CN112405700B - Colloid die cutting anti-reverse type processing technology - Google Patents
Colloid die cutting anti-reverse type processing technology Download PDFInfo
- Publication number
- CN112405700B CN112405700B CN202011153764.6A CN202011153764A CN112405700B CN 112405700 B CN112405700 B CN 112405700B CN 202011153764 A CN202011153764 A CN 202011153764A CN 112405700 B CN112405700 B CN 112405700B
- Authority
- CN
- China
- Prior art keywords
- film
- cutting
- punching
- colloid
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Making Paper Articles (AREA)
Abstract
The invention provides a colloid die-cutting anti-reverse-release processing technology, which is characterized in that a material is divided into two punching types, part of the appearance of a product is punched in the one punching process, at least one side edge of the product is kept without punching, a release paper with a cutter mark is replaced after punching is finished, then the secondary punching is carried out, and all the rest shapes of the product are punched.
Description
Technical Field
The invention relates to the technical field of die cutting processes, in particular to a colloid die cutting anti-reverse type processing process.
Background
In the cross cutting processing of sticky tape, the processing of once only cutting is adopted to partial slender product, produce anti-type after the cross cutting easily, also take out the product at the waste discharge in-process, and directly adopt many times to dash the type, all carry out once discharging after dashing the type each time, though can prevent to produce anti-type like this, but every through cross cutting in proper order, all can produce the tool mark on the basement membrane, when follow-up cross cutting is carried out once more, the product produces the excessive phenomenon of gluing easily, cause the influence to the machining precision of product, consequently, still need improve.
Disclosure of Invention
The invention aims to provide a colloid die cutting anti-reverse type processing technology to solve the problems mentioned in the background technology.
In order to achieve the above purpose, the invention provides the following technical scheme:
a colloid die cutting anti-reverse type processing technology comprises the following steps:
s1) preparing materials: the material is colloid, a first release film is arranged above the colloid, a second release film is arranged below the colloid, the left side and the right side of the second release film respectively extend out of the colloid, and transfer films are respectively stuck to the left side and the right side of the second release film;
s2) first punching: conveying the material to a die-cutting machine through a conveying mechanism, punching first positioning holes at two film transfer positions by using first punching needles, wherein the first positioning holes are full-broken, and simultaneously punching the colloid from one side of a first release film downwards through an upper die cutter to perform first appearance die-cutting, cutting the material into half-broken materials to a second release film, wherein at least one side edge of the product is reserved for the first appearance die-cutting, and waste is discharged after the first punching is completed;
s3) replacing the carrier film: tearing off the first release film and attaching a bearing film, wherein the bearing film is adhered to the left side edge and the right side edge of the transfer film through a fixing film;
s4) replacing the third release film: tearing off the second release film and attaching a third release film below the colloid and the transfer film;
s5) second punching: the colloid is subjected to secondary outline die cutting by a lower die cutter from one side of the third release film to the upper part, the uncut part of the product is completely cut out during the primary outline die cutting by the secondary outline die cutting, the material is cut into half parts by the secondary outline die cutting and is discharged after the secondary punching is finished;
s6) edge cutting: cutting the left side and the right side of the material and cutting the transfer film;
s7) replacing the bottom film: and tearing off the third release film and attaching the bottom film below the colloid.
Further describing the present invention, between the step S5) and the step S6), the method further includes the step S5.1) of attaching a carrier film: sticking a bottom film above the bearing film; in the step S6), a second positioning hole is punched from the lower part of the carrier film through a second punching needle while cutting the edge, and the second positioning hole is punched to the bottom supporting film; between the step S6) and the step S7), the method further comprises the step S6.1) of tearing the base film: tearing off the bottom supporting film and taking out the waste materials cut into the edges in the step S6) and the waste materials punched into the second positioning holes.
For further description of the present invention, after the step S7), the method further includes a step S8) of breaking: the material is cut to a specified length.
