CN105977174A - Gold thread wiring method for fingerprint product packing structure - Google Patents
Gold thread wiring method for fingerprint product packing structure Download PDFInfo
- Publication number
- CN105977174A CN105977174A CN201610532576.1A CN201610532576A CN105977174A CN 105977174 A CN105977174 A CN 105977174A CN 201610532576 A CN201610532576 A CN 201610532576A CN 105977174 A CN105977174 A CN 105977174A
- Authority
- CN
- China
- Prior art keywords
- gold thread
- substrate
- chip
- porcelain mouth
- bank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85186—Translational movements connecting first outside the semiconductor or solid-state body, i.e. off-chip, reverse stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a gold thread routing method for a fingerprint product packing structure. The finger product packaging structure includes: one substrate; one chip which is stacked on a top surface of the substrate; the chip and the substrate are adhered by a tape; a packaging space of the packaging structure is filled with an insulating resin, and the chip is in electrical connection to the substrate by a gold thread bonding technology. According to the invention, the method, compared with prior art, has the following advantages: the method employs multiple routing stages, and at each routing stage, routing is precisely controlled, and after proper routing of the first 4 stages, height and strength control is conducted at the later 2 stages, so that the method can effectively reach a super-low arc height which is lower than 60 [mu]m, and no crack or damage will occur, and effectively acquires better fingerprint signals.
Description
Technical field
The invention belongs to chip encapsulation technology field, the gold thread being specifically related to a kind of fingerprint product encapsulating structure is beaten
Line method.
Background technology
In fingerprint recognition encapsulation field, in order to obtain more preferable fingerprint signal, gold thread loop height must control
Below 60 μm.Conventional semiconductor package uses gold thread to carry out chip functions connection, the line of conventional bonding wire processing procedure
Arc-height needs to control more than 75 μm.Reason is that bank is due to mistake when loop height is less than 75 μm
In tight, tension force increases, and easily pulls bank, when bank tension force exceedes wire rod extension power own, can make line
Arc ruptures.
Summary of the invention
It is an object of the invention to provide the gold thread routing method of a kind of fingerprint product encapsulating structure, so that golden
Line loop height is terminating below 60 μm, in order to complete the envelope of fingerprint product in the case of ultralow loop height
Dress, it is thus achieved that preferably fingerprint signal.
For achieving the above object, present invention employs following technical scheme:
The gold thread routing method of a kind of fingerprint product encapsulating structure, described fingerprint product encapsulating structure includes: one
Substrate；One chip, is stacked on the end face of described substrate；Adhesive tape bonding is used between described chip and substrate；
Being filled with insulating resin in the encapsulated space of encapsulating structure, described chip is electrically connected with by gold thread bonding techniques
To described substrate, it is characterised in that the routing method of described gold thread comprises the following steps:
(1) after being welded on weld pad by soldered ball, porcelain mouth releases the gold thread of about 35～45 μm along Z-direction
Height of foundation as bank；Described Z-direction is the substrate vertically upward direction toward chip；Described porcelain mouth
For capillary；
The vertical gold thread released can reduce the damage to gold thread during unwrapping wire of the porcelain mouth to the full extent, with
Bigization keeps the toughness of gold thread, it is to avoid follow-up bank action breaks bank structure.
(2) when porcelain mouth reaches distance weld pad 35～45 μm, porcelain mouth stops Z-direction motion, starts along base
The gold thread of about 5～10 μm released by plate toward chip direction；
After this section of gold thread is used for ensureing that final bank is formed, bank peak is above weld pad.Reversely unwrapping wire amount
Too small, bank can present the phenomenon leaned forward, and bank inner tensions increases, and easily breaks bank；Reversely put
Line amount is excessive, and bank is the most lax, easily causes loop height unstable.
