CN106000819A - Heating and drying device - Google Patents
Heating and drying device Download PDFInfo
- Publication number
- CN106000819A CN106000819A CN201610171873.8A CN201610171873A CN106000819A CN 106000819 A CN106000819 A CN 106000819A CN 201610171873 A CN201610171873 A CN 201610171873A CN 106000819 A CN106000819 A CN 106000819A
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- substrate
- oscillating plate
- chamber
- top board
- heat drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Drying Of Solid Materials (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microbiology (AREA)
- Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a heating and drying device. A substrate on a conveying path can aslo be dried while the forming of a coating film on the sustrate causing uneven drying is inhibited. The heating and drying device enables ultrasonic vibration floating of the substrate and heats and dries the substrate on the conveying path by a conveying device for conveying. The heating and drying device comprises a heater part which heats the coating film on the substrate; a chamber cover part which is abutted against a vibration plate to form a chamber part and maintains the substrate in the chamber part to be sealed; and an air discharge part which discharges air in the chamber part. A top plate is arranged in the chamber cover part, when the chamber cover part is abutted against the vibration plate, the top plate is close to the substrate on the vibration plate and is opposite to the whole surface of the substrate. The air discharge part discharges air in the chamber part to enable a pressure reduction state in the chamber part and simultaneously carries out heating through the heater part to dry the coating film on the substrate.
Description
Technical field
The present invention relates to heat drying apparatus, for floating basal-plate ultrasonic vibration while carrying out the conveyance transported
Substrate on path, makes the coated film being formed on substrate be dried.
Background technology
In the flat plate panel display such as liquid crystal display or plasma display, use on substrate, be coated with anti-corrosion liquid
Substrate (referred to as coated substrates).This coated substrates is, by apparatus for coating, anti-corrosion liquid is being uniformly coated to substrate
Transported and by drying device, coated film is dried by base board delivery device after above forming coated film and given birth to
Produce.Generally, drying device is arranged with base board delivery device split ground, dry by utilizing mechanical hand etc. to be moved into by substrate
Dry device also keeps the time of regulation and the coated film on substrate is dried.This drying device generally uses drying under reduced pressure to fill
Put, in making chamber, make the coated film on substrate be dried in vacuum state, it is possible to produce in coated film with suppression
The mode of drying mark is dried.
In recent years, in order to improve productive temp, research makes the scheme that coated film is dried in substrate transport path.Specifically
For, develop as Patent Document 1, make utilizing ultrasonic activation to make on the base board delivery device of substrate-levitating
The device (with reference to patent documentation 1) that coated film is dried.Here, Figure 15, Figure 16 are to utilize ultrasonic activation to make substrate
The figure of the base board delivery device floated, Figure 15 is the figure observed from upside, and Figure 16 is the figure observed from side.Should
Base board delivery device have carry out the oscillating plate 100 of ultrasonic activation and substrate W is guided substrate-guided
Part 101, is configured to the substrate-guided part 101 of the substrate W that hold under the state that ultrasound wave has floated along vibration
Plate 100 travels thus conveyance substrate W.That is, (pass through by making substrate-guided part 101 travel along track 102
Substrate-guided part 101 is made to move to double dot dash line from solid line), and transported when keeping substrate W to float
To next adjacent oscillating plate 100.Further, being provided with heat drying apparatus in base board delivery device, this heating is done
Dry device has heater portion 103, by utilizing this heater portion 103 in the rear side of the oscillating plate 100 of a part
Heating vibration plate 100 and make the coated film on substrate W be dried.Specifically, by heat drying apparatus, when making
Substrate W stops at when being provided with on the oscillating plate 100 of heater portion 103, is tieed up by the halted state making substrate W
Hold and be dried the time of required regulation and make the coated film on substrate W be dried.
Patent documentation 1: Japanese Unexamined Patent Publication 2014-022538 publication
But, in above-mentioned heat drying apparatus, there is the coated film on substrate W and produce the situation of drying mark
Such problem.That is, in above-mentioned heat drying apparatus, due to the substrate W stopped on oscillating plate 100
It is thermally dried, the most sometimes causes producing in coated film because of the small flowing change of the air near coated film
Irregular (air-flow is irregular) along the flowing of air-flow.Further, there is following problem: because of coated film is overall and and its
The drying regime that relation between the air of contact causes coated film overall is uneven, when being dried in this condition
Time, in coated film, remain drying mark (light and shade is irregular) sometimes.
Summary of the invention
The present invention completes in view of the foregoing, its object is to provide a kind of heat drying apparatus, for conveyance
Substrate on path, it is also possible to be dried in the way of the coated film generation drying mark that suppression is formed on substrate.
In order to solve above-mentioned problem, basal-plate ultrasonic vibration is being floated while entering by the heat drying apparatus of the present invention
In the transport path of the carrying device of row conveyance, substrate is thermally dried, it is characterised in that this heat drying apparatus
Having: heater portion, the coated film being formed on transported substrate is heated by it；Chamber cap, it passes through
Abut with oscillating plate and form chamber portion, and in chamber portion, substrate is remained sealing state；And exhaust portion, its
It is exhausted in described chamber portion, in described chamber cap, is provided with top board, abuts with oscillating plate at chamber cap
State under, this top board and substrate on oscillating plate close to and whole with substrate relative, described exhaust portion is described
On the position that the center with described top board in chamber cap is relative, there is air vent, by from described aerofluxus
Mouth will be formed as decompression state, by making described heating to being exhausted in described chamber portion in described chamber portion
Device portion carries out heating and making the coated film on substrate be dried.
Fill according to above-mentioned heat drying, form chamber portion by making chamber cap abut with oscillating plate, when this chamber portion
In by exhaust portion by aerofluxus time, be formed as the decompression state more slightly smaller than atmospheric pressure in chamber portion, thus coated film is attached
Closely smoothly attracted.Further, due to be arranged at the top board of chamber cap be arranged to whole with substrate relative, because of
This top board and the distance of the coated film on substrate are uniform on the whole in coated film, and the flowing of the air near coated film realizes
Homogenization.Therefore, the coated film being formed on substrate is heated by heater portion and produces solvent, is on the other hand produced
Solvent attracted by even and be dried, it is possible to suppression in coated film produce air-flow the most even bright
The most irregular.
And, it is also possible to it is configured in described top board, be provided with the top board heater portion that top board is heated.
According to this structure, owing to heating top board by top board heater portion, therefore, it is possible to make the back side, front of substrate become
Roughly the same temperature.That is, in the case of the temperature of top board is relatively low, following problem can be produced: evaporated is molten
The condensation of agent and solvent be attached to top board and condensation drop to coated film and cause coated film become defective products problem or
Person causes the flowing of the solvent of exhaust portion to become uneven and produce the most even light and shade of air-flow because solvent is attached to top board
Irregular problem, by arranging top board heater portion and it can be avoided that these problems.
