CN201803147U - Microfluid cooled silicon wafer LED lighting system - Google Patents
Microfluid cooled silicon wafer LED lighting system Download PDFInfo
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- CN201803147U CN201803147U CN2010202687398U CN201020268739U CN201803147U CN 201803147 U CN201803147 U CN 201803147U CN 2010202687398 U CN2010202687398 U CN 2010202687398U CN 201020268739 U CN201020268739 U CN 201020268739U CN 201803147 U CN201803147 U CN 201803147U
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Abstract
The utility model relates to a microfluid cooled silicon wafer LED lighting system, comprising a silicon wafer substrate (1) and a plurality of LED chips (2) are arranged on the upper surface of the silicon wafer substrate (1). The utility model is characterized in that the silicon wafer substrate (1) is provided with a micro cooling channel for passing cooling fluid, and the micro cooling channel is provided with an inlet and an outlet communicating with the outside; The position of the micro cooling channel corresponds to the LED chips (2) arranged on the upper surface of the silicon wafer substrate (1). The utility model is advantageous in that the LED chips are cooled by the method of cooling fluid passing through the micro cooling channel, thereby the heat dissipation effect of the LED chips are improved; the integration level of the LED lighting system can be greatly improved, and the size of the LED lighting products can be decreased; The producing cost of the LED lighting products can be greatly reduced; the application and popularization of the LED lighting products can be facilitated.
Description
Affiliated technical field
The utility model relates to a kind of Silicon Wafer chip level LED illuminator of microfluid cooling, it specifically is a kind of rapid heat dissipation, the led module external dimensions is less, can increase substantially integrated level, the production efficiency of LED illuminator, and can reduce the LED illuminator of LED illuminator production cost.
Background technology
Light emitting diode (LED) is a kind of light emitting semiconductor device, and its principle of luminosity is to utilize the compound action in electronics and hole to produce photon.LED has the luminous efficiency height, and colour rendering is good, and power consumption is few, energy-conserving and environment-protective, security reliability height, the advantage of long service life.LED is applied at lighting field as a kind of light source novel, low-power consumption.
Although the LED illuminator has many-sided advantage with respect to traditional illumination system, the too high price of LED illuminator has hindered it and has promoted in the larger context.Causing the price main reason of high is that the integrated level of present LED illuminator is not high, and production efficiency is lower, is embodied in following aspect:
(1) led chip can produce a large amount of heats in the process of using, and it could guarantee good performance under relatively low temperature, so the heat management of LED illuminator and heat radiation are had relatively high expectations.The radiating mode that existing LED illuminator adopts is the radiating mode of passive type, and what this radiating mode employing aluminium or copper product were made has heat sink and radiator fin.The heat that LED illuminator when work produces carries out heat exchange by the lower air of radiator and ambient temperature, with the realization cooling purpose.The radiating efficiency of this radiator depends on itself and the contacted area of outside air, thereby existing most of power is lower than that the radiator that the LED illuminator of 300W adopts is generally all bulky, consumable material is more, and cost is also higher.In addition, the temperature of outside air is subjected to the influence of natural cause, environment for use easily, for example the air themperature of winter and summer, indoor and outdoors possibility difference is very big, and the structure of the radiator of same LED illuminator is fixed, thereby in different environments for use or different season, the unstable properties of LED illuminator.
Though the optical lens in the LED illuminating product and the efficient of led chip are improving constantly, cost is in continuous decline, radiator structure under same power consumption output can be done forr a short time but industrial quarters is still expected the LED illuminating product, installing space can more be economized and save to raw material, and can reduce environment for use as much as possible or/and the influence of extraneous natural cause.Proposed in LED illuminating product of future generation, to adopt new material and structure among the technology path figure that USDOE formulates, kept the continuous downward trend of cost of LED illuminating product.Yet, can't decline to a great extent as the radiator structure materials of aluminum of using always in the present LED illuminating product and the raw-material price of copper, even will rise, be unfavorable for the reduction of LED illuminating product cost.Therefore, the LED lighting field needs the new material and the appearance of structure urgently.
