JP2009111226A - Suction head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction head capable of preventing the suction errors and scratches of a solder ball. <P>SOLUTION: The suction head is composed of a mask 2 provided with holes 4 corresponding to a prescribed array pattern and formed by laminating a first layer 2a made of a metal and a second layer 2b made of a resin, and a porous body 3 disposed on the side of the first layer 2a of the mask 2. Thus, a reinforcement effect by laminating and forming the mask 2 is improved, handling is facilitated, the mask 2 is not easily deformed by a sucking action, and thus the solder ball 5 is surely sucked. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a suction head used, for example, to form solder bumps.

  The solder bump formation method includes a printing process in which a flux is applied to electrodes on a workpiece such as a wafer, a flexible board, and a rigid board, an arrangement process in which solder balls are arranged and mounted on the flux, and the solder balls are heated and melted. The bump is formed through the heating process. And in the above-mentioned arrangement | positioning process, there exists a suction system using a suction head as a system which arranges a solder ball on a workpiece | work. In this suction system, a large number of solder balls are vacuumed at a time by a suction device equipped with a suction head having suction holes corresponding to the arrangement pattern of the electrodes of the electronic component, so that the suction holes and the electrodes coincide with each other. The solder balls are mounted on the workpiece electrodes by releasing the suction after aligning the workpiece and the workpiece.

  As such a suction head, for example, Patent Document 1 is disclosed. Patent Document 1 discloses a positioning plate having a positioning hole for defining a solder ball suction position formed from a material having a high gas passage resistance, and a reinforcement for reinforcing a positioning plate formed from a material having a low gas passage resistance. A suction head composed of a plate is described.

JP-A-10-256312

  The positioning plate is preferably formed of a soft material such as a resin so as not to cause a problem that the solder ball is damaged when the solder ball is sucked into the suction hole. However, in the case of a resin-made one, it is difficult to handle and difficult to form on a reinforcing plate because of the lack of strength. Patent Document 1 describes that a positioning plate is formed by immersing a reinforcing plate in a resin bath heated and melted. However, since the reinforcing plate is porous, it is difficult to control resin immersion. It was difficult to form a product with high accuracy. Also, when holes are made by machining, burrs / burrs are formed in the vicinity of the holes, and when the solder balls are adsorbed, the solder balls bite into the burrs / burrs and the balls do not fall even if the suction is released. There was also a problem like this. An object of this invention is to provide the suction head which can eliminate the said problem.

  The suction head of the present invention has a hole 2 corresponding to a predetermined arrangement pattern, a mask 2 formed by laminating a first layer 2a made of metal and a second layer 2b made of resin, and the mask 2 And the porous body 3 disposed on the first layer 2a side.

  The hole 4 includes the through hole 6 provided in the first layer 2 a and the suction hole 7 provided in the second layer 2 b. The diameter of the suction hole 7 is larger than the diameter of the through hole 6. It is large. Further, the second layer 2b is formed so as to prevent the solder ball 5 from coming into contact with the first layer 2a when the solder ball 5 is sucked into the suction hole 7.

  The suction head 1 of the present invention has a hole 2 corresponding to a predetermined arrangement pattern, and is formed by laminating a first layer 2a made of metal and a second layer 2b made of resin, and the mask 2 and the porous body 3 disposed on the first layer 2a side. According to this, since the reinforcement effect (strength improvement effect) of the mask 2 due to the lamination of the mask 2 can be expected, the mask 2 becomes easy to handle and can be easily attached to the adsorption device or the porous body 3. At the same time, deformation of the mask 2 due to the suction action can be made difficult to occur.

