CN105990178B - The detection method and detection device of abnormal board - Google Patents
The detection method and detection device of abnormal board Download PDFInfo
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- CN105990178B CN105990178B CN201510087644.3A CN201510087644A CN105990178B CN 105990178 B CN105990178 B CN 105990178B CN 201510087644 A CN201510087644 A CN 201510087644A CN 105990178 B CN105990178 B CN 105990178B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- Condensed Matter Physics & Semiconductors (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses the detection methods and detection device of a kind of abnormal board.Wherein, this method comprises: receiving the extraction order information of at least two boards of correspondence that wafer extracting device is sent, wherein at least two boards respectively correspond different extraction order informations for this；After the wafer passes sequentially through the cavity of at least two boards according to the extraction order information, first number of the corresponding wafer of cavity which is obtained according to the extraction order information in the FOUP；After the wafer passes through whole boards, defective wafer corresponding second number in the FOUP is obtained；The cavity of board abnormal at least two board is determined according to the corresponding relationship of second number and the first number.Through the invention, it solves the problems, such as accurately confirm abnormal board, realizes the effect for accurately confirming the cavity for the board being abnormal.
Description
Technical field
The present invention relates to wafer manufacturing fields, in particular to the detection method and detection device of a kind of abnormal board.
Background technique
Wafer defect has plenty of during wafer process, due to temperature, pressure, media components concentration, technique board, behaviour
Make personnel, caused by the variation such as environment of plant；Some be then after Crystallization, due to particle warm-up movement or answered masterpiece
With and generate, they can be migrated in lattice, so that disappearing, while can have new defect to generate again, to cause wafer
Low yield.
In the prior art, in order to detect to cause the board of defective wafer, the cavity pair of the defective wafer will can only be passed through
The board answered is found out, and still, often finds out many boards in this way, and which machine can not further confirm that is
Platform is abnormal.
Above-mentioned aiming at the problem that accurately can not confirming abnormal board, currently no effective solution has been proposed.
Summary of the invention
The embodiment of the invention provides the detection methods and detection device of a kind of abnormal board, so that accurately confirmation occurs
The cavity of abnormal board.
According to an aspect of an embodiment of the present invention, a kind of detection method of abnormal board is provided, comprising: receive wafer
The extraction order information of at least two boards of correspondence that extracting device is sent, wherein the extraction order information includes the crystalline substance
Circle extracting device successively extracts the sequence of wafer in wafer cassette FOUP according to FOUP number, and at least two boards are right respectively
Answer different extraction order informations；At least two boards are passed sequentially through according to the extraction order information in the wafer
After cavity, the corresponding wafer of cavity of at least two board is obtained in the FOUP according to the extraction order information
First number；After the wafer passes through whole boards, defective wafer corresponding second number in the FOUP is obtained；According to
Second number determines the cavity of board abnormal at least two board with the corresponding relationship of the first number.
Optionally, described according to second number and the when at least two board includes at least two cavity
The corresponding relationship of one number determines that the cavity of board abnormal at least two board includes: in first number and institute
State the second number it is identical when, determine that the cavity of the corresponding board of first number is abnormal.
Optionally, described to be compiled according to second number with first when at least two board includes a cavity
Number corresponding relationship determine board abnormal at least two board cavity include: it is described second number be included in institute
It states in the first number and second number corresponding number in first number is serial number, determine that described first compiles
The cavity of number corresponding board is abnormal.
Optionally, the extraction order information for receiving at least two boards of correspondence that wafer extracting device is sent includes:
It receives the first board in corresponding at least two boards of wafer extracting device is sent first and extracts order information；Described
Wafer passes sequentially through after first board according to the first extraction order information and the wafer extracting device is according to described
When the wafer is placed in the FOUP by FOUP number again, corresponding at least two boards of wafer extracting device are received
In the second board send second extract order information.
Optionally, after the cavity exception of the corresponding board of the determination first number, the method also includes: hair
Prompting message and show the identification information of the corresponding board of first number out.