(2) in addition, because the radiating effect of existing radiator is unsatisfactory, be difficult to satisfy the requirement that high power, especially power are higher than the illuminator of 300W, therefore existing LED illuminator almost all is based on single LEDs module and designs and produce, and makes that the integrated level of illuminator is not high.But single LEDs power is less, brightness is lower, should not use separately, need in the practical application a plurality of single LEDs modules are fitted together the LED illuminator that is designed to practicality, thereby the amount of parts of existing LED illuminator is many, assembling production expends time in longer, and production efficiency is low, and human cost is higher.
Therefore, the radiating efficiency that how to improve the LED illuminator is directly connected to its integrated level, and then influences the production cost of LED illuminator.
The utility model content
The technical problems to be solved in the utility model provides a kind of rapid heat dissipation, and the led module external dimensions is less, can increase substantially integrated level, the production efficiency of LED illuminator, and can reduce the LED illuminator of LED illuminator production cost.
Problem to be solved in the utility model, can realize by following technical scheme: a kind of Silicon Wafer chip level LED illuminator of microfluid cooling, comprise silicon wafer substrate 1, the upper surface of this silicon wafer substrate 1 is provided with some led chips 2, it is characterized in that: described silicon wafer substrate 1 has the chilly but passage that is used for by cooling fluid, and described chilly but passage is provided with input port, the delivery outlet that is in communication with the outside; The position of described chilly but passage is corresponding with the led chip 2 that the upper surface of described silicon wafer substrate 1 is provided with.
During work, input port with chilly but passage is connected with the cooling device of assisting respectively with delivery outlet earlier, when connecting power supply, the LED illuminator starts cooling device, cooling fluid is in the input port of chilly but passage enters chilly but passage, led chip produces heat and is delivered on the silicon wafer substrate, when cooling fluid flows in chilly but passage, carry out heat exchange with the silicon wafer substrate, reach the purpose that reduces the led chip temperature, absorbed heat then and cooling fluid that temperature raises is flowed out by the delivery outlet of chilly passage.
The utility model adopts cooling fluid and silicon wafer substrate directly to carry out the purpose that heat exchange reaches heat radiation, so the flow direction and the flow velocity effect that directly influence heat radiation of cooling fluid in the chilly but passage of silicon wafer substrate.So on the basis of the above, the utility model can be done following improvement: the led chip 2 on the described silicon wafer substrate 1 forms a line or the above rectangular array of row.
As an embodiment of the present utility model, the position of described silicon wafer substrate 1 corresponding each row led chip 2 below all offers two groups of chilly but passages, and it is separate respectively to organize chilly but passage; It is described that respectively to organize chilly but passage be the micro-channel structure: comprise one be opened in corresponding led chip 2 under straight micro-channel 61, and the input port 7, the delivery outlet 8 that are positioned at described silicon wafer substrate 1 bottom surface; Described straight micro-channel 61 is along the orientation setting of this row led chip 2, and described input port 7 is all vertical with straight micro-channel 61 with delivery outlet 8; The two ends of described straight micro-channel 61 are communicated with input port 7, delivery outlet 8 respectively, form the passage that is in communication with the outside.During work, cooling fluid enters into each separate chilly but passage through corresponding input port respectively, and heat exchange is carried out in silicon wafer substrate part corresponding with this chilly but passage in the flow process, and the delivery outlet through each chilly but passage flows out then.
Because the chilly but passage of each group becomes the shape of bending, be convenient processing, on the basis of the above, the utility model can be done following improvement: described silicon wafer substrate 1 is upper and lower fixed overlay double-layer structure together, the silicon wafer substrate that wherein is positioned at the top is last substrate unit 11, and the silicon wafer substrate that is positioned at the below is following substrate unit 12; The described lower surface of going up substrate unit 11 or/and down the position of corresponding each the row led chip of the upper surface of substrate unit 12 all have the straight groove of two correspondences, the separate and direction of each straight groove is all along the orientation setting of the led chip of correspondence; Described upper and lower substrate unit 11,12 fixed overlay make the lower surface of substrate unit 11 or/and the corresponding groove of the upper surface of following substrate unit 12 forms straight micro-channel 61, the position at described substrate unit down 12 corresponding each straight micro-channel 61 two ends is equipped with a through hole, and the through hole at each straight micro-channel two ends forms respectively and is communicated with itself and extraneous input port 7, delivery outlet 8.
