Logical, and the position fixed will not stagger, the diameter of opening 21 be set to the diameter of conducting sphere 1～
1.5 again.
Secondly, resin sheet 3 be thickness be the thin film of 0.02～0.2mm, overall dimensions is set to
Cover more than the area that the opening 21 of metal mask 2 is whole, and less than the overall dimensions of metal mask 2.
Additionally, the material of resin sheet 3, chemical resistance and excellent heat resistance, mechanical strength can be used high
Polyimides.
In the face of resin sheet 3, processed by ultraviolet and be formed with cancellate distance piece 31.
For distance piece 31, resin sheet is formed as so that certain layout excises into square shape
The clathrate of the such size of opening 21 of metal mask 2 can be exposed.In order to not damage mechanical strength,
The width setup of spacing body 31 is 0.01～20.0mm.The layout of distance piece 31 is formed as, when inciting somebody to action
Time resin sheet 3 is suitably overlapping with metal mask 2, distance piece 31 be arranged in opening 21 each other
Interval or be arranged in the aggregation (unit) of opening 21 interval each other and opening will not be blocked
The design of 21 and size.
The light source of ultraviolet processing method, can use ultraviolet laser, and ultraviolet laser can be lossless
In the case of the shape of cutting portion, cut off nonflammable resin as polyimides gallantly.
Additionally, around the distance piece 31 of resin sheet 3, be formed with air groove 32 with clathrate.
This is to make conducting sphere fix the air between workpiece and distance piece 31 by mask 1 and workpiece contiguity
Release, to outside groove, is processed by ultraviolet laser identically with distance piece 31.
Additionally, laminating metal mask 2 and the bonding thin plate of resin sheet 3, chemical resistance can be used excellent
Different epoxy resin.Bonding thin plate because of be heated or pressure and harden, play bonding force.
Secondly, with reference to the flow chart of Fig. 5, the conducting sphere of present embodiment is fixed by the system of mask 1
The method of making illustrates.
First, the making (step S1) of metal mask 2 is carried out.In the present embodiment, metal mask
2 electrolytic plating methods of manufacture method that can be considered as in the past existing for are (by electric conductivity such as rustless steels
On the plating substrate that the flat board of metal is constituted, use photoetching process, for photonasty dry type film or liquid
After the such photoresist film of shape resist forms patterns of openings, on plating substrate, utilize amido
Sulfonic acid bath or sulfuric acid bath (watt bath) etc., carry out electrolytic nickel plating), laser processing method (utilize laser
Irradiate, at metal (predominantly rustless steel) flat board of the material as metal mask, directly formed and open
Mouthful), (by photoetching, the image carrying out patterns of openings on stainless steel base material is formed etching method, enters
Row opening based on etching is formed).The quick-reading flow sheets of each manufacturing process is documented to Figure 11～Figure 13.
Secondly, carried out the processing of resin sheet 3 by ultraviolet laser processing, form distance piece 31
(step S2).For distance piece 31, by from resin sheet 3 by the small pieces of rectangle with certain
Layout excises, and is formed as clathrate.It addition, step S1 and the order of step S2 also can be anti-
Come over carry out.
Secondly, by thin with in the resin made by step S2 in the metal mask 2 made by step S1
Plate 3, carries out para-position fit (step S3) in the way of distance piece 31 does not block opening 21.Here,
Metal mask 2 does not has bonding with resin sheet 3, but utilizes the adhesion of bonding thin plate, heat-resistant adhesive
Bands etc., fix the most a little.
Secondly, processed by ultraviolet laser, carry out the processing (step S4) of air groove 32.With
It is enclosed in the mode at the excision of four rectangles that step S2 is formed, cuts into the most each three slits
Shape, distance piece 31 separates via air groove 32 respectively.Now, by the processing of ultraviolet laser
Condition is adjusted to suitable value, in order to avoid metal mask 2 is also cut off.Additionally, ultraviolet laser adds
Work is processed into gutter as far as possible and is integrally forming (in the present embodiment, Box Section is all connected), with
Just in following step S4, can peel off simply.
Peel off in gutter (step S5) cancellate produced by step S4.
By predetermined heat or pressure, bonded metal mask 2 and resin sheet 3 (step S6).
Secondly, with reference to Fig. 6, the conducting sphere of present embodiment is fixed fixing with the conducting sphere of mask 1
Operation illustrates.
