CN210443546U

CN210443546U - Packaged triode

Info

Publication number: CN210443546U
Application number: CN201921999787.1U
Authority: CN
Inventors: 韩笑毅; 章鑫
Original assignee: Tonglu Yaolin Electronic Technology Co Ltd
Current assignee: Tonglu Yaolin Electronic Technology Co Ltd
Priority date: 2019-11-19
Filing date: 2019-11-19
Publication date: 2020-05-01
Anticipated expiration: 2029-11-19

Abstract

The utility model relates to a triode, in particular to a packaged triode, which comprises a radiator and a triode main body, wherein the radiator comprises a first side plate and a second side plate, the first side plate and the second side plate are fixedly connected through a connecting plate, the connecting plate is arranged at the middle section of the first side plate and the second side plate, both sides of the bottom of the connecting plate are fixedly provided with pins, the bottom of the connecting plate is fixedly provided with a plurality of groups of radiating fins, the top of the connecting plate is provided with the triode main body, three groups of external contact pins are fixedly arranged at one end of the triode main body close to the pins, one end of the triode main body far away from the external contact pins is fixedly provided with a bottom plate, and the bottom plate extends to the interior of the triode main body close to one end of the triode main body, meanwhile, the heat dissipation efficiency is higher, the heat dissipation effect is better, and the heat dissipation device has a certain popularization effect.

Description

Packaged triode

Technical Field

The utility model relates to a triode specifically is a encapsulation triode.

Background

A triode is a semiconductor device for controlling current, has the function of amplifying a weak signal into an electric signal with a large amplitude value and is also used as a contactless switch, is one of semiconductor basic components, has the function of current amplification, and is a core element of an electronic circuit, is formed by manufacturing two PN junctions which are very close to each other on a semiconductor substrate, divides the whole semiconductor into three parts by the two PN junctions, the middle part is a base region, the two side parts are an emitting region and a collecting region, the arrangement mode is PNP and NPN, and the triode is usually combined and installed by combining a radiating fin when being used and installed to radiate the triode, but when the triode is installed at present, the triode and the radiating fin are independently purchased and installed, so that the production cost is increased, and the radiating effect is not good, there is therefore a need for a packaged transistor that ameliorates the above problems.

Disclosure of Invention

An object of the utility model is to provide a encapsulation triode to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a packaged triode comprises a radiator and a triode body, wherein the radiator comprises a first side plate and a second side plate which are fixedly connected through a connecting plate, the connecting plate is arranged at the middle section of the first side plate and the second side plate, pins are fixedly arranged at both sides of the bottom of the connecting plate, a plurality of groups of radiating fins are fixedly arranged at the bottom of the connecting plate, the top of the connecting plate is provided with the triode body, three groups of external contact pins are fixedly arranged at one end, close to the pins, of the triode body, a bottom plate is fixedly arranged at one end, far away from the external contact pins, of the triode body, the bottom plate extends to the interior of the triode body close to one end of the triode body, the bottom plate and the connecting plate are fixedly arranged through a second mounting groove, a chip is fixedly arranged in the triode body, and the chip and the connecting, an insulating layer is arranged between the first mounting groove and the chip.

Preferably, the insulating layer is customized by ceramic pieces.

Preferably, the triode body and the heat sink are integrally packaged and molded.

Preferably, the bottom plate and the outer contact pin are both made of pure red copper in a customized mode.

Preferably, the first side plate, the second side plate and the connecting plate are integrally formed in a stretching mode and are H-shaped.

Preferably, the triode body shell is customized by epoxy plastic sealing glue, and the outer surface of the triode body shell is subjected to laser engraving and silk printing.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in, during production, with radiator and triode main part integrated package shaping, need not to purchase alone and install radiator and triode main part, equipment and production for subsequent electrical equipment facilitate, whether purchase cost or manufacturing cost all reduce after unifying the two simultaneously, provide more favorable condition for the producer, herein simultaneously, with the chip, bottom plate and connecting plate are respectively through first mounting groove, the second mounting groove carries out fixed mounting, the effectual inner space that has utilized the radiator, and make radiator and triode main part laminate more, the radiating efficiency is higher.

2. The utility model discloses in, during the use, through the insulating layer that forms with adopting the ceramic chip customization between chip and the first mounting groove, can effectually keep apart chip and radiator, lead to the fact electrically conductive to the radiator when avoiding the chip operation, and the shell of the triode main part that forms through adopting the epoxy plastic-encapsulated glue customization has the flame retardant property of preventing, and high temperature resistant, the leakproofness is strong, it is strong to adopt the bottom plate that the pure red copper customization formed and outer contact foot to overflow the heat dissipation simultaneously, in this moment, fixed mounting makes the heat radiating area increase of radiator at a plurality of groups radiating fin of connecting plate bottom, thereby make the radiating effect better.