The beneficial effects of the invention are as follows:
the invention carries out punching and molding on the product by two times, the reserved part position is not punched out after the first punching and molding, so the product can not be taken out by reverse release in the waste discharge process after the first punching and molding, the first punching and molding is from top to bottom, a knife mark can be left on the second release film after punching, in order to prevent the product from generating glue overflow phenomenon in the second punching and molding process, the second release film is replaced, before replacing the second release film, the first release film needs to be replaced, the first release film is replaced by the carrier film and is adhered with the transfer film through the fixed film, then the second release film is torn off and the third release film is replaced, after the replacement is finished, the material is punched and molded for the second time, the product is punched and molded for the second time, and the edge cutting is carried out, the process ensures that the product can not release in the two punching and waste discharge processes, and the product can be adhered on the carrier film, in the two punching processes, the product is formed on the surface without the cutter mark, and the defect of glue overflow is avoided.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a diagram of the product after the first punching of the present invention;
fig. 3 is a diagram of the finished product of the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
as shown, S1) stock preparation: the material is colloid 1, a first release film 2 is arranged above the colloid 1, a second release film 3 is arranged below the colloid 1, the left side and the right side of the second release film 3 respectively extend out of the colloid 1, and transfer films 4 are respectively stuck to the left side and the right side of the second release film 3;
s2) first punching: conveying a material to a die-cutting machine through a conveying mechanism, punching first positioning holes at the positions of two transfer films 4 by using a first punching needle 10, wherein the first positioning holes are full-broken, simultaneously punching the first appearance die-cutting of a colloid 1 from one side of a first release film 2 downwards through an upper die cutter 20, cutting the material into half-broken materials to a second release film 3, at least one side edge of the product is reserved by the first appearance die-cutting, waste is discharged after the first punching is finished, the first positioning holes are punched on the transfer films 4, positioning is provided for the second punching, the embodiment provides a slender L-shaped product, a plurality of rows and a plurality of columns of L-shaped products need to be punched on the colloid 1, the L-shaped product comprises a vertical edge and a transverse straight edge, and when the first punching is performed, the transverse straight edge is punched, and the waste materials are torn off after punching;
s3) replacing the carrier film 5: tearing off the first release film 2 and attaching a bearing film 5, wherein the bearing film 5 is adhered to the left and right edges of the transfer film 4 through a fixing film 6; ensuring that the position of the first positioning hole does not deviate;
s4) replacing the third release film 7: tearing off the second release film 3 and attaching a third release film 7 below the colloid 1 and the transfer film 4; the second release film 3 generates a knife mark due to the first outline die cutting, a new third release film 7 is replaced, and the subsequent die cutting process is placed to generate a glue overflow phenomenon;
s5) second punching: the colloid 1 is subjected to secondary outline die cutting from the lower part through the lower die cutter 30, the secondary outline die cutting completely cuts out the part which is not cut out during the primary outline die cutting, the secondary outline die cutting cuts the material into half parts to be cut on the bearing film 5, and waste discharge is carried out after the secondary punching is finished; the second punching is used for punching the vertical edge of the product, punching is carried out from bottom to top, and waste is discharged after punching is finished;
s5.1) sticking a base film 8: a bottom supporting film 8 is attached above the bearing film 5;
s6) edge cutting: cutting the left side and the right side of the material by a cutter 50 and cutting out the transfer film 4, punching a second positioning hole on the bearing film 5 from the lower part by a second punching needle 40 during cutting, punching the bearing film 5 to the bottom supporting film 8 during cutting and punching the second positioning hole, wherein according to the processing requirement, a second positioning hole needs to be processed on the bearing film 5 in the embodiment, and the second positioning hole and the two edge materials are simultaneously processed during cutting;
s6.1) tearing off the base film 8: tearing off the carrier film 8 and taking out the waste materials cut into edges in the step 6) and the waste materials punched with the second positioning holes;
s7) replacing the bottom film 9: and tearing off the third release film 7 and attaching the bottom film 9 below the colloid 1.
