CN105950036A - Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films - Google Patents
Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films Download PDFInfo
- Publication number
- CN105950036A CN105950036A CN201610307482.4A CN201610307482A CN105950036A CN 105950036 A CN105950036 A CN 105950036A CN 201610307482 A CN201610307482 A CN 201610307482A CN 105950036 A CN105950036 A CN 105950036A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- base material
- mould release
- release membrance
- protecting film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to a processing technology, in particular to a base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films. The processing technology comprises the following steps: (1) first release films are composited on the upper surface and the lower surface of a base-material-free adhesive tape; (2) the base-material-free adhesive tape is shaped, wherein an adhesive tape die-cutting forming tool is used and punches the base-material-free adhesive tape in a certain shape, and adhesive tape waste and the first release films are removed; (3) a release film is shaped, a second release film and a first protection film are composited sequentially on the surface of the formed base-material-free adhesive tape, a release film die-cutting tool is used and punches the release film in a certain shape, the shaped release film is obtained, second release film waste and the protection film are removed, and the base-material-free adhesive tape is obtained. The base-material-free adhesive tape and the release films are processed separately, and accordingly, the phenomenon that the release films have tool marks and are easy to break is avoided.
Description
Technical field
The present invention relates to a kind of processing technique, particularly relate to the processing technique of a kind of adhesive article.
Background technology
Die cutting product is widely used in automobile making, electron trade, along with the fast development of technology, cross cutting work
Skill gradually expands to assist electronic product the production of material from traditional cross cutting to leaflet, such as
By die-cutting process preparation for electronic product bonding, insulant, dust-proof, shockproof, insulate, shield
Adhesive article and membrane-based article, shield.
Prior art carries out the processing technique of cross cutting and generally comprises following steps adhesive article: at double faced adhesive tape
Upper compound mould release membrance and protecting film；Cross cutting double faced adhesive tape；Cross cutting mould release membrance；Cross cutting protecting film, obtains gluing
Goods finished product.
But in the above-mentioned adhesive article course of processing, die-cutting machine is carried out half by double faced adhesive tape towards mould release membrance
Cut, and half cutting depth can not accomplish effectively to control in practical operation, easily occur that hemisection is excessive, cause
Mould release membrance leaves cut channel, is easily broken off, but this situation is difficult to be detected during product inspection,
Cause product not meet the market demand, affect product quality, cause sales difficulty.
Summary of the invention
For the problems referred to above, the invention provides one without the ultralight counterdie of base material adhesive tape without tool marks processing technique,
By compound first mould release membrance, in mould release membrance upper punch extrudate profile, multiple again after getting rid of the first mould release membrance
Close the second mould release membrance and protecting film, stamp out the second mould release membrance profile.
Of the present invention include without the step that is embodied as of tool marks processing technique without the ultralight counterdie of base material adhesive tape:
(1) the first mould release membrance will be combined without base material adhesive tape top and bottom；
(2) without base material adhesive tape molding, die cutting of adhesive tapes shaping jig is used to punch out the shape without base material adhesive tape,
Get rid of adhesive tape waste material and the first mould release membrance respectively；
(3) mould release membrance molding, is combined the second mould release membrance, the first guarantor in molding successively without base material adhesive tape surface
Cuticula, uses mould release membrance cross cutting instrument to punch out the shape of mould release membrance, obtains molding mould release membrance, arrange respectively
Except the second mould release membrance waste material and protecting film, obtain without base material adhesive tape.
Further, after step (3), also include step (4) protecting film molding, by obtain
Product surface without base material adhesive tape is combined the second protecting film, uses protecting film cross cutting instrument to punch out protecting film
Shape, obtains molding protecting film, removes the second protecting film waste material, obtain optimize without base material adhesive tape.
Further, after step (4), also include step (5), carry out cutting to without base material adhesive tape,
Optimized further without base material adhesive tape.
The present invention without the ultralight counterdie of base material adhesive tape without tool marks processing technique, by secondary punch, adhesive tape is not
It is cut into type in mould release membrance upper half, solves the problem that mould release membrance produces tool marks after one-step punching, it is to avoid half
Cutting knife trace brings that the degree of depth is wayward, be difficult to the functional bad problems such as interception, it is achieved that product is without tool marks
Processing, product processing technique is simple simultaneously, relative to common without tool marks processing technique, more saves
Raw material, it is ensured that product quality.
