CN108962849A - A kind of method of integrated antenna package - Google Patents
A kind of method of integrated antenna package Download PDFInfo
- Publication number
- CN108962849A CN108962849A CN201810804876.XA CN201810804876A CN108962849A CN 108962849 A CN108962849 A CN 108962849A CN 201810804876 A CN201810804876 A CN 201810804876A CN 108962849 A CN108962849 A CN 108962849A
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- chip
- cooling mechanism
- framework
- heat
- inserting groove
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- 238000000034 method Methods 0.000 title claims description 13
- 238000001816 cooling Methods 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 22
- 229910052742 iron Inorganic materials 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 238000005538 encapsulation Methods 0.000 abstract description 9
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of encapsulation of heat dissipation type multichip IC, the framework of rectangle including substrate and molding on the substrate, multiple tracks step is formed on the inner wall of the framework, step is equipped with the upper cooling mechanism to radiate for the front to IC chip and the lower cooling mechanism to radiate for the reverse side to IC chip, and the IC chip is between the upper cooling mechanism and lower cooling mechanism；The upper cooling mechanism includes the guide groove of the inserting groove for the strip being molded on the wall of step front and rear sides, the multiple pressure springs being arranged in the inserting groove, the heat-dissipating pipe that both ends are resisted against on the pressure spring and the arc being molded on step bottom wall；The lower cooling mechanism includes fixed plate on the mesa sidewall being removably disposed in below inserting groove, the multiple blower fans for being molded over the tilting connecting plate of described fixed plate one end and being arranged on the connecting plate.The present invention is able to achieve rapid cooling, extends the service life of multi-chip.
Description
The application is application No. is 2016107035068, and the applying date is on 08 22nd, 2016, and invention and created name is
A kind of divisional application of the patent of " heat dissipation type multichip IC encapsulation ".
Technical field
The present invention relates to the technical fields of integrated circuit, are specifically related to a kind of heat dissipation type multichip IC encapsulation.
Background technique
Electronic industry constantly reduces the size of electronic component, and continues to increase function on electronic component, so that integrated electricity
The function and complexity on road are constantly promoted.And this trend also drives the encapsulation technology of integrated circuit component towards small size, high foot
The direction of several and high electricity/thermal efficiency is developed, and meets scheduled industrial standard.Since the generation of high-effect integrated circuit component is higher
Heat, and existing compact package technology only provides the fraction of cooling mechanism of designer, it is therefore desirable in its small-sized envelope
Radiator structure is designed on assembling structure in order to realize heat dissipation, extends the service life of integrated circuit, existing compact package structure
On radiator structure heat dissipation effect it is undesirable, the encapsulating structure of especially some more IC chips, it is especially desirable to efficient heat dissipation
Structure.
Summary of the invention
The purpose of the present invention aims to solve the problem that problem of the existing technology, provides one kind and is able to achieve rapid cooling, extends more
The heat dissipation type multichip IC of the service life of chip encapsulates.
The present invention relates to a kind of encapsulation of heat dissipation type multichip IC, the square including substrate and molding on the substrate
The framework of shape forms multiple tracks step on the inner wall of the framework, multiple contacts is fixedly installed at left and right sides of the step,
The contact is electrically connected by conducting wire with stitch, and the stitch is fixed on substrate, step equipped with for IC chip just
The upper cooling mechanism and the lower cooling mechanism to radiate for the reverse side to IC chip, the IC chip that face is radiated are located at
Between the upper cooling mechanism and lower cooling mechanism；
The upper cooling mechanism includes the inserting groove for the strip being molded on the wall of step front and rear sides, setting described slotting
The guiding of heat-dissipating pipe and the arc being molded on step bottom wall that multiple pressure springs in access slot, both ends are resisted against on the pressure spring
Slot, inserting groove are vertically arranged with the heat-dissipating pipe, and one end of pressure spring is fixed on the inner wall of inserting groove, two side bottom pressure of heat-dissipating pipe
It leans against in the guide groove；
The lower cooling mechanism includes fixed plate on the mesa sidewall being removably disposed in below inserting groove, is molded over
The tilting connecting plate of described fixed plate one end and the multiple blower fans being arranged on the connecting plate, the institute of step front and rear sides
It states blower fan to be oppositely arranged, blower fan is dried against the bottom surface of IC chip.