It is laid on fixing for conducting sphere by stainless steel frame 100 and polyester web plate (screen) with mask 1
The web plate frame that 101 are constituted, makes a plate.
The conducting sphere that will have made a plate is fixing with mask 1, is arranged at and is coated with solder flux (omission at electrode 103
Diagram) the precalculated position of workpiece 102.
Fix with workpiece 102 opposition side of mask 1 at conducting sphere, flow into conducting sphere 104 so that it is pass
Opening 21 and be fixed on the electrode 103 of workpiece 102.
Conducting sphere according to present embodiment is fixing with mask 1, uses resin sheet 3 in uniform thickness to work as
Make the material of distance piece 31, so the thickness of distance piece 31 maintains certain model on the whole at mask
In enclosing, distance piece 31 touches well with workpiece 102, so can prevent conducting sphere 104 from rolling into gap,
Thus bad generation can be reduced.
Additionally, by the polyimides using mechanical strength in resin sheet 3, chemical resistance is high,
Compared with situation about being formed by metal, it is possible to formed be less susceptible to disfiguring workpiece 102 by stationary plane,
And it is less susceptible in Shi Yonging dissolve or the distance piece 31 of breakage.Furthermore, owing to having high-fire resistance, because of
This can be appropriately cut off by ultraviolet, and have and reduce the viscous of resin sheet 3 and metal mask 2
Connect the effect of thermal deformation in operation.
Additionally, the fixing mask 1 of a kind of conducting sphere, compared with conventional pillar-shaped, distance piece can be obtained
31 are less susceptible to damage, and are easier to carry out cleaning of metal mask 2.
Furthermore, owing to ultraviolet can cut off polyimides gallantly, it is possible to formation dimensional accuracy,
The distance piece 31 that shape is the best.
Additionally, due to air can be discharged from air groove 32, distance piece 31 therefore can be made easily to touch
To workpiece 102.
Above, embodiments of the present invention are explained, but the scope of the present application does not limit
In above-mentioned embodiment, also may extend into other forms with this equivalence.
Such as, distance piece 31 can use various forms as Fig. 7～Figure 10.Here, for
The composition identical with embodiment, if without needing especially, the description thereof will be omitted.
First, as fixing in the conducting sphere of Fig. 7 with mask 4, though also distance piece 61 is same with distance piece 31
Sample is clathrate, but is not provided with the situation of air groove 32.In such a case it is not necessary to step
S5, the operation of step S6.
Using mask 7 additionally, as fixing in the conducting sphere of Fig. 8, distance piece 91 is wire, and each line is from resin
The part of the housing of thin plate 9 cuts off, and therefore can not carry out independent of metal as embodiment described above
The processing that distance piece 91 is processed, fitted the most from behind by mask 8.Therefore, resin sheet 9 is fitted
To metal mask 8, by ultraviolet laser, distance piece 91 is processed.
In this case, owing to distance piece 91 is wire, so compared with cancellate situation, relatively
Easily wiping, becomes easier to clean.
Additionally, according to this kind of method, metal mask 8 and resin need not be carried out as embodiment
The para-position of thin plate 9, just can manufacture the fixing mask 7 of conducting sphere by the simplest method.
Furthermore, conducting sphere as shown in Figure 9 is fixing such as, is wafer at workpiece 102 with mask 10,
In the case of the pattern of opening 111 is circle, it is also possible to form shape as distance piece 121；
Conducting sphere as shown in Figure 10 is fixing with mask 13, the situation that pattern at opening 141 is the most special
Under, as distance piece 151, it is also possible to be formed as the distance piece being combined with wire with the shape of planar
151。
Additionally, the system of metal mask 2,5,8,11,14 (hereinafter referred to as " metal mask 2 etc. ")
Make method, it is also possible to be the machining process of the class such as boring machine or end mill(ing) cutter.Additionally, by plating
In the case of carrying out, it is also not necessarily limited to electrolytic nickel plating, uses non-electrolytic plating method also may be used.In this feelings
Under condition, according to the characteristic of electroless plating, compared with electrolytic plating method, except promoting metal mask
Outside thickness evenness, also can obtain hardness height, the plating overlay film of excellent in te pins of durability.
Furthermore, in above-mentioned embodiment, resin sheet 3,6,9,12,15 (hereinafter referred to as " tree
Fat thin plate 3 etc. "), though being the monolayer constructions will of polyimides, but do not limit here, can also be that polyamides is sub-
Amine and the multi-ply construction of metal.In this case, when fitting with metal mask 2 grade, will conduction
Ball is fixed when being installed up to workpiece 102 with mask 1 etc., contacts with workpiece 102 with polyimides (poly-
Acid imide becomes surface) mode fit.