And, it is preferred to use following structure: this heat drying apparatus has alignment pin, this alignment pin with to described
The substrate-guided part that the substrate transported on oscillating plate carries out supporting is different, positions substrate in described chamber portion
And support.
According to this structure, owing to can be thermally dried when making substrate be positioned in chamber portion, therefore can
Enough suppression are because of moving substrate and the irregular impact of the air-flow that causes in heat drying.Further, it is possible to eliminate because of in heating
What dry middle substrate moved and caused rises the metacoxal plate handing-over error to substrate-guided part at chamber.
And, it is also possible to being configured to be provided with position limitation pin in described chamber cap, it is to the base in heat drying
The position of plate limits.
According to this structure, the position limitation pin owing to limiting the position of substrate is arranged at chamber cap, therefore with
The structure of position limitation pin is set in oscillating plate and compares the temperature that can keep equably in chamber portion, it is possible to suppression is dry
Dry irregular generation.That is, it is provided with in oscillating plate in the structure of position limitation pin, owing to needs set in oscillating plate
Put the through hole inserted for position limitation pin, be therefore provided with the part of this through hole compared with other part likely
Produce temperature because temperature environment is different irregular, but can be suppressed this by arranging position limitation pin in chamber cap
The generation that temperature is irregular.
According to the heat drying apparatus of the present invention, for the substrate in transport path, it is also possible to be formed at substrate with suppression
On coated film produce drying mark mode be dried.
Accompanying drawing explanation
Fig. 1 is the top view of the base board delivery device illustrating the heat drying apparatus with one embodiment of the present invention.
Fig. 2 is the top view of 1 unit amplification of the base board delivery device by having above-mentioned heat drying apparatus.
Fig. 3 is the side view of Unit 1 of the base board delivery device with above-mentioned heat drying apparatus.
Fig. 4 is the front view of Unit 1 of the base board delivery device with above-mentioned heat drying apparatus.
Fig. 5 is the top view being shown through the state that substrate is transported to adjacent microscope carrier portion by aforesaid substrate guiding piece.
Fig. 6 is to illustrate that aforesaid substrate guiding piece is made a concession and alignment pin is the top view of state of projected state.
Fig. 7 is the top view of the state illustrating that aforesaid substrate guiding piece resets to original position.
Fig. 8 is the top view of aforesaid substrate guiding piece.
Fig. 9 is the A-A sectional view of Fig. 8.
Figure 10 is the amplification view of floating unit.
Figure 11 is the figure illustrating air cushion portion 55, and (a) is the figure observing air cushion portion 55 from bottom surface side, and (b) is from side
The sectional view that side, face is observed.
Figure 12 is the figure of the heat drying apparatus illustrating the present invention, and (a) illustrates that chamber cap is in top position
The figure of state, (b) is the figure of the state illustrating that chamber cap abuts with oscillating plate.
Figure 13 is the figure of the heat drying apparatus illustrating another embodiment, and (a) is to illustrate that chamber cap is in top
The figure of the state of position, (b) illustrates Pit cover subordinate fall and by position limitation pin, substrate is carried out position limitation
The figure of state.
Figure 14 is the figure being shown in the state that other embodiment middle chamber cap above-mentioned abuts with oscillating plate.
Figure 15 is the top view of the base board delivery device with conventional heat drying apparatus.
Figure 16 is the side view of the base board delivery device with conventional heat drying apparatus.
Label declaration
1: base board delivery device；2: substrate；12: oscillating plate；14: alignment pin；15: heater portion；16: carry
Platform portion；16C: with the microscope carrier portion of heat drying apparatus；30: substrate-guided part；91: chamber cap；92: row
Gas portion；93: chamber portion；95: top board；96: position limitation pin.
Detailed description of the invention
Use accompanying drawing that the embodiment of the heat drying apparatus of the present invention is illustrated.
Fig. 1 is the top view illustrating the base board delivery device with heat drying apparatus, and Fig. 2 is will to have heat drying
The top view that a part for the base board delivery device of device is amplified, Fig. 3 is the substrate conveyance dress with heat drying apparatus
The partial side view put, Fig. 4 is the partial front elevation view of the base board delivery device with heat drying apparatus.
In Fig. 1 to Fig. 4, base board delivery device 1 is used for transporting substrate 2 when making it float,
Can be by the substrate 2 supplied from upstream side so that its state floated change and is transported to down towards ground with keeping intact
Trip side.It addition, in FIG, microscope carrier portion 16A is upstream side, transports towards microscope carrier portion 16C from microscope carrier portion 16A
Substrate 2.
It addition, in the following description, the conveyance direction of conveyance substrate 2 is set to X-direction, will be at horizontal plane
Upper perpendicular direction is set to Y direction, is set in the direction vertical with X-direction and these both sides of Y direction
Z-direction and illustrate.
Base board delivery device 1 has microscope carrier unit 10 and transport unit 20, in the Y direction two of microscope carrier unit 10
Side is configured with transport unit 20.Microscope carrier unit 10 loads substrate 2, it is possible to placed substrate 2 is maintained at floating
State.Further, transport unit 20 retrains the substrate 2 floated in conveyance direction (X-direction)
It is transported.That is, the substrate 2 being supplied to microscope carrier unit 10 floats on microscope carrier unit 10, and is set
Substrate-guided part 30 in transport unit 20 retrains.Further, by making substrate-guided part 30 go in the X-axis direction
Sail and transport substrate 2 in the X-axis direction.
Microscope carrier unit 10 has multiple microscope carrier portion 16, in the example of Fig. 1, by being arranged by microscope carrier portion 16A to 16D
Row form transport path in one direction.It addition, in the case of jointly representing microscope carrier portion 16A to 16D
Referred to as microscope carrier portion 16.
Microscope carrier portion 16 makes placed substrate 2 vibration float, and microscope carrier portion 16 like that has as shown in Figure 3, Figure 4:
Oscillating plate 12, it is positioned on base station 11 and is formed as flat condition；And vibration floating component 13, it makes substrate 2
Float from the positive surface vibration of this oscillating plate 12.Oscillating plate 12 is rectangular-shaped relatively thin metal flat-shaped part, with
The posture configuration of level.That is, by 4 oscillating plates 12 of each microscope carrier portion 16A to 16D are joined in the example of Fig. 1
It is set to keep identical height to form transport path.Further, oscillating plate 12 has relative with the substrate 2 supplied
The front 12a (also referred to as front 12a) of oscillating plate 12, be integrally formed into flat condition.In the present embodiment,
The front 12a of oscillating plate 12 is formed as the size bigger than substrate 2, the whole face of substrate 2 supplied will not highlight and
Relative with the front 12a of this oscillating plate 12.