  The suction head according to the first embodiment of the present invention is shown in FIGS. FIG. 1 is a cross-sectional view of the suction head 1 of the present invention, and FIG. 2 is a bottom view of the suction head 1 of the present invention as viewed from the mask 2 side. The suction head 1 according to this embodiment includes a mask 2 and a porous body 3. The mask 2 has holes 4 (through holes 6 and adsorption holes 7), and is formed by laminating a second layer 2 b on a first layer 2 a facing the porous body 3. The thickness of the suction head 1 is preferably in the range of 0.095 to 4.0 mm. In this embodiment, the thickness is 1.05 mm. Specifically, the mask 2 is 50 μm in the range of 45 μm or more (the first layer 2 a is 30 μm or more, the second layer 2 b is 15 μm or more), and the porous body 3 is 1.0 mm in the range of 0.05 to 3.0 mm. did. The second layer 2b is preferably made of a material whose hardness is lower than that of the solder ball 5 so as not to damage the solder ball 5 when the solder ball 5 is adsorbed to the adsorption hole 7. Good. The first layer 2a is preferably made of a material having a hardness higher than that of the second layer 2b in order to firmly fix the second layer 2b. For example, the first layer 2a may be formed of a metal such as iron, copper, or nickel. Here, the second layer 2b formed on the first layer 2a is preferably formed over the front surface of the first layer 2a as shown in FIG. 2A, but firmly adsorbs the solder balls 5. If possible, the second layer 2b may be partially formed on the first layer 2a as shown in FIGS. 2B and 2C. The porous body 3 includes a mesh and may be made of any material such as metal or resin, but preferably has good adhesion compatibility with the mask 2. The pore diameter of the porous body 3 is preferably in the range of 1 to 500 μm.

  The diameter of the suction hole 7 of the suction head 1 (mask 2) is determined by the diameter of the solder ball 5 to be used. Here, the through holes 6 of the first layer 2a and the suction holes 7 of the second layer 2b may have the same diameter. However, as shown in FIG. It is better to make it larger than the diameter. According to this, a state in which the second layer 2b is firmly fixed over the entire surface by the first layer 2a is obtained. Of course, the diameter of the through hole 6 may be larger than the diameter of the suction hole 7. Further, the suction hole 7 and / or the through hole 6 may be tapered.

  In order to prevent the solder ball 5 from being damaged when the suction head 1 sucks the solder ball 5 into the suction hole 7, as shown in FIG. 3B, the solder ball 5 is made of the first layer 2a. In particular, it is desirable to set the thickness of the second layer 2b and the diameter of the suction hole 7 so as not to contact the portion facing the suction hole 7.

  Next, the operation of the suction device equipped with the suction head of this embodiment will be described with reference to FIG. As shown in FIG. 3A, the suction head 1 is mounted so as to be in close contact with the suction head mounting portion of the suction device. The suction head 1 is formed with suction holes 7 corresponding to a predetermined arrangement pattern, and each suction of the suction head 1 is performed by performing vacuum suction through an intake pipe / through hole 6 provided above the suction device. The solder balls 5 are attracted to the holes 7. FIG. 3B shows a state in which the solder balls 5 are sucked into the suction holes 7 of the suction head 1 by vacuum suction using a suction device.

  In the state shown in FIG. 3B, the solder balls 5 are transferred onto a large number of pads 8 of the electronic component 9 such as a semiconductor chip or a circuit board arranged on the mounting table 10, and the vacuum suction is released in this state. As a result, as shown in FIG. 3C, the solder balls 5 are placed in a predetermined arrangement on the pad 8 to which the flux has been applied in advance.

  Here, the manufacturing method of the suction head according to the present embodiment will be described with reference to FIG. First, one or several negative photosensitive dry photoresists having a predetermined height are laminated on the surface of a mother mold 30 having conductivity, such as stainless steel, brass steel, or copper. A photoresist layer is formed by pressure bonding, and a pattern film (glass mask) having a light transmitting hole corresponding to the through hole 6 is adhered onto the photoresist layer, and then irradiated with ultraviolet light with an ultraviolet lamp. The primary pattern resist having a resist body 31a corresponding to the through hole 6 as shown in FIG. 4A by performing exposure, developing, and drying to dissolve and remove the unexposed portion. 31 was formed on the matrix 30.

  Next, the mother die 30 is put in an electroforming bath that has been bathed under a predetermined condition, and the surface of the mother die 30 that is not covered with the resist member 31a is covered with nickel or the like within the height range of the previous resist member 31a. An electrodeposited metal such as copper was electroformed to form a primary electroformed layer 32 corresponding to the first layer 2 a of the mask 2 over substantially the entire surface of the mother die 30 as shown in FIG. Thereafter, the surface of the primary electroformed layer 32 was subjected to polishing treatment, and the resist body 31a was dissolved and removed.

