CN112848610B - Integrated manufacturing method of conductive shielding product - Google Patents
Integrated manufacturing method of conductive shielding product Download PDFInfo
- Publication number
- CN112848610B CN112848610B CN202011636725.1A CN202011636725A CN112848610B CN 112848610 B CN112848610 B CN 112848610B CN 202011636725 A CN202011636725 A CN 202011636725A CN 112848610 B CN112848610 B CN 112848610B
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- CN
- China
- Prior art keywords
- film
- product
- cutting
- protective film
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 230000001681 protective effect Effects 0.000 claims abstract description 54
- 239000004744 fabric Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000002699 waste material Substances 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 18
- 238000005259 measurement Methods 0.000 abstract description 2
- 210000002469 basement membrane Anatomy 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/045—Slitting
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a manufacturing method of an integrated conductive shielding product, which comprises the following steps: die-cutting a fifth protective film on the upper layer of the second bottom film; laminating PET on a fifth protective film for die cutting; semi-cutting small holes of the conductive cloth on a first protective film of the conductive cloth, taking away small hole waste materials through the first protective film, and transferring the conductive cloth with holes to PET; cutting the whole appearance of the product, and removing waste materials of the outer frame; attaching a shielding film for packaging the product to the product with the cut overall appearance, attaching the shielding film to the adhesive PET except the product, die-cutting the appearance of the shielding film, and setting the distance between the appearance of the shielding film and the outer frame of the product; meanwhile, the second bottom film is avoided during die cutting; and (5) vertically slicing and cutting the product to obtain a final sliced finished product. The invention can save the basement membrane material; the whole-process mold alignment marks without film drawing are all on the film, so that the alignment is accurate, the precision is greatly improved, and the recognition in the process is convenient; the whole product without film drawing is smooth, and the product cannot influence the size measurement and the size fluctuation due to the unevenness.
Description
Technical Field
The invention belongs to the technical field of die cutting processing, and particularly relates to a manufacturing method of an integrated guide shielding product.
Background
The conductive shielding product (the product with holes and the PET bonding product) is manufactured by die cutting through a circular cutter machine. Referring to fig. 1 to 4, the existing process flow is: step one, feeding conductive cloth 1 with a first protective film 2 from a material roller Q1, semi-cutting small holes of the conductive cloth on the first protective film 2 by a cutting die D1 at a station G2, discharging small hole waste from the material roller Q2 through the first protective film 2, and enabling the conductive cloth 1 with holes to enter a station G3; step two, placing PET3 on a material roller Q5, half-cutting the PET3 on a second protective film 4 put down by the material roller Q6 at a station G4 through a cutting die D2, transferring the PET onto the conductive cloth 1 with holes by using the second protective film 4, collecting PET waste through the material roller Q4, and collecting the second protective film 4 through a material roller Q7; step three, while drawing the second protective film 4, putting down a first bottom film (comprising a release film 5 and a third protective film 6) by a material roller Q8, cutting the release film 5 at a station G5 through a cutting die D3, and transferring the first bottom film to the PET3 at the station G5; and fourthly, cutting the whole appearance of the product through a cutting die D4 at a station G8, collecting waste materials through a material roller Q12, and collecting the product through a material roller Q10.
The problems of the above process are: drawing the second protective film 4, and simultaneously die-cutting the first base film to transfer and paste the first base film onto the PET3, wherein bubbles and material ripples can be generated in the action of drawing the second protective film 4; after the second protective film 4 is drawn out, the cutting die mark disappears, which affects the die cutting in the last step.
Disclosure of Invention
Aiming at the problems pointed out in the background technology, the invention provides a manufacturing method of an integrated conductive shielding product, which can improve the product quality and reduce the manufacturing cost.
The technical scheme adopted by the invention is as follows:
a manufacturing method of an integrated conductive shielding product comprises the following steps:
step one, die cutting a fifth protective film on the upper layer of a second bottom film, wherein the lower layer of the second bottom film is a fourth protective film;
attaching PET on the fifth protective film for die cutting;
semi-cutting small holes of the conductive cloth on a first protective film with the conductive cloth, taking away small hole waste materials through the first protective film, and transferring the conductive cloth with the holes to PET;
cutting the whole appearance of the product, and removing waste materials of the outer frame;
step five, pasting a shielding film for packaging products on the basis of the step four, pasting the shielding film with adhesive PET except the products, die-cutting the appearance of the shielding film, and setting the distance between the appearance of the shielding film and the outer frame of the products; meanwhile, the second bottom film is avoided during die cutting; and (5) vertically slicing and cutting the product to obtain a final sliced finished product.
Further, if the product is a multimode product, in the first step, a separation line in the middle of the multimode product is not cut off; in the fifth step, the whole of the multi-mode products is cut off, and the multi-mode products are trimmed up and down.