Further, oscillating plate 12 is provided with alignment pin 14, by this alignment pin 14 by fixed for the substrate 2 moved
Position is in the position of regulation.This alignment pin 14 is provided with 4 on 1 oscillating plate 12, every 2 be arranged on 1 right
On linea angulata.Specifically, this alignment pin 14 is arranged in when substrate 2 is supplied on oscillating plate 12 and clips substrate 2
Diagonal on the position of 2 angle parts.That is, alignment pin 14 configures according to the size of the substrate 2 transported
The position in small gap is formed at substrate 2 and alignment pin 14.
Further, this alignment pin 14 can carry out lifting action, under receiving state, alignment pin 14 entirety is accommodated in
Oscillating plate 12 times, under projected state, alignment pin 14 is prominent on oscillating plate 12 front.Therefore, at alignment pin
14 are in supplying substrate 2 under receiving state, when substrate 2 is supplied on the front 12a of oscillating plate 12, and alignment pin
14 become projected state, and the side 2a of substrate 2 contacts with alignment pin 14, and thus substrate 2 is positioned.That is, when
When being supplied on oscillating plate 12 by substrate 2, substrate 2 is the state floating and can moving freely, but by making location
Pin 14 contacts with the side 2a of substrate 2 and retrains the movement of substrate 2, is positioned on oscillating plate 12 by substrate 2
The position (orientation range) of regulation.
Further, vibration floating component 13 makes supplied substrate 2 vibration float to the front 12a rule away from oscillating plate 12
The position of fixed height.In the present embodiment, as shown in Figure 3, Figure 4, the back side 12b at oscillating plate 12 sets
It is equipped with oscillator 13a, by applying the vibration of specific frequency by this oscillator 13a, thus the base on oscillating plate 12
Plate 2 can float from the front 12a of oscillating plate 12.Specifically, such as when utilizing ultrasound wave to make oscillator 13a shake
Time dynamic, this vibration is passed, and oscillating plate 12 vibrates because of ultrasound wave self.Thus, in the front of oscillating plate 12
Forming small air layer between 12a and substrate 2, substrate 2 floats from the front 12a of oscillating plate 12.That is, when
When making oscillator 13a vibrate with characteristic frequency, substrate 2 to float to the height of regulation from the front 12a of oscillating plate 12
The state of position is maintained on oscillating plate 12.
Further, transport unit 20 transports the substrate 2 on oscillating plate 12 via substrate-guided part 30 in conveyance direction.
Transport unit 20 has the base station 11a extended in one direction, is arranged along the conveyance direction of oscillating plate 12
From Y-direction side clamping vibration plate 12.Further, transport unit 20 has substrate-guided part 30, it is possible to pass through base station
Conveyance drive division 40 on 11a makes multiple substrate-guided part 30 move and transport substrate 2.That is, substrate-guided part 30
Respectively correspondingly arranging with each oscillating plate 12, each substrate-guided part 30 can carry out moving from 1 oscillating plate 12
Next oscillating plate 12 to downstream is then reset to the action of original oscillating plate 12.Each oscillating plate 12 each
Substrate-guided part 30 carries out such action simultaneously, it is possible to transport substrate 2 in conveyance direction.
Specifically, when substrate 2 is supplied to 1 oscillating plate 12, this substrate 2 is retrained (figure by substrate-guided part 30
The state of 1).Further, by the movement of substrate-guided part 30, this substrate 2 is transported to next oscillating plate in downstream
12 (states of Fig. 5), and it is positioned on the oscillating plate 12 in downstream (state of Fig. 6).Further, downstream
Substrate-guided part 30 resets to the original oscillating plate 12 (state of Fig. 7) of upstream side, lays equal stress on and newly retrains by upstream
The substrate 2 that the substrate-guided part 30 of side moves.Transporting by utilizing each oscillating plate 12 to repeat this operation
Substrate 2 is transported on direction.That is, substrate 2 is transported by the mode of taking over of multiple substrate-guided parts 30.It addition,
In Fig. 1, Fig. 5 to Fig. 7, in the case of alignment pin 14 is black, represent projected state, in the feelings that it is white
Receiving state is represented under condition.I.e., in Figure 5, alignment pin 14 is in receiving state, is in Fig. 6, Fig. 7
Projected state.
Conveyance drive division 40 has: the track 41 that extends in one direction, the conveyance of mounted board guiding piece 30
Main part 42 and the linear motor 43 of driving conveyance main part 42.Track 41 is the flat board with even surface
Shape parts, and be arranged on each base station 11 in smooth supine mode.I.e., as shown in Figure 2, Figure 4 shows, rail
Road 41 is arranged on respectively away from shaking in the way of the front 12a along the conveyance direction clamping vibration plate 12 of oscillating plate 12
The dynamic equidistant position of plate 12.Further, the height and position of the even surface of each track 41 is respectively set as common height
Degree position.
Further, the even surface of track 41 is provided with LM guiding piece 44 and linear motor 43.Specifically,
The stator (magnetic sheet) of linear motor 43 is arranged on the Y-axis side of even surface in the way of extending in the X-axis direction
To middle position, LM guiding piece 44 is arranged to extend in the X-axis direction in the both sides of this stator.Further, remove
Sending main part 42 to link with this LM guiding piece 44, the movable piece being arranged at conveyance main part 42 is connected with stator.
Therefore, when by driving linear motor 43 to make movable piece move along stator, conveyance main part 42 can be along
Track 41 moves.That is, by linear motor 43 is driven control, conveyance main part 42 can be along X
Direction of principal axis moves and stops in arbitrary position.
Conveyance main part 42 has the equipped section 42a of mounted board guiding piece 30 and the lower limb from this equipped section 42a extension
Portion 42b, is formed as cross section substantially U-shaped.LM guiding piece 44 links with this leg 42b, and equipped section 42a is joined
It is set to upward.Further, being provided with 1 substrate-guided part 30 on the 42a of this equipped section, substrate-guided part 30 is joined
It is set to lay respectively on the diagonal of oscillating plate 12.That is, it is different from the diagonal at alignment pin 14 place right to be arranged in
On linea angulata.Further, when being driven linear motor 43 controlling, conveyance main part 42 draws maintain substrate
Move in conveyance direction under the state of the position relationship that guiding element 30 is present on diagonal.It addition, the two point of Fig. 2
Line represents the conveyance main part 42 after moving and substrate-guided part 30.
As shown in Figure 8, Figure 9, substrate-guided part 30 has: retrains the substrate-guided part main body 31 of substrate 2, prop up
Hold the guiding piece support 32 of this substrate-guided part main body 31 and make substrate-guided part main body 31 from oscillating plate 12
Front 12a float floating unit 50.Further, to substrate-guided part main body 31 to oscillating plate 12 just have
Force application component 60, floating unit 50 and the force application component 60 of 12a side, face force, it is possible to by substrate-guided part main body
The height and position of 31 regulations maintaining the front 12a away from oscillating plate 12.
