CN208889643U - A kind of high power integrated antenna package component conducive to heat dissipation - Google Patents
A kind of high power integrated antenna package component conducive to heat dissipation Download PDFInfo
- Publication number
- CN208889643U CN208889643U CN201821806208.2U CN201821806208U CN208889643U CN 208889643 U CN208889643 U CN 208889643U CN 201821806208 U CN201821806208 U CN 201821806208U CN 208889643 U CN208889643 U CN 208889643U
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- heat sink
- heat dissipation
- integrated circuit
- board
- high power
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Abstract
The utility model discloses a kind of high power integrated antenna package components conducive to heat dissipation, including shell, heat sink, integrated circuit board and package board, the shell is in the cylinder of both ends open, the heat sink is located at upper part of the housing, the integrated circuit board is located at housing central section, and the package board is located at lower part of the housing.The utility model passes through setting shell, heat sink and package board, integrated circuit board is encapsulated, rapid cooling is carried out to integrated circuit board by heat sink, groove is arranged in housing central section, it is adapted to the snap-gauge of heat sink and package board with groove, reinforce the sealing performance of entire component, structure is simple, is easy assembling.
Description
Technical field
The utility model relates to integrated antenna package field more particularly to a kind of integrated electricity of high power conducive to heat dissipation
Road package assembling.
Background technique
In the prior art, the fever of high power integrated circuit is serious, often results in entire encapsulation after encapsulation in use
Component internal keeps a condition of high temperature, will cause integrated circuit service life under the state that works long hours and shortens, or even causes
Integrated circuit is burnt, and package assembling leakproofness is often inadequate, and integrated circuit board is be easy to cause to contact with the external world, causes integrated electricity
The damage of road plate.
Therefore, the prior art is defective, needs to improve.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of structure is simple, it is easy assembling, and good airproof performance
Conducive to the high power integrated antenna package component of heat dissipation.
The utility model provides a kind of high power integrated antenna package component conducive to heat dissipation, including shell, heat sink,
Integrated circuit board and package board, the shell are in the cylinder of both ends open, and the heat sink is located at upper part of the housing, the collection
It is located at housing central section at circuit board, the package board is located at lower part of the housing；The heat dissipation plate top surface is provided with several criss-cross
Cooling fin, the internal diameter of the housing central section is less than the internal diameter of upper and lower part, and the top surface and bottom surface of the housing central section are distinguished
It is provided with boss, is arranged fluted between the boss and inner walls, the heat sink edge is vertically provided with the first snap-gauge,
The package board edge has set up the second snap-gauge, and first snap-gauge and the second snap-gauge are arranged in groove respectively.
By adopting the above technical scheme, in the high power integrated antenna package component for being conducive to radiate, the integrated electricity
Road plate is respectively arranged with spring on four corners.
Using above-mentioned each technical solution, described is conducive in the high power integrated antenna package component of heat dissipation, the shell
Body top and lower part are respectively arranged with several side through hole, and the heat sink side is provided with several first fixation holes, the encapsulation
Plate side is provided with several second fixation holes, and each first fixation hole and the second fixation hole are adapted with side through hole.
Using above-mentioned each technical solution, described is conducive in the high power integrated antenna package component of heat dissipation, the collection
Circuit board is provided with several pins, the package board is provided with several guide through hole being adapted to each pin.
Using above-mentioned each technical solution, the utility model is by setting shell, heat sink and package board, by integrated electricity
Plate encapsulation in road carries out rapid cooling to integrated circuit board by heat sink, groove is arranged in housing central section, makes heat sink and encapsulation
The snap-gauge of plate is adapted to groove, reinforces the sealing performance of entire component, and structure is simple, is easy assembling.
Detailed description of the invention
Fig. 1 is that the structure of the utility model splits schematic diagram；
Fig. 2 is the schematic cross-sectional view of the utility model.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Such as Fig. 1 and Fig. 2, a kind of high power integrated antenna package component conducive to heat dissipation, including shell are present embodiments provided
Body 1, heat sink 2, integrated circuit board 3 and package board 4, the shell 1 are in the cylinder of both ends open, and the heat sink 2 is located at
1 top of shell, the integrated circuit board 3 are located at 1 middle part of shell, and the package board 4 is located at 1 lower part of shell；The heat sink 2 pushes up
Face is provided with several criss-cross cooling fins 21, and the internal diameter at 1 middle part of shell is less than the internal diameter of upper and lower part, the shell
The top surface and bottom surface at 1 middle part of body are respectively arranged with boss 12, are arranged fluted 14 between 1 inner wall of the boss 12 and shell, institute
It states 2 edge of heat sink and is vertically provided with the first snap-gauge 22,4 edge of package board has set up the second snap-gauge, and described first
Snap-gauge 22 and the second snap-gauge are arranged in respectively in groove 14.
Such as Fig. 1, heat sink 2 is located in 1 top of shell, and package board 4 is located in 1 lower part of shell, passes through heat sink 2 and encapsulation
Integrated circuit board 3 is packaged in shell 1 by plate 4.The heat that 2 bottom surface of heat sink is distributed close to integrated circuit board 3, integrated circuit board 3
Amount passes through heat sink 2 for heat derives.Several lateral heat dissipation pieces 21 and longitudinal heat dissipation are arranged in 2 top surface of heat sink in the present embodiment
Piece 21, lateral heat dissipation piece 21 is respectively perpendicular with longitudinal cooling fin 21 to intersect, and criss-cross cooling fin 21 increases entire heat sink 2
Heat dissipation area, further accelerate heat dissipation.In the present embodiment, lateral heat dissipation piece 21 intersects vertically with longitudinal cooling fin 21, is in
It is regularly arranged, it is conducive to production.