(3) stopping unwrapping wire, porcelain mouth, to Z opposite direction, i.e. forces down toward the direction vertically downward of substrate to chip
3～5 μm, extrude slight radian by bank；
(4) continue to release the gold thread of 10～15 μm along Z-direction；
(5) stop unwrapping wire, move 5～10 μm along chip toward orientation substrate, make porcelain mouth just turn again to weld pad
Top；
(6) utilize porcelain mouth to be pressed downward against 10～15 μm, make final gold thread loop height reach ＜ 60 μm.With
Time, during pressure down, burst is combined by pressure, and the gold thread intensity of burst is significantly greatly increased,
Thus reach the purpose of the present invention: both loop height was controlled below 60 μm, also do not had fracture existing
As.
Beneficial effect:
The gold thread routing method of fingerprint product encapsulating structure of the present invention has the most excellent compared to prior art
Point: using multisection type unwrapping wire, each unwrapping wire stage accurately controls, front 4 stages release appropriate line it
After, carry out height and strength control again by rear 2 stages, can effectively reach ultralow camber, less than 60
μm, and do not have fracture and damage, effectively obtain more preferable fingerprint signal.
Accompanying drawing explanation
Fig. 1 is the structural representation of fingerprint product encapsulating structure of the present invention；
Fig. 2 is the schematic flow sheet of the gold thread routing method of fingerprint product encapsulating structure of the present invention；
Fig. 3 is the gold thread microstructure schematic diagram of fingerprint product encapsulating structure of the present invention；
Wherein, 1, substrate；2, chip；3, adhesive tape；4, gold thread；5, insulating resin.
Detailed description of the invention
Below in conjunction with accompanying drawing and preferred embodiment, technical scheme is further described.
Embodiment:
As shown in FIG. 1 to 3: the gold thread routing side of a kind of fingerprint product encapsulating structure disclosed in the present embodiment
Method, described fingerprint product encapsulating structure includes: a substrate 1；One chip 2, is stacked in the top of described substrate 1
On face；Use adhesive tape 3 bonding between described chip 2 and substrate 1；It is filled with in the encapsulated space of encapsulating structure
Insulating resin 5, described chip 2 is electrically connected to described substrate, described gold thread 4 by gold thread 4 bonding techniques
Routing method comprise the following steps:
(1) after being welded on weld pad by soldered ball, porcelain mouth releases the gold thread of about 35～45 μm along Z-direction
Height of foundation as bank；Described Z-direction is the substrate vertically upward direction toward chip；Described porcelain mouth
For capillary；
The vertical gold thread released can reduce the damage to gold thread during unwrapping wire of the porcelain mouth to the full extent, with
Bigization keeps the toughness of gold thread, it is to avoid follow-up bank action breaks bank structure.
(2) when porcelain mouth reaches distance weld pad 35～45 μm, porcelain mouth stops Z-direction motion, past along substrate
Chip direction releases the gold thread of about 5～10 μm；
After this section of gold thread is used for ensureing that final bank is formed, bank peak is above weld pad.Reversely unwrapping wire amount
Too small, bank can present the phenomenon leaned forward, and bank inner tensions increases, and easily breaks bank；Reversely put
Line amount is excessive, and bank is the most lax, easily causes loop height unstable.
(3) stopping unwrapping wire, porcelain mouth forces down 3～5 μm to Z opposite direction, and bank extrudes slight radian；
(4) continue to release the gold thread of 10～15 μm along Z-direction；
(5) move 5～10 μm along chip toward orientation substrate, make porcelain mouth turn again to directly over weld pad；
(6) utilize porcelain mouth to be pressed downward against 10～15 μm, make final gold thread loop height reach ＜ 60 μm.With
Time, during pressure down, burst is combined by pressure, and the gold thread intensity of burst is significantly greatly increased,
Thus reach the purpose of the present invention: will loop height control below 60 μm, also not have fracture existing
As.
It is pointed out that as described above is only in order to explain the preferred embodiments of the invention, and attempt evidence
The present invention to be made any restriction in form, therefore all have made under identical practical spirit relevant
Any modification of the present invention or change, all must be included in the category that the invention is intended to protection.
