CN105990178A - Abnormal platform detection method and detection device - Google Patents
Abnormal platform detection method and detection device Download PDFInfo
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- CN105990178A CN105990178A CN201510087644.3A CN201510087644A CN105990178A CN 105990178 A CN105990178 A CN 105990178A CN 201510087644 A CN201510087644 A CN 201510087644A CN 105990178 A CN105990178 A CN 105990178A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an abnormal platform detection method and a detection device. The method comprises that extraction sequence information, corresponding to at least two platforms, sent by a wafer extracting device is received, and the at least two platforms correspond to different extraction sequence information; after that wafers pass cavities of the at least two platforms according to the extraction sequence information, first numbers of the wafers corresponding to the cavities of the at least two platforms in an FOUP are obtained according to the extraction sequence information; after that the wafers pass all platforms, second numbers corresponding to defect wafers in the FOUP is obtained; and according to the correspondence between the second numbers and the first numbers, a cavity of an abnormal platform is determined among the at least two platforms. According to the invention, the problem that the abnormal platform cannot be confirmed accurately is solved, and the cavity of the abnormal platform can be confirmed accurately.
Description
Technical field
The present invention relates to wafer and manufacture field, in particular to the detection method of a kind of abnormal board
With detection equipment.
Background technology
Wafer defect has plenty of during wafer process, due to temperature, pressure, media components concentration,
Technique board, operator, the environment of plant etc. changes and causes；Have is then after crystal formation,
Due to the warm-up movement of particle or being produced by stress effect, they can migrate in lattice, so that disappearing
Lose, new defect can be had again to produce simultaneously, thus cause the low yield of wafer.
In prior art, in order to detect the board causing defective wafer, can be by only brilliant by this defect
The board that the cavity of circle is corresponding is found out, but, adopt and the most often find out a lot of board,
And cannot further confirm that is which board is abnormal.
For the above-mentioned problem that cannot accurately confirm abnormal board, effective solution is the most not yet proposed
Scheme.
Summary of the invention
Embodiments provide detection method and the detection equipment of a kind of abnormal board, thus accurately
Ground confirms to occur the cavity of abnormal board.
An aspect according to embodiments of the present invention, it is provided that the detection method of a kind of abnormal board, bag
Include: the extraction order information of at least two boards of correspondence that reception wafer extracting device sends, wherein,
Described extraction order information includes that described wafer extracting device is compiled according to FOUP in wafer cassette FOUP
Number extract the order of wafer, the most corresponding different extraction order information of described at least two boards successively；
After the cavity of at least two boards described in passing sequentially through according to described extraction order information at described wafer,
The wafer corresponding to cavity of described at least two board is obtained described according to described extraction order information
The first numbering in FOUP；After described wafer is by whole boards, obtain defective wafer described
The second numbering corresponding in FOUP；Corresponding relation according to described second numbering with the first numbering determines
The cavity of board abnormal in described at least two board.
Alternatively, when described at least two board includes at least two cavity, described according to described
Two numberings determine the chamber of the board of exception in described at least two board with the corresponding relation of the first numbering
Body includes: when described first numbering is identical with described second numbering, determines described first numbering correspondence
The cavity of board abnormal.
Alternatively, when described at least two board includes a cavity, described according to described second volume
Number determine in described at least two board the cavity bag of abnormal board with the corresponding relation of the first numbering
Include: described second numbering be included in described first numbering in and described second numbering described first compile
Numbered serial number corresponding in number, determines that the cavity of the board of described first numbering correspondence is abnormal.
Alternatively, the extraction order of at least two boards of correspondence that described reception wafer extracting device sends
Information includes: receive what the first board at least two boards described in wafer extracting device correspondence sent
First extraction order information；Pass sequentially through described at described wafer according to described first extraction order information
After first board and described wafer extracting device according to described FOUP numbering again described wafer is put
When putting in described FOUP, receive second at least two boards described in wafer extracting device correspondence
The second extraction order information that board sends.
Alternatively, after the cavity of the described board determining described first numbering correspondence is abnormal, described side
Method also includes: sends prompting message and shows the described first identification information numbering corresponding board.