As another embodiment of the present utility model, the below of the position of described silicon wafer substrate 1 corresponding led chip matrix has two chambers of upper and lower arrangement, it is little spray structure that two chambers are communicated with structure, the chamber that is positioned at the top is the first chilly but passage 62, the chamber that is positioned at the below is the second chilly but passage 63, and first, second micro-channel 62,63 is communicated with by some spray orifices 64 that are opened between the two; Wherein, an end of first micro-channel 62 is communicated with several delivery outlet 8, the second micro-channel 63 that are arranged on silicon wafer substrate 1 bottom surface are arranged on silicon wafer substrate 1 bottom surface away from the end connection of input port 7 several input ports 7.During little spray arrangement works that this embodiment provides, cooling fluid enters into the second chilly but passage that is positioned at the below through a plurality of input ports, be full of after spray orifice enters the first chilly but passage that is positioned at the top, flow out and take away heat through a plurality of delivery outlets then, this structure helps the fluid distribution that is evenly distributed in vertical direction, help reducing the chip chamber temperature difference, make the led chip temperature evenly.
Be convenient processing, on the basis of the above, the utility model can be done following improvement: described silicon wafer substrate is a upper and lower fixed overlay three-decker together, and the silicon wafer substrate that is arranged in top, centre, below is respectively substrate unit 13, substrate unit 14 and following substrate unit 15; The described lower surface of going up substrate unit 13 is or/and the upper surface of middle substrate unit 14, and the lower surface of middle substrate unit 14 is or/and the upper surface of substrate unit 15 down all has a size and led chip matrix corresponding grooves; Described upper, middle and lower substrate unit 13,14,15 fixed overlay, make the lower surface of substrate unit 13 or/and the groove of the upper surface of middle substrate unit 14 forms the chamber as first micro-channel 62, the lower surface of substrate unit 14 in making is or/and the groove of the upper surface of following substrate unit 15 forms the chamber as second micro-channel 63; The position of first, second micro-channel 62,63 of 14 yuan of correspondences of substrate list has some through holes in described, and these through holes are for being communicated with the spray orifice 64 of first, second micro-channel 62,63; The described position of substrate unit 15 corresponding second micro-channel 63 1 ends down has some through holes, and these through holes are for being communicated with second micro-channel 63 and extraneous input port 7; The end that substrate unit 14 and following substrate unit 1 are positioned at away from input port 7 in described all has some through holes, these through holes in, be communicated with during substrate unit 14,15 fixed overlay and form the delivery outlet 8 that is communicated with first micro-channel 62 and the external world down.
On the basis of the above, fix by the mode of Si-Si direct bonding or the indirect bonding of silicon silicon between the silicon wafer substrate unit of upper and lower stack described in the utility model.
The utility model also comprises the phosphor powder layer 3 that covers outside the described led chip 2, this phosphor powder layer 3 is covered the upper surface of described silicon wafer substrate 1 by optics 4 sealings, each led chip 2 all connects an end of conductive channel 5, and the other end of each conductive channel 5 is connected with all and is connected pad 9 with the conduction that external electrical is communicated with.Each led chip is communicated with the conduction that is connected with power supply through conductive channel 5 and connects pad 9, realizes illumination.
On the basis of the above, as an embodiment of the present utility model, described each conductive channel 5 constitutes with the two groups of vertical section that runs through whole silicon wafer substrate 52 connections that are connected its traversing section 51 two ends respectively by the upper surface that is arranged on described silicon wafer substrate and by the traversing section 51 that phosphor powder layer 3 sealings cover, and described vertical section 52 staggers mutually with chilly but passage; Each led chip 3 is fixed on the corresponding traversing section 51, and each conduction connects pad 9 and is fixed on the end that corresponding vertical section 52 is positioned at silicon wafer substrate 1 below.On the basis of the above, the utility model can be done following improvement: the vertical section 52 of described conductive channel 5 adopts TSV (Through Silicon Via, silicon perforation) through-silicon wafer substrate 1.
