CN206770727U - A kind of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting - Google Patents
A kind of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting Download PDFInfo
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- CN206770727U CN206770727U CN201720339301.6U CN201720339301U CN206770727U CN 206770727 U CN206770727 U CN 206770727U CN 201720339301 U CN201720339301 U CN 201720339301U CN 206770727 U CN206770727 U CN 206770727U
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- plunger tube
- dynamic iron
- integrated circuit
- iron core
- heat dissipation
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Abstract
The utility model discloses a kind of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting, including plunger tube, upper conduction magnetic board, lower magnetic conductive board, secured core, dynamic iron core and coil, one end of the plunger tube is provided with air inlet, the other end of the plunger tube is provided with gas outlet, the secured core, dynamic iron core is arranged in the plunger tube, the secured core, the air inlet and the passage of gas outlet are communicated with dynamic iron core, the secured core, elastic component is provided between dynamic iron core, the dynamic iron core blocks the gas outlet in the presence of elastic component.Superminiature air solenoid valve structure of the present utility model for heat dissipation of integrated circuit chip dedusting is novel, ingenious in design, diameter can be produced and be less than 4mm, length is less than 6mm miniature electromagnetic valve, under the cooperation of micro air pump, it can be widely applied to the fields such as the very narrow wiring board in various spaces, fast cooling is played, dedusting function, carrys out the innovation of revolution for the cooling dedusting of domestic and international intelligent chip.
Description
Technical field
Solenoid valve market is the utility model is related to, is specifically related to a kind of ultra micro for heat dissipation of integrated circuit chip dedusting
Type air solenoid valve.
Background technology
In actual applications, the radiating of in general integrated circuit (chip) and dust suppression method have radiator and wind at present
Fan two ways.Radiator makes the heat of chip be transmitted to radiator by the close contact with chip surface, and radiator is usual
It is one piece and carries very mutliblade heat conductor, the radiation for the surface heat transfer that it extends is greatly increased, while the air to circulate also can
Take away bigger heat energy.The use of fan is generally divided into two kinds of forms, and one kind is to be directly installed on spreader surface, and another kind is
On cabinet and frame, the air velocity in whole space is improved, this mode is unable to estimate to the volume requirement of assembly.
Because IC chip increasingly minimizes, its installing space yet very little, the radiating of chip and dust removal problem are not
Good the problems such as causing to crash during work, it is difficult the parts such as installation radiator, fan on the IC chip of especially small macro.
The problem of heat dissipation of integrated circuit chip is bad can not effectively be solved always, it has also become global problem.
Utility model content
(1) technical problems to be solved
In view of the deficienciess of the prior art, the utility model provides a kind of surpassing for heat dissipation of integrated circuit chip dedusting
Miniature air magnetic valve.
(2) technical scheme
To reach above-mentioned purpose, it is empty that the utility model provides a kind of superminiature for heat dissipation of integrated circuit chip dedusting
Pneumoelectric magnet valve, including plunger tube, upper conduction magnetic board, lower magnetic conductive board, secured core, dynamic iron core and coil, one end of the plunger tube
Provided with air inlet, the other end of the plunger tube is provided with gas outlet, the upper conduction magnetic board, lower magnetic conductive board be separately mounted to it is described every
The top and bottom of magnetic tube, the coil are enclosed on the plunger tube and between the upper conduction magnetic board and lower magnetic conductive boards, institute
State plunger tube, upper conduction magnetic board, lower magnetic conductive board and coil joint and be provided with insulating barrier, the secured core, dynamic iron core are arranged on institute
State in plunger tube, the air inlet and the passage of gas outlet, the fixed iron are communicated with the secured core, dynamic iron core
Elastic component is provided between core, dynamic iron core, the dynamic iron core blocks the gas outlet in the presence of elastic component.
Further, the elastic component is dish-shaped rubber ring.
Further, in addition to bottom plate, the air inlet are located on the secured core, and the gas outlet is located at the bottom plate
On, the bottom plate is affixed with the lower magnetic conductive board.
Further, in addition to coil trim, the coil trim cover the plunger tube, upper conduction magnetic board, lower magnetic conductive board simultaneously
Connect with the bottom plate.
Further, the diameter of the coil trim is less than 4mm, and length is less than 6mm.
(3) beneficial effect
Superminiature air solenoid valve structure novelty, the design that the utility model is used for heat dissipation of integrated circuit chip dedusting are skilful
It is wonderful, diameter can be produced and be less than 4mm, length is less than 6mm miniature electromagnetic valve, can extensive use under the cooperation of micro air pump
In fields such as the very narrow wiring boards in various spaces, fast cooling, dedusting function, for domestic and international intelligent chip are played
Cooling dedusting carrys out the innovation of revolution.