Another aspect according to embodiments of the present invention, additionally provides a kind of detection equipment, including: receive
Unit, for receiving the extraction order information of at least two boards of correspondence that wafer extracting device sends,
Wherein, described extraction order information includes described wafer extracting device basis in wafer cassette FOUP
FOUP numbering extracts the order of wafer, the most corresponding different extraction of described at least two boards successively
Order information；Acquiring unit, described wafer according to described extraction order information pass sequentially through described in extremely
After the cavity of few two boards, obtain institute according to the described extraction order information that described reception unit receives
State wafer corresponding to the cavity of at least two board the first numbering in described FOUP, at described crystalline substance
After the whole board of flexible mistake, obtain the second numbering that defective wafer is corresponding in described FOUP；Determine
Unit, determines with the first corresponding relation numbered for the second numbering obtained according to described acquiring unit
The cavity of board abnormal in described at least two board.
Alternatively, described determine that unit also includes: first determines module, if for described at least two
Board includes at least two cavity, when described first numbering is identical with described second numbering, determines institute
The cavity stating board corresponding to the first numbering is abnormal.
Alternatively, described determine that unit also includes: second determines module, if for described at least two
Board includes a cavity, numbers described second and is included in described first numbering and described second volume
Number numbered serial number corresponding in described first numbering, determines the machine that described first numbering is corresponding
The cavity of platform is abnormal.
Alternatively, described reception unit includes: the first receiver module, is used for receiving wafer extracting device
The first extraction order information that the first board at least two boards described in correspondence sends；Second receives
Module, depends on for the first extraction order information received according to described first receiver module at described wafer
Secondary by after described first board and described wafer extracting device according to described FOUP numbering again will
When described wafer is placed in described FOUP, receive at least two machines described in wafer extracting device correspondence
The second extraction order information that the second board in platform sends.
Alternatively, described device also includes: Tip element, for determine that unit determines described described
After the cavity exception of the board that the first numbering is corresponding, send prompting message and show that described first numbering is right
The identification information of the board answered.
In embodiments of the present invention, detection equipment receives the correspondence at least two that wafer extracting device sends
The extraction order information of board, and the cavity of this at least two board is obtained according to this extraction order information
The corresponding wafer the first numbering in this FOUP, after this wafer is by whole boards, obtains and lacks
Fall into the second numbering that wafer is corresponding in this FOUP, corresponding with the first numbering according to this second numbering
Relation determines the cavity of board abnormal in this at least two board, so, owing to different boards is adopted
Extract wafer in differing order such that it is able to find abnormal machine accurately according to the numbering of defective wafer
The cavity of platform.By the present invention, solve the problem that cannot accurately confirm abnormal board, it is achieved that essence
Confirm to occur the effect of the cavity of abnormal board.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the one of the application
Part, the schematic description and description of the present invention is used for explaining the present invention, is not intended that this
Bright improper restriction.In the accompanying drawings:
Fig. 1 is the schematic flow sheet of the detection method of a kind of abnormal board according to embodiments of the present invention；
Fig. 2 is the structural representation of the detection equipment of a kind of abnormal board according to embodiments of the present invention；
Fig. 3 is that the structure of the detection equipment of a kind of optional abnormal board according to embodiments of the present invention is shown
It is intended to；
Fig. 4 is the structure of the detection equipment of another kind of optional abnormal board according to embodiments of the present invention
Schematic diagram；
Fig. 5 is the structure of the detection equipment of the third optional abnormal board according to embodiments of the present invention
Schematic diagram；
Fig. 6 is the structure of the detection equipment of the 4th kind of optional abnormal board according to embodiments of the present invention
Schematic diagram.
Detailed description of the invention
In order to make those skilled in the art be more fully understood that the present invention program, below in conjunction with the present invention
Accompanying drawing in embodiment, is clearly and completely described the technical scheme in the embodiment of the present invention,
Obviously, described embodiment is only the embodiment of a present invention part rather than whole enforcement
Example.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creative work
The every other embodiment obtained under premise, all should belong to the scope of protection of the invention.
It should be noted that the term in description and claims of this specification and above-mentioned accompanying drawing
" first ", " second " etc. are for distinguishing similar object, without be used for describing specific order or
Precedence.Should be appreciated that the data of so use can be exchanged in the appropriate case, in order to retouch here
The embodiments of the invention stated can be real with the order in addition to those here illustrating or describing
Execute.Additionally, term " includes " and " having " and their any deformation, it is intended that cover and do not arrange
He comprises, such as, contain series of steps or the process of unit, method, system, product or
Equipment is not necessarily limited to those steps or the unit clearly listed, but can include the most clearly listing
Or for intrinsic other step of these processes, method, product or equipment or unit.
The detection method of a kind of abnormal board is provided according to embodiments of the present invention, as it is shown in figure 1, this
Bright executive agent can be the detection equipment of abnormal board, and the method may include that
The extraction order of at least two boards of correspondence that step S101, reception wafer extracting device send
Information.
Wherein, this extraction order information includes this wafer extracting device basis in wafer cassette FOUP
FOUP numbering extracts the order of this wafer successively, the most corresponding different extraction of these at least two boards
Order information.
It should be noted that this extraction order information can be configured beforehand through control system, should
The extraction order information set is issued to the wafer extracting device of corresponding board, wafer by control system
Extracting device then extracts the wafer by this board according to this extraction order information.
Alternatively, wafer extracting device is received to should the first board at least two boards send
First extraction order information.
This wafer according to this first extraction order information pass sequentially through this first board after and this wafer
When this wafer is again placed in this FOUP by extracting device according to this FOUP numbering, receive wafer
Extracting device is to should the second extraction order information of sending of the second board at least two boards.
So, the whole wafers in FOUP are by after a board, and wafer extracting device is by wafer
Again put in FOUP according to FOUP numbering, it is ensured that correspondence is not when by different platform for wafer
Same extraction order.
Step S103, pass sequentially through this at least two boards at this wafer according to this extraction order information
Cavity after, the wafer that the cavity that obtains this at least two board according to this extraction order information is corresponding exists
The first numbering in this FOUP.
Wherein, when this at least two board includes at least two cavity, wafer extracting device is pressed successively
According to the wafer in the extraction order extraction FOUP in extraction order information, and by first crystalline substance of extraction
Circle is put in the first cavity that board is corresponding, second wafer of extraction put into board is corresponding first
In cavity, the like, until all of wafer is all put in board.
Illustratively, include that 25 wafers, a board include that 3 cavitys are with a FOUP
Example illustrates, and these 3 cavitys are designated as A respectively1、A2And A3, these 25 wafers are at FOUP
In numbering be followed successively by 1 to 25, then this FOUP is when by board, wafer extracting device according to
Wafer numbering in FOUP according to preset order (here with according to 1 to 25 order) extraction
Wafer, as passed through A by the wafer of numbering 11, the wafer of numbering 2 is passed through A2, by numbering 3
Wafer passes through A3, the wafer of numbering 4 is passed through A1, the wafer of numbering 5 is passed through A2, will numbering
The wafer of 6 passes through A3, by that analogy, then eventually through A1Wafer in FOUP numbered 1,
4,7,10,13,16,19,22 and 25, pass through B2Wafer in FOUP numbered 2,
5,8,11,14,17,20 and 23, pass through B3Wafer in FOUP numbered 3,6,
9,12,15,18,21 and 24.
Step S105, at this wafer by after whole boards, obtain defective wafer in this FOUP
The second corresponding numbering；
Step S107, according to this second numbering with first numbering corresponding relation determine this at least two
The cavity of board abnormal in board.In embodiments of the present invention, the extraction of detection equipment reception wafer sets
The extraction order information of at least two boards of correspondence that preparation is sent, and obtain according to this extraction order information
Wafer corresponding to the cavity of this at least two board the first numbering in this FOUP, leads at this wafer
After crossing whole board, obtain the second numbering that defective wafer is corresponding in this FOUP, according to this second
Numbering determines the cavity of the board of exception in this at least two board with the corresponding relation of the first numbering, this
Sample, adopts due to different boards and extracts wafer in differing order such that it is able to according to defective wafer
Numbering finds the cavity of abnormal board accurately.