By above-mentioned technical proposal, in the use of the present invention, IC chip is arranged on the intracorporal step of frame, on multiple tracks step
Multiple IC chips be arranged in stacked on top, the both ends of IC chip are electrically connected by contact and conducting wire with the stitch on substrate.IC
Chip is arranged between upper cooling mechanism and lower cooling mechanism, and the blower fan of lower cooling mechanism is in tilting state and opposite IC core
The reverse side of piece is dried, and is thus radiated to the reverse side of IC chip, tilting blower fan is conducive to increase the area of blowing, make
The reverse side of IC chip accelerates heat dissipation, and the heat-dissipating pipe of upper cooling mechanism is located at the top of IC chip, carries out to the front of IC chip scattered
Heat.When encapsulating multiple IC chips into framework in the case where framework is vacant, first the fixed plate of lower cooling mechanism can be mounted on
On the lower sides of step, then IC chip is placed in fixed plate, is then installed to the heat-dissipating pipe of upper cooling mechanism one by one
In inserting groove, specifically, one end of heat-dissipating pipe is inserted into inserting groove and is resisted against on pressure spring, pressure spring along the guide groove of arc
It is compressed, then the other end of heat-dissipating pipe is inserted into inserting groove in the same way, thus the both ends of heat-dissipating pipe are pressed against pressure spring
Upper and heat-dissipating pipe two side bottoms are located in guide groove.
Through the above scheme, the present invention adds new cooling mechanism on the basis of the packaging mechanism of more IC chips, is able to achieve
Rapid cooling extends the service life of multi-chip, and cooling mechanism facilitates installing and dismounting, convenient for the encapsulation of IC chip.
As a preference of the above scheme, it is formed on the mesa sidewall below the inserting groove parallel with inserting groove
Resettlement groove is uniformly bolted with multipair bulb plunger, the upper surface and lower end of the fixed plate on the top and bottom sidewall of the resettlement groove
The embedding slot that the multipair bulb with the bulb plunger cooperates uniformly is formed on face, the bulb of bulb plunger is embedded in corresponding
In embedding slot.According to the above scheme, as long as firmly fixed plate is inserted into resettlement groove embedding slot is matched with bulb plunger, i.e.,
Fixed plate can be mounted on step；Similarly, as long as firmly extracting fixed plate out of resettlement groove out, so that the bulb of bulb plunger
It is detached from embedding slot, fixed lower cooling mechanism can be disassembled from step, installing and dismounting is quite convenient to.
As a preference of the above scheme, the top of the framework is equipped with capping, the bottom surface left and right sides of the capping
Holding block is formed, the card slot with holding block cooperation is formed at left and right sides of the top of framework, the bottom of holding block is fixed
Have iron piece, be fixed with the magnet block cooperated with described iron piece on the inner wall of the card slot, the bottom surface front and rear sides of capping at
Type has multiple positioning columns, and the top front and rear sides of framework form the location hole with positioning column cooperation.According to the above scheme, it seals
The top of framework is arranged in lid, is protected to the component inside framework and prevents impurity from entering in framework, fixed when covering capping
Position column sleeve is positioned in position of the positioning hole to capping, and holding block sleeve is in card slot, and iron piece firm by magnet block
Jail absorption, so that capping is fixed in framework, when needing to dismantle lower capping, only firmly need to pull capping so that iron piece with
Magnet block separation.
As a preference of the above scheme, the bottom surface of the holding block forms resettlement groove, and described iron piece is fixed on
In the resettlement groove, the placement block with the protrusion of resettlement groove cooperation is formed on the inner wall of the card slot, the magnet block is fixed
On the top of the placement block.
