CN208108898U - A kind of liquid-cooled uniform-temperature plate heat dissipating device - Google Patents
A kind of liquid-cooled uniform-temperature plate heat dissipating device Download PDFInfo
- Publication number
- CN208108898U CN208108898U CN201820476959.6U CN201820476959U CN208108898U CN 208108898 U CN208108898 U CN 208108898U CN 201820476959 U CN201820476959 U CN 201820476959U CN 208108898 U CN208108898 U CN 208108898U
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- liquid
- temperature
- plate
- radiator
- heat conducting
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Abstract
The utility model discloses a kind of liquid-cooled uniform-temperature plate heat dissipating devices, including temperature-uniforming plate, control device, radiator, sensing device, liquid-discharging means of bottle, the liquid-discharging means of bottle is provided on the upside of the temperature-uniforming plate, the temperature-uniforming plate inside upper surface is provided with the sensing device, the liquid-discharging means of bottle side is provided with the radiator, the control device is provided on the upside of the radiator, the control device includes control chip, power switch, protecting box, the radiator includes semiconductor chilling plate, radiating fin, heat conducting tank, radiator fan, the sensing device includes the first temperature inductor, second temperature inductor, temperature signal conversion chip.Beneficial effect is：The utility model may be implemented automatically to need radiator to carry out heat discharging operation temperature-uniforming plate connection.
Description
Technical field
The utility model relates to field of heat-radiation equipment, more particularly to a kind of liquid-cooled uniform-temperature plate heat dissipating device.
Background technique
Temperature-uniforming plate is the vacuum cavity that an inner wall has micro-structure, when heat is by heat source to evaporating area, nowadays
Temperature-uniforming plate cannot be adjusted according to real time temperature.Comparison is disclosed application No. is 201620567020.1 Chinese patent
A kind of liquid-cooled temperature-uniforming plate includes：Inner tube, closed at both ends, which is equipped with entrance, and the other end is then equipped with outlet；
Outer tube is sheathed on the outer wall of inner tube, and the accommodating space around the inner tube is formed between the outer tube and the inner tube, and the two of the outer tube
End sealing is incorporated into the inner tube, and makes the accommodating space in sealed shape.Above-mentioned patent, which cannot achieve, automatically feels temperature
It should control, therefore to design a kind of new equipment, the utility model, which may be implemented automatically to connect temperature-uniforming plate, needs the dress that radiates
Set carry out heat discharging operation.
Utility model content
The purpose of this utility model is that solve the above-mentioned problems and provides a kind of liquid-cooled uniform-temperature plate heat dissipating device.
The utility model is achieved through the following technical solutions above-mentioned purpose：
A kind of liquid-cooled uniform-temperature plate heat dissipating device, including temperature-uniforming plate, control device, radiator, sensing device, liquid are led
Device is flowed, is provided with the liquid-discharging means of bottle on the upside of the temperature-uniforming plate, the temperature-uniforming plate inside upper surface is provided with the sense
Device is answered, the liquid-discharging means of bottle side is provided with the radiator, is provided with the control on the upside of the radiator
Device, the control device include control chip, power switch, protecting box, and the radiator includes semiconductor chilling plate, dissipates
Hot fin, heat conducting tank, radiator fan, the sensing device include the first temperature inductor, second temperature inductor, temperature signal
Conversion chip, the liquid-discharging means of bottle include the first liquid guide flow pipe, second liquid diversion pipe, the first liquid pump, solenoid valve,
Exhaust valve, second liquid pump, the temperature-uniforming plate upside are provided with the first liquid guide flow pipe, the second liquid diversion pipe,
The temperature-uniforming plate inside upper surface is provided with first temperature inductor, and the first liquid guide flow pipe front end is provided with described
First liquid pump, first liquid pump front end are provided with the heat conducting tank, and the heat conducting tank inside upper surface is provided with described
Second temperature inductor, the second temperature inductor upside are provided with the exhaust valve, and the heat conducting tank front end setting is
Solenoid valve is stated, the solenoid valve front end is provided with the second liquid pump, and second liquid pump front end is provided with described second
Liquid guide flow pipe, the heat conducting tank downside are provided with the semiconductor chilling plate, and the radiating fin is internally provided with described lead
Hot tank, the radiating fin upside are provided with the radiator fan, and the radiator fan is internally provided with the protecting box, described
Protecting box inside upper surface is provided with the control chip, the temperature signal conversion chip, is provided on the upside of the protecting box
The power switch.