Further, in the fifth step, the cut masking film is carried away by the PE film with tackiness.
Further, the shielding film was transparent PET with a thickness of 0.01 mm.
Further, in the fifth step, the set distance is 0.5mm.
Further, the thickness of the conductive cloth is 0.06mm, the thickness of the first protective film is 0.05mm, the thickness of the PET is 0.05mm, the thickness of the fourth protective film is 0.05mm, and the thickness of the fifth protective film is 0.075mm.
Further, the conductive cloth is copper foil.
The invention has the beneficial effects that:
in the invention, the protective film is used as the bottom film of the product without drawing the first low-viscosity protective film (the second bottom film), and compared with the prior art, the bottom film material can be saved (the bottom film release film is directly not used); secondly, the whole mould alignment marks without film drawing are all on the film, so that the accurate alignment can be realized, the precision is greatly improved, and the identification of a manufacturer in the process is facilitated; thirdly, the whole product without film drawing is smooth, and the product cannot influence size measurement and size fluctuation due to unevenness.
Drawings
FIG. 1 is a flow chart of a prior art process;
fig. 2 is a schematic structural diagram of cutting dies D1 and D2 in the prior art;
fig. 3 is a schematic structural diagram of cutting dies D3 and D4 in the prior art;
FIG. 4 is a die-cut view of dies D1 to D4 according to the prior art;
FIG. 5 is a process flow diagram of the present invention;
FIG. 6 is a schematic structural diagram of the cutting dies D1', D2' and D3' in the process of the invention;
FIG. 7 is a schematic structural diagram of the cutting dies D4 'and D5' in the process of the present invention;
FIG. 8 is a die-cut view of dies D1 'to D5' in the process of the present invention;
reference numerals: 1-conductive cloth, 2-first protective film, 3-PET, 4-second protective film, 5-release film, 6-third protective film, 7-fourth protective film, 8-fifth protective film, 9-shielding film and 10-PE film.
Detailed Description
The method for manufacturing the integrated conductive shielding product of the present invention is further described in detail below with reference to the accompanying drawings and specific examples.
As shown in fig. 5 to 8, a method for manufacturing an integrated conductive shielding product includes the following steps:
step one, die cutting a fifth protective film 8 on the upper layer of a second bottom film, wherein the lower layer of the second bottom film is a fourth protective film 7.
And secondly, attaching the PET3 on the fifth protective film 8 for die cutting.
And thirdly, semi-cutting small holes of the conductive cloth on the first protective film 2 of the conductive cloth 1, taking away small hole waste materials through the first protective film 2, and transferring the conductive cloth 1 with holes to the PET 3.
And fourthly, cutting the whole appearance of the product, and removing waste materials of the outer frame.
And fifthly, attaching a shielding film 9 for packaging products on the basis of the fourth step, attaching the shielding film 9 to the adhesive PET except for the products, die-cutting the appearance of the shielding film 9, and setting the distance between the appearance of the shielding film 9 and the outer frame of the products. Meanwhile, the second bottom film is avoided during die cutting. And (5) vertically slicing and cutting the product to obtain a final sliced finished product.
If the product is a multi-mode product, in the first step, the separation line in the middle of the multi-mode product is not cut off. In the fifth step, the whole of the multi-mode products is cut off, and the multi-mode products are trimmed up and down.
In step five, the cut masking film 9 is carried away by the adhesive PE film 10. The set distance is 0.5mm.
In this embodiment, the shielding film 9 is transparent PET with a thickness of 0.01 mm.
The thickness of the conductive cloth 1 is 0.06mm, the thickness of the first protective film 2 is 0.05mm, the thickness of the PET3 is 0.05mm, the thickness of the fourth protective film 7 is 0.05mm, and the thickness of the fifth protective film 8 is 0.075mm. The conductive cloth 1 is copper foil.
The present invention will be described below with reference to the production of a two-die product.
Referring to fig. 5, a second base film (including a fourth protective film 7 of a lower layer and a fifth protective film 8 of an upper layer, which are low-viscosity protective films) is fed through a feed roll Q1, and the fifth protective film 8 is die-cut through a die D1' at a station G2, but without cutting a parting line between the two die products.
The material roller Q4 puts down PET3, and PET3 is attached to the second base film at a station G3 and die-cut through a cutting die D2', and PET waste is recovered through the material roller Q5.
The conductive cloth 1 with the first protective film 2 is put down from the material roller Q7, small holes of the conductive cloth are semi-cut by the first protective film 2 with the conductive cloth 1 at the station G4 through the cutting die D3', small hole waste is taken away by the first protective film 2 and discharged through the material roller Q6, and the conductive cloth 1 with holes is transferred to the PET 3.