  Next, a solder resist layer is formed on the surface of the primary electroformed layer 32 in the same manner as described above, and exposure, development, and drying are performed by well-known methods to dissolve and remove unexposed portions. As shown in (c), a secondary pattern resist 33 having a resist body 33 a corresponding to the second layer 2 b of the mask 2 was formed on the primary electroformed layer 32. Here, if the secondary pattern resist 33 is formed and then a drop prevention process such as baking is performed, the adhesion between the resist body 33a and the primary electroformed layer 32 can be made stronger.

  Subsequently, the primary electroformed layer 32 and the resist body 33a formed on the surface thereof are peeled off from the mother die 30 to laminate the first layer 2a and the second layer 2b as shown in FIG. A mask 2 was obtained.

  Finally, by joining the obtained mask 2 to the porous body 3, the suction head 1 of the present invention as shown in FIG. 4 (e) and FIG. 1 is obtained. Here, in the above description, the mask 2 is formed and then joined to the porous body 3. However, the porous body 3 is used as a matrix, and the steps shown in FIGS. 4A to 4C are performed thereon. If this is applied, the suction head 1 can be manufactured more easily.

  If the suction surface side (second layer 2b) of the mask 2 is formed of a soft material such as a resist or a resin as in the suction head 1 of this embodiment, the solder balls 5 are damaged when the solder balls 5 are sucked. The fear is reduced. Furthermore, if the thickness of the second layer 2b and the size of the suction holes 7 are set so that the solder balls 5 do not contact the first layer 2a or the porous body 3, the risk of damaging the solder balls 5 is further reduced. To do. Further, at the time of adsorption, as shown in FIG. 3B, the solder ball 5 is firmly adsorbed and held in a state of being hard to be inserted into the second layer 2b, so that the solder ball 5 can be prevented from falling off as much as possible. Here, as described above, if the electroforming technique or resist patterning technique is used, the mask 2 can be manufactured in a series of flows. However, a hole formed in a metal plate by machining such as a drill or a punch (first It can also be produced by forming a resin (second layer 2b) on the layer 2a). In such a case, the second layer 2b can prevent the solder ball 5 from being damaged during adsorption, and even if burrs / burrs are formed when a hole is formed by machining, the second layer 2b is cover-like. Because of the role, it is possible to solve the problem that the solder ball bites into the burrs / foils when the solder ball is adsorbed and the ball does not fall even if the suction is released.

  The suction head 1 of the above embodiment has a configuration in which the mask 2 and the porous body 3 are set, and the porous body 3 prevents the solder balls 5 that are chipped or cracked from being sucked into the suction device. If the irregular solder balls 5 are not mixed, it is possible to use only the mask 2 mounted on the suction device as shown in FIG. It is not a thing. Further, in the case of a plate made of resin, there is no risk of damaging the solder ball 5 at the time of adsorption, but it was difficult to handle and attach to the adsorption device because of the slap, but the layer made of metal on the second layer 2b made of resin By backing 2a, the strength can be improved. The thickness of the mask 2 is preferably in the range of 45 μm or more (the first layer 2a is 30 μm or more, and the second layer 2b is 15 μm or more).

It is sectional drawing which shows typically the adsorption head which concerns on 1st Embodiment of this invention. It is a bottom view showing typically the adsorption head concerning a 1st embodiment of the present invention. It is a figure for demonstrating operation | movement of the adsorption | suction apparatus equipped with the adsorption head which concerns on 1st Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the suction head which concerns on 1st Embodiment of this invention. It is a reference drawing of the suction device equipped with the suction head of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Adsorption head 2 Mask 2a 1st layer 2b 2nd layer 3 Porous body 4 Hole 5 Solder ball 6 Through-hole 7 Adsorption hole 30 Master mold 31 Primary pattern resist 31a Resist body 32 Primary electrodeposition layer 33 Primary pattern resist 33a Resist body

Claims (3)

  A mask (2) having a hole (4) corresponding to a predetermined arrangement pattern and formed by laminating a first layer (2a) made of metal and a second layer (2b) made of resin, and the mask A suction head comprising: a porous body (3) disposed on the first layer (2a) side of (2).   The hole (4) includes the through hole (6) provided in the first layer (2a) and the adsorption hole (7) provided in the second layer (2b), and the adsorption hole (7). The suction head according to claim 1, wherein a diameter of the suction head is larger than a diameter of the through hole.   The second layer (2b) is formed so as to prevent the solder ball (5) from coming into contact with the first layer (2a) when the solder ball (5) is sucked into the suction hole (7). The suction head according to claim 1, wherein the suction head is provided.