Drawings

Fig. 1 is a schematic view of the overall overlooking external structure of the present invention;

FIG. 2 is a schematic view of the overall front view of the external structure of the present invention;

FIG. 3 is a schematic view of the overall side view of the internal structure of the present invention;

in the figure: the structure comprises a radiator 1, a triode 2, a bottom plate 3, a first side plate 4, a second side plate 5, a connecting plate 6, a pin 7, an external contact pin 8, a chip 9, a first mounting groove 10, an insulating layer 11, a second mounting groove 12 and a radiating fin 13.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution:

a packaged triode comprises a radiator 1 and a triode body 2, wherein the radiator 1 comprises a first side plate 4 and a second side plate 5, the first side plate 4 and the second side plate 5 are fixedly connected through a connecting plate 6, the connecting plate 6 is arranged at the middle section of the first side plate 4 and the second side plate 5, pins 7 are fixedly arranged at both sides of the bottom of the connecting plate 6, a plurality of groups of radiating fins 13 are fixedly arranged at the bottom of the connecting plate 6, the top of the connecting plate 6 is provided with the triode body 2, one end of the triode body 2, which is close to the pins 7, is fixedly provided with three groups of external contact pins 8, one end of the triode body 2, which is far away from the external contact pins 8, is fixedly provided with a bottom plate 3, one end of the bottom plate 3, which is close to the triode body 2, extends into the triode body 2, the bottom plate 3 and the connecting plate 6 are fixedly arranged, the chip 9 and the connecting plate 6 are fixedly installed through the first installation groove 10, during production, the radiator 1 and the triode body 2 are integrally packaged and formed, independent purchase and installation of the radiator 1 and the triode body 2 are not needed, convenience is provided for subsequent assembly and production of electrical equipment, the purchase cost and the production cost are reduced after the radiator 1 and the triode body 2 are combined, more favorable conditions are provided for manufacturers, meanwhile, the chip 9, the bottom plate 3 and the connecting plate 6 are fixedly installed through the first installation groove 10 and the second installation groove 12 respectively, the internal space of the radiator 1 is effectively utilized, the radiator 1 and the triode body 2 are more attached, the heat dissipation efficiency is higher, the insulating layer 11 is arranged between the first installation groove 10 and the chip 9, and when the heat dissipation device is used, the insulating layer 11 which is customized by ceramic sheets is arranged between the chip 9 and the first installation groove 10, can effectually keep apart chip 9 and radiator 1, lead to the fact electrically conductive to radiator 1 when avoiding chip 9 operation, and the shell of triode main part 2 that forms through adopting the customization of epoxy plastic sealant has the flame retardant nature of preventing, and high temperature resistant, the leakproofness is strong, it is strong with outer contact pin 8 to adopt bottom plate 3 that the customization of pure red copper formed simultaneously to overflow the heat dissipation, herein simultaneously, fixed mounting makes the heat radiating area increase of radiator 1 in a plurality of groups radiating fin 13 of 6 bottoms of connecting plate, thereby make the radiating effect better.

The utility model discloses the theory of operation: during production, the chip 9, the bottom plate 3 and the connecting plate 6 are fixedly installed through the first installation groove 10 and the second installation groove 12 respectively, the radiator 1 and the triode body 2 are integrally packaged and formed, in addition, when in use, the integral device is fixedly connected with a circuit board required to be installed through the arranged pins 7 and the outer contact pins 8, the insulating layer 11 formed by customizing ceramic sheets is arranged between the chip 9 and the first installation groove 10, the chip 9 and the radiator 1 can be effectively isolated, the electric conduction of the radiator 1 during the operation of the chip 9 is avoided, the integral device has a simple structure, the independent purchase and installation of the radiator and the triode body are not needed, the purchase cost and the production cost are both reduced after the two are combined, more favorable conditions are provided for manufacturers, meanwhile, the radiator and the triode body are more attached, the heat dissipation efficiency is higher, the heat dissipation effect is better, has certain spreading value.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A kind of encapsulated triode, including radiator (1) and triode body (2), characterized by that: the radiator (1) comprises a first side plate (4) and a second side plate (5), the first side plate (4) and the second side plate (5) are fixedly connected through a connecting plate (6), the connecting plate (6) is arranged at the middle section of the first side plate (4) and the second side plate (5), both sides of the bottom of the connecting plate (6) are fixedly provided with pins (7), the bottom of the connecting plate (6) is fixedly provided with a plurality of groups of radiating fins (13), the top of the connecting plate (6) is provided with a triode main body (2), one end of the triode main body (2) close to the pins (7) is fixedly provided with three groups of external contact pins (8), one end of the triode main body (2) far away from the external contact pins (8) is fixedly provided with a bottom plate (3), and one end of the bottom plate (3) close to the triode main body (2) extends to the inside of the, bottom plate (3) and connecting plate (6) are through second mounting groove (12) fixed mounting, the inside fixed mounting of triode main part (2) has chip (9), chip (9) and connecting plate (6) are through first mounting groove (10) fixed mounting, be provided with insulating layer (11) between first mounting groove (10) and chip (9).

2. A packaged transistor according to claim 1, wherein: the insulating layer (11) is customized by adopting ceramic sheets.

3. A packaged transistor according to claim 1, wherein: the triode body (2) and the radiator (1) are integrally packaged and formed.

4. A packaged transistor according to claim 1, wherein: the bottom plate (3) and the outer contact pins (8) are both made of pure red copper in a customized mode.

5. A packaged transistor according to claim 1, wherein: the first side plate (4), the second side plate (5) and the connecting plate (6) are integrally formed in a stretching mode and are H-shaped.

6. A packaged transistor according to claim 1, wherein: the shell of the triode body (2) is customized by epoxy plastic sealing glue, and the outer surface of the shell is subjected to laser engraving and silk printing.