CN209364810U - It is a kind of for double-sided adhesive without knife stamp cutting apparatus - Google Patents
It is a kind of for double-sided adhesive without knife stamp cutting apparatus Download PDFInfo
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- CN209364810U CN209364810U CN201822219419.2U CN201822219419U CN209364810U CN 209364810 U CN209364810 U CN 209364810U CN 201822219419 U CN201822219419 U CN 201822219419U CN 209364810 U CN209364810 U CN 209364810U
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Abstract
本实用新型涉及一种用于双面胶的无刀印模切装置，模切装置包括沿物料移动方向依次设置的第一模切单元、辅助离型膜替换单元、第一排废单元、硅双面胶贴合单元、第二模切单元、第二排废单元、料带贴合单元、第三模切单元及第三排废单元。与现有技术相比，本实用新型通过设置套位孔离型膜，并在套位孔离型膜两边均冲切出定位条，在定位条上冲切有套位孔，以便在后续加工过程中，通过硅双面胶使定位条始终保留在物料上，便于通过套位孔进行定位，而毋须多次冲切套位孔，提高了加工效率和加工精度。
This utility model relates to a die-cutting device for double-sided adhesive without die marks. The die-cutting device includes a first die-cutting unit, an auxiliary release film replacement unit, a first waste removal unit, a silicone double-sided adhesive bonding unit, a second die-cutting unit, a second waste removal unit, a material strip bonding unit, a third die-cutting unit, and a third waste removal unit arranged sequentially along the material movement direction. Compared with the prior art, this utility model sets up a release film with positioning holes, and punches positioning strips on both sides of the release film with positioning holes. These positioning strips have positioning holes punched on them, so that during subsequent processing, the positioning strips are always retained on the material by the silicone double-sided adhesive, facilitating positioning through the positioning holes without the need for multiple punching of the positioning holes, thus improving processing efficiency and accuracy.
Description
技术领域technical field
本实用新型属于双面胶加工技术领域，涉及一种用于双面胶的无刀印模切装置。The utility model belongs to the technical field of double-sided adhesive processing, and relates to a knife-free die-cutting device for double-sided adhesive.
背景技术Background technique
随着电子行业的不断发展，手机等电子产品越来越薄，功能越来越多，用于手机上的模切件的要求也越来越高，模切件的大小也不断变小。对于双面胶模切件，在冲切时，需要将离型膜及双面胶依次贴合在保护膜上，先在离型膜上冲切出提手，之后再冲切双面胶的轮廓，排废后将带有提手的双面胶转贴到整张料带上即可。由于在冲切双面胶时，模切刀会在双面胶下层的提手上留下刀模印，导致双面胶模切件在经过一段时间后(一般半个月左右)，就会出现剥离不良的现象，即当使用者将双面胶模切件的胶面贴合在工件上之后，当撕离双面胶上的提手时，双面胶会随着提手一起被带起而脱离工件，无法留在工件上，影响后续的使用。With the continuous development of the electronics industry, electronic products such as mobile phones are becoming thinner and more functional. The requirements for die-cut parts used in mobile phones are also getting higher and higher, and the size of die-cut parts is also getting smaller. For double-sided adhesive die-cut parts, when punching, the release film and double-sided adhesive need to be attached to the protective film in sequence, and the handle is first punched out on the release film, and then the double-sided adhesive is punched. Outline, after the waste is discharged, just transfer the double-sided tape with the handle to the entire material tape. When the double-sided adhesive is die-cut, the die-cutting knife will leave a knife impression on the handle of the lower layer of the double-sided adhesive, so after a period of time (usually about half a month) The phenomenon of poor peeling occurs, that is, after the user attaches the rubber surface of the double-sided adhesive die-cut part to the workpiece, when the handle on the double-sided adhesive is torn off, the double-sided adhesive will be taken along with the handle. Lifting and detaching from the workpiece, unable to stay on the workpiece, affecting subsequent use.
虽然有些厂家改进了双面胶模切件的加工工艺，能够在一定程度上避免双面胶模切件的提手上残留刀印，但这些改进的工艺往往存在着模切次数过多、模切刀线复杂、需要使用多个辅助料带、进行多次冲切套位孔操作等问题，且往往需要进行大板(大的套位模具)转小板(小的套位模具)操作，需要用两种不同的套位孔进行套孔定位，两次换套位孔会导致产品匹配尺寸有问题，整个工艺过于复杂，步骤多，加工效率较低。Although some manufacturers have improved the processing technology of double-sided adhesive die-cut parts, which can avoid residual knife marks on the handle of double-sided adhesive die-cut parts to a certain extent, these improved processes often have problems such as excessive die-cutting times, The cutting line is complicated, it needs to use multiple auxiliary material belts, and perform multiple punching and positioning hole operations, and often needs to convert large plates (large set molds) to small plates (small set molds). It is necessary to use two different positioning holes for the positioning of the positioning holes. Changing the positioning holes twice will cause problems in the matching size of the product. The entire process is too complicated, with many steps and low processing efficiency.
实用新型内容Utility model content
本实用新型的目的就是为了克服上述现有技术存在的缺陷而提供一种用于双面胶的无刀印模切装置。The purpose of this utility model is to provide a knife-free die-cutting device for double-sided adhesive tape in order to overcome the above-mentioned defects in the prior art.
本实用新型的目的可以通过以下技术方案来实现：The purpose of this utility model can be achieved through the following technical solutions:
一种用于双面胶的无刀印模切装置，所述的双面胶包括依次相互贴合的料带、双面胶体及提手，所述的装置包括沿物料移动方向依次设置的第一模切单元、辅助离型膜替换单元、第一排废单元、硅双面胶贴合单元、第二模切单元、第二排废单元、料带贴合单元、第三模切单元及第三排废单元。物料在每个单元中依次完成相应工序。A knife-free die-cutting device for double-sided adhesive tape. The double-sided adhesive tape includes material tapes, double-sided adhesive bodies and handles that are sequentially attached to each other. A die-cutting unit, an auxiliary release film replacement unit, a first waste discharge unit, a silicon double-sided adhesive bonding unit, a second die-cutting unit, a second waste discharge unit, a strip bonding unit, a third die-cutting unit and The third waste unit. The material completes the corresponding process sequentially in each unit.
进一步地，所述的第一模切单元包括第一上模座以及与第一上模座相适配的第一下模座，所述的第一上模座的底部设有第一模切刀。Further, the first die-cutting unit includes a first upper die base and a first lower die base matched with the first upper die base, the bottom of the first upper die base is provided with a first die-cutting Knife.
进一步地，所述的第一模切刀包括由内而外依次设置的双面胶层模切刀、定位条模切刀以及套位孔冲切刀。Further, the first die-cutting knife includes a double-sided adhesive layer die-cutting knife, a positioning strip die-cutting knife and a positioning hole punching knife arranged in sequence from the inside to the outside.
进一步地，所述的辅助离型膜替换单元包括沿物料移动方向依次设置的第一辅助离型膜收料辊以及第二辅助离型膜送料辊，所述的第一辅助离型膜收料辊以及第二辅助离型膜送料辊均位于物料的上方。Further, the auxiliary release film replacement unit includes a first auxiliary release film receiving roller and a second auxiliary release film feeding roller arranged in sequence along the moving direction of the material, and the first auxiliary release film receiving roller The roller and the second auxiliary release film feeding roller are all located above the material.
进一步地，所述的第一排废单元包括设置在物料下方的第一排废辊，所述的硅双面胶贴合单元包括设置在物料下方的复合送料辊。复合送料辊将硅双面胶、提手层及第二保护膜贴合在双面胶层上，并覆盖住定位条。Further, the first waste discharge unit includes a first waste discharge roller arranged under the material, and the silicon double-sided adhesive bonding unit includes a composite feeding roller arranged under the material. The composite feeding roller sticks the silicon double-sided adhesive, the handle layer and the second protective film on the double-sided adhesive layer, and covers the positioning strip.
进一步地，所述的第二模切单元包括第二上模座以及与第二上模座相适配的第二下模座，所述的第二上模座的底部设有第二模切刀。Further, the second die-cutting unit includes a second upper die base and a second lower die base matched with the second upper die base, the bottom of the second upper die base is provided with a second die-cutting Knife.
进一步地，所述的第二模切刀包括提手外轮廓模切刀以及第一定位针。第一定位针与套位孔配合进行定位。Further, the second die-cutting knife includes a handle outer contour die-cutting knife and a first positioning pin. The first positioning pin cooperates with the positioning hole for positioning.
进一步地，所述的第二排废单元包括设置在物料上方的第二排废辊，所述的料带贴合单元包括设置在物料上方的料带送料辊，所述的第三排废单元包括设置在物料下方的第三排废辊。Further, the second waste discharge unit includes a second waste discharge roller arranged above the material, the strip laminating unit includes a strip feed roller arranged above the material, and the third waste discharge unit Includes a third row of waste rollers positioned below the material.
进一步地，所述的第三模切单元包括第三上模座以及与第三上模座相适配的第三下模座，所述的第三上模座的底部设有第三模切刀。Further, the third die-cutting unit includes a third upper die base and a third lower die base matched with the third upper die base, the bottom of the third upper die base is provided with a third die-cutting Knife.
所述的第三模切刀包括料带模切刀以及第二定位针。第二定位针与套位孔配合进行定位。The third die cutter includes a tape die cutter and a second positioning pin. The second positioning pin cooperates with the sleeve hole for positioning.
一种用于双面胶的无刀印模切方法，该方法包括以下步骤：A method for die-cutting without knife printing for double-sided adhesive tape, the method comprises the following steps:
1)依次将套位孔离型膜、双面胶层、第一辅助离型膜贴合在第一保护膜上，之后进行一次冲切，将双面胶层沿长度方向分割为多条，并在套位孔离型膜两边均冲切出定位条，所述的定位条上冲切有套位孔；1) Lay the hole release film, the double-sided adhesive layer, and the first auxiliary release film on the first protective film in sequence, and then perform a punching to divide the double-sided adhesive layer into multiple strips along the length direction. And the positioning strips are punched out on both sides of the release film of the positioning hole, and the positioning holes are punched on the positioning strips;
2)排掉第一辅助离型膜，并将第二辅助离型膜贴合在双面胶层的一侧，之后进行一次排废，并在双面胶层的另一侧依次贴合提手层及第二保护膜，所述的定位条位于双面胶层与提手层之间，所述的定位条与提手层之间还设有硅双面胶；2) Discharge the first auxiliary release film, and stick the second auxiliary release film on one side of the double-sided adhesive layer, and then perform a waste discharge, and sequentially attach and lift the other side of the double-sided adhesive layer. The hand layer and the second protective film, the positioning strip is located between the double-sided adhesive layer and the handle layer, and silicon double-sided adhesive is also provided between the positioning strip and the handle layer;
3)进行二次冲切，在提手层上冲切出提手的外轮廓，之后进行二次排废；3) Carry out secondary punching, punch out the outer contour of the handle on the handle layer, and then carry out secondary waste discharge;
4)在双面胶层上贴合料带，之后进行三次冲切，在料带上冲切出料带的外边缘；4) Lay the material tape on the double-sided adhesive layer, then perform three punching, and punch the outer edge of the discharge tape on the material tape;
5)进行三次排废，即得到所述的双面胶。5) Perform waste discharge three times to obtain the double-sided adhesive tape.
进一步地，所述的双面胶体的长度与提手的长度相等，所述的双面胶体的宽度小于提手的宽度。模切时，一次冲切将双面胶层沿长度方向分割为多条，保证双面胶层的宽度符合要求，之后二次冲切冲切出提手的外轮廓，并保证双面胶层的长度符合要求。Further, the length of the double-sided adhesive is equal to the length of the handle, and the width of the double-sided adhesive is smaller than the width of the handle. When die-cutting, one-time punching divides the double-sided adhesive layer into multiple strips along the length direction to ensure that the width of the double-sided adhesive layer meets the requirements, and then the second punching cuts out the outer contour of the handle and ensures that the double-sided adhesive layer The length meets the requirements.
进一步地，步骤2)中，所述的一次排废过程为：排掉第一保护膜、套位孔离型膜的中间部分、双面胶层的多余部分。套位孔离型膜的两边形成两个定位条，并冲切出套位孔用于后续步骤中的定位，两个定位条中间的套位孔离型膜部分被排掉。Further, in step 2), the first waste discharge process is: discharge the first protective film, the middle part of the release film for the sleeve hole, and the redundant part of the double-sided adhesive layer. Two positioning strips are formed on both sides of the release film of the positioning hole, and the positioning hole is punched out for positioning in the subsequent steps, and the release film part of the positioning hole in the middle of the two positioning strips is drained.
进一步地，步骤2)中，每个定位条与提手层之间均设有硅双面胶，并且所述的硅双面胶与套位孔相互错位设置。硅双面胶将定位条与提手层粘贴在一起，使定位条始终保留在物料上，且露出套位孔，便于后续步骤中的套位定位，而毋须多次冲切套位孔。Further, in step 2), a silicon double-sided adhesive is provided between each positioning strip and the handle layer, and the silicon double-sided adhesive and the positioning hole are mutually misaligned. Silicone double-sided adhesive sticks the positioning strip and the handle layer together, so that the positioning strip is always kept on the material, and the positioning hole is exposed, which is convenient for positioning in the subsequent steps, without the need to punch the positioning hole multiple times.
进一步地，步骤3)中，所述的二次排废过程为：排掉第二辅助离型膜、双面胶层及提手层上的外框废料。二次排废后，双面胶体及提手加工完成，之后贴合料带，并对料带的外边缘进行冲切。Further, in step 3), the secondary waste discharge process is: discharge the outer frame waste on the second auxiliary release film, the double-sided adhesive layer and the handle layer. After the secondary waste discharge, the double-sided adhesive and the handle are processed, and then the tape is pasted and the outer edge of the tape is punched.
进一步地，步骤5)中，所述的三次排废过程为：排掉第二保护膜、提手层的两边、硅双面胶、定位条及料带的两边。三次排废将物料上多余的部分全部排掉，剩下的部分即为双面胶成品。Further, in step 5), the three waste discharge processes include: discharge the second protective film, the two sides of the handle layer, the silicon double-sided adhesive tape, the positioning strip and the two sides of the tape. The waste is discharged three times to remove all the excess parts on the material, and the remaining part is the finished double-sided adhesive tape.
进一步地，所述的一次冲切、二次冲切、三次冲切的方向均为自上而下。Further, the directions of the primary punching, secondary punching and tertiary punching are all from top to bottom.
与现有技术相比，本实用新型具有以下特点：Compared with the prior art, the utility model has the following characteristics:
1)通过设置套位孔离型膜，并在套位孔离型膜两边均冲切出定位条，在定位条上冲切有套位孔，以便在后续加工过程中，通过硅双面胶使定位条始终保留在物料上，便于通过套位孔进行定位，而毋须多次冲切套位孔，提高了加工效率和加工精度；1) By setting the release film of the positioning hole, and punching out the positioning strips on both sides of the release film of the positioning hole, punching the positioning hole on the positioning strip, so that in the subsequent processing process, through the silicon double-sided adhesive The positioning strip is always kept on the material, which is convenient for positioning through the positioning hole without punching the positioning hole multiple times, which improves the processing efficiency and precision;
2)只需进行3次冲切，取消了大板转小板操作，简化了加工步骤。2) It only needs to be punched 3 times, and the operation of turning the large plate into a small plate is canceled, which simplifies the processing steps.
附图说明Description of drawings
图1为双面胶的截面结构示意图；Fig. 1 is the schematic cross-sectional structure diagram of double-sided adhesive tape;
图2为本实用新型中一次冲切前的物料截面结构示意图；Fig. 2 is the schematic diagram of the cross-sectional structure of the material before a punching in the utility model;
图3为本实用新型中一次冲切后的物料俯视结构示意图；Fig. 3 is the structural schematic diagram of the top view of the material after punching once in the utility model;
图4为本实用新型中二次冲切前的物料截面结构示意图；Fig. 4 is the schematic diagram of the cross-sectional structure of the material before secondary punching in the utility model;
图5为本实用新型中二次冲切前的物料三维分解结构示意图；Fig. 5 is a schematic diagram of the three-dimensional decomposition structure of the material before secondary punching in the utility model;
图6为本实用新型中二次冲切后的物料俯视结构示意图；Fig. 6 is the top view structure diagram of the material after secondary punching in the utility model;
图7为本实用新型中三次冲切前的物料截面结构示意图；Fig. 7 is the schematic diagram of the cross-sectional structure of the material before three times punching in the utility model;
图8为本实用新型中三次冲切后的物料俯视结构示意图；Fig. 8 is a structural schematic diagram of a bird's-eye view of the material after three times of punching in the utility model;
图9为本实用新型中三次排废后的双面胶俯视结构示意图；Fig. 9 is a structural schematic diagram of the top view of the double-sided adhesive after three waste discharges in the utility model;
图10为本实用新型中无刀印模切装置的整体结构示意图；Fig. 10 is a schematic diagram of the overall structure of the die-cutting device without knife marks in the utility model;
图11为本实用新型中第一模切刀的仰视结构示意图；Fig. 11 is a schematic view of the structure of the first die cutter in the utility model;
图12为本实用新型中第二模切刀的仰视结构示意图；Fig. 12 is a schematic view of the structure of the second die cutter in the utility model;
图13为本实用新型中第三模切刀的仰视结构示意图；Fig. 13 is a schematic view of the structure of the third die cutter in the utility model;
图中标记说明：Instructions for marks in the figure:
1—套位孔离型膜、2—双面胶层、3—第一辅助离型膜、4—第一保护膜、5—定位条、6—套位孔、7—第二辅助离型膜、8—硅双面胶、9—提手层、10—第二保护膜、11—料带、12—双面胶体、13—提手、14—第一上模座、15—第一下模座、16—第一模切刀、17—双面胶层模切刀、18—定位条模切刀、19—套位孔冲切刀、20—第一辅助离型膜收料辊、21—第二辅助离型膜送料辊、22—第一排废辊、23—复合送料辊、24—第二上模座、25—第二下模座、26—第二模切刀、27—提手外轮廓模切刀、28—第一定位针、29—第二排废辊、30—料带送料辊、31—第三上模座、32—第三下模座、33—第三模切刀、34—料带模切刀、35—第二定位针、36—第三排废辊。1—Release film for set hole, 2—Double-sided adhesive layer, 3—First auxiliary release film, 4—First protective film, 5—Positioning strip, 6—Set hole, 7—Second auxiliary release film Film, 8—silicon double-sided adhesive, 9—handle layer, 10—second protective film, 11—material tape, 12—double-sided adhesive, 13—handle, 14—first upper mold base, 15—first Lower mold base, 16—first die cutter, 17—double-sided adhesive layer die cutter, 18—positioning strip die cutter, 19—set hole punching knife, 20—first auxiliary release film receiving roller , 21—the second auxiliary release film feeding roller, 22—the first row of waste rollers, 23—composite feeding roller, 24—the second upper die holder, 25—the second lower die holder, 26—the second die cutter, 27—handle outer contour die cutter, 28—the first positioning pin, 29—the second row of waste rollers, 30—feeding roller of the material belt, 31—the third upper die holder, 32—the third lower die holder, 33— The 3rd die cutter, 34—material band die cutter, 35—the second positioning pin, 36—the third row of waste rollers.
具体实施方式Detailed ways
下面结合附图和具体实施例对本实用新型进行详细说明。本实施例以本实用新型技术方案为前提进行实施，给出了详细的实施方式和具体的操作过程，但本实用新型的保护范围不限于下述的实施例。The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is carried out on the premise of the technical solution of the utility model, and the detailed implementation and specific operation process are given, but the protection scope of the utility model is not limited to the following examples.
实施例：Example:
如图1所示，双面胶包括依次相互贴合的料带11、双面胶体12及提手13，双面胶体12的长度与提手13的长度相等，双面胶体12的宽度小于提手13的宽度。As shown in Figure 1, the double-sided adhesive tape includes a strip 11, a double-sided adhesive body 12 and a handle 13 that are attached to each other in sequence. The length of the double-sided adhesive body 12 is equal to the length of the handle 13, and the width of the double-sided adhesive body 12 is smaller than that Hand 13 width.
如图10所示的一种用于双面胶的无刀印模切装置，包括沿物料移动方向依次设置的第一模切单元、辅助离型膜替换单元、第一排废单元、硅双面胶贴合单元、第二模切单元、第二排废单元、料带贴合单元、第三模切单元及第三排废单元。As shown in Figure 10, a knife-free die-cutting device for double-sided adhesive tape includes a first die-cutting unit, an auxiliary release film replacement unit, a first waste discharge unit, a silicon double-sided film Adhesive laminating unit, second die-cutting unit, second waste discharge unit, tape laminating unit, third die-cutting unit and third waste discharge unit.
其中，第一模切单元包括第一上模座14以及与第一上模座14相适配的第一下模座15，第一上模座14的底部设有第一模切刀16。如图11所示，第一模切刀16包括由内而外依次设置的双面胶层模切刀17、定位条模切刀18以及套位孔冲切刀19。Wherein, the first die-cutting unit includes a first upper die base 14 and a first lower die base 15 matched with the first upper die base 14 , and a first die-cutting knife 16 is provided at the bottom of the first upper die base 14 . As shown in FIG. 11 , the first die-cutting knife 16 includes a double-sided adhesive layer die-cutting knife 17 , a positioning strip die-cutting knife 18 and a positioning hole punching knife 19 arranged sequentially from inside to outside.
辅助离型膜替换单元包括沿物料移动方向依次设置的第一辅助离型膜收料辊20以及第二辅助离型膜送料辊21，第一辅助离型膜收料辊20以及第二辅助离型膜送料辊21均位于物料的上方。The auxiliary release film replacement unit includes the first auxiliary release film receiving roller 20 and the second auxiliary release film feeding roller 21 arranged in sequence along the moving direction of the material, the first auxiliary release film receiving roller 20 and the second auxiliary release film Form film feeding roller 21 is all positioned at the top of material.
第一排废单元包括设置在物料下方的第一排废辊22，硅双面胶贴合单元包括设置在物料下方的复合送料辊23。The first waste discharge unit includes a first row of waste rollers 22 arranged under the materials, and the silicon double-sided adhesive bonding unit includes a composite feed roller 23 arranged under the materials.
第二模切单元包括第二上模座24以及与第二上模座24相适配的第二下模座25，第二上模座24的底部设有第二模切刀26。如图12所示，第二模切刀26包括提手外轮廓模切刀27以及第一定位针28。The second die-cutting unit includes a second upper die base 24 and a second lower die base 25 compatible with the second upper die base 24 , and a second die-cutting knife 26 is provided at the bottom of the second upper die base 24 . As shown in FIG. 12 , the second die-cutting knife 26 includes a handle outer contour die-cutting knife 27 and a first positioning pin 28 .
第二排废单元包括设置在物料上方的第二排废辊29，料带贴合单元包括设置在物料上方的料带送料辊30，第三排废单元包括设置在物料下方的第三排废辊36。The second waste-discharging unit includes a second waste-discharging roller 29 arranged above the material, the strip laminating unit comprises a strip feeding roller 30 arranged above the material, and the third waste-discharging unit comprises a third waste-discharging roller arranged below the material. Roller 36.
第三模切单元包括第三上模座31以及与第三上模座31相适配的第三下模座32，第三上模座31的底部设有第三模切刀33。如图13所示，第三模切刀33包括料带模切刀34以及第二定位针35。The third die-cutting unit includes a third upper die base 31 and a third lower die base 32 matched with the third upper die base 31 , and a third die-cutting knife 33 is provided at the bottom of the third upper die base 31 . As shown in FIG. 13 , the third die cutter 33 includes a tape die cutter 34 and a second positioning pin 35 .
无刀印模切方法包括以下步骤：The knifeless die-cutting method includes the following steps:
1)依次将套位孔离型膜1、双面胶层2、第一辅助离型膜3贴合在第一保护膜4上，如图2所示，之后进行一次冲切，将双面胶层2沿长度方向分割为多条，并在套位孔离型膜1两边均冲切出定位条5，定位条5上冲切有套位孔6，如图3所示；1) Lay the sleeve hole release film 1, the double-sided adhesive layer 2, and the first auxiliary release film 3 on the first protective film 4 in sequence, as shown in Figure 2, and then perform a punching, and the double-sided The adhesive layer 2 is divided into multiple strips along the length direction, and positioning strips 5 are punched out on both sides of the release film 1 of the positioning hole, and positioning holes 6 are punched on the positioning strip 5, as shown in Figure 3;
2)排掉第一辅助离型膜3，并将第二辅助离型膜7贴合在双面胶层2的一侧，之后进行一次排废，排掉第一保护膜4、套位孔离型膜1的中间部分、双面胶层2的多余部分；并在双面胶层2的另一侧依次贴合提手层9及第二保护膜10，定位条5位于双面胶层2与提手层9之间，定位条5与提手层9之间还设有硅双面胶8，如图4、图5所示，每个定位条5与提手层9之间均设有硅双面胶8，并且硅双面胶8与套位孔6相互错位设置；2) Drain the first auxiliary release film 3, and attach the second auxiliary release film 7 to one side of the double-sided adhesive layer 2, and then perform a waste discharge to remove the first protective film 4 and the positioning hole The middle part of the release film 1 and the excess part of the double-sided adhesive layer 2; 2 and the handle layer 9, silicon double-sided adhesive 8 is also provided between the positioning strip 5 and the handle layer 9, as shown in Figure 4 and Figure 5, between each positioning strip 5 and the handle layer 9 There is a silicon double-sided adhesive 8, and the silicon double-sided adhesive 8 and the positioning hole 6 are mutually misaligned;
3)进行二次冲切，在提手层9上冲切出提手13的外轮廓，如图6所示，之后进行二次排废，排掉第二辅助离型膜7、双面胶层2及提手层9上的外框废料；3) Carry out secondary punching, punch out the outer contour of the handle 13 on the handle layer 9, as shown in Figure 6, then carry out secondary waste discharge, discharge the second auxiliary release film 7, double-sided adhesive tape Frame scraps on layer 2 and handle layer 9;
4)在双面胶层2上贴合料带11，如图7所示，之后进行三次冲切，在料带11上冲切出料带11的外边缘，如图8所示；4) Lay the tape 11 on the double-sided adhesive layer 2, as shown in Figure 7, and then punch three times, and punch out the outer edge of the tape 11 on the tape 11, as shown in Figure 8;
5)进行三次排废，排掉第二保护膜10、提手层9的两边、硅双面胶8、定位条5及料带11的两边，即得到双面胶，如图9所示。5) Carry out waste discharge three times, discharge the second protective film 10, the two sides of the handle layer 9, the silicon double-sided adhesive 8, the positioning strip 5 and the two sides of the material belt 11, and obtain the double-sided adhesive, as shown in FIG. 9 .
其中，一次冲切、二次冲切、三次冲切的方向均为自上而下。Among them, the directions of the first punching, the second punching, and the third punching are all from top to bottom.
上述的对实施例的描述是为便于该技术领域的普通技术人员能理解和使用实用新型。熟悉本领域技术的人员显然可以容易地对这些实施例做出各种修改，并把在此说明的一般原理应用到其他实施例中而不必经过创造性的劳动。因此，本实用新型不限于上述实施例，本领域技术人员根据本实用新型的揭示，不脱离本实用新型范畴所做出的改进和修改都应该在本实用新型的保护范围之内。The above description of the embodiments is for those of ordinary skill in the technical field to understand and use the utility model. It is obvious that those skilled in the art can easily make various modifications to these embodiments, and apply the general principles described here to other embodiments without creative effort. Therefore, the utility model is not limited to the above-mentioned embodiments, and improvements and modifications made by those skilled in the art according to the disclosure of the utility model without departing from the category of the utility model should be within the protection scope of the utility model.
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Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd. Country or region after: China Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. Country or region before: China |