CN105977169B - 封装体电磁防护层的制造方法 - Google Patents

封装体电磁防护层的制造方法 Download PDF

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CN105977169B
CN105977169B CN201610353315.3A CN201610353315A CN105977169B CN 105977169 B CN105977169 B CN 105977169B CN 201610353315 A CN201610353315 A CN 201610353315A CN 105977169 B CN105977169 B CN 105977169B
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简圣华
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Abstract

本发明的封装体电磁防护层的制造方法，包括：a)将可热剥离的紫外线固化胶涂敷于可透光的基材上；b)将封装体置放于紫外线固化胶上，使得紫外线固化胶粘附于封装体的设有焊垫的一面；c)朝基材照射紫外线以固化紫外线固化胶；d)在封装体上形成电磁防护层；e)热剥离紫外线固化胶；由此，本发明通过紫外线固化胶来遮蔽封装体底面的焊垫，能够避免电磁防护层与焊垫发生桥接短路的可能性；另一方面，在紫外线固化胶热剥离的过程中，电磁防护层的受力是相对均匀且缓慢地发生，能够降低电磁防护层的剥落与碎屑。

Description

封装体电磁防护层的制造方法
技术领域
本发明涉及一种封装体电磁防护层的制法，具体而言是指一种封装体电磁防护层的制造方法，该制造方法能够降低电磁防护层剥落或刮伤的可能性。
背景技术
传统的系统级封装(System in package；SiP)模块的封装体的外表面通常镀有一层电磁防护层，以作为电磁屏蔽(EMI Shielding)。然而，传统制造电磁防护层的制程，会有多连板(strips or panels)的设计，此时，便容易发生与邻近的封装体之间电磁防护层相连结的状况，使得在后续制程中必须施加外力以分离各封装体。在分离各封装体的过程中，常常连带地剥离了局部的电磁防护层，或者是产生碎屑沾黏而造成封装体外观不良以及电磁防护层与焊垫发生桥接短路的可能性，因此一种可以改善封装体表面电磁防护层剥落与碎屑的制造方法是非常需要的。
发明内容
有鉴于此，本发明的主要目的在于提供一种封装体电磁防护层的制造方法，该制造方法能够降低电磁防护层剥落与产生碎屑，进而降低电磁防护层与焊垫发生桥接短路的可能性。
为了达成上述目的，本发明提供了一种封装体电磁防护层的制造方法，该方法包括以下几个步骤：步骤a)将可热剥离的紫外线固化胶涂敷于可透光的基材上；步骤b)将封装体置放于紫外线固化胶上，使得紫外线固化胶粘附于封装体的设有焊垫的一面；步骤c)朝基材照射紫外线以固化紫外线固化胶；步骤d)在封装体上形成电磁防护层；步骤e)热剥离紫外线固化胶。
由此，本发明通过紫外线固化胶来遮蔽封装体底面的焊垫，可避免封装体在形成电磁防护层的过程中，电磁防护层与焊垫发生桥接短路的可能性。另一方面，在紫外线固化胶因热膨胀而剥离的过程中，可对封装体侧面的电磁防护层施力而使其断开，电磁防护层的受力情况是相对均匀地且缓慢地发生，可降低电磁防护层的发生剥落与产生碎屑的情况。
在其中一个方面，本发明是选择在将封装体置放于紫外线固化胶上时，使紫外线固化胶也黏附封装体的侧面底部边缘，如此一来，在后续形成电磁防护层时，可更有效地避免侧面的电磁防护层与底面的焊垫发生桥接短路的可能性。
另一方面，本发明是以溅镀的方式来形成电磁防护层，并且是选择使用热剥离温度高于溅镀制程温度(例如摄氏170℃)的紫外线固化胶，避免在溅镀制程时因紫外线固化胶热剥离而失去了原本遮蔽焊垫的功能。
另一方面，本发明是选择将封装体置放于高温液体内，使紫外线固化胶受热膨胀而从封装体剥离。
附图说明
图1为本发明较佳实施例的制法流程图。
图2为本发明较佳实施例的基材的俯视图，用以显示基材的涂敷区域的分布情况。
图3A至图3E为本发明较佳实施例的封装体电磁防护层制造方法的剖面示意图。
(符号说明)
10 封装体
11 基板
110 焊垫
13 封胶层
14 接地层
15 底面
17 侧面
20 可透光的基材
21 涂敷区域
30 紫外线固化胶
40 灯具
50 电磁防护层
S 间隙
S1-S6 步骤
具体实施方式
为了能更理解本发明的特点所在，本发明提供了一较佳实施例并配合附图说明如下。
本发明是以由多个SiP模块的封装体10所组成的封装体连片(strips或panels，省略图示)作为举例对象，SiP模块可以是扇出型SiP(Fan out SiP)或是内嵌式SiP(EmbeddedSiP)，但本发明并不以此为限。
封装体连片的各个封装体10的结构可参考图3B，其中，封装体10包含有基板11和设于基板11上方的封胶层13。基板11的内层设有接地层14。基板11的底面15设有若干个焊垫110，以供封装体10与外部的其他电子组件电性连接。
以下，对本发明的封装体电磁防护层的制造方法的各步骤及其特点与功效进行说明。
步骤S1：将可热剥离的紫外线固化胶30涂敷于可透光的基材20的一表面上(如图3A)。本实施例中选择使用可透光的玻璃作为可透光的基材20，并且本实施例所指称的可透光的基材20是指至少可被紫外光透射的基材20。请同时参考图2与图3A，可透光的基材20的表面被划分成多个涂敷区域21，多个涂敷区域21例如是以五乘以四的数组方式作排列，但本发明不以此为限。每个涂敷区域21均涂敷有层厚度为100微米(μm)的紫外线固化胶30，涂敷的面积大于基板11的底面15的面积。此外，本实施例中选择使用公司的型号为AD4600或AD4601的紫外线固化胶30，关于该紫外线固化胶30，可在紫外光的照射下在数秒内固化，并可在置放于温度超过摄氏170℃的高温液体或环境中时，紫外线固化胶30失去黏性(debond)，并且热膨胀而从黏附的对象剥离。
另一方面，在步骤S2中，将封装体连片进行单体化(singulation)，以从封装体连片切割出各个封装体10。
步骤S3：通过取放装置(Pick and Place Machine)将每一个切割出来的封装体10以其底面15朝下的方式放置在紫外线固化胶30上，使得封装体10的底面15连同焊垫110完整地被紫外线固化胶30粘附并覆盖(如图3B)。此外，本实施例中还选择性地使紫外线固化胶30粘附封装体10的侧面17底部边缘，例如从封装体10的底部边缘起算向上30微米(μm)的高度处，以利于之后在封装体10上形成电磁防护层50时，电磁防护层50不会桥接至封装体10的焊垫110。
执行完步骤S3后，接着执行步骤S4，在该步骤S4中，使用灯具40，朝可透光的基材20的、未涂敷紫外线固化胶30的一面照射紫外线，以固化紫外线固化胶30(如图3C)，本实施例中所使用的灯具例如是水银灯(mercury vapor bulb)，但不以此为限。
执行完步骤S4后，接着执行步骤S5，在该步骤S5中，如图3D所示，在封装体10上形成一层电磁防护层50，并与接地层14电性连接。本实施例中是以溅镀(sputtering)的方式来形成电磁防护层50，在该溅镀的过程中，电磁防护层50形成于封装体10的封胶层13表面与基板11的侧边、以及紫外线固化胶30的局部外表面。需要说明的是：溅镀制程温度是控制在摄氏170℃左右，其低于所选用的紫外线固化胶30的热剥离的温度，从而能够避免在溅镀制程时因紫外线固化胶30热剥离而失去了原本遮蔽封装体10的焊垫110的功能。
之后执行步骤S6，在该步骤S6中，热剥离紫外线固化胶，例如是将紫外线固化胶30放入高温液体内，使固化的紫外线固化胶30从封装体10剥离。本实施例中是将封装体10置放到温度高于摄氏170℃的高温液体中以热剥离紫外线固化胶30，此时位于封装体10的底面15以及靠近侧面17底部边缘的紫外线固化胶30因受热膨胀而从封装体10剥离，并且在热膨胀的过程中，靠近侧面17底部边缘的电磁防护层50也会断开，进而使封装体10和紫外线固化胶30以及可透光的基材20分离，剥离后的封装体10如图3E所示。
需要说明的是：本实施例在步骤S5形成电磁防护层50之前，先利用紫外线固化胶30来遮蔽封装体10的底面15(包含焊垫110)，可降低后续形成电磁防护层50时，电磁防护层50与焊垫110之间发生桥接短路的可能性。此外，也因为在步骤S3中，封装体10的侧面17底部边缘黏附有紫外线固化胶30，因此封装体10的侧面17底部边缘至少留有30微米的高度是没有镀上电磁防护层50，在执行步骤S6之后，如图3E所示，封装体10的底面15与电磁防护层50之间留有间隙S，更可有效降低侧面17上形成的电磁防护层50与焊垫110发生桥接短路的可能性。
进而，本实施例在步骤S6中，紫外线固化胶30是通过高温液体的温度作用而热膨胀，紫外线固化胶30施加于电磁防护层50的力量是相对均匀且缓慢的，因此不易造成电磁防护层50产生剥落(chips)与碎屑(burrs)的情况。