As a preference of the above scheme, 3 positioning have been separately formed with rear side on front side of the top of the framework
Hole, the bottom surface front side of the capping and rear side have been separately formed 3 positioning columns.
As a preference of the above scheme, the upper surface of the upper surface and contact of the fixed plate is located at same level
On.
As a preference of the above scheme, the heat-dissipating pipe is evenly distributed on inserting groove, and the blower fan is uniformly divided
Cloth is on connecting plate.
As a preference of the above scheme, for the conducting wire inside framework, the stitch is fixed on base plate bottom
Front and rear sides.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention and the accompanying drawings.
Detailed description of the invention
The following drawings are only intended to schematically illustrate and explain the present invention, not delimit the scope of the invention.Wherein:
Fig. 1 is cross-sectional view of the invention；
Fig. 2 is that the present invention removes the top view after capping；
Fig. 3 is the cross-sectional view of Fig. 2；
Fig. 4 is the structural schematic diagram of step in the present invention；
Fig. 5 is the partial structural diagram of Fig. 1；
Fig. 6 is the partial structural diagram of Fig. 2；
Fig. 7 is the structural schematic diagram covered in the present invention.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Implement below
Example is not intended to limit the scope of the invention for illustrating the present invention.
Referring to Fig. 1 to Fig. 3, a kind of heat dissipation type multichip IC encapsulation of the present invention, including substrate 10 and at
The framework 20 of the rectangle of type on the substrate forms multiple tracks step 21, the left and right of the step on the inner wall of the framework
Two sides are fixedly installed multiple contacts 22, and the contact is electrically connected by conducting wire 30 with stitch 31, and the conducting wire 30 is embedded in frame
Inside body 20, the stitch 31 is fixed on the front and rear sides of 10 bottom of substrate, and step 21 is equipped with for the front to IC chip 1
The upper cooling mechanism 40 to radiate and the lower cooling mechanism 50 to radiate for the reverse side to IC chip 1, the IC chip 1
Between the upper cooling mechanism 40 and lower cooling mechanism 50.
Referring to Fig. 3, Fig. 4, the upper cooling mechanism 40 includes inserting for the strip being molded on 21 front and rear sides wall of step
The heat-dissipating pipe 43 and be molded over that access slot 41, the multiple pressure springs 42 being arranged in the inserting groove, both ends are resisted against on the pressure spring
The guide groove 44 of arc on 21 bottom wall of step, inserting groove 41 are vertically arranged with the heat-dissipating pipe 43, and one end of pressure spring 42 is fixed
On the inner wall of inserting groove 41, in the guide groove 44, heat-dissipating pipe 43 is evenly distributed on slotting 43 two sides bottom abutment of heat-dissipating pipe
On access slot 41.
Referring to Fig. 3, Fig. 4, the lower cooling mechanism 50 includes 21 side of step for being removably disposed in 41 lower section of inserting groove
Fixed plate 51 on wall is molded over the tilting connecting plate 52 of described fixed plate one end and is arranged in multiple on the connecting plate
Blower fan 53, the upper surface of the fixed plate 51 and the upper surface of contact 22 are located in same level, and the blower fan 53 is
Even to be distributed on connecting plate 52, the blower fan 53 of 21 front and rear sides of step is oppositely arranged, and blower fan 53 is against the bottom surface of IC chip 1
It dries, forms the resettlement groove 54 parallel with inserting groove 41, the resettlement groove on 21 side wall of step of 41 lower section of inserting groove
Top and bottom sidewall on be uniformly bolted with multipair bulb plunger 55, uniformly formed on the upper surface and lower end surface of fixed plate 51 multipair
The bulb of the embedding slot 511 cooperated with the bulb of the bulb plunger 55, bulb plunger 55 is embedded in corresponding embedding slot 511
It is interior.