Guiding piece support 32 has flat arm 32a, and its fore-end is provided with substrate-guided part main body
31.This arm 32a is arranged at the equipped section 42a of conveyance main part 42 via elevating mechanism, it is possible to relative to lift-launch
Portion 42a carries out lifting action in z-direction.In the present embodiment, aerostatic slide platform 81 is used for elevating mechanism,
Arm 32a can be made to move in z-direction by controlling the quantity delivered of the air to this aerostatic slide platform 81.That is,
For aerostatic slide platform 81, the platform 81a of linearly movement is installed to be and can move in z-direction, arm
Portion 32a is installed on this 81a via aerostatic slide platform 82.Further, the quantity delivered of air is controlled, by making arm
32a moves down and makes substrate-guided part main body 31 close to substrate 2, makes substrate by making arm 32a be moved upwardly by
Guidance body 31 moves up in the side away from substrate 2.In the present embodiment, substrate-guided part main body 31
The degree not contacted can be risen to the alignment pin 14 of projected state from the position of constraint substrate 2.That is, at such as figure
After substrate 2 is transported to shown in 5 next oscillating plate 12 in downstream, as shown in Figure 6, substrate 2 is highlighted shape
The alignment pin 14 of state retrains.It addition, as described above in Fig. 1, Fig. 5 to Fig. 7, be black at alignment pin 14
In the case of represent projected state, in the case of it be white expression receiving state.Further, by making substrate draw
After guiding element main body 31 rises, making conveyance main part 42 travel, substrate-guided part 30 can cross this projected state
The top of alignment pin 14 and return to original oscillating plate 12 (state of Fig. 7).It addition, this aerostatic slide platform
81 play a role as the aftermentioned force application component 60 that also serves as.
Further, guiding piece support 32 has driving and reversing mechanism, it is possible to make arm 32a retreat relative to substrate 2
Action.In the present embodiment, this driving and reversing mechanism is used aerostatic slide platform 82, by controlling this aerostatic slide
The quantity delivered of the air of platform 82 and substrate-guided part main body 31 can be made with the side can separateing relative to substrate 2
Formula carries out action.Specifically, the main body of aerostatic slide platform 82 is installed on aerostatic slide platform 81, is installed to be: in
The platform 82a of the aerostatic slide platform 82 that linearity moves can move on the direction towards the center of the substrate 2 being positioned
Dynamic.Further, can make platform 82a in substrate 2 by controlling the quantity delivered of the air to aerostatic slide platform 82
Moving back and forth is carried out on heart direction.I.e., it is possible to be moved into that arm 32a extends on the center position of substrate 2 is prominent
State and arm 32a are retracted to the back-off state of main body side.That is, make substrate 2 by substrate-guided part main body 31
In the case of constraint, make arm 32a to substrate 2 side prominent (Fig. 7 → Fig. 1), and in substrate-guided part main body 31
Stop under the state abutted with substrate 2.Further, as shown in Figure 5 substrate 2 is being transported to next oscillating plate 12
In the case of, make arm 32a move to the opposition side of substrate 2 and become back-off state, it is possible to release substrate 2 (figure
The state of 6).
As shown in Figure 8, Figure 9, the leading section of the arm 32a of substrate-guided part main body 31 directed part support 32
Branch holds.In the present embodiment, 2 substrate-guided part main bodys 31 are installed on the fore-end of arm 32a,
Substrate 2 can be retrained by making configuration these 2 substrate-guided part main bodys 31 on the diagonal contact with substrate 2.
Substrate-guided part main body 31 is formed by columnar component, is that the substrate making its outer peripheral face abut with substrate 2 abuts
Portion 34.Further, these 2 substrate-guided part main bodys 31 are fixed on equidistant position, the center away from arm 32a, when
When driving aerostatic slide platform 82, the arm 32a of guiding piece support 32 is prominent to substrate 2 side, and thus substrate abuts
Portion 34 abuts with the side 2a of substrate 2, it is possible to constraint substrate 2.That is, configuration each substrate on the diagonal draws
The substrate abutting part 34 of guiding element 30 is slightly crimped on the side 2a of the angle part of substrate 2, and thus constraint floats up to
The action of the substrate 2 of the front 12a of oscillating plate 12.Even if it addition, at substrate abutting part 34 not side to substrate 2
Face 2a applies pressing and the side 2a of degree with substrate 2 can form small gap also can in the case of abutting
Constraint substrate 2.That is, as long as so that the substrate 2 floating up to the front 12a of oscillating plate 12 can be suppressed to move freely
Degree carries out retraining.
Further, floating unit 50 makes substrate-guided part main body 31 (substrate abutting part 34) from the front of oscillating plate 12
12a floats.The floating unit 50 of present embodiment is arranged to be fixed on guiding piece support 32, is arranged in substrate
Between the aerostatic slide platform 82 of guidance body 31 and driving and reversing mechanism.That is, in order to reliably make substrate-guided part main body
31 float, and floating unit 50 is arranged near substrate-guided part main body 31.This floating unit 50 has air cushion portion 55.
Here, Figure 10 is the amplification view of floating unit 50.Further, Figure 11 is the figure illustrating air cushion portion 55, (a)
Being the figure observing air cushion portion 55 from bottom surface side, (b) is the sectional view observed from side.Air cushion portion 55 is on the whole
Disc-shape, has the air discharge portion 55a of air-out and covers the shell portion 55b of this air discharge portion 55a.Should
Air discharge portion 55a is formed by porous sintering material, is formed as the air being fed into shell portion 55b by sintering material
Material is discharged.That is, it is supplied to the air capacity of shell portion 55b by control and can regulate from air discharge portion 55a discharge
The output of air.Further, air cushion portion 55 is with shape relative with the front 12a of oscillating plate 12 for air discharge portion 55a
State is mounted.Therefore, when supplying air to air cushion portion 55, air from the air discharge portion 55a in air cushion portion 55 to
Oscillating plate 12 front 12a ejection, thus guiding piece support 32 by buoyancy and with guiding piece support
The 32 substrate-guided part main bodys 31 linked are also by buoyancy, and substrate-guided part main body 31 is from the front of oscillating plate 12
12a floats slightly.
Further, force application component 60 makes substrate-guided part main body 31 press to the 12a side, front of oscillating plate 12.This reality
The force application component 60 executing mode is aerostatic slide platform 81, is supplied to the air of aerostatic slide platform 81 by control and incites somebody to action
Substrate-guided part main body 31 presses to the 12a side, front of oscillating plate 12.That is, by controlling air, aerostatic slide platform
The platform 81a of 81 to move down, thus the driving and reversing mechanism, guiding piece support 32 and the substrate that link with platform 81a
Guidance body 31 is all the time towards lower stress, and substrate-guided part main body 31 is pressed to the 12a side, front of oscillating plate 12.
