CN106024759B - 封装体电磁防护层的制造方法 - Google Patents

封装体电磁防护层的制造方法 Download PDF

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CN106024759B
CN106024759B CN201610352028.0A CN201610352028A CN106024759B CN 106024759 B CN106024759 B CN 106024759B CN 201610352028 A CN201610352028 A CN 201610352028A CN 106024759 B CN106024759 B CN 106024759B
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简圣华
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Abstract

本发明的封装体电磁防护层的制造方法，包括以下步骤：a)将可热剥离的紫外线固化胶涂敷于封装体连片的设有焊垫的表面上，以将所述焊垫遮蔽；b)使紫外线固化胶固化；c)将封装体连片单体化，以切割出多个封装体；d)在各个封装体上形成电磁防护层；以及e)热剥离紫外线固化胶；由此，本发明通过紫外线固化胶来遮蔽封装体底面上的焊垫，可避免电磁防护层与焊垫发生桥接短路的可能性；另一方面，在紫外线固化胶热剥离的过程中，电磁防护层的受力是相对均匀且缓慢地发生，从而能够降低电磁防护层剥落与产生碎屑的情况。

Description

封装体电磁防护层的制造方法
技术领域
本发明涉及一种封装体电磁防护层的制法，具体而言是指一种封装体电磁防护层的制造方法，该制造方法能够降低电磁防护层发生剥落或刮伤的可能性。
背景技术
传统的系统级封装(System in package；SiP)模块的封装体的外表面通常镀有一层电磁防护层，以作为电磁屏蔽(EMI Shielding)。然而，传统制造电磁防护层的制程，因应产能的需求，会有多连板(strips or panels)或称为连片的设计，此时，容易发生邻近的封装体之间的电磁防护层相连结的状况，使得在后续制程中必须施加外力以分离各封装体。在分离各封装体的过程中，常常连带地剥离了局部的电磁防护层，或者是产生碎屑沾黏而造成封装体外观不良的情况，因此，一种可以改善封装体表面电磁防护层剥落与碎屑的制造方法是非常需要的。
发明内容
有鉴于此，本发明的其中一个目的在于提供一种封装体电磁防护层的制造方法，该制造方法能够降低电磁防护层剥落与产生碎屑。
为了达成上述目的，本发明提供了一种封装体电磁防护层的制造方法，该制造方法包括以下几个步骤：步骤a)将可热剥离的紫外线固化胶涂敷于封装体连片的设有焊垫的表面上，以将所述焊垫遮蔽；步骤b)使紫外线固化胶固化；步骤c)将上述封装体连片单体化，以切割出多个封装体；步骤d)在各个封装体上形成电磁防护层；以及步骤e)热剥离紫外线固化胶。
由此，当紫外线固化胶因受热而膨胀时，紫外线固化胶将与封装体的焊垫分离，并可对封装体侧面的电磁防护层施力而使其断开，电磁防护层的受力情况是相对均匀且缓慢地发生，可降低电磁防护层发生剥落和产生碎屑的情况。
在其中一个方面，本发明通过预先在封装体上黏合一层紫外线固化胶来遮蔽焊垫，可有效降低电磁防护层与焊垫之间发生桥接短路的可能性，避免系统失效。
另一方面，本发明通过高温液体来分离紫外线固化胶，其过程相对方便且不易产生碎屑。
另一方面，本发明可选择利用封装体与紫外线固化胶在高温液体中的比重不同的情况而使两者分离，分离过程快速且不易刮伤电磁防护层。
另一方面，本发明可适用于利用喷涂(spray coating)的方式来形成电磁防护层。喷涂设备的价格便宜，而且因为无需使用无尘室，设备所占用的空间较小，环境需求也较低，制程时间短，因而能够有效降低制造成本。
附图说明
图1为本发明较佳实施例的制法流程图。
图2A至图2D为本发明较佳实施例的封装体电磁防护层制造方法的剖面示意图。
图3为本发明较佳实施例的封装体连片的俯视图。
(符号说明)
1 封装体连片
5 封装体
10 基板
11 焊垫
20 封胶层
30 电磁防护层
40 紫外线固化胶
S1-S7 步骤
具体实施方式
为了能更理解本发明的特点所在，本发明提供了一较佳实施例并配合附图说明如下。
本发明是以由多个SiP模块的封装体5所组成的封装体连片1作为举例对象(如图3)，SiP模块可以是扇出型SiP(Fan out SiP)或是内嵌式SiP(Embedded SiP)，但本发明并不以此为限。
封装体连片1的各个封装体5的结构可参考图2A的封装体的剖面示意图。每个封装体5包含有基板10和设于基板10上的封胶层20，基板10的底面上设有若干个焊垫11，以供封装体5与外部的其他电子组件电性连接。
以下，对本发明的封装体电磁防护层的制造方法的各步骤及其特点与功效进行说明。
请首先参考图1。步骤S1：将可热剥离的紫外线固化胶40涂敷于封装体连片1的各个基板10的底面上，在本实施例中，该底面是指设有焊垫11的表面，该紫外线固化胶40以将基板10的整个底面以及各焊垫11遮蔽的状态粘附于基板10的底面上(如图2B)。本实施例选择使用公司的型号为AD4500的紫外线固化胶40，该紫外线固化胶40可在紫外光的照射下在数秒内固化，并可在例如浸泡于摄氏90℃至95℃的高温液体(热水)时、或者是放置于内部温度为140℃的烘箱时，紫外线固化胶40失去黏性(debond)而从基板10剥离。
在步骤S1之后执行步骤S2：使用紫外光照射紫外线固化胶40，使紫外线固化胶40固化。
之后执行步骤S3：将封装体连片1进行单体化(singulation)，以从封装体连片1切割出多个封装体5。
在步骤S3之后，执行步骤S4：通过取放装置(Pick and Place Machine)将各个封装体5放置并固定于载板(省略图示)上。
之后执行步骤S5：使用例如喷涂的方式并使用常用的电磁防护材料，在封装体5的外表面(例如封装体5的顶面与侧面)形成一层电磁防护层30，该电磁防护层30与接地层(省略图示)电性连接，由此屏蔽封装体5外部的电磁辐射(如图2C)，电磁防护层30所使用的材料可以是例如金属材料或者具有导电性的复合材料，但不以此为限。需要说明的是，在喷涂形成电磁防护层30时，电磁防护层30会形成于紫外线固化胶40的侧边上、或者与相邻近的另一个封装体5的电磁防护层30相连结。
步骤S6：热剥离上述紫外线固化胶40。本实施例是通过将封装体5放置于高温液体中的方式来热剥离紫外线固化胶40，本实施例所述的高温液体例如是摄氏90℃至95℃的热水，但不以此为限，也可以是其他液体或者温度高于摄氏90℃至95℃的其他液体。此时，紫外线固化胶40因受热膨胀而与封装体5的焊垫11分离，并且在热膨胀的过程中，位于紫外线固化胶40侧边的电磁防护层30断开。由于分离后的紫外线固化胶40与封装体5在热水中的比重不同，因而能够轻易且完全地使紫外线固化胶40从封装体5脱离，脱离后的封装体5如图2D所示。
步骤S7：进行最终加热烘烤(Final Cure)，以烘干封装体的电磁防护层30并完成制造。
本实施例在步骤S5中形成电磁防护层30之前，先在步骤S1中涂敷紫外线固化胶40并覆盖焊垫11的表面，可有效降低后续电磁防护层30与焊垫11之间发生桥接短路的可能性。
再者，本实施例在步骤S6中，紫外线固化胶40是通过热水的温度作用而热膨胀，紫外线固化胶40施加于电磁防护层30的力量是相对均匀且缓慢的，因而不易造成封装体5侧边的电磁防护层30发生剥落(chips)与碎屑(burrs)的情况。

