CN106044704A - 微电子机械系统结构形成方法 - Google Patents
微电子机械系统结构形成方法 Download PDFInfo
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- CN106044704A CN106044704A CN201610478764.0A CN201610478764A CN106044704A CN 106044704 A CN106044704 A CN 106044704A CN 201610478764 A CN201610478764 A CN 201610478764A CN 106044704 A CN106044704 A CN 106044704A
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- layer
- thickness
- mechanical system
- angstrom
- polycrystalline silicon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00388—Etch mask forming
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Micromachines (AREA)
- Formation Of Insulating Films (AREA)
Abstract
Description
氮化硅 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
碳化硅 | 2.54 | 1.75 | 0.28 | 4.3 | 1.36 | 1.29 | 2.2 | 3 | 1.2 | 3.8 | 1.48 |
Claims (9)
Priority Applications (1)
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CN201610478764.0A CN106044704B (zh) | 2016-06-27 | 2016-06-27 | 微电子机械系统结构形成方法 |
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CN201610478764.0A CN106044704B (zh) | 2016-06-27 | 2016-06-27 | 微电子机械系统结构形成方法 |
Publications (2)
Publication Number | Publication Date |
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CN106044704A true CN106044704A (zh) | 2016-10-26 |
CN106044704B CN106044704B (zh) | 2017-09-29 |
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CN201610478764.0A Active CN106044704B (zh) | 2016-06-27 | 2016-06-27 | 微电子机械系统结构形成方法 |
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CN (1) | CN106044704B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1334594A (zh) * | 2001-08-24 | 2002-02-06 | 清华大学 | 硅基单面加工悬浮结构微机械电感的制作方法 |
CN1484280A (zh) * | 2003-08-11 | 2004-03-24 | 中国科学院上海技术物理研究所 | 含氧化多孔硅的低阻硅衬底及其制备 |
US20090117364A1 (en) * | 2007-11-07 | 2009-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Micro-electro-mechanical device and method of manufacturing the same |
CN102205942A (zh) * | 2011-05-13 | 2011-10-05 | 上海集成电路研发中心有限公司 | Mems牺牲层结构制造方法 |
US8273653B2 (en) * | 2008-06-06 | 2012-09-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Microscopic structure packaging method and device with packaged microscopic structure |
CN104627949A (zh) * | 2013-11-14 | 2015-05-20 | 盛美半导体设备(上海)有限公司 | 微电子机械系统结构形成方法 |
-
2016
- 2016-06-27 CN CN201610478764.0A patent/CN106044704B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1334594A (zh) * | 2001-08-24 | 2002-02-06 | 清华大学 | 硅基单面加工悬浮结构微机械电感的制作方法 |
CN1484280A (zh) * | 2003-08-11 | 2004-03-24 | 中国科学院上海技术物理研究所 | 含氧化多孔硅的低阻硅衬底及其制备 |
US20090117364A1 (en) * | 2007-11-07 | 2009-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Micro-electro-mechanical device and method of manufacturing the same |
US8273653B2 (en) * | 2008-06-06 | 2012-09-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Microscopic structure packaging method and device with packaged microscopic structure |
CN102205942A (zh) * | 2011-05-13 | 2011-10-05 | 上海集成电路研发中心有限公司 | Mems牺牲层结构制造方法 |
CN104627949A (zh) * | 2013-11-14 | 2015-05-20 | 盛美半导体设备(上海)有限公司 | 微电子机械系统结构形成方法 |
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Publication number | Publication date |
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CN106044704B (zh) | 2017-09-29 |
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Inventor after: Zhu Xiaoyan Inventor after: Liu Na Inventor after: Wen Jinyou Inventor after: Li Yan Inventor after: Qi Jia Inventor before: Li Yan Inventor before: Qi Jia |
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GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhu Xiaoyan Inventor after: Liu Na Inventor after: Wen Jinyou Inventor after: Li Yan Inventor after: Qi Jia Inventor before: Zhu Xiaoyan Inventor before: Liu Na Inventor before: Wen Jinyou Inventor before: Li Yan Inventor before: Qi Jia |
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CB03 | Change of inventor or designer information |