Brief description of the drawings
Fig. 1 is the structural representation for the superminiature air solenoid valve that the utility model is used for heat dissipation of integrated circuit chip dedusting
Figure；
Fig. 2 is that the utility model is used for plunger tube component in the superminiature air solenoid valve of heat dissipation of integrated circuit chip dedusting
Structural representation；
Fig. 3 is the knot for the superminiature air solenoid valve closure state that the utility model is used for heat dissipation of integrated circuit chip dedusting
Structure schematic diagram；
Fig. 4 is the knot for the superminiature air solenoid valve opening that the utility model is used for heat dissipation of integrated circuit chip dedusting
Structure schematic diagram；
Fig. 5 is a kind of structural representation of surface-mounted integrated circuit cooling system.
Wherein, 1 is plunger tube, and 2 be upper conduction magnetic board, and 3 be lower magnetic conductive board, and 4 be secured core, and 5 be dynamic iron core, and 6 be elasticity
Part, 7 be coil, and 8 be air inlet, and 9 be gas outlet, and 10 be bottom plate, and 11 be coil trim, and 12 be passage, and 13 be insulating barrier, and 14 are
Rubber blanket, 15 be valve port, and 20 be circuit board, and 21 be micro air pump, and 22 be miniature electromagnetic valve, and 23 be shower nozzle, and 24 be heat emission hole.
Embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Embodiment is used to illustrate the utility model, but is not limited to the scope of the utility model.
A kind of structure of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting of the present utility model is as schemed
1st, shown in Fig. 2, Fig. 3 and Fig. 4, including plunger tube 1, upper conduction magnetic board 2, lower magnetic conductive board 3, secured core 4, dynamic iron core 5 and coil 7.
One end of the plunger tube 1 is provided with air inlet 8, and the other end of the plunger tube 1 is provided with gas outlet 9, the upper conduction magnetic board 2, under
Magnetic conductive board 3 is separately mounted to the top and bottom of the plunger tube 1, and the coil 7 is enclosed on the plunger tube 1 and positioned at described
Between upper conduction magnetic board 2 and lower magnetic conductive board 3, the plunger tube 1, upper conduction magnetic board 2, lower magnetic conductive board 3 and the joint of coil 7 are provided with insulation
Layer 13, the secured core 4, dynamic iron core 5 are arranged in the plunger tube 1, and the secured core 4, dynamic iron core 5, which are provided with, to be connected
Lead to the air inlet 8 and the passage 12 of gas outlet 9, elastic component 6, the dynamic iron are provided between the secured core 4, dynamic iron core 5
Core 5 blocks the gas outlet 9 in the presence of elastic component 6.
Wherein plunger tube 1, upper conduction magnetic board 2, lower magnetic conductive board 3, secured core 4 form plunger tube component.Plunger tube component is real
The purposes of general line solenoid valve ring framework and conducting magnet core is showed, it is designed work(that is compacter and keeping original magnetic valve
Energy.Air inlet 8 and gas outlet 9 and passage 12 form a path, and dynamic iron core 5 is arranged in the path.Outside plunger tube component
There is an insulating coating 13 side, to replace the purposes of coil rack, effectively can isolate with enamel-covered wire, to reach the purpose of insulation.Cause
This above structure can be substantially reduced the volume of magnetic valve, to produce the micro electromagnetic for heat dissipation of integrated circuit chip dedusting
Valve provides possibility.
In the present embodiment, in addition to bottom plate 10, the air inlet 8 are located on the secured core 4, the gas outlet 9
On the bottom plate 10, the bottom plate 10 is affixed with the lower magnetic conductive board 3.
In the present embodiment, in addition to coil trim 11, the coil trim 11 cover the plunger tube 1, upper conduction magnetic board
2nd, lower magnetic conductive board 3 and connect with the bottom plate 10.
In the present embodiment, the diameter of the coil trim 11 is less than 4mm, and length is less than 6mm.When the volume of magnetic valve
For diameter 4.0mm, during length 6.0mm, the magnetic valve of the size is similar with the little module in integrated circuit, can flexibly be installed on each
On kind integrated circuit and chip, designed without changing, without considering that design of the magnetic valve on integrated circuit influences.
In the present embodiment, the passage in the dynamic iron core 5 is in T shape, and the end of the dynamic iron core 5 is provided with rubber blanket
14, the bottom plate 10 is provided with raised valve port 15, and the dynamic iron core 5 is blocked in the presence of elastic component 6 by rubber blanket 14
The valve port 15.