Alternatively, when this at least two board includes at least two cavity, above-mentioned steps S104 has
Body is: when this first numbering is identical with this second numbering, determine the board of this first numbering correspondence
Cavity is abnormal.
Illustratively, the wafer in a FOUP is carried out as a example by completing silicon wafer process by two boards
Illustrating, this FOUP includes 25 wafers, and this 25 wafers numbering in FOUP depends on
Secondary is 1 to 25, and these two boards are designated as board A and board B, this board A respectively and include 3
Cavity, is designated as A respectively1、A2And A3, this board B includes 3 cavitys, is designated as B respectively1、
B2And B3, the wafer in this FOUP first passes through board A, and wafer extracting device can be according to crystalline substance
Circle numbering in FOUP according to
“16-18-14-13-5-25-23-3-10-24-19-4-2-20-15-6-22-11-17-1-21-9-12-7-8”
Order extract the wafer in this FOUP successively and by each cavity of board A, so, logical
Cross A1Wafer in FOUP numbered 16,13,23,24,2,6,17,9 and 8, logical
Cross A2Wafer in FOUP numbered 18,5,3,19,20,22,1 and 12, pass through
A3Wafer in FOUP numbered 14,25,10,4,15,11,21 and 7, wafer is taken out
Number information corresponding for above-mentioned each cavity is sent to detecting equipment by taking equipment, and detection equipment is by above-mentioned volume
Number information is stored in data base, and the wafer in this FOUP is after by board A, and wafer extraction sets
For being reapposed in FOUP in order according to the numbering at FOUP by wafer, and continue through machine
Each cavity in platform B.
Wafer extracting device can according to wafer numbering in FOUP according to
“1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-16-17-18-19-20-21-22-23-24-25”
Order extract the wafer in this FOUP successively and by each cavity of board B, so, logical
Cross B1Wafer in FOUP numbered 1,4,7,10,13,16,19,22 and 25,
Pass through B2Wafer in FOUP numbered 2,5,8,11,14,17,20 and 23, logical
Cross B3Wafer in FOUP numbered 3,6,9,12,15,18,21 and 24, wafer
Number information corresponding for above-mentioned each cavity is sent to detecting equipment by extracting device, and detection equipment is by above-mentioned
Number information is stored in data base, and the wafer in this FOUP is after by board B, and wafer extracts
Wafer is reapposed in order in FOUP by equipment according to the numbering at FOUP, now, if inspection
Measurement equipment determines that 3,6,9,12,15,18,21 and 24 is defective wafer, owing to this defect is brilliant
Numbering and by the cavity B of board B of circle3The numbering of corresponding wafer is identical (i.e. passes through machine
The cavity B of platform B3Wafer all create defect), then this detection equipment i.e. can determine that the chamber of board B
Body B3For abnormal board cavity.It should be noted that merely just illustrate, the present invention couple
The parameters such as the number of the wafer in the number of above-mentioned board, the number of the cavity of board and a FOUP
It is not construed as limiting.
Alternatively, when this at least two board includes a cavity, above-mentioned steps S104 particularly as follows:
This second numbering be included in this first numbering in and this second numbering this first numbering in right
The numbered serial number answered, determines that the cavity of the board of this first numbering correspondence is abnormal.