According to another aspect of an embodiment of the present invention, a kind of detection device is additionally provided, comprising: receiving unit, for connecing
Receive the extraction order information of at least two boards of correspondence that wafer extracting device is sent, wherein the extraction order information includes
The wafer extracting device successively extracts the sequence of wafer, at least two boards in wafer cassette FOUP according to FOUP number
Respectively correspond different extraction order informations；Acquiring unit passes sequentially through institute according to the extraction order information in the wafer
After the cavity for stating at least two boards, described at least two are obtained according to the received extraction order information of the receiving unit
First number of the corresponding wafer of the cavity of board in the FOUP obtains defect after the wafer passes through whole boards
Wafer corresponding second number in the FOUP；Determination unit, for according to the acquiring unit obtain second number with
The corresponding relationship of first number determines the cavity of board abnormal at least two board.
Optionally, the determination unit further include: the first determining module, if including at least at least two board
Two cavitys determine the cavity of the corresponding board of first number when first number is identical as second number
It is abnormal.
Optionally, the determination unit further include: the second determining module, if including one at least two board
Cavity is included in first number in second number and described second numbers the corresponding volume in first number
Number it is serial number, determines that the cavity of the corresponding board of first number is abnormal.
Optionally, the receiving unit includes: the first receiving module, described at least for receiving wafer extracting device correspondence
The first extraction order information that the first board in two boards is sent；Second receiving module is used in the wafer according to institute
The received first extraction order information of the first receiving module is stated to pass sequentially through after first board and the wafer extracting device
When being again placed on the wafer in the FOUP according to FOUP number, it is described at least to receive wafer extracting device correspondence
The second extraction order information that the second board in two boards is sent.
Optionally, described device further include: prompt unit, for determining that first number corresponds in the determination unit
Board cavity exception after, issue the identification information that prompting message simultaneously shows the corresponding board of first number.
In embodiments of the present invention, detection device receives the extraction at least two boards of correspondence that wafer extracting device is sent
Order information, and the corresponding wafer of cavity that at least two board is obtained according to the extraction order information in the FOUP
One number obtains defective wafer corresponding second number in the FOUP after the wafer passes through whole boards, according to this second
The corresponding relationship of number and the first number determines the cavity of board abnormal at least two board, in this way, due to different
Board is adopted extracts wafer in differing order, and the chamber of abnormal board is accurately found so as to the number according to defective wafer
Body.Through the invention, it solves the problems, such as accurately confirm abnormal board, realizes and accurately confirm the board being abnormal
The effect of cavity.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is a kind of flow diagram of the detection method of abnormal board according to an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram of the detection device of abnormal board according to an embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of the detection device of optional abnormal board according to an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of the detection device of another optional abnormal board according to an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the detection device of the third optional abnormal board according to an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of the detection device of 4th kind according to an embodiment of the present invention optional abnormal board.
Specific embodiment
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The model that the present invention protects all should belong in member's every other embodiment obtained without making creative work
It encloses.
It should be noted that description and claims of this specification and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so as to the embodiment of the present invention described herein can in addition to illustrating herein or
Sequence other than those of description is implemented.In addition, term " includes " and " having " and their any deformation, it is intended that cover
Cover it is non-exclusive include, for example, the process, method, system, product or equipment for containing a series of steps or units are not necessarily limited to
Step or unit those of is clearly listed, but may include be not clearly listed or for these process, methods, product
Or other step or units that equipment is intrinsic.
A kind of detection method of abnormal board is provided according to embodiments of the present invention, as shown in Figure 1, executing subject of the invention
It can be the detection device of abnormal board, this method may include:
Step S101, the extraction order information of at least two boards of correspondence that wafer extracting device is sent is received.
Wherein, which includes that the wafer extracting device is successively taken out in wafer cassette FOUP according to FOUP number
The sequence of the wafer is taken, at least two boards respectively correspond different extraction order informations for this.
It is configured it should be noted that the extraction order information can first pass through in advance control system, which will
The extraction order information set is issued to the wafer extracting device of corresponding board, and wafer extracting device is then according to extraction sequence
Information extraction passes through the wafer of the board.
Optionally, it is suitable to correspond to the first extraction that the first board at least two boards is sent for reception wafer extracting device
Sequence information.
The wafer passed sequentially through after first board according to the first extraction order information and the wafer extracting device by
When being again placed on the wafer in the FOUP according to FOUP number, receives wafer extracting device and correspond at least two boards
The second board send second extract order information.
In this way, wafer extracting device is by wafer again according to FOUP after whole wafers in FOUP are by a board
Number is put into FOUP, ensure that wafer corresponds to different extraction sequences when passing through different platform.
Step S103, after the wafer passes sequentially through the cavity of at least two boards according to the extraction order information, root
First number of the corresponding wafer of cavity for obtaining at least two board according to the extraction order information in the FOUP.