It is in order to increase the leakproofness of entire encapsulating structure, the internal diameter setting at 1 middle part of shell is upper in being less than such as Fig. 1 and Fig. 2
The internal diameter in portion and lower part, meanwhile, boss 12 is arranged in portion top surface and bottom surface within the case 1, and boss 12 is annular in shape.Boss 12 and shell
Groove 14 is installed between the inner wall of 1 upper and lower part, groove 14 is equally in a ring.2 bottom margin of heat sink is down-set
4 top edge of package board is set up the second snap-gauge by the first snap-gauge 22, and the first snap-gauge 22 and the second snap-gauge are also annular, and
It is adapted to respectively with groove 14.First snap-gauge 22 is stuck in the groove 14 of top, the second snap-gauge is stuck in the groove 14 of lower section,
Heat sink 2 is set to combine closely with package board 4 and shell 1, due to the effect of groove 14, outside extends at a distance from internal circulation,
Increase the leakproofness of entire encapsulating structure.
Further, various electronic devices are provided on integrated circuit board 3, in order to prevent electronic device and heat sink 2
It contacts and damages, be respectively arranged with spring 31 on 3 four corners of the integrated circuit board.Spring 31 is by heat sink 2 and integrates
Space is set up between circuit board 3, to be used to accommodate electronic device, plays the role of protecting electronic device, meanwhile, spring 31 is right
When integrated circuit board 3 can also play the role of support buffer function, integrated circuit board 3 and heat sink 2 close due to impact force,
Spring 31 plays buffer function, prevents the electronic device hardness on integrated circuit board 3 from hitting.
Further, in order to reinforce the stability of package assembling, 1 top of shell is respectively arranged with several with lower part
Side through hole 13,2 side of heat sink are provided with several first fixation holes 23, and 4 side of package board is provided with several second
Fixation hole 43, each first fixation hole 23 and the second fixation hole 43 are adapted with side through hole 13.Certainly it should be noted that side
Through-hole 13, the first fixation hole 23 and the second fixation hole 43 are respectively threaded hole, and threaded hole has the screw being adapted to therewith.Work as heat dissipation
When plate 2 and package board 4 are fastened in groove 14, side through hole 13 is respectively corresponded with the first fixation hole 23, the second fixation hole 43, at this time
It is screwed into the screw of adaptation, heat sink 2, package board 4 and shell 1 can be stablized and fix.
Further, the integrated circuit board 3 is provided with several pins 32, the package board 4 be provided with it is several with it is each
The guide through hole 42 that pin 32 is adapted to.Each pin 32 is adapted to respectively with guide through hole 42, and pin 32 is inserted into guide through hole 42 can
It keeps being in close contact, pin 32 passes through insertion guide through hole 42 and contacts with external.
Using above-mentioned each technical solution, the utility model is by setting shell, heat sink and package board, by integrated electricity
Plate encapsulation in road carries out rapid cooling to integrated circuit board by heat sink, groove is arranged in housing central section, makes heat sink and encapsulation
The snap-gauge of plate is adapted to groove, reinforces the sealing performance of entire component, and structure is simple, is easy assembling.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (4)
1. a kind of high power integrated antenna package component conducive to heat dissipation, it is characterised in that: including shell, heat sink, integrated electricity
Road plate and package board, the shell are in the cylinder of both ends open, and the heat sink is located at upper part of the housing, the integrated circuit
Plate is located at housing central section, and the package board is located at lower part of the housing；The heat dissipation plate top surface is provided with several criss-cross heat dissipations
Piece, the internal diameter of the housing central section are less than the internal diameter of upper and lower part, and top surface and the bottom surface of the housing central section are respectively arranged with
Boss, is arranged fluted between the boss and inner walls, the heat sink edge is vertically provided with the first snap-gauge, the envelope
Loading board edge has set up the second snap-gauge, and first snap-gauge and the second snap-gauge are arranged in groove respectively.
2. the high power integrated antenna package component according to claim 1 for being conducive to heat dissipation, it is characterised in that: described integrated
Circuit board is respectively arranged with spring on four corners.
3. the high power integrated antenna package component according to claim 1 for being conducive to heat dissipation, it is characterised in that: the shell
Top and lower part are respectively arranged with several side through hole, and the heat sink side is provided with several first fixation holes, the package board
Side is provided with several second fixation holes, and each first fixation hole and the second fixation hole are adapted with side through hole.
4. the high power integrated antenna package component according to claim 1 for being conducive to heat dissipation, it is characterised in that: described integrated
Circuit board is provided with several pins, and the package board is provided with several guide through hole being adapted to each pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821806208.2U CN208889643U (en) | 2018-11-02 | 2018-11-02 | A kind of high power integrated antenna package component conducive to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821806208.2U CN208889643U (en) | 2018-11-02 | 2018-11-02 | A kind of high power integrated antenna package component conducive to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208889643U true CN208889643U (en) | 2019-05-21 |
Family
ID=66517759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821806208.2U Active CN208889643U (en) | 2018-11-02 | 2018-11-02 | A kind of high power integrated antenna package component conducive to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208889643U (en) |
-
2018
- 2018-11-02 CN CN201821806208.2U patent/CN208889643U/en active Active
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