During work, an elastic component 6 is arranged at the top of dynamic iron core 5, and after solenoid valves, dynamic iron core 5 overcomes the bullet of elastic component 6
Power is moved upwards, and magnetic valve is opened, as shown in Figure 4.After magnetic valve powers off, dynamic iron core 5 is transported downwards in the presence of elastic component 6
It is dynamic, valve port 15 is sealed, medium disconnects, as shown in Figure 3.Using dish-shaped rubber ring as elastic component 6, whole magnetic valve volume is more
It is small, it can more effectively realize flexible switch.
Fig. 5 is a kind of surface-mounted integrated circuit cooling system, and the surface-mounted integrated circuit cooling system includes circuit board 20, miniature
Air pump 21, miniature electromagnetic valve 22 and shower nozzle 23, the shower nozzle 23 have several to be fixed on the circuit board 20, the shower nozzle
23 are connected by pipeline with micro air pump 21, miniature electromagnetic valve 22 be arranged on pipeline on be used for control the shower nozzle 23 with it is miniature
Break-make between air pump 21.
The beneficial effects of the utility model：Structure is novel, ingenious in design, can produce diameter and be less than 4mm, length is less than
6mm miniature electromagnetic valve, under the cooperation of micro air pump, it can be widely applied to the neck such as very narrow wiring board in various spaces
Domain, fast cooling is played, dedusting function, carrys out the innovation of revolution for the cooling dedusting of domestic and international intelligent chip.
Described above is only preferred embodiment of the present utility model, it is noted that for the common skill of the art
For art personnel, on the premise of the utility model technical principle is not departed from, some improvements and modifications can also be made, these change
Enter and retouch and also should be regarded as the scope of protection of the utility model.
Claims (5)
1. a kind of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting, it is characterised in that including plunger tube
(1), upper conduction magnetic board (2), lower magnetic conductive board (3), secured core (4), dynamic iron core (5) and coil (7), the one of the plunger tube (1)
End is provided with air inlet (8), and the other end of the plunger tube (1) is provided with gas outlet (9), the upper conduction magnetic board (2), lower magnetic conductive board
(3) top and bottom of the plunger tube (1) are separately mounted to, the coil (7) is enclosed on the plunger tube (1) and is located at institute
State between upper conduction magnetic board (2) and lower magnetic conductive board (3), the plunger tube (1), upper conduction magnetic board (2), lower magnetic conductive board (3) and the line
Circle (7) joint is provided with insulating barrier (13), and the secured core (4), dynamic iron core (5) are arranged in the plunger tube (1), described
The air inlet (8) and the passage (12) of gas outlet (9), the fixed iron are communicated with secured core (4), dynamic iron core (5)
Elastic component (6) is provided between core (4), dynamic iron core (5), the dynamic iron core (5) blocks the outlet in the presence of elastic component (6)
Mouth (9).
2. it is used for the superminiature air solenoid valve of heat dissipation of integrated circuit chip dedusting as claimed in claim 1, it is characterised in that
The elastic component (6) is dish-shaped rubber ring.
3. it is used for the superminiature air solenoid valve of heat dissipation of integrated circuit chip dedusting as claimed in claim 1, it is characterised in that
Also include bottom plate (10), the air inlet (8) is located on the secured core (4), and the gas outlet (9) is located at the bottom plate
(10) on, the bottom plate (10) is affixed with the lower magnetic conductive board (3).
4. it is used for the superminiature air solenoid valve of heat dissipation of integrated circuit chip dedusting as claimed in claim 3, it is characterised in that
Also include coil trim (11), the coil trim (11) covers the plunger tube (1), upper conduction magnetic board (2), lower magnetic conductive board (3)
And connect with the bottom plate (10).
5. it is used for the superminiature air solenoid valve of heat dissipation of integrated circuit chip dedusting as claimed in claim 1, it is characterised in that
The diameter of the coil trim (11) is less than 4mm, and length is less than 6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720339301.6U CN206770727U (en) | 2017-04-01 | 2017-04-01 | A kind of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720339301.6U CN206770727U (en) | 2017-04-01 | 2017-04-01 | A kind of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting |
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| Publication Number | Publication Date |
|---|---|
| CN206770727U true CN206770727U (en) | 2017-12-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720339301.6U Active CN206770727U (en) | 2017-04-01 | 2017-04-01 | A kind of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106838435A (en) * | 2017-04-01 | 2017-06-13 | 余姚市三力信电磁阀有限公司 | A kind of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting |
-
2017
- 2017-04-01 CN CN201720339301.6U patent/CN206770727U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106838435A (en) * | 2017-04-01 | 2017-06-13 | 余姚市三力信电磁阀有限公司 | A kind of superminiature air solenoid valve for heat dissipation of integrated circuit chip dedusting |
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