Wherein, when at least two board includes at least two cavity, wafer extracting device is successively according to extraction sequence
Extraction sequence in information extracts the wafer in FOUP, and first wafer of extraction is put into corresponding first cavity of board
In, second wafer of extraction is put into corresponding first cavity of board, and so on, until all wafers are all put into
In board.
Illustratively, to include 25 wafers in a FOUP, a board for 3 cavitys including being illustrated, and this 3
Cavity is denoted as A respectively1、A2And A3, which is followed successively by 1 to 25, then the FOUP is passing through board
When, wafer extracting device is extracted according to number of the wafer in FOUP according to preset order (here according to 1 to 25 sequence)
The wafer of number 1 is such as passed through A by wafer1, the wafer of number 2 is passed through into A2, the wafer of number 3 is passed through into A3, by the crystalline substance of number 4
Circle passes through A1, the wafer of number 5 is passed through into A2, the wafer of number 6 is passed through into A3, and so on, then eventually by A1Wafer exists
Number in FOUP is 1,4,7,10,13,16,19,22 and 25, passes through B2Number of the wafer in FOUP be 2,5,8,11,
14,17,20 and 23, pass through B3Number of the wafer in FOUP be 3,6,9,12,15,18,21 and 24.
Step S105, after the wafer passes through whole boards, defective wafer corresponding second number in the FOUP is obtained；
Step S107, it is determined according to the corresponding relationship of second number and the first number abnormal at least two board
The cavity of board.In embodiments of the present invention, detection device receives correspondence at least two boards that wafer extracting device is sent
Order information is extracted, and the corresponding wafer of cavity for obtaining at least two board according to the extraction order information is in the FOUP
The first number defective wafer corresponding second number in the FOUP is obtained, according to this after the wafer passes through whole boards
The corresponding relationship of second number and the first number determines the cavity of board abnormal at least two board, in this way, due to not
Same board is adopted extracts wafer in differing order, so as to accurately find abnormal board according to the number of defective wafer
Cavity.
Optionally, at least two board include at least two cavitys when, above-mentioned steps S104 specifically: this first
When numbering identical as second number, determine that the cavity of the corresponding board of the first number is abnormal.
Illustratively, it is illustrated so that the wafer in a FOUP completes silicon wafer process by two boards as an example, this
It include 25 wafers in FOUP, which is followed successively by 1 to 25, which is denoted as board respectively
A and board B, board A include 3 cavitys, are denoted as A respectively1、A2And A3, board B includes 3 cavitys, is denoted as B respectively1、B2
And B3, the wafer in the FOUP passes through board A first, wafer extracting device can according to number of the wafer in FOUP according to
“16-18-14-13-5-25-23-3-10-24-19-4-2-20-15-6-22-11-17-1-21-9-12-7-8”
Sequence successively extract the wafer in the FOUP and by each cavity of board A, in this way, passing through A1Wafer exist
Number in FOUP is 16,13,23,24,2,6,17,9 and 8, passes through A2Number of the wafer in FOUP be 18,5,3,19,
20,22,1 and 12, pass through A3Number of the wafer in FOUP be 14,25,10,4,15,11,21 and 7, wafer extracting device will
The corresponding number information of above-mentioned each cavity is sent to detection device, and detection device stores above-mentioned number information in the database,
For wafer in the FOUP after through board A, wafer extracting device reapposes wafer according to the number in FOUP in order
In FOUP, and continue through each cavity in board B.
Wafer extracting device can according to number of the wafer in FOUP according to
“1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-16-17-18-19-20-21-22-23-24-25”
Sequence successively extract the wafer in the FOUP and by each cavity of board B, in this way, passing through B1Wafer exist
Number in FOUP is 1,4,7,10,13,16,19,22 and 25, passes through B2Number of the wafer in FOUP be 2,5,8,11,
14,17,20 and 23, pass through B3Number of the wafer in FOUP be 3,6,9,12,15,18,21 and 24, wafer extracting device will
The corresponding number information of above-mentioned each cavity is sent to detection device, and detection device stores above-mentioned number information in the database,
For wafer in the FOUP after through board B, wafer extracting device reapposes wafer according to the number in FOUP in order
In FOUP, at this point, if detection device determines 3,6,9,12,15,18,21 and 24 for defective wafer, due to the defective wafer
Number and the cavity B for passing through board B3The number of corresponding wafer is identical (to pass through the cavity B of board B3Wafer all produce
Give birth to defect), then the detection device is the cavity B that can determine board B3For abnormal board cavity.It should be noted that here
It is merely illustrative, number of the present invention to above-mentioned board, the number of the number of the cavity of board and the wafer in a FOUP
Etc. parameters be not construed as limiting.