On the basis of the above, as another embodiment of the present utility model, described each conductive channel 5 is the upper surface that is arranged on described silicon wafer substrate, wherein each led chip is fixed on the corresponding conductive channel 5, the two ends of each conductive channel 5 all spread out of phosphor powder layer 3, and both ends all are connected with conduction connection pad.
Led chip 2 described in the utility model is for taking the led chip or the light emitting diode (LED) chip with vertical structure of gold thread.The utility model also comprises waterproof part.
Optics described in the utility model 4 is one or more integrated in the lens made by silicon or glass, reflector, the dispersing element.
Led chip 2 described in the utility model is connected with conductive path 5 by the mode with eutectic welding or adhesive bond; Scolder can be golden tin solder or other viable material, and binding agent can be the material with high thermal conductivity coefficient.
On the basis of the above, described optics 4 is bonded on the described silicon wafer substrate 1 by fusion bonding, anode linkage, thermocompression bonding or the method for cohering bonding.
Compared with prior art, the utlity model has following beneficial effect:
(1) LED illuminator of the present utility model adopts directly the structure of offering cooling passage at the silicon wafer substrate to replace the radiator of making of aluminium or copper product, not only save material cost, and make the more compact structure of whole illuminator, reduce the installing space that takies significantly, illuminator of the present utility model need not to install in addition radiator, reduce the operation of producing, further reduced the cost of product.
(2) chilly but passage of the present utility model be positioned at led chip under, cooling fluid is directly carried out heat exchange with the highest position of silicon wafer underlayer temperature, has improved the efficient of dispelling the heat greatly; Compare with air easily affected by environment, cooling fluid will be stablized manyly, all can guarantee the heat radiation requirement of led chip in different environments for use.
(3) because the utility model has improved the radiating effect of led chip, even if several led chips are integrated in the requirement that also can satisfy heat radiation on the less module, therefore can improve the integrated level of LED illuminator greatly, thereby dwindle the size of LED illuminating product, greatly reduce the production cost of LED illuminating product, help the application of LED illuminating product.
(4) the utility model is arranged on input port, the delivery outlet of the chilly but passage of each group the bottom surface of silicon wafer substrate 1, the input port of in fact chilly but passage, delivery outlet can also be arranged on other positions of silicon wafer substrate, for example the relative two sides of silicon wafer substrate only need to satisfy to be in communication with the outside to get final product; But a LED illuminator is as an independent module, need in use to carry out being communicated with of fluid and circuit with substrate, this connection generally in vertical direction, therefore preferably input port, the delivery outlet of chilly but passage is arranged on the bottom surface of silicon wafer substrate, to make things convenient for the assembling of whole LED illuminator.
(5) the chilly but channel design of the employing micro-channel structure that provides of the utility model is simple, easy to process; The utility model provide another adopt the cooling duct of little spray structure to help the fluid distribution that is evenly distributed in vertical direction, help reducing the chip chamber temperature difference, make the led chip temperature evenly.The LED illuminator that the utility model provides can also be in conjunction with micro-channel structure and two kinds of chilly but passages of little spray structure, and make suitable change so that the demand of more realistic use.
Description of drawings
Fig. 1 is the structural representation of embodiment one of the present utility model;
Fig. 2 is the sectional structure schematic diagram along A-A line among Fig. 1;
Fig. 3 is the sectional structure schematic diagram along B-B line among Fig. 1;
Fig. 4 is the structural representation of embodiment two of the present utility model;
Fig. 5 is the sectional structure schematic diagram along C-C line among Fig. 4;
Fig. 6 is the sectional structure schematic diagram along D-D line among Fig. 4;
Fig. 7 is the structural representation of embodiment three of the present utility model;
Fig. 8 is the sectional structure schematic diagram along E-E line among Fig. 7;
Fig. 9 is the sectional structure schematic diagram along F-F line among Fig. 7;
Figure 10 is the structural representation of embodiment four of the present utility model;
Figure 11 is the sectional structure schematic diagram along G-G line among Figure 10;
Figure 12 is the sectional structure schematic diagram along H-H line among Figure 10.