In above structure, the temperature-uniforming plate is mounted on and needs position of radiating, opening the power switch makes the control
Chip is powered, and first temperature inductor receives the temperature-uniforming plate internal liquid temperature signal and is transferred to the temperature signal turn
It changes chip and is converted to electric signal transmission to the control chip, first described in the control chip controls according to set temperature data
Hot liquid is pumped into the heat conducting tank by liquid pump, and radiator fan described in the control chip controls is opened inside to the heat conducting tank
High-temp liquid radiates, and semiconductor chilling plate described in the control chip controls carries out the heat conducting tank after opening scattered
Heat, the second temperature inductor receive the heat conducting tank interior temperature signal, control after temperature reaches set temperature
Solenoid valve described in chip controls processed is opened, and the pump of second liquid described in the control chip controls drives the heat conducting tank inner cryogenic
Liquid is pumped into the temperature-uniforming plate by the second liquid diversion pipe.
In order to further realize Full-automatic temperature induction, control function, the protecting box and the control core of the present apparatus
Piece, the temperature signal conversion chip pass through welded connecting.
In order to further realize Full-automatic temperature induction, control function, the heat conducting tank and the semiconductor of the present apparatus
Cooling piece, the second temperature inductor, first liquid pump, the solenoid valve, the exhaust valve fasten phase by screw
Even.
In order to further realize Full-automatic temperature induction, control function, the heat conducting tank and the heat radiating fin of the present apparatus
Piece is connected by card slot.
In order to further realize Full-automatic temperature induction, control function, the temperature-uniforming plate and first liquid of the present apparatus
Body diversion pipe, the second liquid diversion pipe pass through bonding.
In order to further realize Full-automatic temperature induction, control function, the control chip and the power supply of the present apparatus
Switch, the radiator fan, first temperature inductor, the second temperature inductor, the temperature signal conversion chip,
First liquid pump, the solenoid valve, second liquid pump pass through electrical connection.
In order to further realize Full-automatic temperature induction, control function, the radiating fin and the heat dissipation of the present apparatus
Fan is fastened by screw to be connected.
Beneficial effect is：The utility model may be implemented automatically to need radiator to radiate temperature-uniforming plate connection
Operation.
Detailed description of the invention
Fig. 1 is a kind of schematic view of the front view of liquid-cooled uniform-temperature plate heat dissipating device described in the utility model；
Fig. 2 is a kind of top view of liquid-cooled uniform-temperature plate heat dissipating device described in the utility model；
Fig. 3 is a kind of left view of liquid-cooled uniform-temperature plate heat dissipating device described in the utility model.