Referring to Fig. 1, Fig. 5 to Fig. 7, the top of the framework 20 is equipped with capping 60, at left and right sides of the bottom surface of the capping at
Type has holding block 61, and the card slot 23 with the holding block 61 cooperation is formed at left and right sides of the top of framework 20, holding block 61
Bottom is fixed with iron piece 71, and the magnet block 72 cooperated with described iron piece 71, capping are fixed on the inner wall of the card slot 23
60 bottom surface front and rear sides form multiple positioning columns 62, and the top front and rear sides of framework 20 are formed matches with the positioning column 62
The location hole 24 of conjunction, the top front side of framework 20 and rear side have been separately formed 3 location holes 24, have covered on front side of 60 bottom surface
3 positioning columns 62 have been separately formed with rear side, the bottom surface of the holding block 61 forms resettlement groove 611, and described iron piece
71 are fixed in the resettlement groove 611, and the placement block of the protrusion cooperated with resettlement groove 611 is formed on the inner wall of the card slot 23
231, the magnet block 72 is fixed on the top of the placement block 231.
Referring to Fig. 1, Fig. 3, in the specific implementation, IC chip 1 is arranged on the step 21 in framework 20 present invention, multiple tracks platform
Multiple IC chips 1 on rank 21 are arranged in stacked on top, and the both ends of IC chip 1 pass through on contact 22 and conducting wire 30 and substrate 10
Stitch 31 is electrically connected.IC chip 1 is arranged between upper cooling mechanism 40 and lower cooling mechanism 50, the blower fan of lower cooling mechanism 50
53 dry in tilting state and against the reverse side of IC chip 1, thus radiate to the reverse side of IC chip 1, tilting blow
Fan 53 is conducive to increase the area of blowing, so that the reverse side of IC chip 1 is accelerated heat dissipation, the heat-dissipating pipe 43 of upper cooling mechanism 40 is located at
The top of IC chip 1 radiates to the front of IC chip 1.It is encapsulated in the case where framework 20 is vacant into framework 20 multiple
When IC chip 1, first the fixed plate 51 of lower cooling mechanism 50 can be mounted on the lower sides of step 21, then by IC chip 1
It is placed in fixed plate 51, then the heat-dissipating pipe 43 of upper cooling mechanism 40 is installed to one by one in inserting groove 41, specifically, will radiate
One end of pipe 43 is inserted into inserting groove 41 along the guide groove 44 of arc and is resisted against on pressure spring 42, and pressure spring 42 is compressed, then will
The other end of heat-dissipating pipe 43 is inserted into the same way in inserting groove 41, thus the both ends of heat-dissipating pipe 43 be pressed against on pressure spring 42 and
Two side bottoms of heat-dissipating pipe 43 are located in guide groove 44.
In conclusion the present invention adds new cooling mechanism on the basis of the packaging mechanism of more IC chips, it is able to achieve quickly
Heat dissipation, extends the service life of multi-chip, and cooling mechanism facilitates installing and dismounting, convenient for the encapsulation of IC chip.
Heat dissipation type multichip IC encapsulation provided by the present invention, only a specific embodiment of the invention, but this
The protection scope of invention is not limited thereto, anyone skilled in the art the invention discloses technical scope
It is interior, it can easily think of the change or the replacement, should all cover within that scope of the present invention.Therefore, protection scope of the present invention is answered
It is subject to the scope of protection of the claims.