Claims (1)
1. a gold thread routing method for fingerprint product encapsulating structure, described fingerprint product encapsulating structure includes: one
Substrate；One chip, is stacked on the end face of described substrate；Adhesive tape bonding is used between described chip and substrate；
Being filled with insulating resin in the encapsulated space of encapsulating structure, described chip is electrically connected with by gold thread bonding techniques
To described substrate, it is characterised in that the routing method of described gold thread comprises the following steps:
(1) after being welded on weld pad by soldered ball, porcelain mouth releases the gold thread of about 35～45 μm along Z-direction
Height of foundation as bank；Described Z-direction is the substrate vertically upward direction toward chip；Described porcelain mouth
For capillary；
(2) when porcelain mouth reaches distance weld pad 35～45 μm, porcelain mouth stops Z-direction motion, past along substrate
Chip direction releases the gold thread of about 5～10 μm；
(3) stopping unwrapping wire, porcelain mouth forces down 3～5 μm to Z opposite direction, and bank extrudes slight radian；
(4) continue to release the gold thread of 10～15 μm along Z-direction；
(5) stop unwrapping wire, move 5～10 μm along chip toward orientation substrate, make porcelain mouth just turn again to weld pad
Top；
(6) utilize porcelain mouth to be pressed downward against 10～15 μm, make final gold thread loop height reach ＜ 60 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610532576.1A CN105977174A (en) | 2016-07-07 | 2016-07-07 | Gold thread wiring method for fingerprint product packing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610532576.1A CN105977174A (en) | 2016-07-07 | 2016-07-07 | Gold thread wiring method for fingerprint product packing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105977174A true CN105977174A (en) | 2016-09-28 |
Family
ID=56953935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610532576.1A Pending CN105977174A (en) | 2016-07-07 | 2016-07-07 | Gold thread wiring method for fingerprint product packing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105977174A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107066949A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN117153700A (en) * | 2023-10-30 | 2023-12-01 | 深圳飞骧科技股份有限公司 | Packaging method and packaging structure of radio frequency front end module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005159267A (en) * | 2003-10-30 | 2005-06-16 | Shinkawa Ltd | Semiconductor and wire bonding method |
| TW200527556A (en) * | 2004-02-06 | 2005-08-16 | Siliconware Precision Industries Co Ltd | Wire bonding method and semiconductor package using the method |
| CN101193724A (en) * | 2005-01-25 | 2008-06-04 | 库利克和索夫工业公司 | Method and apparatus for forming a low profile wire loop |
| CN101552214A (en) * | 2008-04-02 | 2009-10-07 | 力成科技股份有限公司 | Multi-chip stacking method for halving routing procedure and structure thereof |
| JP2015056426A (en) * | 2013-09-10 | 2015-03-23 | 株式会社東芝 | Bonding tool, bonding device, and semiconductor device |
-
2016
- 2016-07-07 CN CN201610532576.1A patent/CN105977174A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005159267A (en) * | 2003-10-30 | 2005-06-16 | Shinkawa Ltd | Semiconductor and wire bonding method |
| TW200527556A (en) * | 2004-02-06 | 2005-08-16 | Siliconware Precision Industries Co Ltd | Wire bonding method and semiconductor package using the method |
| CN101193724A (en) * | 2005-01-25 | 2008-06-04 | 库利克和索夫工业公司 | Method and apparatus for forming a low profile wire loop |
| CN101552214A (en) * | 2008-04-02 | 2009-10-07 | 力成科技股份有限公司 | Multi-chip stacking method for halving routing procedure and structure thereof |
| JP2015056426A (en) * | 2013-09-10 | 2015-03-23 | 株式会社東芝 | Bonding tool, bonding device, and semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107066949A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN117153700A (en) * | 2023-10-30 | 2023-12-01 | 深圳飞骧科技股份有限公司 | Packaging method and packaging structure of radio frequency front end module |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160928 |