The reference numerals are as follows：
1, temperature-uniforming plate；2, control device；3, chip is controlled；4, power switch；5, protecting box；6, radiator；7, it partly leads
Body cooling piece；8, radiating fin；9, heat conducting tank；10, radiator fan；11, sensing device；12, the first temperature inductor；13,
Two temperature inductors；14, temperature signal conversion chip；15, liquid-discharging means of bottle；16, the first liquid guide flow pipe；17, the second liquid
Body diversion pipe；18, the first liquid pump；19, solenoid valve；20, exhaust valve；21, second liquid pumps.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawing：
As shown in Figure 1-Figure 3, a kind of liquid-cooled uniform-temperature plate heat dissipating device, including temperature-uniforming plate 1, control device 2, radiator
6, sensing device 11, liquid-discharging means of bottle 15 are provided with liquid-discharging means of bottle 15,1 inside upper surface of temperature-uniforming plate on the upside of temperature-uniforming plate 1
It is provided with sensing device 11, sensing device 11 acts on the temperature sense function of being to realize the present apparatus, liquid-discharging means of bottle 15 1
Side is provided with radiator 6, and radiator 6 acts on the heat sinking function for being to realize the present apparatus, is provided with control on the upside of radiator 6
Device 2 processed, control device 2 act on the control function for being to realize the present apparatus, and control device 2 includes control chip 3, power switch
4, protecting box 5, radiator 6 include semiconductor chilling plate 7, radiating fin 8, heat conducting tank 9, radiator fan 10, sensing device 11
Including the first temperature inductor 12, second temperature inductor 13, temperature signal conversion chip 14, liquid-discharging means of bottle 15 includes the
One liquid guide flow pipe 16, second liquid diversion pipe 17, the first liquid pump 18, solenoid valve 19, exhaust valve 20, second liquid pump 21,
The first liquid guide flow pipe 16, second liquid diversion pipe 17 are provided on the upside of temperature-uniforming plate 1,1 inside upper surface of temperature-uniforming plate is provided with
One temperature inductor 12,16 front end of the first liquid guide flow pipe are provided with the first liquid pump 18, and 18 front end of the first liquid pump is provided with
Heat conducting tank 9,9 inside upper surface of heat conducting tank are provided with second temperature inductor 13, the row of being provided on the upside of second temperature inductor 13
Air valve 20,9 front end of heat conducting tank are provided with solenoid valve 19, and 19 front end of solenoid valve is provided with second liquid pump 21, second liquid pump 21
Front end is provided with second liquid diversion pipe 17, and semiconductor chilling plate 7 is provided on the downside of heat conducting tank 9, and radiating fin 8 is internally provided with
Heat conducting tank 9, is provided with radiator fan 10 on the upside of radiating fin 8, and radiator fan 10 is internally provided with protecting box 5, inside protecting box 5
Upper surface is provided with control chip 3, temperature signal conversion chip 14, is provided with power switch 4 on the upside of protecting box 5.
In above structure, temperature-uniforming plate 1 is mounted on and needs position of radiating, turning on the power switch 4 makes to control the energization of chip 3,
First temperature inductor 12 reception 1 internal liquid temperature signal of temperature-uniforming plate is transferred to temperature signal conversion chip 14 and is converted to telecommunications
It number is transferred to control chip 3, chip 3 is controlled according to set temperature data and controls the first liquid pump 18 hot liquid is pumped into heat conducting tank
9, control chip 3 controls the opening of radiator fan 10 and radiates to 9 internal high temperature liquid of heat conducting tank, and the control control of chip 3 is partly led
Body cooling piece 7 radiates to heat conducting tank 9 after opening, and second temperature inductor 13 receives 9 interior temperature signal of heat conducting tank, when
Temperature reaches set temperature and controls the control opening of solenoid valve 19 of chip 3 later, and the control control second liquid of chip 3 pump 21, which drives, leads
Hot 9 inner cryogenic liquid of tank is pumped into temperature-uniforming plate 1 by second liquid diversion pipe 17.
In order to further realize Full-automatic temperature induction, the control function of the present apparatus, protecting box 5 and control chip 3, temperature
Signal conversion chip 14 is by being welded to connect, heat conducting tank 9 and semiconductor chilling plate 7, second temperature inductor 13, the first liquid pump
18, solenoid valve 19, exhaust valve 20 by screw fasten be connected, heat conducting tank 9 is connect with radiating fin 8 by card slot, temperature-uniforming plate 1 and
First liquid guide flow pipe 16, second liquid diversion pipe 17 pass through bonding, control chip 3 and power switch 4, radiator fan 10, the
One temperature inductor 12, second temperature inductor 13, temperature signal conversion chip 14, the first liquid pump 18, solenoid valve 19, second
Liquid pump 21 is connected with radiator fan 10 by screw fastening by electrical connection, radiating fin 8.
The basic principles and main features and advantage of the utility model have been shown and described above.The technical staff of the industry
It should be appreciated that the present utility model is not limited to the above embodiments, the above embodiments and description only describe this
The principle of utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model also has various change
And improvement, these various changes and improvements fall within the scope of the claimed invention.