Accompanying drawing illustrates:
Fig. 1 is that the embodiment of the present invention is combined schematic diagram without base material adhesive tape and mould release membrance；
Fig. 2 is that the embodiment of the present invention is without base material adhesive tape profile shape by die-cutting schematic diagram；
Fig. 3 is that the embodiment of the present invention is without base material adhesive tape mould release membrance shape by die-cutting schematic diagram；
Fig. 4 is that the embodiment of the present invention is without base material adhesive tape protecting film shape by die-cutting schematic diagram.
Fig. 1 to Fig. 4 label declaration: 1 indicates without base material adhesive tape；2 represent the first mould release membrance；3 represent
Second mould release membrance；4 represent the first protecting film；5 represent the second protecting film；11 represent that molding is without base material glue
Band；12 expressions optimize the molding obtained without base material adhesive tape；13 represent optimize further the molding that obtains without
Base material adhesive tape.
Detailed description of the invention:
Below in conjunction with accompanying drawing embodiment, the present invention is described in further detail.
(1) as it is shown in figure 1, will be without base material adhesive tape 1 surface recombination the first mould release membrance 2；
(2) without base material adhesive tape molding, die cutting of adhesive tapes shaping jig is used to punch out the shape without base material adhesive tape,
Get rid of adhesive tape waste material and the first mould release membrance 2 respectively；
The concrete operations of this step are: will be fixed on die-cutting machine without base material adhesive tape molding cutter, according to product
Product and job requirements arrange die-cut stepping, when will complete the material feeding die-cutting machine appointment position of step (1),
The cutter of shape by die-cutting without base material adhesive tape punches out adhesive tape global shape, obtains molding without base material adhesive tape 11, punching
Cutting into rear die cutting of adhesive tapes molding cutter and rise separation, die-cutting machine continues feeding by setting procedure, without base material
Die cutting of adhesive tapes molding cutter is the most die-cut, separation, and die-cutting machine separates and the most just completes without base material adhesive tape profile
Cross cutting, until cross cutting completes, after cross cutting, resulting materials structure is as shown in Figure 2；Then get rid of without base material glue
Band waste material and the first mould release membrance 2.
(3) mould release membrance molding, molding without base material adhesive tape 11 surface be combined successively the second mould release membrance 3,
One protecting film 4, uses mould release membrance cross cutting instrument to punch out the shape of mould release membrance, obtains molding mould release membrance, point
Do not get rid of the second mould release membrance waste material and protecting film 4, obtain molding as shown in Figure 3 without base material adhesive tape 12；
The concrete operations of this step are: will complete Material cladding second mould release membrance 3 of step (2), then
Compound first protecting film 4 on mould release membrance.Check rear material and send into die-cutting machine formulation position, according to product and work
Industry demand arranges blanking process, then is punched out with mould release membrance shape by die-cutting cutter, obtain die-cut after from
Type film, mould release membrance shape by die-cutting cutter rises separation, and die-cutting machine continues feeding, mould release membrance by setting procedure
Shape by die-cutting cutter is again punched out, separates, and die-cutting machine separates the epimorph the most just completing mould release membrance
Cutting, until completing, the material structure after cross cutting is as it is shown on figure 3, get rid of the second mould release membrance waste material and first
Protecting film 4.
Preferably, following operation can be carried out after above-described embodiment step (3):
(4) protecting film molding, the second protecting film of surface recombination without base material adhesive tape 5 that will obtain, use and protect
Cuticula cross cutting instrument punches out the shape of protecting film, obtains molding protecting film, removes the second protecting film waste material,
After being optimized as shown in Figure 4 without base material adhesive tape 13；
The concrete operations of this step are: fix protecting film molding cutter on die-cutting machine, by gained without base material glue
Band product is combined the second protecting film 5, sends into die-cutting machine and specifies position, arranges punching according to product and job requirements
Cut stepping, punch out protecting film global shape, obtain molding protecting film, on protecting film shape by die-cutting cutter
Liter separates, and die-cutting machine continues feeding by setting stepping, and protecting film shape by die-cutting cutter is the most die-cut, separation,
Die-cutting machine separates and the most just completes protecting film profile cross cutting, until cross cutting completes, gets rid of protecting film waste material,
After being optimized without base material adhesive tape 13.
(5) carry out cutting to without base material adhesive tape product, obtain molding without base material adhesive tape.