The specific embodiment
The Silicon Wafer chip level LED illuminator of the microfluid cooling shown in Fig. 1～3 is embodiment 1 of the present utility model, it has comprised silicon wafer substrate 1, the upper surface of this silicon wafer substrate 1 is provided with some led chips 2 of taking gold thread, led chip 2 is lined up the rectangular array of m * n, and wherein m, n are integer.
The position of silicon wafer substrate 1 corresponding each row led chip 2 below all offers two groups of chilly but passages, and it is separate respectively to organize chilly but passage; Each organizes chilly but passage is the micro-channel structure: comprise one be opened in corresponding led chip 2 under straight micro-channel 61, and the input port 7, the delivery outlet 8 that are positioned at silicon wafer substrate 1 bottom surface.
Be convenient processing, silicon wafer substrate 1 be a upper and lower fixed overlay double-layer structure together, and the silicon wafer substrate that wherein is positioned at the top is last substrate unit 11, the silicon wafer substrate that is positioned at the below under substrate unit 12; Position under corresponding each the row led chip of the upper surface of following substrate unit 12 all has the straight groove of two correspondences, and the separate and direction of each straight groove is all along the orientation setting of the led chip of correspondence; After the mode fixed overlay of upper and lower substrate unit 11,12 by Si-Si direct bonding or the indirect bonding of silicon silicon, make down the corresponding groove of the upper surface of substrate unit 12 form straight micro-channel 61, the position at following substrate unit 12 corresponding each straight micro-channel 61 two ends is equipped with a perpendicular through hole, and the through hole at each straight micro-channel two ends forms respectively and is communicated with itself and extraneous input port 7, delivery outlet 8.
This LED illuminator also comprises phosphor powder layer 3, optics 4 and waterproof part; Phosphor powder layer 3 covers outside the led chip 2, and optics 4 covers phosphor powder layer 3 sealings the upper surface of silicon wafer substrate 1.Phosphor powder layer 3 is by yttroalumite pomegranate fluorescent material (YAG:Ce
3+) make; Optics 4 is one or more integrated in the lens made by silicon or glass, reflector, the dispersing element, and it is bonded on the silicon wafer substrate 1 by fusion bonding, anode linkage, thermocompression bonding or the method for cohering bonding.
The led chip 2 of this LED illuminator all is connected with conduction by conductive channel 5 and connects pad 9, each conductive channel 5 constitutes with the two groups of vertical section that runs through whole silicon wafer substrate 52 connections that are connected its traversing section 51 two ends respectively by the upper surface that is arranged on the silicon wafer substrate and by the traversing section 51 that phosphor powder layer 3 sealings cover, vertical section 52 adopts TSV (Through Silicon Via, silicon perforation) through-silicon wafer substrate 1, and stagger mutually with chilly but passage.Each led chip 3 is connected on the corresponding traversing section 51 by the mode with eutectic welding or adhesive bond, and scolder can be golden tin solder or other viable material, and binding agent can be the material with high thermal conductivity coefficient; Each conduction connects pad 9 and is fixed on the end that corresponding vertical section 52 is positioned at silicon wafer substrate 1 below.Each led chip is communicated with the conduction that is connected with power supply through conductive channel 5 and connects pad 9, realizes illumination.
During work, input port with each chilly but passage is connected with the cooling device of assisting respectively with delivery outlet earlier, when connecting power supply, the LED illuminator starts cooling device, cooling fluid enters into each separate chilly but passage through corresponding input port respectively, led chip produces heat and is delivered on the silicon wafer substrate, when cooling fluid flows in chilly but passage, heat exchange is carried out in the silicon wafer substrate part corresponding with this chilly but passage, reach the purpose that reduces the led chip temperature, absorbed heat then and cooling fluid that temperature raises is flowed out by the delivery outlet of chilly passage.