At the station G6, the whole appearance of the product is cut by a cutting die D4', and the waste materials of the outer frame are recovered by a material roller Q8.
The transparent PET (i.e. masking film 9) of 0.01mm thickness for packaging the product is attached to the product with the whole shape cut, the masking film 9 is attached to the adhesive PET except the product, and the masking film 9 is put down from a material roll Q9. The appearance of transparent PET with the thickness of 0.01mm (0.5 mm compared with the outer frame of the product) is die-cut by a cutter die D5' at a station G10, and meanwhile, the second bottom film is avoided during die-cutting (the second bottom film can be torn off normally). The cutting die D5' is added with an integral cutting line in the middle of the two dies and trimming up and down, each cutting vertical line is added, and the finished product is directly discharged after the product comes out.
The cut masking film 9 is carried away by the PE film 10 with the adhesive, the PE film 10 is dropped from the stock roll Q10, and the cut masking film 9 is taken up to the stock roll Q11.
In the invention, the low-viscosity protective film is used as the bottom film, and the exposed glue part of the product is attached by transparent PET with the thickness of 0.01mm, so that the manual packaging is not affected.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any alternatives or modifications, which are easily conceivable by those skilled in the art within the scope of the present invention, should be included in the scope of the present invention.
Claims (5)
1. The manufacturing method of the integrated conductive shielding product is characterized by comprising the following steps of:
step one, die cutting a fifth protective film (8) on the upper layer of a second bottom film, wherein the lower layer of the second bottom film is a fourth protective film (7);
step two, attaching the PET (3) on a fifth protective film (8) for die cutting;
semi-cutting small holes of the conductive cloth on a first protective film (2) of the conductive cloth (1), taking away small hole wastes through the first protective film (2), and transferring the conductive cloth (1) with holes to PET (3);
cutting the whole appearance of the product, and removing waste materials of the outer frame;
step five, sticking a shielding film (9) for packaging products on the basis of the step four, sticking the shielding film (9) to the adhesive PET except the products, and die-cutting the appearance of the shielding film (9); meanwhile, the second bottom film is avoided during die cutting; cutting the product vertically into slices to obtain a final slice finished product;
in step five, the cut shielding film (9) is taken away by the PE film (10) with the adhesive.
2. The method of claim 1, wherein in the first step, the parting line is not cut off in the middle of the multimode product; in the fifth step, the whole of the multi-mode products is cut off, and the multi-mode products are trimmed up and down.
3. The method of manufacturing an integrated conductive shielding product according to claim 1, characterized in that the shielding film (9) is transparent PET with a thickness of 0.01 mm.
4. The method for manufacturing the integrated conductive shielding product according to claim 1, wherein the thickness of the conductive cloth (1) is 0.06mm, the thickness of the first protective film (2) is 0.05mm, the thickness of the pet (3) is 0.05mm, the thickness of the fourth protective film (7) is 0.05mm, and the thickness of the fifth protective film (8) is 0.075mm.
5. The method for manufacturing an integrated conductive shielding product according to claim 1 or 4, wherein the conductive cloth (1) is copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011636725.1A CN112848610B (en) | 2020-12-31 | 2020-12-31 | Integrated manufacturing method of conductive shielding product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011636725.1A CN112848610B (en) | 2020-12-31 | 2020-12-31 | Integrated manufacturing method of conductive shielding product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112848610A CN112848610A (en) | 2021-05-28 |
| CN112848610B true CN112848610B (en) | 2024-03-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011636725.1A Active CN112848610B (en) | 2020-12-31 | 2020-12-31 | Integrated manufacturing method of conductive shielding product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112848610B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203831890U (en) * | 2014-05-23 | 2014-09-17 | 昆山锦悦电子有限公司 | Adhesive application film |
| CN109572144A (en) * | 2018-12-12 | 2019-04-05 | 深圳市飞荣达科技股份有限公司 | Aperture covers the asynchronous die cutting method in position and aperture covers the asynchronous die cutting qualified ratio in position |
| CN110077889A (en) * | 2019-04-23 | 2019-08-02 | 深圳市池纳光电有限公司 | It is a kind of to be die cut except useless technique |
-
2020
- 2020-12-31 CN CN202011636725.1A patent/CN112848610B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203831890U (en) * | 2014-05-23 | 2014-09-17 | 昆山锦悦电子有限公司 | Adhesive application film |
| CN109572144A (en) * | 2018-12-12 | 2019-04-05 | 深圳市飞荣达科技股份有限公司 | Aperture covers the asynchronous die cutting method in position and aperture covers the asynchronous die cutting qualified ratio in position |
| CN110077889A (en) * | 2019-04-23 | 2019-08-02 | 深圳市池纳光电有限公司 | It is a kind of to be die cut except useless technique |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112848610A (en) | 2021-05-28 |
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