Optionally, when at least two board includes a cavity, above-mentioned steps S104 specifically:
It is included in first number in second number and second number corresponding number in first number is
Serial number determines that the cavity of the corresponding board of the first number is abnormal.
Illustratively, it is illustrated so that the wafer in a FOUP completes silicon wafer process by two boards as an example, this
It include 25 wafers in FOUP, which is followed successively by 1 to 25, which is denoted as board respectively
A and board B, board A include 1 cavity, are denoted as A1, and board B includes 1 cavity, are denoted as B1, and the wafer in the FOUP is first
Board A is first passed through, wafer extracting device can be according to number of the wafer in FOUP according to " 16-18-14-13-5-25-23-3-
10-24-19-4-2-20-15-6-22-11-17-1-21-9-12-7-8”
Sequence successively extract the wafer in the FOUP and by the cavity A of board A1, wafer extracting device will be above-mentioned each
The corresponding number information of cavity is sent to detection device, and detection device stores above-mentioned number information in the database, the FOUP
In wafer by the way that after board A, wafer is reapposed over FOUP according to the number in FOUP by wafer extracting device in order
In, and continue through each cavity in board B, wafer extracting device can according to number of the wafer in FOUP according to
“1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-16-17-18-19-20-21-22-23-24-25”
Sequence successively extract the wafer in the FOUP and by the cavity B of board B1, wafer extracting device is by above-mentioned chamber
Body B1Corresponding number information is sent to detection device, and detection device stores above-mentioned number information in the database, the FOUP
In wafer by the way that after board B, wafer is reapposed over FOUP according to the number in FOUP by wafer extracting device in order
In, at this point, if detection device determines 3,4,5,10,19,23,24 and 25 for defective wafer, due to the number packet of the defective wafer
It is contained in the cavity A by board A1In the number of corresponding wafer and in the A1The number of corresponding wafer is serial number, then should
Detection device is the cavity A that can determine board A1For abnormal board cavity.Here it is merely illustrative, the present invention is to above-mentioned machine
The number of platform, the parameters such as number of wafer in the number of the cavity of board and a FOUP are not construed as limiting.
It should be noted that above-mentioned serial number refers to position of each number of the second number in the first number
It is that continuously, e.g., the second number is " 3,4,5,10,19,23,24 and 25 ", and the first number is
“16-18-14-13-5-25-23-3-10-24-19-4-2-20-15-6-22-11-17-1-21-9-12-7-8”
It can be seen that " 5,25,23,3,10,24,19 and 4 " and the second number in the first number are continuous in position
(i.e. " 5,25,23,3,10,24,19 and 4 " respectively number between do not include the no number of the second number)；If above-mentioned first compiles
Number it is
“16-18-14-13-5-8-25-23-3-10-24-19-4-2-20-15-6-22-11-17-1-21-9-12-7”
It can be seen that although the first number includes the second number " 3,4,5,10,19,23,24 and 25 ", due to the first volume
" 5,6,25,23,3,10,24,19 and 4 " in number, it is one " 6 " more between " 5 " and " 25 ", and should " 6 " be not belonging to the
Two numbers, it is determined that second number corresponding number in first number is discontinuously to number.
Optionally, after the cavity exception for determining the corresponding board of the first number, issue prompting message and show this
The identification information of the corresponding board of one number facilitates operator timely to inform the board cavity of relevant operation personnel's exception
The board cavity to note abnormalities promotes user experience.
In one possible implementation of the present invention, operator can be reminded by following three kinds of modes:
Mode one: detection device sounds an alarm and by the identification information of the abnormal board cavity of display screen display.
Wherein, detection device can sound an alarm within a preset time and by the abnormal board cavity of display screen display
Identification information.
Mode two: the identification information that detection device passes through display screen display alarm information and abnormal board cavity.
Wherein, terminal can display alarm information and abnormal board cavity within a preset time identification information.