S8) breaking: the material is cut to a specified length and the final product in this design is a sheet, so the material is cut into multiple pieces and packaged.
The above description does not limit the technical scope of the present invention, and any modifications, equivalent variations and modifications of the above embodiments according to the technical spirit of the present invention still fall within the technical scope of the present invention.
Claims (3)
1. A colloid die cutting anti-reverse type processing technology is characterized in that: the method comprises the following steps:
s1) preparing materials: the material is colloid, a first release film is arranged above the colloid, a second release film is arranged below the colloid, the left side and the right side of the second release film respectively extend out of the colloid, and transfer films are respectively stuck to the left side and the right side of the second release film;
s2) first punching: conveying the material to a die-cutting machine through a conveying mechanism, punching first positioning holes at two film transfer positions by using first punching needles, wherein the first positioning holes are full-broken, and simultaneously punching the colloid from one side of a first release film downwards through an upper die cutter to perform first appearance die-cutting, cutting the material into half-broken materials to a second release film, wherein at least one side edge of the product is reserved for the first appearance die-cutting, and waste is discharged after the first punching is completed; s3) replacing the carrier film: tearing off the first release film and attaching a bearing film, wherein the bearing film is adhered to the left side edge and the right side edge of the transfer film through a fixing film;
s4) replacing the third release film: tearing off the second release film and attaching a third release film below the colloid and the transfer film;
s5) second punching: the colloid is subjected to secondary appearance die cutting from one side of the third release film to the upper part by a lower die cutter, the part which is not cut out in the primary appearance die cutting is completely cut out by the secondary appearance die cutting, the material is cut into half parts by the secondary appearance die cutting and is arranged on the bearing film, and waste is discharged after the secondary punching is finished;
s6) edge cutting: cutting the left side and the right side of the material and cutting the transfer film;
s7) replacing the bottom film: and tearing off the third release film and attaching the bottom film below the colloid.
2. The colloid die-cutting anti-reverse type processing technology according to claim 1, characterized in that: between the step S5 and the step S6, the method further includes a step S5.1 of attaching a carrier film: sticking a bottom film above the bearing film; in step S6, while cutting the edge, punching a second positioning hole in the carrier film from below by a second punching pin, and punching the second positioning hole to the bottom supporting film; between step S6 and step S7, step S6.1 of tearing the bottom film is further included: and (5) tearing the bottom supporting film, and taking out the waste materials of the edges cut in the step (S6) and the waste materials of the second positioning holes.
3. The colloid die-cutting anti-reverse type processing technology according to claim 1, characterized in that: after the step S7, the method further includes a step S8 of breaking: the material is cut to a specified length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011153764.6A CN112405700B (en) | 2020-10-26 | 2020-10-26 | Colloid die cutting anti-reverse type processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011153764.6A CN112405700B (en) | 2020-10-26 | 2020-10-26 | Colloid die cutting anti-reverse type processing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112405700A CN112405700A (en) | 2021-02-26 |
| CN112405700B true CN112405700B (en) | 2022-05-17 |
Family
ID=74841475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011153764.6A Active CN112405700B (en) | 2020-10-26 | 2020-10-26 | Colloid die cutting anti-reverse type processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112405700B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19521022A1 (en) * | 1995-06-13 | 1996-12-19 | Heraeus Gmbh W C | Process for producing a layered composite |