The buoyancy of this floating unit 50 and the active force of force application component 60 can be utilized to reach the position of balance by substrate
The height and position of guidance body 31 (substrate abutting part 34) is maintained the height and position of the side 2a of substrate 2.That is,
When from the air discharge portion 55a air-out in air cushion portion 55, air collides with oscillating plate 12, comprises substrate-guided
The guiding piece support 32 of part main body 31 to float, but guiding piece support 32 entirety by force application component 60 to front
12a lateral inhibition, when being thus formed with small gap and upper between air cushion portion 55 and oscillating plate 12
The buoyancy of floating unit 50 and the active force of force application component 60 have reached static under the state balanced.So, by substrate
The height and position of guidance body 31 (substrate abutting part 34) remains constant.Further, by making in this condition
Transport unit 20 moves, and can not make substrate-guided part main body 31 (substrate abutting part 34) and oscillating plate 12
Front 12a contact in the case of transport substrate 2.
Further, in floating unit 50, it is formed with venting stream 70.This venting stream 70 is by from air cushion portion 55
The stream that the air that air discharge portion 55a discharges is released.That is, suppression from air discharge portion 55a discharge air towards
Substrate 2 flows.
The base that this venting stream 70 is arranged at air discharge portion 55a and is kept with being connected to substrate abutting part 34
Between plate 2, be formed as the air in gap that formed with oscillating plate 12 by air cushion portion 55 towards the height than substrate 2
The position releasing that position is high.As shown in figure 11, the venting stream 70 of present embodiment is by surround air discharge portion
Endless groove 71 and the through hole 72 connected with this endless groove 71 that the mode of 55a is formed are formed.Specifically, ring
Shape groove 71 is formed at shell portion 55b, in the position of the size leaving regulation from air discharge portion 55a, with outside whole
The mode surrounding air discharge portion 55a in the range of week is formed as circular.Further, with from the top of shell portion 55b (with
The side that air discharge portion 55a is contrary) mode that connects with endless groove 71 is formed with through hole 72 at 4 positions.
In the example of (a) of Figure 11, it is formed at 4 positions equably according to 90 degree of directions.Thus, owing to entering into
The air of endless groove 71 can pass through through hole 72 aerofluxus upward, therefore, it is possible to make to enter into the sky of endless groove 71
Gas directs it to outside (aerofluxus) by through hole 72, it is possible to suppression is present in the air in this gap to substrate 2
Effluent dynamic (the indicating of Figure 10 × arrow).
Further, with the pressure loss of stream 70 of exitting than the pressure in the gap formed with oscillating plate 12 by air cushion portion 55
Lose little mode to be formed.Specifically, endless groove 71 and through hole 72 as venting stream 70 are designed to
Its flow path dimensions is bigger with the gap that oscillating plate 12 is formed than by air cushion portion 55.Thus, due to the pressure of stream 70 of exitting
Power loss is less than this gap, and therefore compared with this gap, air is easier to flow to stream 70 of exitting.Thus, energy
The air that enough suppression effectively are present in this gap moves to substrate 2 effluent.That is, the sky discharged from air discharge portion 55a
Gas radially flows with the gap that oscillating plate 12 is formed from by air discharge portion 55a on the external diameter direction in air cushion portion 55
Dynamic, and it is flowed into endless groove 71.Further, the air being flowed into endless groove 71 will not be bigger to the pressure loss further
The gap formed by the air cushion portion 55 of outside diameter and oscillating plate 12 flowing, and to the pressure loss less and endless groove
The through hole 72 of 71 connections flows, and from through hole 72 towards the position aerofluxus higher than the height and position of substrate 2.
Therefore, it is possible to the air that suppression is discharged from air discharge portion 55a moves to substrate 2 effluent, suppression painting on a substrate 2
Forming drying mark in cloth film C, this drying mark is the track of the flowing as air and is formed.
Further, in microscope carrier portion 16C, it is provided with heat drying apparatus.This heat drying apparatus makes to be formed at utilization and shakes
The coated film moved on the substrate 2 that plate 12 carries out transporting is dried.This heat drying apparatus has heater portion 15, chamber
Cap 91 and exhaust portion 92, form chamber portion 93 by making chamber cap 91 abut with oscillating plate 12, at this
In chamber portion 93, the coated film on substrate 2 heated and make it be dried.Here, Figure 12 is to illustrate microscope carrier portion
The figure of 16C, (a) is the figure of the state illustrating that chamber cap 91 separates from oscillating plate 12, and (b) is to illustrate Pit cover
Portion 91 abuts with oscillating plate 12 and forms the figure of the state in chamber portion 93.
Coated film on the heater portion 15 substrate 2 to being positioned on microscope carrier portion 16C heats.Specifically,
It is configured with heater portion 15 in the 12b side, the back side (opposition side of front 12a) of the oscillating plate 12 of microscope carrier portion 16C,
By this heater portion 15 coated film on substrate 2 heated and make it be dried.This is in the heating of embodiment
In device portion 15, the parts that box heater, encapsulation heater are inserted into the aluminum frame of rectangle and are formed are become thermal source, this
A little heaters by and the back side 12b of each oscillating plate 12 relative in the way of be arranged on the position at the interval separately specified.
Therefore, when the work process at heater portion 15 transports substrate 2, utilize the back side 12b from oscillating plate 12
Radiations heat energy heat, the coated film that thus will be formed on substrate 2 is dried.
Further, chamber cap 91 is for forming chamber portion 93 and making substrate 2 in sealing state on oscillating plate 12
Parts.Chamber cap 91 is arranged in the top of microscope carrier portion 16C, chamber cap 91 decline and abut with oscillating plate 12 by
This can form chamber portion 93.Specifically, chamber cap 91 has and is formed as bigger than substrate 2 rectangular flat
Base plate 91a of tabular and from this base plate 91a side of sidewall portion 91b prominent to the direction towards oscillating plate 12.Should
Side of sidewall portion 91b is continuously formed in the whole peripheral extent of base plate 91a, and the size extended towards oscillating plate 12 exists
Identical size is formed as in whole peripheral extent.Further, on the oscillating plate opposite face 91c of side of sidewall portion 91b,
It is provided with towards the prominent seal member (not shown) of oscillating plate 12 in the whole peripheral extent of oscillating plate opposite face 91c,
By making this seal member abut with oscillating plate 12, and chamber cap 91 can be made to touch with oscillating plate 12.
In this chamber cap 91, lift cylinder 94 is installed, can make by making lift cylinder 94 carry out action
Chamber cap 91 separate relative to oscillating plate 12.Therefore, when the shape being positioned at lifting position from chamber cap 91
State ((a) of Figure 12) rises when making lift cylinder 94 carry out action and make chamber cap 91 decline, chamber cap 91
Sealing abut with oscillating plate 12, it is possible to formed for making substrate by chamber cap 91 and oscillating plate 12
The 2 chamber portions 93 ((b) of Figure 12) in sealing state.