Claims (10)
1. a kind of method of integrated antenna package, comprising:
There is provided substrate (10) and the rectangle being formed on the substrate framework (20), on the step (21) setting be used for pair
The upper cooling mechanism (40) and be used to radiate to the reverse side of IC chip (1) lower scattered that the front of IC chip (1) is radiated
Heat engine structure (50), the upper cooling mechanism (40) include the inserting groove for the strip being molded on the wall of step (21) front and rear sides
(41), multiple pressure springs (42) for being arranged in the inserting groove, both ends be resisted against heat-dissipating pipe (43) on the pressure spring (42) and
It is molded over the guide groove (44) of the arc on the step (21) bottom wall, the lower cooling mechanism (50) is described solid including being molded over
The tilting connecting plate (52) of fixed board one end and the multiple blower fans (53) being arranged on the connecting plate；
IC chip (1) is arranged on the step (21) in framework (20), multiple IC chips (1) on multiple tracks step (21) are presented
The both ends of the IC chip (1) are passed through the stitch on contact (22) and conducting wire (30) and the substrate (10) by lower stacking setting
(31) it is electrically connected, the IC chip (1) is arranged between the upper cooling mechanism (40) and the lower cooling mechanism (50), it will
The blower fan (53) of the lower cooling mechanism (50) is in tilting state and dries against the reverse side of the IC chip (1), thus
It radiates to the reverse side of IC chip (1), the heat-dissipating pipe (43) of the upper cooling mechanism (40) is set to the IC chip
(1) top radiates to the front of the IC chip (1)；
In the case where the framework (20) is vacant to when encapsulating multiple IC chip (1) in the framework (20), first will be described under
The fixed plate (51) of cooling mechanism (50) is mounted on the lower sides of the step (21), then sets the IC chip (1)
In on fixed plate (51), then the heat-dissipating pipe (43) of upper cooling mechanism (40) is installed to one by one in the inserting groove (41), tool
Body, one end of the heat-dissipating pipe (43) is inserted into inserting groove (41) along the guide groove (44) of arc and is resisted against the pressure
On spring (42), the pressure spring (42) is compressed, then the other end of heat-dissipating pipe (43) is inserted into the inserting groove in the same way
(41) in, thus the both ends of heat-dissipating pipe (43) are pressed against on the pressure spring (42) and two side bottoms of the heat-dissipating pipe (43)
It is set in the guide groove (44).
2. a kind of method of integrated antenna package according to claim 1, which is characterized in that further include:
Step (21) described in multiple tracks is formed on the inner wall of the framework (20), fixed setting is more in the left and right sides of the step
The contact is electrically connected by conducting wire (30) with stitch (31), and the stitch is fixed on substrate by a contact (22)
(10) on.
3. a kind of method of integrated antenna package according to claim 1, which is characterized in that further include:
The inserting groove (41) and the heat-dissipating pipe (43) are vertically arranged, one end of the pressure spring (42) is fixed on inserting groove
(41) on inner wall, by the heat-dissipating pipe (43) two sides bottom abutment in the guide groove (44).
4. a kind of method of integrated antenna package according to claim 1, which is characterized in that further include:
The resettlement groove (54) parallel with inserting groove (41) is formed on step (21) side wall below the inserting groove (41), in institute
Uniformly be spirally connected on the top and bottom sidewall of resettlement groove multipair bulb plunger (55) are stated, in the upper surface and lower end surface of the fixed plate (51)
On be formed uniformly the embedding slot (511) that the multipair bulbs with the bulb plunger (55) cooperate, by the bulb plunger (55)
Bulb is in corresponding embedding slot (511).
5. a kind of method of integrated antenna package according to claim 1, which is characterized in that further include:
In the top of the framework (20) setting capping (60), holding block (61) are formed at left and right sides of the bottom surface of the capping,
The card slot (23) with the holding block (61) cooperation is formed at left and right sides of the top of the framework (20), in the holding block
(61) fixed iron piece (71) in bottom, the fixed magnet with iron piece (71) cooperation on the inner wall of the card slot (23)
Block (72) forms multiple positioning columns (62) in the bottom surface front and rear sides of the capping (60), two before and after the top of framework (20)
Side forms the location hole (24) with the positioning column (62) cooperation.
6. a kind of method of integrated antenna package according to claim 5, which is characterized in that further include:
Resettlement groove (611) are formed in the bottom surface of the holding block (61), iron piece (71) are fixed on the resettlement groove
(611) in, the placement block (231) with the protrusion of the resettlement groove (611) cooperation is formed on the inner wall of the card slot (23), it will
The magnet block (72) is fixed on the top of the placement block (231).