Claims (10)

1.一种封装体电磁防护层的制造方法，其特征在于包括以下步骤：
a)将紫外线固化胶涂敷于封装体连片的设有多个焊垫的表面上，以将各个所述焊垫遮蔽；
b)使所述紫外线固化胶固化；
c)将所述封装体连片单体化，以切割出多个封装体；
d)在各个所述封装体上形成电磁防护层；以及
e)热剥离所述紫外线固化胶。
2.如权利要求1所述的制造方法，其特征在于，在步骤d)中，利用喷涂的方式形成所述电磁防护层。
3.如权利要求1所述的制造方法，其特征在于，在步骤c)与步骤d)之间还包含步骤f)，在该步骤f)中，将各个所述封装体放置于载板上。
4.如权利要求1或2所述的制造方法，其特征在于，在步骤e)中，将各个所述封装体放置于高温液体中。
5.如权利要求4所述的制造方法，其特征在于，在步骤e)中，将各个所述封装体放置于90℃至95℃的热水中。
6.如权利要求1或2所述的制造方法，其特征在于，在步骤e)之后还包含步骤g)，在该步骤g)中，将各个所述封装体烘干。
7.一种封装体电磁防护层的制造方法，其特征在于包括以下步骤：
a)将可热剥离的紫外线固化胶涂敷于封装体连片的设有多个焊垫的表面上，以将各个所述焊垫遮蔽；
b)使所述紫外线固化胶固化；
c)将所述封装体连片单体化，以切割出多个封装体；
d)将各个所述封装体放置于载板上；
e)利用喷涂的方式在各个所述封装体上形成电磁防护层；以及
f)将各个所述封装体放置于高温液体中，以热剥离所述紫外线固化胶。
8.如权利要求7所述的制造方法，其特征在于，在步骤f)中，将各个所述封装体放置于热水中。
9.如权利要求8所述的制造方法，其特征在于，在步骤f)中，将各个所述封装体放置于90℃至95℃的热水中。
10.如权利要求7所述的制造方法，其特征在于，在步骤f)之后还包含步骤g)，在该步骤g)中，将各个所述封装体烘干。
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