Further, chamber cap 91 is provided with exhaust portion 92.This exhaust portion 92 is set as pressure-reducing ring by chamber
Under border.Specifically, the middle body at chamber cap 91 is provided with air vent, this air vent be linked to not scheme
The pipe arrangement of the vacuum pump shown connects.Therefore, when making vacuum pump carry out action, the air in chamber portion 93 is by row
QI KOU and be attracted, the pressure (reduced pressure atmosphere) forced down than air will be set as in chamber portion 93.Here, pressure-reducing ring
Border refers to the pressure environment more slightly lower than atmospheric pressure, is set as 80kPa in the present embodiment.That is, when atmospheric pressure is pressed
When being set to 1atm=101.33kPa according to absolute value pressure reference, reduced pressure atmosphere is set as about 80kPa.That is, by
Formed thin in the oscillating plate 12 carrying out ultrasonic activation, therefore common set by decompression dry device when being set as
High vacuum environment time, oscillating plate 12 can deform and makes the flatness of oscillating plate 12 impaired and produce damage conduct
The such problem of function of transport path.Therefore, the captivation by adjusting vacuum pump makes air vent produce slight suction
Gravitation and be set to reduced pressure atmosphere, it is possible to when maintain the flatness of oscillating plate 12 quickly to attract to steam
The solvent sent out, therefore, it is possible to suppression produces drying mark in coated film.
Further, chamber cap 91 is provided with top board 95.Top board 95 for make relative to substrate 2 whole just
The gap uniformity in face.Top board 95 is formed as having than substrate 2 writing board shape of overall big area, is arranged on chamber
The inside of cap 91.Specifically, the front of top board 95 is arranged to relative with substrate 2, at chamber cap 91
Under the state declined and form chamber portion 93, in the whole front of substrate 2 between the front of top board 95 and substrate 2
In the range of form uniform gap.The generation of drying mark can be suppressed by this top board 95.That is, coated film is worked as
When being heated by heater portion 15, solvent evaporates.On the other hand, due to air vent center configuration with in top board 95
The position that the heart is relative, therefore when making air vent produce captivation and to form reduced pressure atmosphere, at top board 95 and substrate 2
Between gap in form the constant more weak air-flow of end towards top board 95 equably.That is, due to from coating
The solvent of film evaporation is not detained in the gap between top board 95 and substrate 2 and is directed towards the end of top board 95 successfully
Flowing is also discharged from air vent, therefore with the solvent produced in the case of there is not top board 95 along with flow velocity
The situation that change is flowed on one side on a substrate 2 is compared, it is possible to suppression produces drying mark in coated film.
Further, top board 95 is provided with the top board heater portion 95a that top board 95 is heated.This top board heats
Device portion 95a is arranged on the upper surface of top board 95, it is possible to the temperature of controlroof 95.Specifically, top board heating
Device portion 95a is planar heater, is arranged to substantially cover the upper surface of top board 95.Further, it is set to when making
When planar heater carries out action, top board 95 entirety is heated, and become and carried out temperature control by heater portion 15
The identical temperature of oscillating plate 12 of system.Thereby, it is possible to suppression solvent is attached to top board 95.That is, owing to being coated with when heating
Cloth film and solvent evaporation time this solvent suspend between substrate 2 and top board 95, therefore contact with top board 95.Now,
When the temperature of top board 95 is relatively low, sometimes produce following problem: the solvent after solvent occurs condensation to condense falls
Foreign body is thus caused to be mixed into coated film.Further, result at substrate 2 and top board because of the existence of the solvent after condensation
Air turbulence between 95, produces the problem that the disorder of this air-flow causes the drying mark of coated film the most sometimes.
Therefore, by top board 95 being controlled for the temperature roughly the same with oscillating plate 12, it is possible to avoid solvent at top board 95
Upper condensation, therefore, it is possible to suppression foreign body is mixed into coated film or produces the such problem of drying mark.
Then, the action to the substrate 2 with heat drying apparatus illustrates.
Here, before substrate 2 is transported, each substrate-guided part 30 with each oscillating plate 12
Adjacent position is standby, and the arm 32a of guiding piece support 32 becomes back-off state.Further, alignment pin 14 is received
In the lower section of the front 12a of oscillating plate 12, and maintain receiving state.
First, the location of substrate 2 is carried out.That is, substrate is carried out in order to utilize substrate-guided part 30 to retrain substrate 2
The location action of 2.Specifically, when supply finishes the substrate 2 of a upper operation, it is in the location of receiving state
Pin 14 highlights from the front 12a of oscillating plate 12, thus substrate 2 is positioned at orientation range.That is, when to by shaking
Sub-13a and on the oscillating plate 12 that vibrates during supplying substrate 2, substrate 2 float from the front 12a of oscillating plate 12 and
Move freely on the front 12a of oscillating plate 12, but because the alignment pin 14 with projected state contacts and the movement of substrate 2
It is restricted.Thus, substrate 2 is positioned at orientation range (Fig. 7).
Then, the constrained action realized by substrate-guided part 30 is carried out.That is, the arm 32a of guiding piece support 32
Extend to substrate 2 side.Specifically, air sprays from the air cushion 51 of substrate-guided part main body 31, this buoyancy with
The active force of force application component 60 reaches balance and substrate-guided part main body 31 is supported and at oscillating plate by arm 32a
Float on the front 12a of 12.In this condition, the height and position of substrate abutting part 34 is adjusted to and substrate 2
The height and position that side 2a abuts.Further, when arm 32a extends, substrate-guided part main body 31 is close to substrate 2
Side 2a, substrate abutting part 34 abuts with the side 2a of substrate 2, thus arm 32a stop extension action.That is,
The configuration of the side 2a of the angle part of substrate 2 and substrate-guided part main body 31 4 substrate abutting parts on the diagonal
34 abut, thus constraint substrate 2 (Fig. 1).Therefore, in this condition, the action of substrate 2 is by substrate-guided part
30 and alignment pin 14 retrain.
Then, substrate 2 is transported.That is, the substrate-guided part 30 retrained is carried from current oscillating plate 12
Put next oscillating plate 12 adjacent in downstream, and repeat this action thus transport substrate 2.Specifically,
The alignment pin 14 making the action of constraint substrate 2 declines and becomes and carry out, merely with substrate-guided part 30, the state that retrains.
Further, conveyance drive division 40 is driven to make substrate-guided part 30 downstream side shifting.
Further, in conveyance, air is persistently sprayed from the air cushion portion 55 of substrate-guided part 30 such that it is able to by substrate
Guidance body 31 is maintained the state floated from the front 12a of oscillating plate 12, on the other hand, from air cushion 55 row
The air gone out is released to the position higher than substrate 2 by venting stream 70.That is, the air from air cushion portion 55 is discharged
The air that portion 55a discharges from the gap formed by air discharge portion 55a and oscillating plate 12 in the external diameter side in air cushion portion 55
The most radially flow, but after being flowed into endless groove 71, from through hole 72 aerofluxus.Thereby, it is possible to suppression
The air discharged from air cushion portion 55 moves to substrate 2 effluent, and suppression coated film on a substrate 2 forms drying mark,
This drying mark is the track of the flowing as air and is formed.