Additionally, resin sheets 3 etc. it is not absolutely required to use the structure of single thickness, it is possible to use many
Sheet thickness difference person, then change into the thickness of distance piece 31 etc. partly.In this manner, can make
Produce the fixing mask 1 of conducting sphere that the thickness of distance piece 31 grade is different because of place, though workpiece 102
In the case of having jump, distance piece 31 grade still can suitably be touched with workpiece 102.
Additionally, by the airport suitably arranging release air at the outer frame of resin sheet 3 grade,
Make, when being pasted to metal mask 2 grade, air to be carried secretly and form bubble, can be thin by resin
Plate 3 grade conforms to metal mask 2 etc. well.
Additionally, distance piece 31,61,91,121,151 (hereinafter referred to as " distance piece 31 etc. ")
Processing, as long as ultraviolet irradiation can be passed through, cuts off resin with certain layout, does not limits
In ultraviolet laser.Such as, by making (the hole, aperture of the layout institute opening of distance piece 31 grade
Version), contiguity is to resin sheet 3 grade the method for irradiation ultraviolet radiation, it is also possible to form distance piece 31 etc..
Claims (4)
1. the fixing mask of conducting sphere, is arranged in work for being fixed on by conducting sphere with predetermined pattern
Part by the electrode on stationary plane, it is characterised in that
Possess metal flat mask and the thin plate of film like；
Described mask have be formed at face with the pattern corresponding with described electrode in and can insert and lead
The opening of the size of electricity ball；
Described thin plate has: resin bed, is made up of the polyimides as heat-resisting chemically-resistant resin；With
And distance piece, in face, this thin plate is formed, described certain setting with certain layout excision
Meter pattern is clathrate, wire, planar or these combination；
Described mask and described thin plate do not block institute with described resin bed towards face side, described distance piece
Stating the mode of opening, the bonding thin plate of the heat/pressure hardening type by being made up of epoxy resin is bonding.
2. conducting sphere fixes the manufacture method using mask, and this conducting sphere is fixing to be used for leading with mask
Electricity ball be fixed on predetermined pattern be arranged in workpiece by the electrode on stationary plane, this manufacture method
It is characterised by, including:
Mask manufacture operation, by the either method in electrolytic plating method, laser processing method or etching method,
Make mask, this mask have be formed at face with the pattern corresponding with described electrode in and can insert
The opening of the size of logical conducting sphere；
Distance piece formation process, utilizes ultraviolet laser by the thin plate of film like with certain design drawing
Case is excised, and removes need not part and forming distance piece of described thin plate, and described thin plate has by conduct
The resin bed that the polyimides of heat-resisting chemically-resistant resin is constituted, described certain layout be clathrate,
Wire, planar or these combination；
Bonding process, does not blocks described thin plate towards face side, described distance piece with described resin bed
The mode of described opening, the bonding thin plate of the heat/pressure hardening type by being made up of epoxy resin, energy
Enough conform to described mask surfaces with peeling off；And
Bonding process, with mask described in predetermined heat or pressure bond and described thin plate.
3. conducting sphere fixes the manufacture method using mask, and this conducting sphere is fixing to be used for leading with mask
Electricity ball be fixed on predetermined pattern be arranged in workpiece by the electrode on stationary plane, this manufacture method
It is characterised by, including:
Mask manufacture operation, by the either method in electrolytic plating method, laser processing method or etching method,
Make mask, this mask have be formed at face with the pattern corresponding with described electrode in and can insert
The opening of the size of logical conducting sphere；
Bonding process, will have the thin plate of the film like of resin bed with described resin bed towards face side
Mode, the bonding thin plate of the heat/pressure hardening type by being made up of epoxy resin, it is possible to peel off ground patch
Being bonded to the surface of described mask, described resin bed is made up of the polyimides as heat-resisting chemically-resistant resin；
Distance piece formation process, in the face of described thin plate, utilizes ultraviolet laser, will process bar
Part is adjusted to suitable value in order to avoid cutting off described mask and being cut with certain layout by described thin plate
Disconnected, remove need not part and forming distance piece of described thin plate, described certain layout is lattice
Sub-shape, wire, planar or these combination；And
Bonding process, with mask described in predetermined heat or pressure bond and described thin plate；
Described distance piece is formed not blocking of said openings.