The Silicon Wafer chip level LED illuminator of the microfluid cooling shown in Fig. 4～6 is embodiment 2 of the present utility model, and it is with the different of embodiment 1:
The below of the position of silicon wafer substrate 1 corresponding led chip matrix has two chambers of upper and lower arrangement, it is little spray structure that two chambers are communicated with structure, the chamber that is positioned at the top is the first chilly but passage 62, the chamber that is positioned at the below is the second chilly but passage 63, and first, second micro-channel 62,63 is communicated with by some spray orifices 64 that are opened between the two; Wherein, an end of first micro-channel 62 is communicated with several delivery outlet 8, the second micro-channel 63 that are arranged on silicon wafer substrate 1 bottom surface are arranged on silicon wafer substrate 1 bottom surface away from the end connection of input port 7 several input ports 7.
Be convenient processing, the silicon wafer substrate is a upper and lower fixed overlay three-decker together, and the silicon wafer substrate that is arranged in top, centre, below is respectively substrate unit 13, substrate unit 14 and following substrate unit 15; Upper surface, the lower surface of middle substrate unit 14 have a size and led chip matrix corresponding grooves; Upper, middle and lower substrate unit 13,14,15 fixed overlay, the groove of the upper surface of substrate unit 14 and lower surface forms chamber that is used as first micro-channel 62 and the chamber that is used as second micro-channel 63 respectively in making; The position of middle first, second micro-channel 62,63 of 14 yuan of correspondences of substrate list has some through holes, and these through holes are for being communicated with the spray orifice 64 of first, second micro-channel 62,63; The position of following substrate unit 15 corresponding second micro-channel 63 1 ends has some through holes, and these through holes are for being communicated with second micro-channel 63 and extraneous input port 7; In the end that is positioned at away from input port 7 of substrate unit 14 and following substrate unit 1 all have some through holes, these through holes in, be communicated with during substrate unit 14,15 fixed overlay and form the delivery outlet 8 that is communicated with first micro-channel 62 and the external world down.
During little spray arrangement works that this embodiment provides, cooling fluid enters into the second chilly but passage that is positioned at the below through a plurality of input ports, be full of after spray orifice enters the first chilly but passage that is positioned at the top, flow out and take away heat through a plurality of delivery outlets then, this structure helps the fluid distribution that is evenly distributed in vertical direction, help reducing the chip chamber temperature difference, make the led chip temperature evenly.
The Silicon Wafer chip level LED illuminator of the microfluid cooling shown in Fig. 7～9 is embodiment 3 of the present utility model, it is with the different of embodiment 1: be used to connect the upper surface that each led chip is connected pad 9 with conduction conductive channel 5 only is arranged on the silicon wafer substrate, each led chip is fixed on the corresponding conductive channel 5, the two ends of each conductive channel 5 all spread out of phosphor powder layer 3, and both ends all are connected with conduction connection pad.
The Silicon Wafer chip level LED illuminator of the microfluid cooling shown in Figure 10～12 is embodiment 4 of the present utility model, and it is with the different of embodiment 1: led chip is a light emitting diode (LED) chip with vertical structure.
Claims (16)
1. the Silicon Wafer chip level LED illuminator of microfluid cooling, comprise silicon wafer substrate (1), the upper surface of this silicon wafer substrate (1) is provided with some led chips (2), it is characterized in that: described silicon wafer substrate (1) has the chilly but passage that is used for by cooling fluid, and described chilly but passage is provided with input port, the delivery outlet that is in communication with the outside; The position of described chilly but passage is corresponding with the led chip (2) that the upper surface of described silicon wafer substrate (1) is provided with.
2. LED illuminator according to claim 1 is characterized in that: the led chip (2) on the described silicon wafer substrate (1) forms a line or the above rectangular array of row.
3. LED illuminator according to claim 2 is characterized in that: the position of corresponding each row led chip (2) below of described silicon wafer substrate (1) all offers two groups of chilly but passages, and it is separate respectively to organize chilly but passage; It is described that respectively to organize chilly but passage be the micro-channel structure: comprise one be opened in corresponding led chip (2) under straight micro-channel (61), and the input port (7), the delivery outlet (8) that are positioned at described silicon wafer substrate (1) bottom surface; Described straight micro-channel (61) is along the orientation setting of this row led chip (2), and described input port (7) are all vertical with straight micro-channel (61) with delivery outlet (8); The two ends of described straight micro-channel (61) are communicated with input port (7), delivery outlet (8) respectively, form the passage that is in communication with the outside.