For example, the detection device is provided with alarm lamp, and when being alarmed by the alarm lamp, the alarm lamp
It is always on or flashes, and the mark of the board cavity of the interface display exception of the human-computer interaction by being arranged on the detection device
Information；Alternatively, showing the warning message and abnormal board cavity on the interface for the human-computer interaction being arranged on the detection device
Identification information, certainly, the invention is not limited to above embodiment, other modes that can be realized alarm also fall in this hair
Within bright protection scope.
Mode three: detection device display alarm information and the mark of abnormal board cavity letter while sounding an alarm
Breath.
A kind of detection device 20 of abnormal board is provided according to embodiments of the present invention, as shown in Fig. 2, the detection device 20 can
To include:
Receiving unit 21, the extraction order information of at least two boards of correspondence for receiving the transmission of wafer extracting device,
Wherein, which includes that the wafer extracting device successively extracts wafer according to FOUP number in wafer cassette FOUP
Sequentially, this at least two boards respectively correspond different extraction order informations；
Acquiring unit 22, for passing sequentially through the cavity of at least two boards according to the extraction order information in the wafer
Afterwards, the corresponding wafer of cavity for obtaining at least two board according to the received extraction order information of the receiving unit 21 is at this
The first number in FOUP obtains defective wafer corresponding second number in the FOUP after the wafer passes through whole boards；
The corresponding relationship of determination unit 23, the second number and the first number for being obtained according to the acquiring unit 22 determines
The cavity of abnormal board at least two board.
In embodiments of the present invention, detection device receives the extraction at least two boards of correspondence that wafer extracting device is sent
Order information, and the corresponding wafer of cavity that at least two board is obtained according to the extraction order information in the FOUP
One number obtains defective wafer corresponding second number in the FOUP after the wafer passes through whole boards, according to this second
The corresponding relationship of number and the first number determines the cavity of board abnormal at least two board, in this way, due to different
Board is adopted extracts wafer in differing order, and the chamber of abnormal board is accurately found so as to the number according to defective wafer
Body.
Optionally, as shown in figure 3, the determination unit 23 may include: the first determining module 231, if for this at least two
A board includes at least two cavitys, when first number is identical as second number, determines the corresponding machine of the first number
The cavity of platform is abnormal.
Optionally, as shown in figure 4, the determination unit 23 further include: the second determining module 232, if for this at least two
Board includes a cavity, is included in first number in second number and second number is corresponding in first number
Number be serial number, determine that the cavity of the corresponding board of the first number is abnormal.
Optionally, it as shown in figure 5, the receiving unit 21 includes: the first receiving module 211, is set for receiving wafer extraction
The first extraction order information that the first board in standby corresponding at least two boards is sent；Second receiving module 212 is used for
The wafer extracts order information according to first receiving module 211 received first and passes sequentially through after first board and the wafer
When the wafer is placed in the FOUP by extracting device again according to FOUP number, receives wafer extracting device and correspond to this at least
The second extraction order information that the second board in two boards is sent.
Optionally, as shown in fig. 6, the detection device 20 further include: prompt unit 24, for being determined in the determination unit 23
After the cavity exception of the corresponding board of first number, issues prompting message and show the mark of the corresponding board of the first number
Information.
In this way, adopted due to different boards by using above-mentioned detection device and extract wafer in differing order, so as to
Enough cavitys that abnormal board is accurately found according to the number of defective wafer.
It should be noted that affiliated those skilled in the art can be understood that, for convenience and simplicity of description,
The specific work process and description of the detection device of foregoing description, the corresponding process during reference can be made to the above method embodiment,
This is repeated no more.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (10)
1. a kind of detection method of exception board characterized by comprising
Receive the extraction order information of at least two boards of correspondence that wafer extracting device is sent, wherein the extraction sequence is believed
Breath include the wafer extracting device in wafer cassette FOUP according to FOUP number successively extract wafer sequence, described at least two
Platform board respectively corresponds different extraction order informations；
After the wafer passes sequentially through the cavity of at least two boards according to the extraction order information, according to the pumping
Order information is taken to obtain first number of the corresponding wafer of cavity of at least two board in the FOUP；
After the wafer passes through whole boards, defective wafer corresponding second number in the FOUP is obtained；
The chamber of board abnormal at least two board is determined with the corresponding relationship of the first number according to second number
Body.
2. the method according to claim 1, wherein including at least two cavitys at least two board
When, the corresponding relationship according to second number and the first number determines board abnormal at least two board
Cavity includes:
When first number is identical as second number, determine that the cavity of the corresponding board of first number is abnormal.