4. conducting sphere as claimed in claim 1 or 2 is fixed by the manufacture method of mask, it is characterised in that
After the described mask bonding process with described thin plate, before bonding process, utilize described ultraviolet
Laser instrument, is adjusted to suitable value by processing conditions in order to avoid cutting off described mask and being cut off by described thin plate,
And process air groove or airport.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-081827 | 2015-04-13 | ||
| JP2015081827A JP5838436B1 (en) | 2015-04-13 | 2015-04-13 | Conductive ball placement mask and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106057691A true CN106057691A (en) | 2016-10-26 |
| CN106057691B CN106057691B (en) | 2017-09-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610222492.8A Active CN106057691B (en) | 2015-04-13 | 2016-04-12 | Conducting sphere fixation mask and its manufacture method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5838436B1 (en) |
| CN (1) | CN106057691B (en) |
| PH (1) | PH12016000141A1 (en) |
| TW (1) | TWI573209B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107888157A (en) * | 2017-12-26 | 2018-04-06 | 东晶锐康晶体（成都）有限公司 | A kind of double-deck spot welded type electrode mask |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208608230U (en) * | 2017-08-01 | 2019-03-15 | 上海自旭光电科技有限公司 | Manufacturing equipment for organic light emitting diode display |
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| JP2005236211A (en) * | 2004-02-23 | 2005-09-02 | Process Lab Micron:Kk | Method for manufacturing conductive ball fixing mask |
| JP2006324618A (en) * | 2005-04-20 | 2006-11-30 | Kyushu Hitachi Maxell Ltd | Mask for conductive ball arrangement and its manufacturing method |
| JP2008263053A (en) * | 2007-04-12 | 2008-10-30 | Kyushu Hitachi Maxell Ltd | Mask for arrangement, and its manufacturing method |
| JP2009111226A (en) * | 2007-10-31 | 2009-05-21 | Kyushu Hitachi Maxell Ltd | Suction head |
| CN101683001A (en) * | 2008-05-30 | 2010-03-24 | 揖斐电株式会社 | Solder ball mounting method |
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| JP2005101242A (en) * | 2003-09-25 | 2005-04-14 | Murata Mfg Co Ltd | Method for forming solder bump |
| JP2005243723A (en) * | 2004-02-24 | 2005-09-08 | Ibiden Co Ltd | Mask for settling conductive ball |
| CN2862324Y (en) * | 2005-12-17 | 2007-01-24 | 鸿富锦精密工业（深圳）有限公司 | Ball grid array plant table |
| TWM334457U (en) * | 2007-12-20 | 2008-06-11 | Xu-Rong Wei | Mold structure of ball mounting machine |
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2015
- 2015-04-13 JP JP2015081827A patent/JP5838436B1/en active Active
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2016
- 2016-02-04 TW TW105103735A patent/TWI573209B/en active
- 2016-04-07 PH PH12016000141A patent/PH12016000141A1/en unknown
- 2016-04-12 CN CN201610222492.8A patent/CN106057691B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005236211A (en) * | 2004-02-23 | 2005-09-02 | Process Lab Micron:Kk | Method for manufacturing conductive ball fixing mask |
| JP2006324618A (en) * | 2005-04-20 | 2006-11-30 | Kyushu Hitachi Maxell Ltd | Mask for conductive ball arrangement and its manufacturing method |
| JP2008263053A (en) * | 2007-04-12 | 2008-10-30 | Kyushu Hitachi Maxell Ltd | Mask for arrangement, and its manufacturing method |
| JP2009111226A (en) * | 2007-10-31 | 2009-05-21 | Kyushu Hitachi Maxell Ltd | Suction head |
| CN101683001A (en) * | 2008-05-30 | 2010-03-24 | 揖斐电株式会社 | Solder ball mounting method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107888157A (en) * | 2017-12-26 | 2018-04-06 | 东晶锐康晶体（成都）有限公司 | A kind of double-deck spot welded type electrode mask |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5838436B1 (en) | 2016-01-06 |
| JP2016201493A (en) | 2016-12-01 |
| TW201637106A (en) | 2016-10-16 |
| PH12016000141B1 (en) | 2017-10-18 |
| PH12016000141A1 (en) | 2017-10-18 |
| TWI573209B (en) | 2017-03-01 |
| CN106057691B (en) | 2017-09-12 |
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