CN102193043A - Testing integration method for bare board of circuit board - Google Patents
Testing integration method for bare board of circuit board Download PDFInfo
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- CN102193043A CN102193043A CN2010101192706A CN201010119270A CN102193043A CN 102193043 A CN102193043 A CN 102193043A CN 2010101192706 A CN2010101192706 A CN 2010101192706A CN 201010119270 A CN201010119270 A CN 201010119270A CN 102193043 A CN102193043 A CN 102193043A
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Abstract
The invention discloses a testing integration method for a bare board of a circuit board. By using the integration method provided by the invention, operation flows such as feeding, testing, retesting, spraying and the like of the bare board of the circuit board can be automatically finished in a consistent way. The testing integration method disclosed by the invention has the following advantages: the floor space of the equipment can be effectively reduced, the testing integration method can be operated by single person, the transfer time of each flow is immediately eliminated, the working frequency is largely increased, a simple operation mode is obtained, and the testing integration mode is still very conveniently switched to a manual mode because the function of each unit can be stopped.
Description
Technical field
The present invention relates to a kind of test integration method, relate in particular to a kind of test integration method of circuit board hollow plate.
Background technology
Circuit board in process of production, unavoidably because of external factor cause short circuit, open circuit and electric leakage etc. electrically on flaw, add circuit board constantly towards high density, thin space and multi-level evolution, if fail in time bad plate screening to be come out, and let alone to flow in the processing procedure, will certainly cause more cost waste, therefore except the improvement of processing procedure control, improving the technical level of test, also is to provide the mode that reduces scrappage and promote the product yield for the circuit board manufacturer.
Available circuit plate hollow plate is after the test of automatic test machine tool, and defective products carries out repetition measurement by artificial transfer flying probe tester; The circuit board hollow plate after automatic test machine tool test non-defective unit and the non-defective unit that passes through through the flying probe repetition measurement, also be by manually being transferred to the operation of affixing one's seal of the ink-jet machine of affixing one's seal.Means of transportation between each method is for manually taking, and transfer process can't be expected situation such as batch mixing takes place, collide, drop, and running costs such as transfer process labor intensive, time, and each process apparatus is all independence, and it is bigger to take work space.
Therefore how to cook up moving-wire circuit board detection method smoothly, reach time, saving manpower and the saving facility saving circuit board and be sent to each testing station and take up room, become the problem that present industry is demanded urgently overcoming in fact.
Summary of the invention
The object of the present invention is to provide the integration method of circuit board hollow plate test, make the circuit board can be by conveying belt, delivery track or mechanical arm, integrate in the moving-wire of cooking up, with each workstation of passing through of the shortest time, and finish each the station test or other task, solving tradition manually coming the transfer circuit plate between each workstation, running costs such as institute's circuit board that causes is impaired, labor intensive, time, and the problem that takes up room of each facility.
Means of the present invention, be delivery track to be set between each workstation mechanism or to draw circuit board with mechanical arm, make circuit board finish each station test in regular turn, and the non-defective unit after each workstation also can further be planned distinguishing tests and the temporary storage location of defective products, make whole test process smooth and easy without hindrance, got rid of the chance of blocking, to adapt to the demand of volume production.
The integration method of first kind of circuit board hollow plate test provided by the present invention is:
(1) the circuit board hollow plate is put in a feeding mechanism;
(2) the circuit board hollow plate is transported to an automatic test machine structure from this feeding mechanism and tests;
(3) by the circuit board hollow plate of test, be transported to an ink-jet stamping mechanism from this automatic test machine structure, spray printing non-defective unit mark;
(4) the circuit board hollow plate is transported to a discharging mechanism from this ink-jet stamping mechanism.
Wherein, after the test of circuit board hollow plate through step (2), on not by the circuit board hollow plate of testing, paste the defective products paster, and be transported to this discharging mechanism.
The integration method of second kind of circuit board hollow plate test provided by the present invention is:
After the test of circuit board hollow plate through above-mentioned steps (2), be not transported to a flying probe mechanism and carry out repetition measurement by the circuit board hollow plate of testing;
Circuit board hollow plate by repetition measurement is transported to this ink-jet stamping mechanism, and spray printing non-defective unit mark is transported to this discharging mechanism again;
The circuit board hollow plate by repetition measurement is not then sticked the defective products paster, is transported to this discharging mechanism again.