Illustratively, the wafer in a FOUP is carried out as a example by completing silicon wafer process by two boards
Illustrating, this FOUP includes 25 wafers, and this 25 wafers numbering in FOUP depends on
Secondary is 1 to 25, and these two boards are designated as board A and board B, this board A respectively and include 1
Cavity, is designated as A1, and this board B includes 1 cavity, is designated as B1, and the wafer in this FOUP is first
First pass through board A, wafer extracting device can according to wafer numbering in FOUP according to
“16-18-14-13-5-25-23-3-10-24-19-4-2-20-15-6-22-11-17-1-21-9-12-7-8”
Order extract the wafer in this FOUP successively and by the cavity A of board A1, wafer is taken out
Number information corresponding for above-mentioned each cavity is sent to detecting equipment by taking equipment, and detection equipment is by above-mentioned volume
Number information is stored in data base, and the wafer in this FOUP is after by board A, and wafer extraction sets
For being reapposed in FOUP in order according to the numbering at FOUP by wafer, and continue through machine
Each cavity in platform B, wafer extracting device can according to wafer numbering in FOUP according to
“1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-16-17-18-19-20-21-22-23-24-25”
Order extract the wafer in this FOUP successively and by the cavity B of board B1, wafer is taken out
Taking equipment is by above-mentioned cavity B1Corresponding number information sends to detecting equipment, and detection equipment is by above-mentioned
Number information is stored in data base, and the wafer in this FOUP is after by board B, and wafer extracts
Wafer is reapposed in order in FOUP by equipment according to the numbering at FOUP, now, if inspection
Measurement equipment determines that 3,4,5,10,19,23,24 and 25 is defective wafer, owing to this defect is brilliant
The numbering of circle is included in the cavity A by board A1In the numbering of corresponding wafer and at this A1Corresponding
The numbered serial number of wafer, then this detection equipment i.e. can determine that the cavity A of board A1For different
Normal board cavity.Merely just illustrate, the present invention number to above-mentioned board, the chamber of board
The parameters such as the number of the wafer in the number of body and a FOUP are not construed as limiting.
It should be noted that each numbering that above-mentioned serial number refers to the second numbering is compiled first
Position in number is continuous print, e.g., and second numbered " 3,4,5,10,19,23,24 and 25 ",
First is numbered
“16-18-14-13-5-25-23-3-10-24-19-4-2-20-15-6-22-11-17-1-21-9-12-7-8”
As can be seen here, " 5,25,23,3,10,24,19 and 4 " and second in the first numbering
Numbering be in position continuous print (i.e. " 5,25,23,3,10,24,19 and 4 " respectively number it
Between do not include the numbering that the second numbering does not has)；If it is above-mentioned first numbered
“16-18-14-13-5-8-25-23-3-10-24-19-4-2-20-15-6-22-11-17-1-21-9-12-7”
As can be seen here, although the first numbering includes the second numbering " 3,4,5,10,19,23,24
With 25 ", but " 5,6,25,23,3,10,24,19 and 4 " in numbering due to first,
Between " 5 " and " 25 " many one " 6 ", and " 6 " the second numbering should be not belonging to, it is determined that
The numbered discontinuous numbering that this second numbering is corresponding in this first numbering.
Alternatively, after determining that the cavity of board of this first numbering correspondence is abnormal, prompting message is sent
And show the identification information of board corresponding to this first numbering, the machine abnormal to inform associative operation personnel
Platform cavity, facilitates the board cavity that operator note abnormalities in time, promotes Consumer's Experience.
In a kind of possible implementation of the present invention, operator can be reminded by following three kinds of modes
Member:
Mode one: detection equipment sends alarm the mark of the board cavity by display screen display exception
Information.
Wherein, detection equipment can send alarm and by display screen display exception in Preset Time
The identification information of board cavity.
Mode two: detection equipment is by display screen display alarm information and the mark of abnormal board cavity
Information.
Wherein, terminal can in Preset Time display alarm information and the mark of abnormal board cavity
Information.
Such as, this detection equipment is provided with alarm lamp, when being reported to the police by this alarm lamp,
This alarm lamp is the brightest or flashes, and the boundary of the man-machine interaction by arranging on this detection equipment
The identification information of the board cavity that face display is abnormal；Or, the man-machine friendship arranged on this detection equipment
This warning message and the identification information of abnormal board cavity, certainly, the present invention is shown on mutual interface
Being not limited to above-mentioned embodiment, other modes being capable of reporting to the police also fall in the protection of the present invention
Within the scope of.
Mode three: detection equipment is display alarm information and abnormal board cavity while sending alarm
Identification information.