Further, when substrate 2 arrives next oscillating plate 12 adjacent in downstream, the position of regulation it is positioned at substrate 2
Conveyance drive division 40 is driven controlling and making substrate-guided part 30 stop by the mode put.That is, stop at when location
Pin 14 becomes the back side of substrate 2 in the case of projected state will not be with the position (Fig. 5) of alignment pin 14 collision.
Then, from substrate-guided part 30 release substrate 2.Specifically, alignment pin 14 is from the front of oscillating plate 12
12a highlights, and the substrate 2 transported by this alignment pin 14 constrains in the front of next oscillating plate 12 in downstream
On 12a.That is, substrate 2 is positioned pin 14 and retrains with substrate-guided part 30.Further, the arm of substrate-guided part 30
Portion 32a makes a concession and returns to original position, and arm 32a is risen by elevating mechanism.That is, substrate-guided part
Main body 31 rises to the position not contacted with alignment pin 14.Thus, substrate-guided part 30 releasing substrate 2 is carried out
Put, retrain substrate 2 (Fig. 6) merely with alignment pin 14.
Then, at the end of the yielding action and vertical motion of arm 32a, substrate-guided part 30 resets to original
Position (Fig. 7).That is, conveyance drive division 40 is driven, and makes substrate-guided part 30 move to and release
The oscillating plate 12 of the upstream side that oscillating plate 12 after substrate 2 is adjacent.Now, although alignment pin 14 is for bound base
Plate 2 and in projected state, but owing to substrate-guided part main body 31 is more further up than alignment pin 14, therefore due to base
The movement of plate guiding piece 30, substrate-guided part main body 31 will not contact with alignment pin 14.
Further, the substrate 2 of the oscillating plate 12 being transported to downstream is drawn by the substrate being initially just arranged at oscillating plate 12
Guiding element 30, the most from than this oscillating plate 12 downstream oscillating plate 12 reset substrate-guided part 30 retrain, and
It is transported to the oscillating plate 12 in downstream further.So, substrate 2 is arranged at the substrate-guided of each oscillating plate 12
Retrain and move to next oscillating plate 12 in downstream to part 30 property taken over.That is, substrate 2 from microscope carrier portion 16A through carry
Platform portion 16B and be transported to be provided with the microscope carrier portion 16C of heat drying apparatus.
The substrate 2 being transported to microscope carrier portion 16C is thermally dried process, carries out the coated film formed on a substrate 2
Be dried.Specifically, when substrate 2 is positioned on the oscillating plate 12 of microscope carrier portion 16C alignment pin 14 from vibration
The front 12a of plate 12 highlights.Then, the arm 32a of substrate-guided part 30 makes a concession and returns to original position,
Thus substrate 2 is positioned pin 14 and retrains.By from this state drive lift cylinder 94 make chamber cap 91 decline and
Form chamber portion 93.That is, seal (with reference to (b) of Figure 12) is formed in substrate 2 is accommodated in chamber portion 93.
Here, when loading substrate 2 on the oscillating plate 12 at microscope carrier portion 16C, by pre-heated heater portion
The radiations heat energy of 15 and start to be dried.Further, when defining chamber portion 93, by top board heater portion
95a carries out temperature controlled top board 95 and is arranged as opposed in the way of forming small gap between coated film.
That is, by being controlled so as to placement substrate 2 between the oscillating plate 12 of roughly the same temperature and top board 95, and by base
The front of plate 2 and the back side remain roughly the same temperature, advance heat drying.Further, by making exhaust portion 92
Vacuum pump carry out action, the air in chamber portion 93 is attracted by air vent, is set in chamber portion 93
The pressure (reduced pressure atmosphere) forced down than air.Thus, the solvent owing to evaporating from coated film is not detained in top board 95
And gap between substrate 2 and be directed towards the end of top board 95 and successfully flow and discharge from air vent, therefore with molten
The situation that agent is flowed on a substrate 2 along with change in flow is compared, it is possible to suppression produces drying mark in coated film.
Further, due to it can be avoided that solvent condenses on top board 95, therefore, it is possible to suppression foreign body is mixed into coated film or produces dry
Dry irregular such problem.
Further, after the time maintaining regulation in chamber portion 93, heat drying process terminates.That is, chamber is made
Return to atmospheric pressure in room portion 93, and make chamber cap 91 increase.Further, carry out being realized by substrate-guided part 30
Constrained action, and after having received alignment pin 14, substrate-guided part 30 downstream side shifting.By repeating
Carry out this operation, and substrate 2 is transported to the final position of substrate 2.
So, according to above-mentioned heat drying apparatus, chamber cap 91 abuts with oscillating plate 12 and is consequently formed chamber portion
93, when in this chamber portion 93 to exhaust portion 92 aerofluxus, in chamber portion 93, be formed as the decompression more slightly smaller than atmospheric pressure
State, is thus smoothly attracted near coated film.Further, set owing to being arranged at the top board 95 of chamber cap 91
Be set to whole with substrate 2 relative, therefore the distance between the coated film on top board 95 and substrate 2 is in whole coating
Reaching uniform in the range of film, the flowing of the air near coated film realizes homogenization.Therefore, substrate 2 it is formed at
On coated film heated by heater portion 15 and thus produce solvent, the most equal to produced solvent
Carrying out attracting while advancing and being dried, generation air-flow is irregular and light and shade is irregular in coated film to it is possible to suppression evenly.
Further, in the above-described embodiment, to utilizing the location being arranged at each microscope carrier portion 16 when heat drying processes
The example that pin 14 carries out keeping is illustrated but it also may as shown in Figure 13, Figure 14, in chamber cap 91
There is the position limitation pin 96 limited the position of substrate 2 when heat drying processes.Here, Figure 13 is to show
Going out the figure of the heat drying apparatus of other embodiment, (a) is to illustrate the state that chamber cap is in top position
Figure, (b) is to illustrate that chamber cap 91 is declined and substrate 2 is carried out by position limitation pin 96 state of position limitation
Figure.Figure 14 is to illustrate that chamber cap 91 declines further and the figure of state that chamber cap abuts with oscillating plate.Position
Put banking pin 96 and be arranged on the surface of the alignment pin in chamber cap 91.Specifically, it is arranged at and is positioned at diagonal angle
The position at the different diagonal angle of substrate-guided part 30, when changing into position limitation pin 96 from substrate-guided part 30,
Position limitation pin 96 is configured to contact with substrate-guided part 30.
Further, position limitation pin 96 has position limitation pin main body 96a and receives this position limitation pin main body 96a
Pin boss portion 96b.The cylindrical member that position limitation pin main body 96a is bar-like, it is possible to limit by abutting with substrate 2
The position of substrate 2 processed.This position limitation pin main body 96a is configured to one part and is accommodated in pin boss portion 96b, it is possible to
Come in and go out relative to pin boss portion 96b.This position limitation pin 96 is not forming the state in chamber portion 93, i.e. chamber cap
91 separate and state above from oscillating plate 12, with the fore-end of position limitation pin 96 from chamber cap
The state that the seal member of the side of sidewall portion 91b of 91 highlights is kept.