7. a kind of method of integrated antenna package according to claim 5, which is characterized in that further include:
On front side of the top of the framework (20) and rear side is respectively formed 3 location holes (24), in the capping (60)
On front side of bottom surface and rear side is respectively formed 3 positioning columns (62).
8. a kind of method of integrated antenna package according to claim 1, which is characterized in that further include:
The upper surface of the upper surface of the fixed plate (51) and contact (22) is set in same level.
9. a kind of method of integrated antenna package according to claim 1, which is characterized in that further include:
The heat-dissipating pipe (43) is evenly distributed on inserting groove (41), and the blower fan (53) is evenly distributed on connecting plate
(52) on.
10. a kind of method of integrated antenna package according to claim 1, which is characterized in that further include:
The conducting wire (30) are internal embedded in the framework (20), and the stitch (31) is fixed on the substrate (10) bottom
The front and rear sides in portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810804876.XA CN108962849B (en) | 2016-08-22 | 2016-08-22 | Method for packaging integrated circuit |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610703506.8A CN106206492B (en) | 2016-08-22 | 2016-08-22 | A kind of heat dissipation type multichip IC encapsulation |
| CN201810804876.XA CN108962849B (en) | 2016-08-22 | 2016-08-22 | Method for packaging integrated circuit |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610703506.8A Division CN106206492B (en) | 2016-08-22 | 2016-08-22 | A kind of heat dissipation type multichip IC encapsulation |
Publications (2)
| Publication Number | Publication Date |
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| CN108962849A true CN108962849A (en) | 2018-12-07 |
| CN108962849B CN108962849B (en) | 2020-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810804876.XA Active CN108962849B (en) | 2016-08-22 | 2016-08-22 | Method for packaging integrated circuit |
| CN201610703506.8A Active CN106206492B (en) | 2016-08-22 | 2016-08-22 | A kind of heat dissipation type multichip IC encapsulation |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201610703506.8A Active CN106206492B (en) | 2016-08-22 | 2016-08-22 | A kind of heat dissipation type multichip IC encapsulation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109951957A (en) * | 2019-03-25 | 2019-06-28 | 江苏聚润硅谷新材料科技有限公司 | A kind of IC package structure conducive to heat dissipation |
| CN110785038A (en) * | 2019-11-07 | 2020-02-11 | 徐州陀微传感科技有限公司 | Wafer-level electronic component and packaging method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130470B (en) * | 2021-04-21 | 2022-08-16 | 深圳市芯视佳半导体科技有限公司 | Micro-display structure and manufacturing method thereof |
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| US5157588A (en) * | 1991-03-30 | 1992-10-20 | Samsung Electronics Co., Ltd. | Semiconductor package and manufacture thereof |
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| US7429792B2 (en) * | 2006-06-29 | 2008-09-30 | Hynix Semiconductor Inc. | Stack package with vertically formed heat sink |
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| US5157588A (en) * | 1991-03-30 | 1992-10-20 | Samsung Electronics Co., Ltd. | Semiconductor package and manufacture thereof |
| US6014314A (en) * | 1997-05-15 | 2000-01-11 | Nec Corporation | Package structure of a multi-chip module |
| US20050011656A1 (en) * | 2003-07-16 | 2005-01-20 | Maxwell Technologies, Inc., A Delaware Corporation | Packaging of semiconductor devices for increased reliability |
| CN101097906A (en) * | 2006-06-29 | 2008-01-02 | 海力士半导体有限公司 | Stack package with vertically formed heat sink |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109951957A (en) * | 2019-03-25 | 2019-06-28 | 江苏聚润硅谷新材料科技有限公司 | A kind of IC package structure conducive to heat dissipation |
| CN110785038A (en) * | 2019-11-07 | 2020-02-11 | 徐州陀微传感科技有限公司 | Wafer-level electronic component and packaging method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106206492A (en) | 2016-12-07 |
| CN108962849B (en) | 2020-10-16 |
| CN106206492B (en) | 2018-06-22 |
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