Describe the know-why of the present invention above in association with specific embodiment, but this description is intended merely to explain
The principle of the present invention, and limiting the scope of the invention can not be construed to by any way.Therefore,
Those skilled in the art need not to pay performing creative labour, and can to associate other of the present invention specifically real
Execute mode, within these modes fall within protection scope of the present invention.
Claims (4)
1. one kind without the ultralight counterdie of base material adhesive tape without tool marks processing technique, it is characterised in that: by compound the
One mould release membrance, in mould release membrance upper punch extrudate profile, then is combined the second mould release membrance and protecting film, gets rid of
The second mould release membrance profile is stamped out again after first mould release membrance.
2. one as claimed in claim 1 is without the ultralight counterdie of base material adhesive tape without tool marks processing technique, and it is special
Levying and be, concrete operation step is as follows:
(1) the first mould release membrance will be combined without base material adhesive tape top and bottom；
(2) without base material adhesive tape molding, die cutting of adhesive tapes shaping jig is used to punch out the shape without base material adhesive tape,
Get rid of adhesive tape waste material and the first mould release membrance respectively；
(3) mould release membrance molding, is combined the second mould release membrance, the first guarantor in molding successively without base material adhesive tape surface
Cuticula, uses mould release membrance cross cutting instrument to punch out the shape of mould release membrance, obtains molding mould release membrance, arrange respectively
Except the second mould release membrance waste material and protecting film, after obtaining this process implementing, gained is without base material adhesive tape.
3. one as claimed in claim 2 is without the ultralight counterdie of base material adhesive tape without tool marks processing technique, and it is special
Levy and be: after step (3), also include step (4) protecting film molding, by obtain without base material
Tape surface is combined the second protecting film, uses protecting film cross cutting instrument to punch out the shape of protecting film, obtains
Molding protecting film, removes the second protecting film waste material, after being optimized without base material adhesive tape.
4. one as claimed in claim 3 is without the ultralight counterdie of base material adhesive tape without tool marks processing technique, and it is special
Levy and be: after step (4), also include step (5), carry out cutting to without base material adhesive tape, obtain
Optimize further without base material adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610307482.4A CN105950036A (en) | 2016-05-11 | 2016-05-11 | Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610307482.4A CN105950036A (en) | 2016-05-11 | 2016-05-11 | Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105950036A true CN105950036A (en) | 2016-09-21 |
Family
ID=56911207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610307482.4A Pending CN105950036A (en) | 2016-05-11 | 2016-05-11 | Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films |
Country Status (1)
| Country | Link |
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| CN (1) | CN105950036A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106480236A (en) * | 2016-11-26 | 2017-03-08 | 胡挺 | A kind of compound skin material cutting die for die-cutting and the method for punching skin material |
| CN106675428A (en) * | 2016-11-21 | 2017-05-17 | 东莞市澳中电子材料有限公司 | Pressure-sensitive adhesive sheet capable of regularly coiling during heating and expanding and production method thereof |
| CN106893506A (en) * | 2017-03-23 | 2017-06-27 | 昆山威斯泰电子技术有限公司 | It is anti-to pull conducting resinl manufacture method |
| CN107351514A (en) * | 2017-07-14 | 2017-11-17 | 苏州天立达胶粘制品有限公司 | A kind of gluing product is without offset printing processing method |
| CN108247740A (en) * | 2018-01-21 | 2018-07-06 | 成都冠佳科技有限公司 | Without tool marks foam rubber die-cutting production method |