Further, a part for pin boss portion 96b reception position banking pin 96, position limitation pin 96 is with only with sliding stroke
Amount chamber cap 91 the state extended above constitute.This pin boss portion 96b is arranged at chamber cap 91
The upper shed of base plate 91a, position limitation pin 96 can through this opening portion and come in and go out.Further, at peristome
Being provided with the pin guiding piece (not shown) of bearing position banking pin 96 in Fen, position limitation pin 96 is formed through
It is supported on the state lower slider of this pin guiding piece and can come in and go out relative to pin boss portion 96b (chamber cap 91).
Utilize such position limitation pin 96, when the substrate 2 that will remain on substrate-guided part 30 is positioned in microscope carrier portion
When 16C is upper, lift cylinder 94 is made to carry out action and make chamber cap 91 above decline.That is, Pit cover is made
Portion 91 drops to position limitation pin main body 96a and arrives (Figure 13 till the position that can abut with the side of substrate 2
(b)).Now, as described above, in chamber cap 91, owing to position limitation pin main body 96a is dashed forward downwards
Go out, thus while make chamber cap 91 drop to the position that can abut, chamber cap 91 with the side of substrate 2
Also will not contact with substrate 2, oscillating plate 12 and substrate-guided part 30.Further, by making substrate-guided part 30
Make a concession and utilize position limitation pin 96 that the position of the substrate 2 on oscillating plate 12 is limited.Then, such as Figure 14
Shown in, make chamber cap 91 decline and utilize oscillating plate 12 and chamber cap 91 to form chamber portion 93 further, and
Substrate 2 in chamber portion 93 is thermally dried process.Specifically, in the same manner as above-mentioned embodiment, logical
Cross pre-heated heater portion 15 and coated film is heated by top board heater portion 95a, and to chamber portion 93
Inside it is exhausted, thus under reduced pressure atmosphere, is thermally dried process.
So position limitation pin 96 is being arranged in the structure of chamber cap 91, fixed with arranging on oscillating plate 12
Position pin 14 structure compare, do not exist produce cause because alignment pin 14 contacts with oscillating plate 12 vibration floating remove
Send bad or cause heating irregular owing to arranging alignment pin 14 because being formed at the existence of the through hole of oscillating plate 12
Worry, it is possible to carry out vibration floating conveyance more reliably and high-precision heat drying processes.
Further, in the above-described embodiment, the example arranging top board heater portion 95a is illustrated, but also may be used
To be the structure omitting top board heater portion 95a.I.e., although by arranging top board heater portion 95a it can be avoided that steam
The problems such as the condensation of the solvent sent out, but make less with the temperature difference of top board 95 by the temperature setting of heater portion 15
In the case of without producing condensation etc., it is possible to omit top board heater portion 95a and reduce the cost of device.
Further, in the above-described embodiment, the example that heater portion 15 is only arranged at microscope carrier portion 16C is carried out
Explanation but it also may use be respectively arranged at each microscope carrier portion 16 structure and be moved to heat drying apparatus it
The front structure that by each heater portion 15 preparation property ground, the coated film on substrate 2 is carried out heat treated.
Claims (4)
1. a heat drying apparatus, basal-plate ultrasonic vibration is being floated while carrying out the conveyance dress transported by it
In the transport path put, substrate is thermally dried, it is characterised in that this heat drying apparatus has:
Heater portion, the coated film being formed on transported substrate is heated by it；
Chamber cap, it forms chamber portion by abutting with oscillating plate, and in chamber portion, substrate is remained sealing
State；And
Exhaust portion, it is exhausted in described chamber portion,
In described chamber cap, be provided with top board, when chamber cap has abutted with oscillating plate, this top board with
Substrate on oscillating plate close to and whole with substrate relative,
On the position that the described exhaust portion center with described top board in described chamber cap is relative, there is aerofluxus
Mouthful,
While by from described air vent to be exhausted in described chamber portion and by described chamber portion in be formed as decompression
State, heats by making described heater portion carry out and makes the coated film on substrate be dried.
Heat drying apparatus the most according to claim 1, it is characterised in that
The top board heater portion that top board is heated it is provided with in described top board.
Heat drying apparatus the most according to claim 1 and 2, it is characterised in that
This heat drying apparatus has alignment pin, this alignment pin with the substrate transported on described oscillating plate carried out
The substrate-guided part held is different, positions substrate and support in described chamber portion.
4. according to the heat drying apparatus described in any one in claims 1 to 3, it is characterised in that
It is provided with position limitation pin, this position limitation pin position to the substrate in heat drying in described chamber cap
Limit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-061915 | 2015-03-25 | ||
| JP2015061915A JP2016180563A (en) | 2015-03-25 | 2015-03-25 | Heating drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106000819A true CN106000819A (en) | 2016-10-12 |
Family
ID=57082974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610171873.8A Pending CN106000819A (en) | 2015-03-25 | 2016-03-24 | Heating and drying device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016180563A (en) |
| KR (1) | KR20160115693A (en) |
| CN (1) | CN106000819A (en) |
| TW (1) | TW201637725A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784411A (en) * | 2017-03-09 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of film levelling equipment |
| CN113663885A (en) * | 2021-08-11 | 2021-11-19 | 江苏长虹智能装备股份有限公司 | Novel sealing structure of drying chamber body |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7018713B2 (en) * | 2017-03-29 | 2022-02-14 | 東京応化工業株式会社 | Substrate heating device, substrate processing system and substrate heating method |
| CN112432467A (en) * | 2020-11-19 | 2021-03-02 | 江西尚绿科技有限公司 | Active carbon drying device |
| KR20230016548A (en) | 2021-07-26 | 2023-02-02 | 주식회사 와우쓰리디 | the functional wheelchair for the patient transfer |
| KR102640421B1 (en) | 2022-01-18 | 2024-02-23 | (주)휴먼아이티 | movable and height adjustable lift chair |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014022538A (en) | 2012-07-18 | 2014-02-03 | Toray Eng Co Ltd | Heat treatment apparatus and heat treatment method |
-
2015
- 2015-03-25 JP JP2015061915A patent/JP2016180563A/en active Pending
-
2016
- 2016-01-26 TW TW105102387A patent/TW201637725A/en unknown
- 2016-02-04 KR KR1020160013827A patent/KR20160115693A/en unknown
- 2016-03-24 CN CN201610171873.8A patent/CN106000819A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784411A (en) * | 2017-03-09 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of film levelling equipment |
| CN113663885A (en) * | 2021-08-11 | 2021-11-19 | 江苏长虹智能装备股份有限公司 | Novel sealing structure of drying chamber body |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201637725A (en) | 2016-11-01 |
| KR20160115693A (en) | 2016-10-06 |
| JP2016180563A (en) | 2016-10-13 |
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