Claims (10)

1.一种封装体电磁防护层的制造方法，其特征在于包括以下步骤：
a)将紫外线固化胶涂敷于可透光的基材上；
b)将封装体置放于所述紫外线固化胶上，使得所述紫外线固化胶粘附于所述封装体的设有焊垫的一面；
c)朝所述可透光的基材照射紫外线以固化所述紫外线固化胶；
d)在所述封装体上形成电磁防护层；
e)热剥离所述紫外线固化胶。
2.如权利要求1所述的制造方法，其特征在于，
在所述步骤d)中，以溅镀制程的方式形成所述电磁防护层，并且所述紫外线固化胶热剥离的温度高于所述溅镀制程的温度。
3.如权利要求1或2所述的制造方法，其特征在于，
在所述步骤a)中，将所述紫外线固化胶涂敷于可透光的玻璃上。
4.如权利要求1或2所述的制造方法，其特征在于，
在所述步骤a)中，将100微米厚度的所述紫外线固化胶涂敷于所述可透光的基材。
5.如权利要求1所述的制造方法，其特征在于，
在所述步骤b)中，所述紫外线固化胶黏附所述封装体的侧面底部边缘。
6.如权利要求5所述的制造方法，其特征在于，
在所述步骤b)中，所述紫外线固化胶黏附所述封装体的从底部边缘起算高度为30微米的侧面。
7.如权利要求1所述的制造方法，其特征在于，
在所述步骤e)中，将所述封装体置放于高温液体中，以热剥离所述紫外线固化胶。
8.如权利要求7所述的制造方法，其特征在于，
所述高温液体的温度高于摄氏170℃。
9.如权利要求1所述的制造方法，其特征在于，
在所述步骤a)与所述步骤b)之间，还执行将封装体连片进行单体化的步骤，以从所述封装体连片切割出各所述封装体。
10.如权利要求1至2、5至9中任一项所述的制造方法，其特征在于，所述封装体的底面与所述电磁防护层之间留有间隙。
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