The detection equipment 20 of a kind of abnormal board is provided according to embodiments of the present invention, as in figure 2 it is shown, should
Detection equipment 20 may include that
Receive unit 21, for receiving the extraction of at least two boards of correspondence that wafer extracting device sends
Order information, wherein, this extraction order information includes that this wafer extracting device is in wafer cassette FOUP
The order of wafer, the most corresponding different the taking out of these at least two boards is extracted successively according to FOUP numbering
Take order information；
Acquiring unit 22, for passing sequentially through these at least two at this wafer according to this extraction order information
After the cavity of board, according to this reception unit 21 receive this extraction order information obtain this at least two
Wafer corresponding to the cavity of individual board the first numbering in this FOUP, at this wafer by whole machines
After platform, obtain the second numbering that defective wafer is corresponding in this FOUP；
Determine unit 23, for the second numbering and the first numbering that obtain according to this acquiring unit 22
Corresponding relation determines the cavity of board abnormal in this at least two board.
In embodiments of the present invention, detection equipment receives the correspondence at least two that wafer extracting device sends
The extraction order information of board, and the cavity of this at least two board is obtained according to this extraction order information
The corresponding wafer the first numbering in this FOUP, after this wafer is by whole boards, obtains and lacks
Fall into the second numbering that wafer is corresponding in this FOUP, corresponding with the first numbering according to this second numbering
Relation determines the cavity of board abnormal in this at least two board, so, owing to different boards is adopted
Extract wafer in differing order such that it is able to find abnormal machine accurately according to the numbering of defective wafer
The cavity of platform.
Alternatively, as it is shown on figure 3, this determines that unit 23 may include that first determines module 231,
If including at least two cavity for this at least two board, in this first numbering and this second numbering phase
Meanwhile, determine that the cavity of the board of this first numbering correspondence is abnormal.
Alternatively, as shown in Figure 4, this determines that unit 23 also includes: second determines module 232, uses
If including a cavity in this at least two board, this second numbering be included in this first numbering in and
The numbered serial number that this second numbering is corresponding in this first numbering, determines this first numbering correspondence
The cavity of board abnormal.
Alternatively, as it is shown in figure 5, this reception unit 21 includes: the first receiver module 211, it is used for
Receive wafer extracting device to should the first extraction of sending of the first board at least two boards suitable
Sequence information；Second receiver module 212, for receiving according to this first receiver module 211 at this wafer
First extraction order information pass sequentially through this first board after and this wafer extracting device according to this
FOUP numbering is when being again placed on this wafer in this FOUP, receives wafer extracting device to should
The second extraction order information that the second board at least two boards sends.
Alternatively, as shown in Figure 6, this detection equipment 20 also includes: Tip element 24, is used for
After this determines the cavity exception that unit 23 determines the board of this first numbering correspondence, send prompting message
And show the identification information of the board of this first numbering correspondence.
So, by using above-mentioned detection equipment, adopt due to different boards and extract in differing order
Wafer such that it is able to find the cavity of abnormal board according to the numbering of defective wafer accurately.
It should be noted that affiliated those skilled in the art is it can be understood that arrive, for describe
Convenient and succinct, the specific works process of the detection equipment of foregoing description and description, it is referred to above-mentioned
Corresponding process in embodiment of the method, does not repeats them here.
The above is only the preferred embodiment of the present invention, it is noted that for the art
For those of ordinary skill, under the premise without departing from the principles of the invention, it is also possible to make some improvement
And retouching, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (10)
1. the detection method of an abnormal board, it is characterised in that including:
Receive the extraction order information of at least two boards of correspondence that wafer extracting device sends, its
In, described extraction order information includes described wafer extracting device basis in wafer cassette FOUP
FOUP numbering extracts the order of wafer successively, and described at least two boards are the most corresponding different
Extraction order information；
Described wafer according to described extraction order information pass sequentially through described at least two boards
Cavity after, the cavity obtaining described at least two board according to described extraction order information is corresponding
Wafer in described FOUP first numbering；
After described wafer is by whole boards, obtain defective wafer corresponding in described FOUP
Second numbering；
Corresponding relation according to described second numbering with the first numbering determines described at least two machine
The cavity of board abnormal in platform.