4. LED illuminator according to claim 3, it is characterized in that: described silicon wafer substrate (1) is a upper and lower fixed overlay double-layer structure together, the silicon wafer substrate that wherein is positioned at the top is last substrate unit (11), and the silicon wafer substrate that is positioned at the below is following substrate unit (12); The described lower surface of going up substrate unit (11) or/and down the position of corresponding each the row led chip of the upper surface of substrate unit (12) all have the straight groove of two correspondences, the separate and direction of each straight groove is all along the orientation setting of the led chip of correspondence; Described upper and lower substrate unit (11,12) fixed overlay makes the lower surface of substrate unit (11) or/and the corresponding groove of the upper surface of following substrate unit (12) forms straight micro-channel (61), the position at corresponding each straight micro-channel (61) two ends of described substrate unit (12) down is equipped with a through hole, and the through hole at each straight micro-channel two ends forms respectively and is communicated with itself and extraneous input port (7), delivery outlet (8).
5. LED illuminator according to claim 2, it is characterized in that: the below of the position of the corresponding led chip matrix of described silicon wafer substrate (1) has two chambers of upper and lower arrangement, it is little spray structure that two chambers are communicated with structure, the chamber that is positioned at the top is the first chilly but passage (62), the chamber that is positioned at the below is the second chilly but passage (63), and first, second micro-channel (62,63) is communicated with by some spray orifices (64) that are opened between the two; Wherein, one end of first micro-channel (62) is communicated with several delivery outlets (8) that are arranged on silicon wafer substrate (1) bottom surface, and second micro-channel (63) is communicated with several input ports (7) that are arranged on silicon wafer substrate (1) bottom surface away from an end of input port (7).
6. LED illuminator according to claim 5, it is characterized in that: described silicon wafer substrate is a upper and lower fixed overlay three-decker together, and the silicon wafer substrate that is arranged in top, centre, below is respectively substrate unit (13), substrate unit (14) and following substrate unit (15); The described lower surface of going up substrate unit (13) is or/and the upper surface of middle substrate unit (14), and the lower surface of middle substrate unit (14) is or/and the upper surface of substrate unit (15) down all has a size and led chip matrix corresponding grooves; Described upper, middle and lower substrate unit (13,14,15) fixed overlay, make the lower surface of substrate unit (13) or/and the groove of the upper surface of middle substrate unit (14) forms the chamber as first micro-channel (62), make the lower surface of middle substrate unit (14) or/and the groove of the upper surface of following substrate unit (15) forms the chamber as second micro-channel (63); The position of substrate list (14) corresponding first, second micro-channel of unit (62,63) has some through holes in described, and these through holes are for being communicated with the spray orifice (64) of first, second micro-channel (62,63); The described position of corresponding second micro-channel of substrate unit (15) (63) one ends down has some through holes, and these through holes are for being communicated with second micro-channel (63) and extraneous input port (7); The end that substrate unit (14) and following substrate unit (1) are positioned at away from input port (7) in described all has some through holes, these through holes in, be communicated with during substrate unit (14,15) fixed overlay and form the delivery outlet (8) that is communicated with first micro-channel (62) and the external world down.
7. according to claim 4 or 6 described LED illuminators, it is characterized in that: fix by the mode of Si-Si direct bonding or the indirect bonding of silicon silicon between the silicon wafer substrate unit of described upper and lower stack.
8. LED illuminator according to claim 7, it is characterized in that: also comprise covering the outer phosphor powder layer (3) of described led chip (2), this phosphor powder layer (3) is covered the upper surface of described silicon wafer substrate (1) by optics (4) sealing, each led chip (2) all connects an end of conductive channel (5), and the other end of each conductive channel (5) is connected with all and is connected pad (9) with the conduction that external electrical is communicated with.
9. LED illuminator according to claim 8, it is characterized in that: described each conductive channel (5) is communicated with formation by the upper surface that is arranged on described silicon wafer substrate and by the traversing section (51) that phosphor powder layer (3) sealing covers with two groups of vertical section that run through whole silicon wafer substrate (52) that are connected its traversing section (51) two ends respectively, and described vertical section (52) staggers mutually with chilly but passage; Each led chip (3) is fixed on the corresponding traversing section (51), and each conduction connects pad (9) and is fixed on the end that corresponding vertical section (52) is positioned at silicon wafer substrate (1) below.
