CN105977360B - 具有良好气密性的led支架的制作工艺 - Google Patents
具有良好气密性的led支架的制作工艺 Download PDFInfo
- Publication number
- CN105977360B CN105977360B CN201610432556.7A CN201610432556A CN105977360B CN 105977360 B CN105977360 B CN 105977360B CN 201610432556 A CN201610432556 A CN 201610432556A CN 105977360 B CN105977360 B CN 105977360B
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- carried out
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- tightness
- plating
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 20
- 238000005452 bending Methods 0.000 claims abstract description 16
- 239000012212 insulator Substances 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 238000001746 injection moulding Methods 0.000 claims abstract description 11
- 238000004080 punching Methods 0.000 claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
- 239000000047 product Substances 0.000 claims description 44
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 239000011265 semifinished product Substances 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 230000002950 deficient Effects 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 238000005238 degreasing Methods 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000011536 re-plating Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- 230000008569 process Effects 0.000 abstract description 20
- 239000000463 material Substances 0.000 abstract description 9
- 238000009713 electroplating Methods 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 abstract description 3
- 229920003023 plastic Polymers 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000007689 inspection Methods 0.000 description 8
- 238000005253 cladding Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610432556.7A CN105977360B (zh) | 2016-06-17 | 2016-06-17 | 具有良好气密性的led支架的制作工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610432556.7A CN105977360B (zh) | 2016-06-17 | 2016-06-17 | 具有良好气密性的led支架的制作工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105977360A CN105977360A (zh) | 2016-09-28 |
CN105977360B true CN105977360B (zh) | 2018-08-14 |
Family
ID=57021609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610432556.7A Active CN105977360B (zh) | 2016-06-17 | 2016-06-17 | 具有良好气密性的led支架的制作工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN105977360B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107170873B (zh) * | 2017-04-26 | 2018-11-13 | 安徽欧瑞特照明有限公司 | 一种led支架清洗工艺 |
CN107910430A (zh) * | 2017-11-22 | 2018-04-13 | 叶逢新 | Led线路板制作方法 |
CN108123023A (zh) * | 2018-01-30 | 2018-06-05 | 易美芯光(北京)科技有限公司 | 一种深紫外led封装结构及其制备方法 |
CN110528036B (zh) * | 2019-08-29 | 2020-12-15 | 深圳市崇辉表面技术开发有限公司 | 一种led支架电镀方法和led支架 |
CN110791788A (zh) * | 2019-09-03 | 2020-02-14 | 深圳市崇辉表面技术开发有限公司 | 发光二极管支架的电镀方法及系统、发光二极管支架 |
CN110993776B (zh) * | 2019-12-11 | 2021-06-04 | 东莞智昊光电科技有限公司 | Led支架制作方法和led支架 |
CN111405772B (zh) * | 2020-03-10 | 2021-04-20 | 昆山一鼎工业科技有限公司 | 半导体器件的表面处理方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101235460B1 (ko) * | 2006-02-14 | 2013-02-20 | 엘지이노텍 주식회사 | 측면 발광형 엘이디 및 그 제조방법 |
CN102709440A (zh) * | 2012-05-23 | 2012-10-03 | 李海涛 | 贴片led支架、贴片led制造方法及其贴片led |
DE102012107829B4 (de) * | 2012-08-24 | 2024-01-25 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische Bauelemente und Verfahren zur Herstellung eines optoelektronischen Bauelements |
CN203826430U (zh) * | 2014-05-13 | 2014-09-10 | 深圳市晶台股份有限公司 | 一种led支架防湿气渗透结构 |
-
2016
- 2016-06-17 CN CN201610432556.7A patent/CN105977360B/zh active Active
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Publication number | Publication date |
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CN105977360A (zh) | 2016-09-28 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20180516 Address after: No. 12, Tangxia Town, Dongguan, Guangdong, Guangdong Applicant after: Dongguan national China new Mstar Technology Ltd Address before: 523000 Dongguan, Guangdong, Dongguan, Tangxia two Town Road 2 Dongguan Kai Chang Germany electronic Polytron Technologies Inc Applicant before: Dongguan Kechenda Electronic Technology Co., Ltd |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacturing technology of LED bracket with good air-tightness Effective date of registration: 20200707 Granted publication date: 20180814 Pledgee: Guangxin (Yili) Financial Leasing Co., Ltd Pledgor: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2020980003830 |
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Date of cancellation: 20201015 Granted publication date: 20180814 Pledgee: Guangxin (Yili) Financial Leasing Co., Ltd Pledgor: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2020980003830 |
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Effective date of registration: 20201223 Address after: 224000 No.9 Yunxi Road, environmental protection science and Technology City, Tinghu District, Yancheng City, Jiangsu Province Patentee after: JIANGSU CASHH NUCLEAR ENVIRONMENT PROTECTION Co.,Ltd. Address before: No. 12, Tangxia Town, Dongguan, Guangdong, Guangdong Patentee before: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20210702 Address after: 224000 40 Taihu Road, Tinghu District, Yancheng City, Jiangsu Province Patentee after: YANCHENG CHUANLIU AUTO PARTS Co.,Ltd. Address before: 224000 No.9 Yunxi Road, environmental protection science and Technology City, Tinghu District, Yancheng City, Jiangsu Province Patentee before: JIANGSU CASHH NUCLEAR ENVIRONMENT PROTECTION Co.,Ltd. |
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