The integration method of the third circuit board hollow plate test provided by the invention is:
(1) the circuit board hollow plate is put in a feeding mechanism;
(2) the circuit board hollow plate is transported to an automatic test machine structure from this feeding mechanism and tests;
(3) the circuit board hollow plate by test is transported to a discharging mechanism, is not transported to flying needle survey formula mechanism by the circuit board hollow plate of testing and carries out repetition measurement;
(4) by and not the circuit board hollow plate by repetition measurement all be transported to this discharging mechanism, but deposit respectively.
The integration method of the 4th kind of circuit board hollow plate test provided by the invention is:
(1) the circuit board hollow plate is put in a feeding mechanism;
(2) the circuit board hollow plate is transported to a flying probe mechanism from this feeding mechanism and cuts apart test;
(3) the circuit board hollow plate by test is transported to an ink-jet stamping mechanism, spray printing non-defective unit mark;
(4) the circuit board hollow plate is transported to a discharging mechanism from this ink-jet stamping mechanism.
Wherein, this to cut apart test be further test with flying needle mechanism at the circuit board hollow plate that can't see through automatic test machine structure test.
The circuit board hollow plate through step (2) cut apart test after, on circuit board hollow plate not, paste the defective products paster, and be transported to this discharging mechanism by test.
Various integration method provided by the present invention can reach automatic consistentization and finish test, jet printing method operation.Effectively reduce occupation area of equipment, and single can the operation.Eliminate each flow process transfer time immediately, significantly promote work efficiency, mode of operation is simple.Because but each unit hold function still easily switches to manual mode.
Description of drawings
Fig. 1 is first kind of circuit board hollow plate test integration method of the present invention.
Fig. 2 is second kind of circuit board hollow plate test integration method of the present invention.
Fig. 3 is the third circuit board hollow plate test integration method of the present invention.
Fig. 4 is the 4th a kind of circuit board hollow plate test integration method of the present invention.
Embodiment
Those skilled in the art below cooperate Figure of description that embodiments of the present invention are done more detailed description, so that can implement after studying this instructions carefully according to this.
The embodiment of the invention provides several feasible test integration methods, but the mode of integrating is not as limit.See also Fig. 1 and be first kind of circuit board hollow plate test of the present invention integration method.Between each workstation can by continuous track or with mechanical arm take (or draw) come transfer circuit plate hollow plate.Mainly comprise the following steps:
(1) the circuit board hollow plate is put in a feeding mechanism;
(2) the circuit board hollow plate is transported to an automatic test machine structure from this feeding mechanism and tests;
(3) by the circuit board hollow plate of test, be transported to an ink-jet stamping mechanism from this automatic test machine structure, spray printing non-defective unit mark;
(4) the circuit board hollow plate is transported to a discharging mechanism from this ink-jet stamping mechanism.
The integration method of Fig. 1 is performance, at first numerous circuit board hollow plate storehouses is positioned over a feeding mechanism 1, in regular turn described circuit board hollow plate is delivered to each workstation.The circuit board hollow plate at first enters an automatic test machine structure 2 and carries out testing electrical property in the mode that presses, circuit board hollow plate by test is transported to an ink-jet stamping mechanism 3, spray printing non-defective unit mark, spray printing is finished, and deposit the non-defective unit stack area 41 that is transported to a discharging mechanism 4 again; The circuit board hollow plate by test does not then stick the defective products paster, can paste system by a paster mechanism, and afterwards, deposit the defective products stack area 42 that is transported to this discharging mechanism 4 again.
See also Fig. 2 and be second kind of circuit board hollow plate test of the present invention integration method.Be with the difference of previous embodiment, the circuit board hollow plate by step (2) test can further not be transported to a flying needle and surveys formula mechanism 6 and carry out repetition measurement, circuit board hollow plate by repetition measurement is transported to described ink-jet stamping mechanism 3, and deposit the non-defective unit stack area 41 that is transported to discharging mechanism 4 again; The circuit board hollow plate by repetition measurement then is not transported to this paster mechanism 5, sticks the defective products paster, and deposit the defective products stack area 42 that is transported to this discharging mechanism 4 again.
See also Fig. 3 and be the third circuit board hollow plate test integration method of the present invention.Between each workstation can by continuous track or with mechanical arm take (or draw) come transfer circuit plate hollow plate.Mainly comprise the following steps:
(1) the circuit board hollow plate is put in a feeding mechanism;
(2) the circuit board hollow plate is transported to an automatic test machine structure from this feeding mechanism and tests;
(3) the circuit board hollow plate is transported to a flying probe mechanism from this automatic test machine structure and tests;
(4) by reaching, be transported to a discharging mechanism from this flying needle automatic test machine structure, but deposit respectively by the circuit board hollow plate of test.
The integration method of Fig. 3 is performance, at first numerous circuit board hollow plate storehouses is positioned over a feeding mechanism 1, in regular turn described circuit board hollow plate is delivered to each workstation.The circuit board hollow plate at first enters an automatic test machine structure 2 and carries out testing electrical property in the mode that presses, and deposit the non-defective unit stack area 41 that is transported to a discharging mechanism 4 by the circuit board hollow plate of testing; The circuit board hollow plate by step (2) test is not transported to a flying needle and surveys formula mechanism 6 and carry out repetition measurement, by and not the circuit board hollow plate by repetition measurement all be transported to described discharging mechanism 4, but deposit in non-defective unit stack area 41 and defective products stack area 42 respectively.
More than, the flying probe among Fig. 2 and Fig. 3 is not do repetition measurement at the circuit board of testing by the automatic test machine structure, below, Fig. 4 is the part that can't test at the automatic test machine structure, test is cut apart in mechanism by flying probe.Between each workstation can by continuous track or with mechanical arm take (or draw) come transfer circuit plate hollow plate.Mainly comprise the following steps:
(1) the circuit board hollow plate is put in a feeding mechanism;
(2) the circuit board hollow plate is transported to a flying probe mechanism from this feeding mechanism and cuts apart test;
(3) the circuit board hollow plate by test is transported to an ink-jet stamping mechanism, spray printing non-defective unit mark;
(4) the circuit board hollow plate is transported to a discharging mechanism from this ink-jet stamping mechanism.
The integration method of present embodiment is performance, at first numerous circuit board hollow plate storehouses is positioned over a feeding mechanism 1, in regular turn described circuit board hollow plate is delivered to each workstation.The circuit board hollow plate at first enters a flying probe mechanism 6 and cuts apart test, test that it is electrical, the circuit board hollow plate by test is transported to an ink-jet stamping mechanism 3, spray printing non-defective unit mark, spray printing is finished, and deposit the non-defective unit stack area 41 that is transported to a discharging mechanism 4 again; The circuit board hollow plate by test does not then stick the defective products paster, can paste system by a paster mechanism 5, and afterwards, deposit the defective products stack area 42 that is transported to this discharging mechanism 4 again.
The above only is in order to explain preferred embodiment of the present invention; be not that attempt is done any pro forma restriction to the present invention according to this; therefore, all have in that identical creation spirit is following do relevant any modification of the present invention or change, all must be included in the category that the invention is intended to protect.
Claims (10)
1. a circuit board hollow plate is tested integration method, it is characterized in that step comprises:
(1) the circuit board hollow plate is put in a feeding mechanism;
(2) the circuit board hollow plate is transported to an automatic test machine structure from this feeding mechanism and tests;
(3) by the circuit board hollow plate of test, be transported to an ink-jet stamping mechanism from this automatic test machine structure, spray printing non-defective unit mark;
(4) the circuit board hollow plate is transported to a discharging mechanism from this ink-jet stamping mechanism.
2. circuit board hollow plate test integration method as claimed in claim 1 is characterized in that, after the test of circuit board hollow plate through step (2), on not by the circuit board hollow plate of testing, pastes the defective products paster, and is transported to this discharging mechanism.
3. circuit board hollow plate test integration method as claimed in claim 1 is characterized in that the conveying of step (1) to (4) can be finished by track or mechanical arm.
4. circuit board hollow plate test integration method as claimed in claim 1 is characterized in that, after the test of circuit board hollow plate through step (2), is not transported to a flying probe mechanism by the circuit board hollow plate of testing and carries out repetition measurement.
5. circuit board hollow plate as claimed in claim 4 test integration method is characterized in that, the circuit board hollow plate by repetition measurement is transported to this ink-jet stamping mechanism, and spray printing non-defective unit mark is transported to this discharging mechanism again; The circuit board hollow plate by repetition measurement is not then sticked the defective products paster, is transported to this discharging mechanism again.
6. a circuit board hollow plate is tested integration method, it is characterized in that step comprises:
(1) the circuit board hollow plate is put in a feeding mechanism;
(2) the circuit board hollow plate is transported to an automatic test machine structure from this feeding mechanism and tests;
(3) the circuit board hollow plate is transported to a flying probe mechanism from this automatic test machine structure and tests;
(4) by reaching, be transported to a discharging mechanism from this flying probe mechanism, but deposit respectively by the circuit board hollow plate of test.
7. circuit board hollow plate test integration method as claimed in claim 6 is characterized in that the circuit board hollow plate by described automatic test machine structure test is transported to described discharging mechanism from this automatic test machine structure; The circuit board hollow plate by test then is not transported to described flying probe mechanism and carries out repetition measurement.
8. a circuit board hollow plate is tested integration method, it is characterized in that step comprises:
(1) the circuit board hollow plate is put in a feeding mechanism;
(2) the circuit board hollow plate is transported to a flying probe mechanism from this feeding mechanism and cuts apart test;
(3) the circuit board hollow plate by test is transported to an ink-jet stamping mechanism, spray printing non-defective unit mark;
(4) the circuit board hollow plate is transported to a discharging mechanism from this ink-jet stamping mechanism.
9. circuit board hollow plate test integration method as claimed in claim 8 is characterized in that the conveying of step (1) to (4) can be finished by track or mechanical arm.
10. circuit board hollow plate test integration method as claimed in claim 8 is characterized in that, after the test of circuit board hollow plate through step (2), on not by the circuit board hollow plate of testing, pastes the defective products paster, and is transported to this discharging mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101192706A CN102193043A (en) | 2010-03-08 | 2010-03-08 | Testing integration method for bare board of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101192706A CN102193043A (en) | 2010-03-08 | 2010-03-08 | Testing integration method for bare board of circuit board |
Publications (1)
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| CN102193043A true CN102193043A (en) | 2011-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010101192706A Pending CN102193043A (en) | 2010-03-08 | 2010-03-08 | Testing integration method for bare board of circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102680850A (en) * | 2012-05-30 | 2012-09-19 | 昱鑫科技(苏州)有限公司 | Network partitioning method and network partitioning device of electrical performance testing points of PCB (printed circuit board) |
| CN104793064A (en) * | 2014-01-16 | 2015-07-22 | 久元电子股份有限公司 | Substrate detection system |
| CN104977524A (en) * | 2015-06-24 | 2015-10-14 | 中国电子科技集团公司第四十五研究所 | Retest method based on multi-point test around coordinate position of test point |
| CN114839516A (en) * | 2022-07-06 | 2022-08-02 | 中北大学 | Table type flying probe testing machine |
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| CN1477917A (en) * | 2002-08-20 | 2004-02-25 | 明基电通股份有限公司 | Soft circuit board capable of providing for identification |
| CN1553205A (en) * | 2003-06-03 | 2004-12-08 | 欣强科技股份有限公司 | Electrical property testing method of printing circuit board |
| TWM272990U (en) * | 2005-01-11 | 2005-08-11 | Domintech Co Ltd | Automatic testing device for electronic components |
| CN1925724A (en) * | 2005-09-02 | 2007-03-07 | 三星电机株式会社 | Method of forming circuit pattern on printed circuit board |
| CN101134190A (en) * | 2006-08-31 | 2008-03-05 | 欣兴电子股份有限公司 | Jet printing technique for the metal surface treatment |
| CN101140310A (en) * | 2007-01-31 | 2008-03-12 | 中兴通讯股份有限公司 | Detecting system of printed circuit boards half-finished product plate |
| CN101424723A (en) * | 2008-12-12 | 2009-05-06 | 四川长虹电器股份有限公司 | Optimizing method based on four-needle flying-needle test path |
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| TW272990B (en) * | 1992-11-25 | 1996-03-21 | Zeneca Ltd | |
| US6587980B2 (en) * | 1996-08-02 | 2003-07-01 | Micron Technology, Inc. | Intelligent binning for electrically repairable semiconductor chips |
| CN1477917A (en) * | 2002-08-20 | 2004-02-25 | 明基电通股份有限公司 | Soft circuit board capable of providing for identification |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102680850A (en) * | 2012-05-30 | 2012-09-19 | 昱鑫科技(苏州)有限公司 | Network partitioning method and network partitioning device of electrical performance testing points of PCB (printed circuit board) |
| CN104793064A (en) * | 2014-01-16 | 2015-07-22 | 久元电子股份有限公司 | Substrate detection system |
| CN104977524A (en) * | 2015-06-24 | 2015-10-14 | 中国电子科技集团公司第四十五研究所 | Retest method based on multi-point test around coordinate position of test point |
| CN104977524B (en) * | 2015-06-24 | 2017-11-17 | 中国电子科技集团公司第四十五研究所 | Retest method based on multi-point test around coordinate position of test point |
| CN114839516A (en) * | 2022-07-06 | 2022-08-02 | 中北大学 | Table type flying probe testing machine |
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Application publication date: 20110921 |