10. LED illuminator according to claim 9 is characterized in that: the vertical section (52) of described conductive channel (5) adopts TSV (Through Silicon Via, silicon perforation) through-silicon wafer substrate (1).
11. LED illuminator according to claim 10, it is characterized in that: described each conductive channel (5) is the upper surface that is arranged on described silicon wafer substrate, wherein each led chip is fixed on the corresponding conductive channel (5), the two ends of each conductive channel (5) all spread out of phosphor powder layer (3), and both ends all are connected with conduction connection pad.
12. LED illuminator according to claim 11 is characterized in that: described led chip (2) is for taking the led chip or the light emitting diode (LED) chip with vertical structure of gold thread.
13. LED illuminator according to claim 12 is characterized in that: described phosphor powder layer (3) is by yttroalumite pomegranate fluorescent material (YAG:Ce
3+) make.
14. LED illuminator according to claim 13 is characterized in that: described optics (4) is one or more integrated in the lens made by silicon or glass, reflector, the dispersing element.
15. LED illuminator according to claim 14 is characterized in that: described led chip (2) is connected with conductive path (5) by the mode with eutectic welding or adhesive bond.
16. LED illuminator according to claim 15 is characterized in that: described optics (4) is bonded on the described silicon wafer substrate (1) by fusion bonding, anode linkage, thermocompression bonding or the method for cohering bonding.
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| CN2010202687398U CN201803147U (en) | 2010-07-23 | 2010-07-23 | Microfluid cooled silicon wafer LED lighting system |
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| CN2010202687398U CN201803147U (en) | 2010-07-23 | 2010-07-23 | Microfluid cooled silicon wafer LED lighting system |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101916757A (en) * | 2010-07-23 | 2010-12-15 | 广东昭信光电科技有限公司 | Microfluid cooling silicon wafer level LED illuminating system |
| CN102208519A (en) * | 2011-05-19 | 2011-10-05 | 苏州环创电子有限公司 | Light-emitting diode (LED) device based on radiator package |
| WO2012151713A1 (en) * | 2011-05-09 | 2012-11-15 | 盐城豪迈照明科技有限公司 | Tubular elementary led encapsulation structure and illumination device with the same |
| CN105914191A (en) * | 2016-06-20 | 2016-08-31 | 东莞市联洲知识产权运营管理有限公司 | Water-cooling integrated circuit packaging |
| CN107251213A (en) * | 2015-02-20 | 2017-10-13 | 国际商业机器公司 | Use the supercomputer that wafer scale is integrated |
-
2010
- 2010-07-23 CN CN2010202687398U patent/CN201803147U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101916757A (en) * | 2010-07-23 | 2010-12-15 | 广东昭信光电科技有限公司 | Microfluid cooling silicon wafer level LED illuminating system |
| CN101916757B (en) * | 2010-07-23 | 2011-12-21 | 广东昭信光电科技有限公司 | Microfluid cooling silicon wafer level LED illuminating system |
| WO2012151713A1 (en) * | 2011-05-09 | 2012-11-15 | 盐城豪迈照明科技有限公司 | Tubular elementary led encapsulation structure and illumination device with the same |
| CN102208519A (en) * | 2011-05-19 | 2011-10-05 | 苏州环创电子有限公司 | Light-emitting diode (LED) device based on radiator package |
| CN107251213A (en) * | 2015-02-20 | 2017-10-13 | 国际商业机器公司 | Use the supercomputer that wafer scale is integrated |
| DE112016000381B4 (en) | 2015-02-20 | 2020-06-18 | International Business Machines Corporation | Supercomputer with integration at wafer level |
| CN107251213B (en) * | 2015-02-20 | 2020-10-16 | 国际商业机器公司 | Supercomputer using wafer-level integration |
| CN105914191A (en) * | 2016-06-20 | 2016-08-31 | 东莞市联洲知识产权运营管理有限公司 | Water-cooling integrated circuit packaging |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110420 Effective date of abandoning: 20111221 |