| CN105950036A (en) * | 2016-05-11 | 2016-09-21 | 苏州安洁科技股份有限公司 | Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films |
| CN109531694A (en) * | 2017-09-22 | 2019-03-29 | 昊佰电子科技（上海）有限公司 | A kind of Kapton product without knife stamp blanking method and die-cutting apparatus |
| CN209364810U (en) * | 2018-12-27 | 2019-09-10 | 昊佰电子科技（上海）有限公司 | It is a kind of for double-sided adhesive without knife stamp cutting apparatus |
| CN210062313U (en) * | 2019-06-04 | 2020-02-14 | 广东顶峰精密技术有限公司 | Novel multifunctional laminating machine |
| CN111070322A (en) * | 2019-12-20 | 2020-04-28 | 无锡积捷光电材料有限公司 | Die-cutting non-knife-mark processing technology of adhesive product |
-
2020
- 2020-10-26 CN CN202011153764.6A patent/CN112405700B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19521022A1 (en) * | 1995-06-13 | 1996-12-19 | Heraeus Gmbh W C | Process for producing a layered composite |
| CN105950036A (en) * | 2016-05-11 | 2016-09-21 | 苏州安洁科技股份有限公司 | Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films |
| CN109531694A (en) * | 2017-09-22 | 2019-03-29 | 昊佰电子科技（上海）有限公司 | A kind of Kapton product without knife stamp blanking method and die-cutting apparatus |
| CN209364810U (en) * | 2018-12-27 | 2019-09-10 | 昊佰电子科技（上海）有限公司 | It is a kind of for double-sided adhesive without knife stamp cutting apparatus |
| CN210062313U (en) * | 2019-06-04 | 2020-02-14 | 广东顶峰精密技术有限公司 | Novel multifunctional laminating machine |
| CN111070322A (en) * | 2019-12-20 | 2020-04-28 | 无锡积捷光电材料有限公司 | Die-cutting non-knife-mark processing technology of adhesive product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112405700A (en) | 2021-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111070322B (en) | Die-cutting non-knife-mark processing technology of adhesive product | |
| CN105950036A (en) | Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films | |
| CN113561263B (en) | Method for manufacturing non-knife impression cutting piece | |
| CN112405700B (en) | Colloid die cutting anti-reverse type processing technology | |
| CN112077936A (en) | Asynchronous die cutting method for strip-shaped product and product | |
| CN108858446A (en) | Die cutting method of irregular die-cut piece | |
| CN110385907A (en) | It is a kind of for solving anti-release die cutting product and its production technology | |
| CN112776086B (en) | Narrow strip die cutting piece capable of preventing poor stripping and manufacturing method thereof | |
| CN110355821A (en) | It is a kind of for correct automation arrangement product to patch knife print technique | |
| CN111086062B (en) | Circular cutter machine cutting die with alignment marks and method for manufacturing qualified products by using circular cutter machine cutting die | |
| US3630122A (en) | Method and means for producing blanks | |
| CN104441057B (en) | Support plate production device with automatic waste discharge function | |
| CN211993323U (en) | Circular knife machine cutting die with alignment mark | |
| CN212385618U (en) | Die-cutting rule die assembly for processing non-universal step-pitch coil stock product | |
| CN111136726B (en) | Concentric die cutting processing technology | |
| CN111605287A (en) | Logo mark material production device and production process thereof | |
| CN206501179U (en) | It is a kind of to be die cut the tool that slitting is molded simultaneously | |
| CN105578713B (en) | A kind of production method of reinforcing chip support plate with holes | |
| CN111098357B (en) | Processing technology of Mylar with handle | |
| CN212948208U (en) | Die cutting tool assembly for processing double faced adhesive tape product with holes | |
| CN113183236B (en) | Die cutting method for foam material belt product | |
| CN204996856U (en) | Checking machine of punching press seal of a government organization in old china depth constructs | |
| CN112743632A (en) | Jig with movable positioning pins | |
| CN214290303U (en) | Apron blanking mould | |
| CN112848610B (en) | Integrated manufacturing method of conductive shielding product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230925 Address after: 315000 No. 1, building 1, No. 539, longjiaoshan Road, Daqi street, Beilun District, Ningbo City, Zhejiang Province Patentee after: Ningbo Liuchun Intelligent Technology Co.,Ltd. Address before: No.62 Fumin South Road, Qiufu Road community, Dalang Town, Dongguan City, Guangdong Province Patentee before: Dongguan Liuchun Intelligent Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |