CN105914191B - A kind of integrated antenna package of water-cooling - Google Patents
A kind of integrated antenna package of water-cooling Download PDFInfo
- Publication number
- CN105914191B CN105914191B CN201610462579.2A CN201610462579A CN105914191B CN 105914191 B CN105914191 B CN 105914191B CN 201610462579 A CN201610462579 A CN 201610462579A CN 105914191 B CN105914191 B CN 105914191B
- Authority
- CN
- China
- Prior art keywords
- chip carrier
- cooling
- chip
- liquid bath
- cooling liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 27
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 16
- 239000000110 cooling liquid Substances 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 8
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000002826 coolant Substances 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The invention discloses a kind of integrated antenna package of water-cooling, its support plate is fixedly arranged in the middle of chip carrier, some pins are fixed with the support plate of chip carrier surrounding, concave station is formed on chip carrier, IC chip is mounted with concave station, the side wall of concave station forms some wire lead slots, lead is plugged with wire lead slot, the both ends of lead are respectively electrically connected in IC chip and pin, cooling liquid bath is formed on chip carrier on the upside of wire lead slot, it is molded on the corner bottom surface of cooling liquid bath fluted, plugged and fixed has highly heat-conductive carbon/ceramic porcelain knob in the side wall of groove, one end of highly heat-conductive carbon/ceramic porcelain knob is in the groove of chip carrier, the other end is against on the ic chip, capping is fixed with chip carrier, sealing gasket is clamped between capping and chip carrier, the both ends of capping have been respectively fixedly connected with cooling tube adapter, cooling tube is taken over to be connected with cooling liquid bath.The present invention accelerates radiating in the loop of structure setting water or coolant the cooling radiating of existing integrated antenna package, help integrated circuit realization.
Description
Technical field：
The present invention relates to the technical field of integrated circuit, is sealed more specifically to a kind of integrated circuit of water-cooling
Dress.
Background technology：
Electronic industry constantly reduces the size of electronic component, and is continuing to increase function in electronic component so that integrated electricity
The function and complexity on road are constantly lifted.And this trend also drives the encapsulation technology of integrated circuit component towards small size, height
The direction of pin number and high electricity/thermal efficiency is developed, and meets predetermined industrial standard.Because high-effect integrated circuit component produces more
High heat, and existing compact package technology only provides the fraction of cooling mechanism of designer, it is therefore desirable to it is small-sized at its
Radiator structure is designed on encapsulating structure in order to realize high efficiency and heat radiation, extends the service life of integrated circuit.
The content of the invention：
The purpose of the present invention aiming at prior art deficiency, and provide a kind of water-cooling integrated circuit envelope
Dress, it designs water-cooling structure in the structure of integrated antenna package, realizes and accelerates radiating.
To achieve the above object, the technical solution adopted by the present invention is as follows：
A kind of integrated antenna package of water-cooling, including support plate, support plate are fixedly arranged in the middle of chip carrier, chip carrier surrounding
Support plate on be fixed with some pins, concave station is formed on chip carrier, IC chip is mounted with concave station, the side wall of concave station forms
Some wire lead slots, lead is plugged with wire lead slot, the both ends of lead are respectively electrically connected in IC chip and pin, on the upside of wire lead slot
Chip carrier on form the cooling liquid bath of " returning " font, cool down and fluted, the side wall of groove be molded on the corner bottom surface of liquid bath
Upper plugged and fixed has a highly heat-conductive carbon/ceramic porcelain knob, and one end of highly heat-conductive carbon/ceramic porcelain knob is in the groove of chip carrier, the other end is resisted against IC
Capping is fixed with chip, on chip carrier, is clamped with sealing gasket between capping and chip carrier, the both ends of capping are respectively fixedly connected with
There is cooling tube adapter, cooling tube adapter is connected with cooling liquid bath.
The sealing gasket includes the main body of " returning " font, is inserted on the lower surface of main body into the raised line for having " returning " font, raised line
It is connected in the cooling liquid bath of chip carrier.
The corner of the cold but liquid bath of the chip carrier is at least respectively provided with a highly heat-conductive carbon/ceramic porcelain knob, and highly heat-conductive carbon/ceramic porcelain knob uses
Aluminium oxide ceramics or beryllium oxide ceramics.
The beneficial effects of the present invention are：It cools down radiating in the structure setting water or coolant of existing integrated antenna package
Loop, help encapsulating structure in integrated circuit realize accelerate radiating.
Brief description of the drawings：
Fig. 1 is the structural representation of invention；
Fig. 2 is the structural representation of invention section view；
Fig. 3 is the structural representation of invention chip carrier.
In figure：1st, support plate；2nd, chip carrier；21st, concave station；22nd, wire lead slot；23rd, liquid bath is cooled down；24th, groove；3rd, pin；4、
IC chip；5th, cover；6th, sealing gasket；61st, raised line；7th, cooling tube is taken over；8th, lead；9th, highly heat-conductive carbon/ceramic porcelain knob.
Embodiment：
Embodiment：As shown in Fig. 1 to 3, a kind of integrated antenna package of water-cooling, including support plate 1, the middle part of support plate 1
Chip carrier 2 is fixed with, some pins 3 are fixed with the support plate 1 of the surrounding of chip carrier 2, concave station 21, concave station are formed on chip carrier 2
IC chip 4 is mounted with 21, the side wall of concave station 21 forms some wire lead slots 22, lead 8, lead 8 are plugged with wire lead slot 22
Both ends be respectively electrically connected in IC chip 4 and pin 3, form the cold of " returning " font on the chip carrier 2 of the upside of wire lead slot 22
But liquid bath 23, cool down and be molded fluted 24 on the corner bottom surface of liquid bath 23, plugged and fixed has highly heat-conductive carbon/ceramic in the side wall of groove 24
Porcelain knob 9, one end of highly heat-conductive carbon/ceramic porcelain knob 9 is in the groove 24 of chip carrier 2, the other end is resisted against in IC chip 4, chip carrier 2
On be fixed with capping 5, be clamped with sealing gasket 6 between capping 5 and chip carrier 2, the both ends for covering 5 have been respectively fixedly connected with cooling tube
Adapter 7, cooling tube adapter 7 are connected with cooling liquid bath 23.
The sealing gasket 6 includes the main body of " returning " font, into the raised line 61 for having " returning " font, raised line on the lower surface of main body
61 are plugged in the cooling liquid bath 23 of chip carrier 2.
The corner of the cooling liquid bath 23 of the chip carrier 2 is at least respectively provided with a highly heat-conductive carbon/ceramic porcelain knob 9, highly heat-conductive carbon/ceramic porcelain knob
9 use aluminium oxide ceramics or beryllium oxide ceramics.
Operation principle：The present invention is the encapsulating structure of integrated circuit, and its feature is to be provided with water cooling on encapsulating structure
Structure, help the integrated circuit in encapsulating structure to realize and accelerate radiating, its water-cooling structure is by cooling liquid bath 23, groove 24, cooling
Pipe adapter 7 can form, and heat caused by its IC chip 4 transfers heat to the cold of cooling liquid bath 23 by highly heat-conductive carbon/ceramic porcelain knob 9
But medium (such as water or coolant), cooling medium connects cooling tube by cooling tube adapter 7 and realizes that cooling medium exchanges, so as to real
Existing quick heat radiating.
Claims (3)
1. a kind of integrated antenna package of water-cooling, including support plate (1), support plate (1) is fixedly arranged in the middle of chip carrier (2), core
Some pins (3) are fixed with the support plate (1) of bar (2) surrounding, concave station (21) is formed on chip carrier (2), concave station (21) is interior
IC chip (4) is mounted with, the side wall of concave station (21) forms some wire lead slots (22), lead (8) is plugged with wire lead slot (22),
The both ends of lead (8) are respectively electrically connected in IC chip (4) and pin (3), it is characterised in that：Chip on the upside of wire lead slot (22)
The cooling liquid bath (23) of " returning " font is formed on seat (2), is molded fluted (24) on the corner bottom surface of cooling liquid bath (23), it is recessed
Plugged and fixed has highly heat-conductive carbon/ceramic porcelain knob (9) in the side wall of groove (24), and one end of highly heat-conductive carbon/ceramic porcelain knob (9) is located at chip carrier (2)
Groove (24) is interior, the other end is resisted against in IC chip (4), and capping (5) is fixed with chip carrier (2), covers (5) and chip carrier
(2) sealing gasket (6) is clamped between, the both ends of capping (5) have been respectively fixedly connected with cooling tube adapter (7), cooling tube adapter (7)
It is connected with cooling liquid bath (23).
A kind of 2. integrated antenna package of water-cooling according to claim 1, it is characterised in that：The sealing gasket (6)
Include the main body of " returning " font, chip carrier is plugged on into the raised line (61) for having " returning " font, raised line (61) on the lower surface of main body
(2) in cooling liquid bath (23).
A kind of 3. integrated antenna package of water-cooling according to claim 1, it is characterised in that：The chip carrier (2)
The corner of cooling liquid bath (23) be at least respectively provided with a highly heat-conductive carbon/ceramic porcelain knob (9), highly heat-conductive carbon/ceramic porcelain knob (9) is made pottery using aluminum oxide
Porcelain or beryllium oxide ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610462579.2A CN105914191B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated antenna package of water-cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610462579.2A CN105914191B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated antenna package of water-cooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105914191A CN105914191A (en) | 2016-08-31 |
| CN105914191B true CN105914191B (en) | 2018-03-16 |
Family
ID=56758451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610462579.2A Active CN105914191B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated antenna package of water-cooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105914191B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328610B (en) * | 2016-09-25 | 2018-12-07 | 绍兴柯桥东进纺织有限公司 | A kind of multi-mode integrated circuit packaging system |
| CN109707825B (en) * | 2017-10-18 | 2022-02-25 | 上海汽车集团股份有限公司 | Cooling device for automobile and gearbox |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87104536A (en) * | 1986-05-30 | 1988-05-11 | 数字设备公司 | Integral heat pipe module |
| CN1156903A (en) * | 1995-12-29 | 1997-08-13 | Lg半导体株式会社 | Plate and column type semiconductor package having heat sink |
| CN1542951A (en) * | 2003-04-29 | 2004-11-03 | 宏�股份有限公司 | Semiconductor chip module and heat radiating assembly thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0410458A (en) * | 1990-04-26 | 1992-01-14 | Hitachi Ltd | Method and device for manufacturing semiconductor integrated circuit device |
| US6218730B1 (en) * | 1999-01-06 | 2001-04-17 | International Business Machines Corporation | Apparatus for controlling thermal interface gap distance |
| KR100677617B1 (en) * | 2005-09-29 | 2007-02-02 | 삼성전자주식회사 | Heat sink assembly |
| CN201803147U (en) * | 2010-07-23 | 2011-04-20 | 广东昭信光电科技有限公司 | Microfluid cooled silicon wafer LED lighting system |
-
2016
- 2016-06-20 CN CN201610462579.2A patent/CN105914191B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87104536A (en) * | 1986-05-30 | 1988-05-11 | 数字设备公司 | Integral heat pipe module |
| CN1156903A (en) * | 1995-12-29 | 1997-08-13 | Lg半导体株式会社 | Plate and column type semiconductor package having heat sink |
| CN1542951A (en) * | 2003-04-29 | 2004-11-03 | 宏�股份有限公司 | Semiconductor chip module and heat radiating assembly thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105914191A (en) | 2016-08-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108807312B (en) | Heat radiator | |
| CN106328613B (en) | A kind of integrated antenna package mechanism convenient for heat dissipation | |
| CN105914191B (en) | A kind of integrated antenna package of water-cooling | |
| CN207009436U (en) | Power model and electric machine controller | |
| CN102117784B (en) | Integrated circuit assembly | |
| CN106098641B (en) | A kind of integrated circuit package structure of heat dissipation | |
| CN210403710U (en) | IGBT packaging structure of middle liquid phase cooling double-sided welding chip | |
| CN106067451B (en) | A kind of heat dissipation type integrated circuit package structure | |
| CN105379097B (en) | Power-converting device | |
| CN207149548U (en) | A kind of radiator structure of package substrate | |
| CN108962849A (en) | A kind of method of integrated antenna package | |
| CN215869375U (en) | Double-control-electrode module packaging structure | |
| CN113555190B (en) | Inductor and electrical apparatus box assisting in heat dissipation of electronic component | |
| CN213690192U (en) | Camera module refrigeration heat abstractor | |
| CN213028681U (en) | Strengthen radiating packaging circuit board | |
| CN208108898U (en) | A kind of liquid-cooled uniform-temperature plate heat dissipating device | |
| CN209949722U (en) | Totally-enclosed dustproof magnetron power supply | |
| CN210986828U (en) | Air-cooled case containing graphite aluminum | |
| CN208047149U (en) | A kind of electric vehicle heating element radiator structure | |
| CN103579143B (en) | Plate power device packaging structure based on interior cooling heat radiation | |
| CN106098647B (en) | A kind of multi-chip stacks formula integrated antenna package | |
| CN213782011U (en) | High security circuit board lid | |
| CN108489314A (en) | A kind of liquid-cooled uniform-temperature plate heat dissipating device | |
| CN110517997A (en) | Electronic component cooling device | |
| CN207505234U (en) | A kind of novel projector circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Li Gang Inventor after: Xu Jian Inventor before: Wang Wenqing |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180213 Address after: 518000 Guangdong province Shenzhen City Pingshan District Longtian Street Industrial Zone No. three road a poly Longshan Industrial Park C1 Building 1 to 3 floor Applicant after: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD. Address before: 523000 Guangdong province Dongguan City Songshan Lake high tech Industrial Zone Building 406 industrial development productivity Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518118 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd. Address before: 518000 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD. |