3. the method according to claim 1, wherein at least two board include a cavity when, institute
State the cavity for determining board abnormal at least two board with the corresponding relationship of the first number according to second number
Include:
It is included in first number in second number and described second numbers the corresponding volume in first number
Number it is serial number, determines that the cavity of the corresponding board of first number is abnormal.
4. method according to any one of claims 1 to 3, which is characterized in that described to receive what wafer extracting device was sent
The extraction order information of corresponding at least two boards includes:
It receives the first board in corresponding at least two boards of wafer extracting device is sent first and extracts order information；
After the wafer passes sequentially through first board according to the first extraction order information and wafer extraction is set
It is standby when being again placed on the wafer in the FOUP according to FOUP number, receive wafer extracting device it is corresponding it is described extremely
The second extraction order information that the second board in few two boards is sent.
5. according to the method described in claim 4, it is characterized in that, numbering the chamber of corresponding board in the determination described first
After body exception, the method also includes:
It issues prompting message and shows the identification information of the corresponding board of first number.
6. a kind of detection device characterized by comprising
Receiving unit, the extraction order information of at least two boards of correspondence for receiving the transmission of wafer extracting device, wherein institute
Stating and extracting order information includes that the wafer extracting device successively extracts the suitable of wafer according to FOUP number in wafer cassette FOUP
Sequence, at least two boards respectively correspond different extraction order informations；
Acquiring unit, after the wafer passes sequentially through the cavity of at least two boards according to the extraction order information,
Existed according to the corresponding wafer of cavity that the received extraction order information of the receiving unit obtains at least two board
It is corresponding in the FOUP to obtain defective wafer after the wafer passes through whole boards for the first number in the FOUP
Second number；
Determination unit, the corresponding relationship of the second number and the first number for being obtained according to the acquiring unit determine it is described extremely
The cavity of abnormal board in few two boards.
7. equipment according to claim 6, which is characterized in that the determination unit further include:
First determining module, if at least two board include at least two cavitys, it is described first number with it is described
When second number is identical, determine that the cavity of the corresponding board of first number is abnormal.
8. equipment according to claim 6, which is characterized in that the determination unit further include:
Second determining module is included in described if including a cavity at least two board in second number
In first number and second number corresponding number in first number is serial number, determines first number
The cavity of corresponding board is abnormal.
9. according to the described in any item equipment of claim 6 to 8, which is characterized in that the receiving unit includes:
First receiving module is taken out for receiving the first board in corresponding at least two boards of wafer extracting device is sent first
Take order information；
Second receiving module, for extracting order information successively according to first receiving module received first in the wafer
By after first board and the wafer extracting device number according to the FOUP wafer is placed on again it is described
When in FOUP, receives the second extraction sequence that the second board in corresponding at least two boards of wafer extracting device is sent and believe
Breath.
10. equipment according to claim 9, which is characterized in that the equipment further include:
Prompt unit, for after the cavity exception that the determination unit determines the corresponding board of first number, sending to be mentioned
Show message and shows the identification information of the corresponding board of first number.
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| JP2010272797A (en) * | 2009-05-25 | 2010-12-02 | Sharp Corp | Inspection result analyzing method and inspection result analyzing device, abnormal facility detecting method and abnormal facility detecting device, program for enabling computer to execute inspection result analyzing method or abnormal facility detecting method, and computer-readable recording medium where program is recorded |
| CN102196721A (en) * | 2010-03-05 | 2011-09-21 | 欧姆龙株式会社 | Method for supporting analytical work of solder printing state and solder printing inspection machine |
| JP2012248796A (en) * | 2011-05-31 | 2012-12-13 | Fuji Mach Mfg Co Ltd | Substrate operation inspection support system |
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| JP2010272797A (en) * | 2009-05-25 | 2010-12-02 | Sharp Corp | Inspection result analyzing method and inspection result analyzing device, abnormal facility detecting method and abnormal facility detecting device, program for enabling computer to execute inspection result analyzing method or abnormal facility detecting method, and computer-readable recording medium where program is recorded |
| CN102196721A (en) * | 2010-03-05 | 2011-09-21 | 欧姆龙株式会社 | Method for supporting analytical work of solder printing state and solder printing inspection machine |
| JP2012248796A (en) * | 2011-05-31 | 2012-12-13 | Fuji Mach Mfg Co Ltd | Substrate operation inspection support system |
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