| CN108326949A (en) * | 2018-01-20 | 2018-07-27 | 东莞六淳智能科技有限公司 | A kind of no knife print processing film technique |
| CN109385220A (en) * | 2018-10-31 | 2019-02-26 | 苏州萍升源电子科技有限公司 | A kind of production method of no substrate double-sided adhesive |
| CN111376346A (en) * | 2018-12-27 | 2020-07-07 | 昊佰电子科技（上海）有限公司 | Knife-free die cutting method and device for double-sided adhesive tape |
| CN111909632A (en) * | 2020-06-29 | 2020-11-10 | 苏州滕艺科技有限公司 | Manufacturing method of anti-bubble base-material-free adhesive sticker |
| CN112405700A (en) * | 2020-10-26 | 2021-02-26 | 东莞六淳智能科技股份有限公司 | Colloid die cutting anti-reverse type processing technology |
| CN112743867A (en) * | 2020-12-30 | 2021-05-04 | 中融飞腾（北京）科技有限公司 | Production system and process for gum product of satellite type circular knife die-cutting machine |
| CN112776086A (en) * | 2021-01-30 | 2021-05-11 | 昊佰电子科技（上海）有限公司 | Narrow strip die cutting piece capable of preventing poor stripping and manufacturing method thereof |
| CN114536469A (en) * | 2022-03-17 | 2022-05-27 | 达翔技术（恩施）有限公司 | Flat knife die cutting process without knife mark |
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| CN105172318A (en) * | 2015-10-23 | 2015-12-23 | 苏州达翔新材料有限公司 | Die cutting process for adhesive products |
| CN105273647A (en) * | 2014-11-14 | 2016-01-27 | 苏州达翔新材料有限公司 | Processing method for an adhesive product |
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| CN105273647A (en) * | 2014-11-14 | 2016-01-27 | 苏州达翔新材料有限公司 | Processing method for an adhesive product |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106675428A (en) * | 2016-11-21 | 2017-05-17 | 东莞市澳中电子材料有限公司 | Pressure-sensitive adhesive sheet capable of regularly coiling during heating and expanding and production method thereof |
| CN106675428B (en) * | 2016-11-21 | 2020-04-03 | 东莞市澳中电子材料有限公司 | Pressure-sensitive adhesive sheet with regular-type curling through heating expansion and manufacturing method thereof |
| CN106480236A (en) * | 2016-11-26 | 2017-03-08 | 胡挺 | A kind of compound skin material cutting die for die-cutting and the method for punching skin material |
| CN106893506A (en) * | 2017-03-23 | 2017-06-27 | 昆山威斯泰电子技术有限公司 | It is anti-to pull conducting resinl manufacture method |
| CN107351514A (en) * | 2017-07-14 | 2017-11-17 | 苏州天立达胶粘制品有限公司 | A kind of gluing product is without offset printing processing method |
| CN108326949B (en) * | 2018-01-20 | 2020-09-01 | 东莞六淳智能科技有限公司 | Non-knife-mark film processing technology |
| CN108326949A (en) * | 2018-01-20 | 2018-07-27 | 东莞六淳智能科技有限公司 | A kind of no knife print processing film technique |
| CN108247740A (en) * | 2018-01-21 | 2018-07-06 | 成都冠佳科技有限公司 | Without tool marks foam rubber die-cutting production method |
| CN109385220A (en) * | 2018-10-31 | 2019-02-26 | 苏州萍升源电子科技有限公司 | A kind of production method of no substrate double-sided adhesive |
| CN111376346A (en) * | 2018-12-27 | 2020-07-07 | 昊佰电子科技（上海）有限公司 | Knife-free die cutting method and device for double-sided adhesive tape |
| CN111376346B (en) * | 2018-12-27 | 2023-10-27 | 昊佰电子科技（上海）有限公司 | Knife-free stamping and cutting method and device for double faced adhesive tape |
| CN111909632A (en) * | 2020-06-29 | 2020-11-10 | 苏州滕艺科技有限公司 | Manufacturing method of anti-bubble base-material-free adhesive sticker |
| CN112405700A (en) * | 2020-10-26 | 2021-02-26 | 东莞六淳智能科技股份有限公司 | Colloid die cutting anti-reverse type processing technology |
| CN112405700B (en) * | 2020-10-26 | 2022-05-17 | 东莞六淳智能科技股份有限公司 | Colloid die cutting anti-reverse type processing technology |
| CN112743867A (en) * | 2020-12-30 | 2021-05-04 | 中融飞腾（北京）科技有限公司 | Production system and process for gum product of satellite type circular knife die-cutting machine |
| CN112776086A (en) * | 2021-01-30 | 2021-05-11 | 昊佰电子科技（上海）有限公司 | Narrow strip die cutting piece capable of preventing poor stripping and manufacturing method thereof |
| CN112776086B (en) * | 2021-01-30 | 2023-02-17 | 昊佰电子科技（上海）有限公司 | Narrow strip die cutting piece capable of preventing poor stripping and manufacturing method thereof |
| CN114536469A (en) * | 2022-03-17 | 2022-05-27 | 达翔技术（恩施）有限公司 | Flat knife die cutting process without knife mark |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160921 |
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| RJ01 | Rejection of invention patent application after publication |