Claims (7)
1. a kind of liquid-cooled uniform-temperature plate heat dissipating device, it is characterised in that：Including temperature-uniforming plate (1), control device (2), radiator
(6), sensing device (11), liquid-discharging means of bottle (15), temperature-uniforming plate (1) upside are provided with the liquid-discharging means of bottle
(15), temperature-uniforming plate (1) inside upper surface is provided with the sensing device (11), and liquid-discharging means of bottle (15) side is set
It is equipped with the radiator (6), is provided with the control device (2) on the upside of the radiator (6), the control device (2)
Including controlling chip (3), power switch (4), protecting box (5), the radiator (6) includes semiconductor chilling plate (7), heat dissipation
Fin (8), heat conducting tank (9), radiator fan (10), the sensing device (11) include the first temperature inductor (12), the second temperature
Spend inductor (13), temperature signal conversion chip (14), the liquid-discharging means of bottle (15) include the first liquid guide flow pipe (16),
Second liquid diversion pipe (17), the first liquid pump (18), solenoid valve (19), exhaust valve (20), second liquid pump (21), it is described equal
The first liquid guide flow pipe (16), the second liquid diversion pipe (17), the temperature-uniforming plate (1) are provided on the upside of warm plate (1)
Inside upper surface is provided with first temperature inductor (12), and the first liquid guide flow pipe (16) front end is provided with described
One liquid pump (18), the first liquid pump (18) front end are provided with the heat conducting tank (9), table on heat conducting tank (9) inside
Face is provided with the second temperature inductor (13), is provided with the exhaust valve on the upside of the second temperature inductor (13)
(20), heat conducting tank (9) front end is provided with the solenoid valve (19), and solenoid valve (19) front end is provided with second liquid
Body pumps (21), and the second liquid pump (21) front end is provided with the second liquid diversion pipe (17), heat conducting tank (9) downside
It is provided with the semiconductor chilling plate (7), the radiating fin (8) is internally provided with the heat conducting tank (9), the radiating fin
(8) upside is provided with the radiator fan (10), and the radiator fan (10) is internally provided with the protecting box (5), the guarantor
Shield box (5) inside upper surface is provided with the control chip (3), the temperature signal conversion chip (14), the protecting box (5)
Upside is provided with the power switch (4).
2. a kind of liquid-cooled uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The protecting box (5) with
The control chip (3), the temperature signal conversion chip (14) pass through welded connecting.
3. a kind of liquid-cooled uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The heat conducting tank (9) with
The semiconductor chilling plate (7), the second temperature inductor (13), first liquid pump (18), the solenoid valve (19),
The exhaust valve (20) is fastened by screw to be connected.
4. a kind of liquid-cooled uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The heat conducting tank (9) with
The radiating fin (8) is connected by card slot.
5. a kind of liquid-cooled uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The temperature-uniforming plate (1) with
The first liquid guide flow pipe (16), the second liquid diversion pipe (17) pass through bonding.
6. a kind of liquid-cooled uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The control chip (3)
With the power switch (4), the radiator fan (10), first temperature inductor (12), the second temperature inductor
(13), the temperature signal conversion chip (14), first liquid pump (18), the solenoid valve (19), the second liquid
Pump (21) passes through electrical connection.
7. a kind of liquid-cooled uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The radiating fin (8)
It is connected with the radiator fan (10) by screw fastening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820476959.6U CN208108898U (en) | 2018-04-04 | 2018-04-04 | A kind of liquid-cooled uniform-temperature plate heat dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820476959.6U CN208108898U (en) | 2018-04-04 | 2018-04-04 | A kind of liquid-cooled uniform-temperature plate heat dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208108898U true CN208108898U (en) | 2018-11-16 |
Family
ID=64120751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820476959.6U Expired - Fee Related CN208108898U (en) | 2018-04-04 | 2018-04-04 | A kind of liquid-cooled uniform-temperature plate heat dissipating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208108898U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110389639A (en) * | 2019-07-01 | 2019-10-29 | 奇鋐科技股份有限公司 | Compound water cooling arranges structure |
-
2018
- 2018-04-04 CN CN201820476959.6U patent/CN208108898U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110389639A (en) * | 2019-07-01 | 2019-10-29 | 奇鋐科技股份有限公司 | Compound water cooling arranges structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181116 Termination date: 20200404 |