Method the most according to claim 1, it is characterised in that include at described at least two board
During at least two cavity, the described corresponding relation according to described second numbering with the first numbering determines
The cavity of board abnormal in described at least two board includes:
When described first numbering is identical with described second numbering, determine described first numbering correspondence
The cavity of board abnormal.
Method the most according to claim 1, it is characterised in that include at described at least two board
During one cavity, the described corresponding relation according to described second numbering and the first numbering determines described
The cavity of board abnormal at least two board includes:
Described second numbering be included in described first numbering in and described second numbering described
Numbered serial number corresponding in first numbering, determines the board of described first numbering correspondence
Cavity is abnormal.
4. according to the method described in any one of claims 1 to 3, it is characterised in that described reception wafer
The extraction order information of at least two boards of correspondence that extracting device sends includes:
Receive what the first board at least two boards described in wafer extracting device correspondence sent
First extraction order information；
Described first board is passed sequentially through according to described first extraction order information at described wafer
Described wafer is again placed on by rear and described wafer extracting device according to described FOUP numbering
Time in described FOUP, receive second at least two boards described in wafer extracting device correspondence
The second extraction order information that board sends.
Method the most according to claim 4, it is characterised in that determine described first numbering described
After the cavity of corresponding board is abnormal, described method also includes:
Send prompting message and show the described first identification information numbering corresponding board.
6. a detection equipment, it is characterised in that including:
Receive unit, for receiving taking out of at least two boards of correspondence of wafer extracting device transmission
Taking order information, wherein, described extraction order information includes that described wafer extracting device is at wafer
Box FOUP extracts successively the order of wafer, described at least two boards according to FOUP numbering
The most corresponding different extraction order information；
Acquiring unit, described wafer according to described extraction order information pass sequentially through described at least
After the cavity of two boards, obtain according to the described extraction order information that described reception unit receives
Wafer corresponding to the cavity of described at least two board the first numbering in described FOUP,
Described wafer by after whole boards, obtains defective wafer in described FOUP corresponding second
Numbering；
Determine unit, for the second numbering and the first numbering that obtain according to described acquiring unit
Corresponding relation determines the cavity of board abnormal in described at least two board.
Equipment the most according to claim 6, it is characterised in that described determine that unit also includes:
First determines module, if including at least two cavity for described at least two board,
When described first numbering is identical with described second numbering, determine the board that described first numbering is corresponding
Cavity abnormal.
Equipment the most according to claim 6, it is characterised in that described determine that unit also includes:
Second determines module, if including a cavity, described for described at least two board
Second numbering is included in described first numbering and described second numbering is in described first numbering
Corresponding numbered serial number, determines that the cavity of the board of described first numbering correspondence is abnormal.
9. according to the equipment described in any one of claim 6 to 8, it is characterised in that described reception unit
Including:
First receiver module, is used for receiving at least two boards described in wafer extracting device correspondence
First board send first extraction order information；
Second receiver module, for receive according to described first receiver module at described wafer the
One extraction order information pass sequentially through described first board after and described wafer extracting device according to
When described wafer is placed in described FOUP by described FOUP numbering again, receives wafer and take out
The second extraction order letter that the second board at least two boards described in taking equipment correspondence sends
Breath.
Equipment the most according to claim 9, it is characterised in that described equipment also includes:
Described, Tip element, for determining that unit determines the board of described first numbering correspondence
After cavity is abnormal, sends prompting message and show the described first mark letter numbering corresponding board
Breath.
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| CN116230586A (en) * | 2022-12-12 | 2023-06-06 | 全芯智造技术有限公司 | Commonality analysis method and terminal of wafer manufacturing machine unit |
| CN116244658A (en) * | 2023-05-06 | 2023-06-09 | 粤芯半导体技术股份有限公司 | Abnormality detection method and device for semiconductor machine, electronic equipment and storage medium |
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| CN116244658A (en) * | 2023-05-06 | 2023-06-09 | 粤芯半导体技术股份有限公司 | Abnormality detection method and device for semiconductor machine, electronic equipment and storage medium |
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